Device for PCB pattern electroplating

Abstract

A device for PCB pattern electroplating comprises a flying palladium head used for fixing a PCB, a conductive part is arranged at the end of the flying palladium head, the periphery of the flying palladium head is conical, the device further comprises a conical conductive seat matched with the flying palladium head, the conductive seat is provided with a conductive hole matched with the conductive part, and the conductive hole is communicated with the conductive part. The utility model provides the conical flying palladium head and the conductive seat matched with the flying palladium head in shape, and after the flying palladium head and the conductive seat are matched in shape, the flying palladium head can be stably fixed on the conductive seat, so that reliable connection is ensured, abnormal occurrence of a conductive part is avoided, and stable production quality is ensured; the production quality is effectively improved.

Description

Technical Field

[0001] The utility model relates to the field of PCB electroplating, in particular to a device for PCB pattern electroplating. Background Art

[0002] In the PCB selective pattern plating process, the PCB board is usually fixed on the conductive palladium, and then the palladium head contacts the conductive V seat to conduct electricity. Because the V seat is directly connected to the cathode of the power supply through the fire bull line, when the power supply inputs current, the PCB copper plate surface produces an electroplating reaction. In the actual production process, the palladium head and the V seat are often in poor contact or the temperature of the V seat rises, resulting in poor conductivity, which directly affects the PCB plating effect. Sometimes the electroplating reaction does not occur due to no power, resulting in abnormal PCB quality. Utility Model Content

[0003] In order to solve the above problems, the present technical solution provides a device for PCB pattern electroplating.

[0004] To achieve the above purpose, the technical solution is as follows:

[0005] A device for PCB pattern electroplating includes a palladium head for fixing a PCB board, a conductive part is provided at the end of the palladium head, the outer circumference of the palladium head is conical, and also includes a conical conductive seat matched with the palladium head, the conductive seat is provided with a conductive hole matched with the conductive part, and also includes a base connected to the conductive seat.

[0006] In some embodiments, a slide groove is provided on the inner wall surface of the conductive seat, and a positioning portion is provided on the palladium head relative to the slide groove.

[0007] In some embodiments, an isolation groove is provided at the lower end of the flying palladium head, and an isolation block is provided at the inner end of the conductive seat relative to the isolation groove.

[0008] In some embodiments, the end surface of the conductive seat is provided with at least one locking structure for locking the flying palladium head.

[0009] In some embodiments, the locking structure includes a sliding cavity arranged on the end surface of the flying palladium head, and positioning plates located on both sides of the sliding cavity, and also includes a tongue that can slide on the sliding cavity, and the tongue is provided with a sliding plate relative to the positioning plate, and a spring is provided between the sliding plate and the positioning plate.

[0010] In some embodiments, the sliding plate is provided with a guide rod passing through the positioning plate, and the spring is sleeved on the guide rod.

[0011] In some embodiments, the plugging end surface of the plug tongue is designed to be an inclined surface.

[0012] The beneficial effects of this application are:

[0013] The present application provides a flying palladium head with a conical design and a conductive seat that matches the same shape. After the two are matched in shape, the flying palladium head can be firmly fixed on the conductive seat, thereby ensuring a reliable connection and avoiding abnormalities in the conductive area, ensuring stable production quality, and effectively improving production quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for describing the embodiments.

[0015] Figure 1 This is a schematic diagram of the structure of the embodiment of the utility model Figure 1 ;

[0016] Figure 2 This is a schematic diagram of the structure of the embodiment of the utility model Figure 2 . DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0018] Please refer to Figure 1-2 As shown, a device for PCB pattern electroplating includes a palladium head 1 for fixing a PCB board, a conductive portion 2 is provided at the end of the palladium head 1, the outer circumference of the palladium head 1 is conical, and also includes a conical conductive seat 3 matched with the palladium head 1, the conductive seat 3 is provided with a conductive hole 4 matched with the conductive portion 2, and also includes a base 5 connected to the conductive seat 3.

[0019] The present application provides a flying palladium head with a conical design, and a conductive seat that matches the same shape. After the two are matched in shape, the flying palladium head can be firmly fixed on the conductive seat, thereby ensuring a reliable connection so that the conductive part can be firmly inserted into the conductive hole to achieve electrical connection, thereby avoiding abnormalities in the conductive part, ensuring stable production quality, and effectively improving production quality.

[0020] In this embodiment, the inner wall surface of the conductive seat 3 is provided with a slide groove 6, and the flying palladium head 1 is provided with a positioning part 7 relative to the slide groove 6. The positioning part is used to slide into the slide groove to ensure that the conductive part can be fully engaged with the conductive hole during assembly.

[0021] In this embodiment, an isolation groove 8 is provided at the lower end of the flying palladium head 1, and an isolation block 9 is provided at the inner end of the conductive seat 3 relative to the isolation groove 8, which not only plays an isolation role but also has a positioning and assembly effect.

[0022] In this embodiment, at least one locking structure for locking the flying palladium head 1 is provided on the end surface of the conductive base 3 .

[0023] In this embodiment, the locking structure includes a sliding cavity arranged on the end face of the flying palladium head 1, and positioning plates 10 located on both sides of the sliding cavity, and also includes a tongue 11 that can slide on the sliding cavity, and the tongue 11 is provided with a sliding plate 12 relative to the positioning plate 10, and a spring 13 is provided between the sliding plate 12 and the positioning plate 10.

[0024] In this embodiment, the sliding plate 12 is provided with a guide rod 14 passing through the positioning plate 10 , and the spring 13 is sleeved on the guide rod 14 .

[0025] In this embodiment, the plugging end surface of the plug tongue 11 is designed to be an inclined surface.

[0026] Since the end of the tongue is designed with a slope, when the flying palladium head moves downward, the guiding effect of the slope forces the tongue to move outward, thereby compressing the spring. After the flying palladium head completely enters the conductive seat, the restoring force of the spring drives the tongue to extend into the upper end surface of the flying palladium head to fix it. When disassembling, just pull the guide rod. As for the number of locking structures, there is no limit, and setting four is the most stable.

[0027] The above description is only a preferred embodiment of the present application and is not intended to limit the scope of implementation of the present application. Other principles and basic structures that are the same or similar to those of the present application are within the protection scope of the present application.

Claims

1. A device for PCB pattern electroplating, characterized in that: The invention comprises a palladium head (1) for fixing a PCB board, wherein a conductive portion (2) is provided at the end of the palladium head (1), the outer circumference of the palladium head (1) is in a conical shape, and further comprises a conductive seat (3) of a conical design matched with the palladium head (1), wherein the conductive seat (3) is provided with a conductive hole (4) matched with the conductive portion (2), and further comprises a base (5) connected with the conductive seat (3).

2. The device for PCB pattern electroplating according to claim 1, characterized in that: The inner wall surface of the conductive seat (3) is provided with a slide groove (6), and the palladium head (1) is provided with a positioning portion (7) relative to the slide groove (6).

3. The device for PCB pattern electroplating according to claim 2, characterized in that: The lower end of the flying palladium head (1) is provided with an isolation groove (8), and the inner end of the conductive seat (3) is provided with an isolation stopper (9) relative to the isolation groove (8).

4. The device for PCB pattern electroplating according to claim 1, characterized in that: The end surface of the conductive seat (3) is provided with at least one locking structure for locking the flying palladium head (1).

5. The device for PCB pattern electroplating according to claim 4, characterized in that: The locking structure comprises a sliding cavity arranged on the end surface of the flying palladium head (1), and positioning plates (10) located on both sides of the sliding cavity, and also comprises an inserting tongue (11) that can slide on the sliding cavity, the inserting tongue (11) is provided with a sliding plate (12) relative to the positioning plate (10), and a spring (13) is provided between the sliding plate (12) and the positioning plate (10).

6. The device for PCB pattern electroplating according to claim 5, characterized in that: The sliding plate (12) is provided with a guide rod (14) passing through the positioning plate (10), and the spring (13) is sleeved on the guide rod (14).

7. The device for PCB pattern electroplating according to claim 6, characterized in that: The plug-in end surface of the plug-in tongue (11) is designed to be an inclined surface.

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