Temperature control system and laser radar

By designing a temperature control system that includes a processor, temperature sensor, and temperature controller, the semiconductor thermoelectric module and driving module are used to solve the problem of temperature control of laser radar at different ambient temperatures, and realize the internal temperature of the laser radar in the temperature of the laser radar. Precise control and improvement of equipment stability and operating efficiency.

CN222394291UActive Publication Date: 2025-01-24ANHUI LANKE INFORMATION TECH CO LTD +1
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Patent Information

Application Number
CN202421333493.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-12
Publication Date
2025-01-24
Estimated Expiration
2034-06-12

AI Technical Summary

Technical Problem

When lidar operates at different ambient temperatures, it may cause the laser generator to operate beyond the expected range, affecting the accuracy of detection data, and possibly causing equipment to go down.

Method used

Design a temperature control system, including a processor, temperature sensor, and temperature controller. The semiconductor thermal power module and driving module are used to maintain the temperature inside the laser radar through automated temperature monitoring and control through automated temperature monitoring and control.

Benefits of technology

The precise control of the internal temperature of the laser radar is achieved, and the problems of the device downtime and detection data caused by temperature fluctuations are avoided, and the stability and operating efficiency of the equipment are improved.

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Abstract

The utility model discloses a temperature control system and a laser radar, and relates to the technical field of temperature measurement and control. The system specifically comprises a processor which is used for executing a corresponding working instruction according to a burnt program set; the temperature sensor is electrically connected with the processor, converts a collected temperature signal into an electric signal and sends the electric signal to the processor; and the temperature controller is electrically connected with the processor, receives the instruction issued by the processor, and executes corresponding temperature control operation according to the instruction of the processor. The utility model aims to ensure that the working temperature of the laser generator is kept within an expected interval and is not influenced by the external environment temperature.
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Description

Technical Field

[0001] The utility model relates to the technical field of temperature measurement and control, and in particular to a temperature control system and a laser radar. Background Art

[0002] In the daily detection operation of LiDAR, the working environment is changeable. High temperature and direct sunlight in summer and severe cold in winter will affect the stability of LiDAR, and may even cause the LiDAR to shut down due to excessively high or low temperatures. Even if the LiDAR can maintain operation, when the difference between the external ambient temperature and the rated operating temperature range of the internal laser generator is too large, it may cause the frequency of the laser emitted by the laser generator to drift, reducing the accuracy of the data detected by the LiDAR. Therefore, it is necessary to design a temperature control system to ensure that the operating temperature of the laser generator is maintained within the expected range without being affected by the external ambient temperature. Utility Model Content

[0003] The main purpose of the utility model is to provide a temperature control system and a laser radar, aiming to ensure that the operating temperature of the laser generator is maintained within a desired range without being affected by the external ambient temperature.

[0004] In order to achieve the above object, the utility model proposes a temperature control system, comprising:

[0005] A processor, the processor is used to execute corresponding working instructions according to the burned program set;

[0006] A temperature sensor is electrically connected to the processor and converts the collected temperature signal into an electrical signal and sends it to the processor;

[0007] The temperature controller is electrically connected to the processor, receives instructions sent by the processor, and performs corresponding temperature control operations according to the instructions of the processor.

[0008] In one embodiment of the present application, the temperature controller includes a semiconductor thermoelectric module for changing the ambient temperature, a semiconductor driving module electrically connected to the semiconductor thermoelectric module, the semiconductor driving module is used to control the working mode of the semiconductor thermoelectric module, and the semiconductor driving module is electrically connected to the processor.

[0009] In one embodiment of the present application, the semiconductor thermoelectric module is arranged in the laser radar cabin, and an air suction fan, an internal heat transfer plate, a semiconductor thermoelectric module, an external heat sink, and an air blowing fan are arranged in sequence from the inside of the laser radar cabin to the outside of the cabin.

[0010] In one embodiment of the present application, the semiconductor driving module has an H-bridge driving circuit composed of four field effect transistors, the semiconductor thermoelectric module is connected to the middle crossbeam of the H-bridge driving circuit, and the upper and lower parts of the H-bridge driving circuit are respectively connected to the power supply and the common ground; every two field effect transistors are connected to form a half bridge of the H-bridge driving circuit, and the gates of the two field effect transistors are connected to the common node; each half bridge is also connected to a control circuit; the control circuits are connected to the power supply end and the signal end in sequence via a pull-down resistor, a common node, a transistor collector, a transistor base, and a current limiting resistor; the signal ends of the two half bridges are respectively connected to the two output ports of the processor.

[0011] In one embodiment of the present application, the temperature control system further includes a parameter memory, wherein the parameter memory is used to store configuration information, and the parameter memory is electrically connected to the processor.

[0012] In one embodiment of the present application, the temperature control system further includes an input device, and the input device is connected to the processor signal.

[0013] In one embodiment of the present application, the input device is a host computer connected to the processor signal.

[0014] In one embodiment of the present application, the temperature control system further includes a communication module, the communication module is electrically connected to the processor, and the communication module is signal-connected to the host computer.

[0015] In one embodiment of the present application, the temperature control system further includes an alarm module, which is electrically connected to the processor and is configured to issue an alarm when the temperature exceeds a predetermined range.

[0016] The present application also discloses a laser radar, comprising a temperature control system as described in any of the above items.

[0017] By adopting the above technical solution, through the electrical connection between the temperature sensor and the temperature controller, the processor can accurately receive and process the temperature signal obtained from the temperature sensor, thereby performing accurate temperature control to ensure the operating status and efficiency of the equipment. The temperature sensor automatically collects the temperature of the environment, converts it into an electrical signal and sends it to the processor. The processor determines the current temperature change based on the acquired electrical signal and automatically issues a work instruction, thereby realizing automated temperature control, reducing manual intervention and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is described in detail below with reference to specific embodiments and accompanying drawings, wherein:

[0019] Figure 1 This is a schematic diagram of the temperature control system structure of the utility model;

[0020] Figure 2It is a schematic diagram of the structure of the temperature controller 3 of the utility model;

[0021] Figure 3 This is a schematic diagram of the installation of the temperature controller 3 of the utility model;

[0022] Figure 4 It is a circuit diagram of the semiconductor driving module 31 of the temperature controller 3 of the utility model;

[0023] Figure 5 It is a further structural schematic diagram of the temperature control system of the utility model;

[0024] Figure 6 for Figure 5 Schematic diagram of the working process of the temperature control system;

[0025] 1. Processor; 2. Temperature sensor; 3. Temperature controller; 4. Parameter memory; 5. Communication module; 6. Host computer; 7. Alarm module; 31. Semiconductor drive module; 32. Semiconductor thermoelectric module; 33. Suction fan; 34. Internal heat transfer plate; 35. External heat sink; 36. Blowing fan. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the following specific embodiments are only used to explain the utility model and do not constitute a limitation on the utility model.

[0027] Figure 1 The schematic diagram of the temperature control system of the utility model is shown in FIG. This temperature control system includes three main parts: a processor 1, a temperature sensor 2 and a temperature controller 3. The processor 1 runs according to a pre-set program and issues or executes instructions. The temperature sensor 2 detects the temperature and converts the collected temperature into an electrical signal and sends it to the processor 1. After receiving the instruction from the processor 1, the temperature controller 3 adjusts the temperature according to the received instruction, thereby achieving temperature regulation.

[0028] like Figure 2As shown, the temperature controller 3 is mainly composed of two parts: one part is a semiconductor drive module 31, and the other part is a semiconductor thermoelectric module 32. One or more semiconductor thermoelectric modules 32 can be used according to the required heat dissipation and heat dissipation area. Among them, the semiconductor thermoelectric module 32 can use electric energy to achieve cooling or heating. It uses the Peltier effect, that is, when the current passes through the contact point between two different conductors, a temperature difference will be generated, causing one contact point to cool and the other contact point to heat. Therefore, when the direction of the current changes, the cooling surface and heating surface of the semiconductor thermoelectric module 32 will also change accordingly. This allows the semiconductor thermoelectric module 32 to provide cooling or heating on demand. When there is no power, the semiconductor thermoelectric module 32 does not work.

[0029] The semiconductor thermoelectric module 32 adopts Figure 3 From the inside of the laser radar cabin to the outside of the cabin, the suction fan 33, the inner heat transfer plate 34, the semiconductor thermoelectric module 32, the outer heat sink 35 and the blowing fan 36 are installed in sequence.

[0030] The function of the suction fan 33 is to suck in the air in the cabin. Immediately following the suction fan 33 is the internal heat transfer plate 34, which is in close contact with the surface of the semiconductor thermoelectric module 32 through thermal grease to achieve heat transfer. The semiconductor thermoelectric module 32 is located behind the internal heat transfer plate 34. It is the core of the system and is responsible for achieving the function of cooling or heating. According to needs, multiple semiconductor thermoelectric modules 32 can be installed in the lidar cabin, for example, six are arranged.

[0031] On the outside of the semiconductor thermoelectric module 32 is an external heat sink 35, which is also in contact with the semiconductor thermoelectric module 32 through thermal grease, and its main task is to conduct the heat collected by the semiconductor thermoelectric module 32 to the outside. The blower fan 36 is located at the outermost side, and its function is to release the heat on the external heat sink 35 to the environment, thereby reducing the workload of the semiconductor thermoelectric module 32.

[0032] In order to achieve effective temperature management, when the semiconductor thermoelectric module 32 is working, the suction fan 33 draws air from the inside of the laser radar, adjusts the temperature through the semiconductor thermoelectric module 32, and then sends it back to the laser radar cabin. This circulation ensures that the air temperature in the cabin is evenly distributed and maintained within the required temperature range.

[0033] Whether cooling or heating, the combination of the suction fan 33 and the internal heat transfer sheet 34 ensures the balanced distribution of temperature in the laser radar cabin. The configuration of the semiconductor thermoelectric module 32, the external heat sink 35 and the blowing fan 36 ensures the efficient energy use of the system, realizes the reverse gradient maintenance of the temperature, and meets the temperature management requirements of the laser radar.

[0034] In order to enable the semiconductor thermoelectric module 32 to switch between cooling and heating, it is possible to set Figure 4 The semiconductor driving module 31 shown. The semiconductor driving module 31 controls the working state of the semiconductor thermoelectric module 32. The semiconductor driving module 31 includes an H-bridge driving circuit composed of four field effect transistors. In this H-bridge driving circuit, the semiconductor thermoelectric module 32 is connected to the middle crossbeam part, and the top and bottom of the H bridge are connected to the power supply and the ground wire respectively.

[0035] Each half-bridge is composed of two field effect transistors connected in series, and the gates of the two field effect transistors are connected together to form a common node C. There is also a control circuit in each half-bridge, which includes the following parts: first a pull-down resistor, then connected to the common node C, then through the collector of a transistor to the base, and finally connected to the power supply and signal terminal through a current limiting resistor.

[0036] The processor 1 has two output terminals, which are respectively connected to the signal terminals of the two half bridges of the H-bridge driving circuit. By changing the level (high or low) of the output terminal of the processor 1, the direction of the current passing through the semiconductor thermoelectric module 32 can be controlled, thereby realizing the switching control of the function of the semiconductor thermoelectric module 32.

[0037] Specifically, if the semiconductor thermoelectric module 32 is set to the cooling mode, we will set the first signal end to a high level and the second signal end to a low level. If the semiconductor thermoelectric module 32 needs to be switched to the heating mode, then only the first signal end needs to be set to a low level and the second signal end needs to be set to a high level to achieve the reversal of the current direction. If the levels of the two signal ends are the same (both high or both low), the semiconductor thermoelectric module 32 will not work. In this way, the working mode of the semiconductor thermoelectric module 32 can be flexibly controlled to achieve the switching between cooling and heating.

[0038] Its working principle is as follows Figure 4 As shown, processor 1 sends out two control signals, signal A and signal B.

[0039] In cooling mode, if signal A is high and signal B is low, transistor Q3 will be turned on and Q4 will be turned off. At this time, field effect transistors Q1 and Q6 will be turned on, while Q2 and Q5 will be turned off. After this connection, pin 1 of the green connector JP31 becomes the positive pole and pin 2 becomes the negative pole. If you want to use this driver circuit board to drive the semiconductor temperature control system, you need to connect the positive pole of the semiconductor temperature control system to pin 1 of JP31 and the negative pole to pin 2. At this time, the semiconductor thermoelectric module 32 connected to the drive circuit will start cooling and work on the radar side, and the fan will blow cold air into the radar cabin to reduce the temperature of the radar. The heat collected by the other end face of the semiconductor thermoelectric module 32 will be absorbed by the heat sink on the outside, and then the fan will disperse the heat on the heat sink to the surrounding environment.

[0040] In the heating mode, if signal A is low and signal B is high, the scene will change. At this time, the radar side of the semiconductor thermoelectric module 32 will start heating, while the other side will discharge the generated water vapor into the external environment.

[0041] When the processor 1 makes both signal A and signal B at a high level or at a low level, the semiconductor temperature control system will not work. In this way, by controlling the level states of signals A and B, the working mode of the semiconductor thermoelectric module 32 can be controlled to switch from cooling to heating, or the system can be suspended.

[0042] like Figure 5 As shown, the temperature control system includes a parameter memory 4 for storing configuration information, referred to as parameter memory 4. Parameter memory 4 is directly connected to processor 1. The system also includes an input device, which communicates signals with processor 1. Through the input device, maintenance personnel can set parameters for processor 1 to achieve configuration changes such as modifying the upper and lower limits of the temperature control range. Processor 1 is responsible for saving these configuration information in parameter memory 4.

[0043] In addition, the input device may be a host computer 6 connected to the processor 1 by signal. The temperature control system further includes a communication module 5 connected to the processor 1. Through the communication module 5, the system can realize wireless communication. This allows maintenance personnel to remotely operate and wirelessly modify the configuration through the host computer 6 without having to go to the site in person. The configuration modification information is transmitted from the host computer 6 to the processor 1 through the communication module 5.

[0044] In addition, the temperature control system is also designed with an alarm module connected to the processor 1. Based on the data fed back by the temperature sensor 2 and the working condition of the system, the processor 1 can determine whether the system is working properly. If the temperature exceeds the preset range, the alarm module will sound an alarm to alert the maintenance personnel.

[0045] In this temperature control system, processor 1 uses a single-chip microcomputer of the ST series. Temperature sensor 2 uses the SHT35 model. The parameter storage module uses EEPROM. Communication module 5 is based on the ESP8266 chip. Using the ESP8266 chip as a bridge, maintenance personnel can remotely adjust the upper and lower limit set values ​​of the temperature, as well as turn on or off the function of the temperature control module. The description of the working cycle is shown in Figure 6 .

[0046] High temperatures and direct sunlight in summer often increase the internal temperature of outdoor LiDARs. In this case, the industrial computer may not be able to operate normally, or the laser may not be able to emit light due to high temperature alarms. If semiconductors are simply used for temperature control, there will be two problems: first, the temperature information cannot be displayed intuitively, so it is difficult to effectively monitor the operating status of a specific site radar; second, the operation is inconvenient. If the set temperature in the radar cabin of a certain site needs to be changed, the shell must be disassembled on site for setting. This not only wastes human resources and increases the company's maintenance costs, but also the risk of the radar being damaged due to water ingress may be caused by frequent disassembly of the shell.

[0047] The above problems can be avoided by using a wireless temperature control system. This system can connect to the Internet via a wireless network and monitor and control the temperature inside the lidar in real time on a cloud platform. In general, the wireless temperature control system can not only solve the problem of the radar not being able to work properly due to excessive temperature, but also check the temperature conditions inside the radar in real time. In addition, the system also allows the upper or lower limit of the temperature to be set remotely through the control end, and the internal temperature of the radar can be adjusted more reasonably according to the actual situation to ensure that the radar is in the best working condition.

[0048] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A temperature control system, characterized in that: include: A processor, the processor is used to execute corresponding working instructions according to the burned program set; A temperature sensor is electrically connected to the processor and converts the collected temperature signal into an electrical signal and sends it to the processor; The temperature controller is electrically connected to the processor, receives instructions sent by the processor, and performs corresponding temperature control operations according to the instructions of the processor.

2. The temperature control system according to claim 1, characterized in that: The temperature controller includes a semiconductor thermoelectric module for changing the ambient temperature, a semiconductor driving module electrically connected to the semiconductor thermoelectric module, the semiconductor driving module is used to control the working mode of the semiconductor thermoelectric module, and the semiconductor driving module is electrically connected to the processor.

3. The temperature control system according to claim 2, characterized in that: The semiconductor thermoelectric module is arranged in the laser radar cabin, and an air suction fan, an internal heat transfer plate, a semiconductor thermoelectric module, an external heat sink, and an air blowing fan are arranged in sequence from the inside of the laser radar cabin to the outside of the cabin.

4. The temperature control system according to claim 2, characterized in that: The semiconductor driving module has an H-bridge driving circuit composed of four field effect transistors, the semiconductor thermoelectric module is connected to the middle crossbeam of the H-bridge driving circuit, and the upper and lower parts of the H-bridge driving circuit are respectively connected to the power supply and the common ground; every two field effect transistors are connected to form a half bridge of the H-bridge driving circuit, and the gates of the two field effect transistors are connected to the common node; each half bridge is also connected to a control circuit; the control circuits are connected to the power supply end and the signal end via a pull-down resistor, a common node, a transistor collector, a transistor base, and a current limiting resistor in sequence; the signal ends of the two half bridges are respectively connected to the two output ports of the processor.

5. The temperature control system according to any one of claims 1 to 4, characterized in that: The temperature control system further comprises a parameter memory, wherein the parameter memory is used to store configuration information, and the parameter memory is electrically connected to the processor.

6. The temperature control system according to any one of claims 1 to 4, characterized in that: The temperature control system further comprises an input device, which is connected to the processor signal.

7. The temperature control system according to claim 6, characterized in that: The input device is a host computer connected to the processor signal.

8. The temperature control system according to claim 7, characterized in that: The temperature control system also includes a communication module, which is electrically connected to the processor and has a signal connection with the host computer.

9. The temperature control system according to any one of claims 1 to 4, characterized in that: The temperature control system also includes an alarm module, which is electrically connected to the processor and is used to issue an alarm when the temperature exceeds a predetermined range.

10. A laser radar, characterized in that: Comprising a temperature control system as described in any one of claims 1-9.