Liquid cooling plate heat dissipation structure

Abstract

The utility model discloses a liquid cooling plate heat dissipation structure, which comprises a cold head, a cold row and a water pipe, the cold head comprises a liquid cooling plate, heat dissipation fins and a fan, the liquid cooling plate comprises an upper cover and a cooling plate, the upper cover and the cooling plate form an integrated structure through friction welding or brazing, the cooling plate is used for contact heat conduction of a CPU (Central Processing Unit) or a chip, the heat dissipation fins are assembled on the upper cover, and the fan is assembled on the upper cover. A heat-conducting medium (heat-conducting paste or heat-conducting paste) is added in the middle, and the fan is connected to the radiating fins. The integrated liquid cooling plate is adopted, the step that a user needs to assemble the liquid cooling plate through screws is omitted, and compared with a split structure locked through screws, the structure design that the upper cover and the cooling plate are integrated through friction welding or brazing is good in sealing effect and better in heat conduction effect; in addition, according to the utility model, the heat dissipation fins and the fan are additionally arranged on the basis of the liquid cooling plate, so that the heat dissipation effect of the CPU or the chip is further optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a liquid cooling plate heat dissipation structure. Background Art

[0002] Mainstream computer host radiators are generally divided into two types: air-cooled radiators and liquid-cooled radiators. Compared with traditional air-cooled radiators, liquid-cooled radiators have the advantages of better heat dissipation effect, lower temperature, high customizability and playability.

[0003] Liquid cooling radiators generally include a cold head, a cold radiator and a water pipe. The cold radiator is equipped with a cooling fan. The cold head directly contacts the surface of the computer CPU or chip. The other side of the cold head has many micro-water channels, which are connected to the cold radiator through water pipes. When working, the cold water of the cold radiator enters the cold head, and the hot water of the cold head flows back to the cold radiator. Due to the different reflux methods, the cold head is divided into a pump body cold head and a liquid cooling plate cold head. The traditional liquid cooling plate cold head usually assembles the cooling plate to the plastic cover with screws. Such a structure needs to be assembled with screws and sealing rings. The production efficiency is not high, and there are certain risks in stability and reliability. In addition, there is a risk of leakage, performance degradation or failure during long-term use. Therefore, it is necessary to improve it. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model aims to provide a liquid cooling plate heat dissipation structure.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a liquid cooling plate heat dissipation structure, including a liquid cooling plate, the liquid cooling plate includes an upper cover and a cooling plate, the upper cover and the cooling plate are formed into an integrated structure by friction welding or brazing, the cooling plate is used for CPU or chip contact heat conduction, the upper cover is provided with cooling fins, and a fan is provided above the cooling fins.

[0006] In a further technical solution, the upper cover is formed with a cooling groove, and a liquid inlet channel and a liquid outlet channel respectively connected to the cooling groove, and the front side of the cooling plate is formed with a plurality of micro-water channels protruding into the cooling groove.

[0007] In a further technical solution, the upper cover is concavely formed with a positioning groove, the cooling groove is secondary concavely formed from the positioning groove, the cooling plate is welded into the positioning groove, and the plate surface of the cooling plate is flush with the groove surface of the positioning groove.

[0008] In a further technical solution, a water inlet pipe joint is provided at the position of the liquid inlet flow channel of the upper cover, and a water outlet pipe joint is provided at the position of the liquid outlet flow channel of the upper cover.

[0009] In a further technical solution, the liquid inlet channel and the liquid outlet channel are respectively located on the left and right sides of the cooling tank.

[0010] In a further technical solution, the liquid inlet channel has a liquid inlet, the liquid outlet channel has a liquid outlet, the liquid inlet and the liquid outlet are located on the same side of the upper cover, and the liquid inlet channel, the liquid outlet channel and the cooling groove form a U-shaped water channel.

[0011] In a further technical solution, the upper cover and the cooling plate are made of copper or aluminum.

[0012] In a further technical solution, the water inlet pipe joint and the water outlet pipe joint can also be assembled to the upper cover by rivets, and the water inlet pipe joint and the water outlet pipe joint respectively use double-layer sealing rings to be connected or welded to the inlet channel and the outlet channel respectively.

[0013] In a further technical solution, the upper cover is formed with a plurality of first mounting holes, and the first mounting holes are used for assembling the heat dissipation fins.

[0014] In a further technical solution, the upper cover is formed with a second mounting hole, and the second mounting hole is used to connect the liquid cooling plate to an external computer motherboard structure.

[0015] After adopting the above structure, the utility model has the following advantages compared with the prior art:

[0016] The utility model adopts an integrated liquid cooling plate, and the upper cover and the cooling plate are integrated by friction welding or brazing. Compared with the split type locked by screws, this structural design has a good sealing effect, better heat conduction effect, and simpler and more convenient process steps; secondly, it eliminates the need for locking screws and sealing rings to assemble, which can improve production efficiency, enhance product stability and reliability, and there is no risk of leakage and performance degradation or failure during long-term use. The utility model also adds heat dissipation fins and fans on the basis of the liquid cooling plate, thereby further optimizing the heat dissipation effect of the liquid cooling plate. The heat dissipation fins conduct the heat of the liquid cooling plate, and the fan accelerates the heat dissipation of the heat dissipation fins. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0018] Figure 1 It is a schematic diagram of the use state of the utility model when it is assembled to the computer motherboard;

[0019] Figure 2 It is a structural schematic diagram of the cold head of the utility model;

[0020] Figure 3 It is a structural schematic diagram of the upper cover of the utility model;

[0021] Figure 4 It is a structural schematic diagram of a water inlet pipe joint, a water outlet pipe joint and an upper cover. DETAILED DESCRIPTION

[0022] The following are only preferred embodiments of the present invention, and do not limit the protection scope of the present invention.

[0023] like Figures 1 to 4 As shown, a liquid cooling plate heat dissipation structure provided by the utility model is applied to a water-cooled radiator. The water-cooled radiator includes a cold head, a cold row 2 and a water pipe 3 for connecting the cold head and the cold row 2. The cold head includes a liquid cooling plate 10, heat dissipation fins 11, a heat conducting medium, and a fan 12. The liquid cooling plate 10 includes an upper cover 100 and a cooling plate 101. The upper cover 100 and the cooling plate 101 are formed into an integrated structure by friction welding or brazing. The cooling plate 101 is used for CPU contact heat conduction. The heat dissipation fins 11 are assembled on the upper cover 100, and the fan 12 is connected to the heat dissipation fins 11.

[0024] The utility model adopts an integrated liquid cooling plate 10, and the upper cover 100 and the cooling plate 101 are integrated by friction welding or brazing. Compared with the split structure locked by screws, such a structure can not only ensure the firmness of welding, but also reduce the welding cost, thereby ensuring the sealing of the liquid cooling plate 10, increasing the service life of the liquid cooling plate 10, and having a better thermal conductivity. The process molding steps are also simpler and more convenient. Secondly, the utility model also adds heat dissipation fins 11 and a fan 12 on the basis of the liquid cooling plate 10, so as to further optimize the heat dissipation effect of the CPU.

[0025] Furthermore, the heat dissipation fins 11 between the upper cover 100 are provided with a heat conducting medium 13, and the heat conducting medium 13 can be a heat conducting paste or a heat conducting paste.

[0026] Specifically, the upper cover 100 is formed with a cooling groove 1000, and a liquid inlet channel 1001 and a liquid outlet channel 1002 respectively connected to the cooling groove 1000, and the front of the cooling plate 101 is formed with a plurality of micro-water channels 1010 protruding into the cooling groove 1000. The cold liquid in the radiator flows into the cooling groove 1000 through the liquid inlet channel 1001, and under the action of the micro-water channel 1010, the back side of the cooling plate 101 contacts the CPU, which has a heat conduction effect on the CPU, and the hot water after heat exchange is discharged through the liquid outlet channel 1002.

[0027] Specifically, the upper cover 100 is concavely formed with a positioning groove 1003 , the cooling groove 1000 is concavely formed twice from the positioning groove 1003 , the cooling plate 101 is welded into the positioning groove 1003 , and the plate surface of the cooling plate 101 is flush with the groove surface of the positioning groove 1003 .

[0028] Specifically, the liquid inlet channel 1001 of the upper cover 100 is connected to a water inlet pipe joint 102, and the liquid outlet channel 1002 of the upper cover 100 is connected to a water outlet pipe joint 103, and the joints are connected by double-layer sealing rings or directly welded together.

[0029] In a feasible implementation scheme, Figure 4 As shown, the water inlet pipe joint 102 and the water outlet pipe joint 103 can also be assembled to the upper cover 100 through rivets 104.

[0030] In this embodiment, the liquid inlet channel 1001 and the liquid outlet channel 1002 are respectively located on the left and right sides of the cooling groove 1000. Preferably, the liquid inlet channel 1001 has a liquid inlet, and the liquid outlet channel 1002 has a liquid outlet. The liquid inlet and the liquid outlet are located on the same side of the upper cover 100. The liquid inlet channel 1001, the liquid outlet channel 1002 and the cooling groove 1000 form a U-shaped water channel. The U-shaped water channel can prevent hot water from flowing back and causing heat exchange, and can ensure that the temperature of the cold liquid is low, and the cooling effect is better.

[0031] Preferably, the upper cover 100 and the cooling plate 101 are made of copper or aluminum to achieve the best heat conduction effect.

[0032] In this embodiment, the upper cover 100 is formed with a plurality of first mounting holes 1004 , and the first mounting holes 1004 are used to assemble the heat dissipation fins 11 .

[0033] The upper cover 100 is formed with a second mounting hole 1005 , and the second mounting hole 1005 is used to connect the liquid cooling plate 10 to an external computer motherboard structure.

[0034] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. A liquid cooling plate heat dissipation structure, comprising a liquid cooling plate (10), characterized in that: The liquid cooling plate (10) comprises an upper cover (100) and a cooling plate (101); the upper cover (100) and the cooling plate (101) are formed into an integrated structure by friction welding or brazing; the cooling plate (101) is used for contact heat conduction with a CPU or a chip; a heat dissipation fin (11) is provided on the upper cover (100); and a fan (12) is provided above the heat dissipation fin (11).

2. The liquid cooling plate heat dissipation structure according to claim 1, characterized in that: The upper cover (100) is formed with a cooling groove (1000), and a liquid inlet channel (1001) and a liquid outlet channel (1002) respectively connected to the cooling groove (1000), and the front surface of the cooling plate (101) is formed with a plurality of micro-water channels (1010) protruding into the cooling groove (1000).

3. The liquid cooling plate heat dissipation structure according to claim 2, characterized in that: The upper cover (100) is concavely formed with a positioning groove (1003), the cooling groove (1000) is secondary concavely formed from the positioning groove (1003), the cooling plate (101) is welded into the positioning groove (1003), and the plate surface of the cooling plate (101) is flush with the groove surface of the positioning groove (1003).

4. The liquid cooling plate heat dissipation structure according to claim 2, characterized in that: A water inlet pipe joint (102) is provided at the position of the liquid inlet flow channel (1001) of the upper cover (100), and a water outlet pipe joint (103) is provided at the position of the liquid outlet flow channel (1002) of the upper cover (100).

5. The liquid cooling plate heat dissipation structure according to claim 3, characterized in that: The liquid inlet channel (1001) and the liquid outlet channel (1002) are respectively located on the left and right sides of the cooling tank (1000).

6. The liquid cooling plate heat dissipation structure according to claim 5, characterized in that: The liquid inlet channel (1001) has a liquid inlet, and the liquid outlet channel (1002) has a liquid outlet. The liquid inlet and the liquid outlet are located on the same side of the upper cover (100). The liquid inlet channel (1001), the liquid outlet channel (1002) and the cooling groove (1000) form a U-shaped water channel.

7. The liquid cooling plate heat dissipation structure according to claim 4, characterized in that: The water inlet pipe joint (102) and the water outlet pipe joint (103) are assembled to the upper cover (100) via rivets (104); the water inlet pipe joint (102) and the water outlet pipe joint (103) are respectively connected or welded to the liquid inlet flow channel (1001) and the liquid outlet flow channel (1002) using double-layer sealing rings.

8. The liquid cooling plate heat dissipation structure according to claim 1, characterized in that: The upper cover (100) is formed with a plurality of first mounting holes (1004), and the first mounting holes (1004) are used for assembling the heat dissipation fins (11).

9. The liquid cooling plate heat dissipation structure according to claim 1, characterized in that: The upper cover (100) is formed with a second mounting hole (1005), and the second mounting hole (1005) is used to connect the liquid cooling plate (10) to an external computer motherboard, and is suitable for different chip architectures.

10. The liquid cooling plate heat dissipation structure according to claim 1, characterized in that: A heat-conducting medium (13) is provided between the upper cover (100) and the heat dissipation fins (11).

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