Lead frame row with pins provided with through grooves

Abstract

The utility model relates to the technical field of lead frames, in particular to a lead frame row with pins provided with through grooves, which comprises a plurality of lead frame groups, each lead frame group comprises a plurality of lead frame substrates, each lead frame substrate comprises a plurality of pins, each pin is provided with a through groove, the middle section of each pin is provided with a broadening part, and the broadening part is provided with a plurality of through grooves. According to the utility model, the width size of the middle section of the pin is locally increased by arranging the widening part, so that the advantage that the deformation risk of the middle section of the pin is smaller is realized.

Description

Technical Field

[0001] The present application relates to the technical field of lead frames, and more particularly to a lead frame array with through slots for pins. Background Art

[0002] Lead frames, as the chip carrier for integrated circuits, use bonding materials such as copper wire to electrically connect the chip's internal circuit terminals to external leads. They are required in most semiconductor integrated circuits and are a crucial foundational material in the electronics and information industry. When multiple lead frames are arranged in a certain manner, they form a lead frame row. During processing, a stamping device punches out the sheet to form the lead frame row. After the row is formed, the lead frame is trimmed to obtain the final lead frame.

[0003] Our company currently has a lead frame array, such as Figure 1 As shown, it includes several rows of lead frames 90 arranged side by side, each of the lead frames 90 includes a pin 901, and the pin 901 has a through slot 9011. Since the slot width of the through slot 9011 is slightly smaller than the width of the pin 901, the width of the portion of the pin 901 where the through slot 9011 is opened is narrower. Moreover, since the pin 901 is thin and long, the strength of the pin 901 is relatively low. During the process of picking up, transporting, trimming and packaging, there is a greater risk that the middle section of the pin 901 will be deformed or bent.

[0004] Therefore, there is a need to provide a lead frame array with through-slots for pins, which has a lower risk of deformation of the middle portion of the pins. Summary of the Invention

[0005] The main purpose of the present application is to provide a lead frame row with pins having through slots, wherein the lead frame row with pins having through slots includes a plurality of lead frame groups, each of the lead frame groups includes a plurality of lead frame bases, the lead frame bases include a plurality of pins, each of the pins has a through slot, and the middle section of each of the pins has a widening portion, and the maximum width dimension of the middle section of the pin is made greater than the maximum width dimension of the two ends of the pin. By providing the widening portion to partially increase the width dimension of the middle section of the pin, compared with the existing technology, the lead frame row has the advantage of less risk of deformation of the middle section of the pin.

[0006] Another object of the present application is to provide a lead frame row with pins having through grooves, wherein each lead frame group includes two lead frame bases, and the pins of the two lead frame bases are oriented in opposite directions and arranged alternately. By arranging the pins more densely, the utilization rate of the board material is improved, and the pin portion of the lead frame row with pins having through grooves is not easily deformed.

[0007] Another object of the present application is to provide a lead frame array with pins having through slots, wherein each lead frame base includes four chip seats, and the chip seats have a plurality of cross marks, which facilitate the printing of solder paste at a specified position.

[0008] In order to achieve at least one of the above-mentioned invention objectives, the present application provides a lead frame array with through slots for pins, wherein the lead frame array with through slots for pins comprises:

[0009] A plurality of lead frame groups are provided, each of which includes a plurality of lead frame bases, each of which includes a plurality of pins, each of which has a through slot, and a middle section of each pin has a widening portion, and the maximum width of the middle section of the pin is greater than the maximum width of the two ends of the pin.

[0010] In one or more embodiments of the present application, each of the lead frame groups includes two lead frame bases, and the pins of the two lead frame bases are oriented in opposite directions and are arranged alternately.

[0011] In one or more embodiments of the present application, each of the lead frame bases includes four spaced-apart pins, a connecting portion and four chip seats, the connecting portion is located between the pins and the chip seat, and the two ends of the connecting portion are respectively connected to the four pins and the four chip seats.

[0012] In one or more embodiments of the present application, the four chip seats include a first chip seat, a second chip seat, a third chip seat and a fourth chip seat, the second chip seat and the third chip seat are flush with one side close to the first chip seat, and the second chip seat and the third chip seat are both located between the first chip seat and the fourth chip seat.

[0013] In one or more embodiments of the present application, each of the chip pads of the lead frame base has a plurality of cross marks.

[0014] In one or more embodiments of the present application, both ends of the first chip holder have a cross mark, and the second chip holder and the third chip holder each have a cross mark on a side facing away from the first chip holder.

[0015] In one or more embodiments of the present application, the chip seat of each lead frame base has a plurality of grid patterns.

[0016] In one or more embodiments of the present application, the second chip holder and the third chip holder each have a grid pattern on one side close to the first chip holder, and both ends of the fourth chip holder each have a grid pattern.

[0017] In one or more embodiments of the present application, each of the first chip seat and the fourth chip seat has a positioning hole.

[0018] In one or more embodiments of the present application, the chip seat has a placement hole, and the placement hole is provided between the second chip seat and the third chip seat.

[0019] In an embodiment of the present application, a lead frame row with pins having through slots includes several lead frame groups, each lead frame group includes several lead frame bases, the lead frame bases include several pins, each pin has a through slot, and the middle section of each pin has a widening portion, and the maximum width dimension of the middle section of the pin is greater than the maximum width dimension of the two ends of the pin. By setting the widening portion to locally increase the width dimension of the middle section of the pin, compared with the existing technology, the risk of deformation of the middle section of the pin is smaller. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] These and / or other aspects and advantages of the present application will become more clear and easier to understand from the following detailed description of the embodiments of the present application in conjunction with the accompanying drawings, in which:

[0021] Figure 1 The figure shows a schematic structural diagram of an existing lead frame array;

[0022] Figure 2 The figure shows a schematic structural diagram of a lead frame group in a lead frame row with through slots for pins according to the present invention;

[0023] Figure 3 Pictured Figure 2 A local enlarged view of point C;

[0024] Figure 4 The figure shows a schematic structural diagram of a lead frame with through slots on the pins at a certain viewing angle. DETAILED DESCRIPTION

[0025] The terms and words used in the following description and claims are not limited to the literal meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present application. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present application is provided for illustration purposes only and not for the purpose of limiting the present application as defined by the appended claims and their equivalents.

[0026] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the elements may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0027] Although ordinal numbers such as "first," "second," and the like will be used to describe various components, these are not intended to limit those components. The terms are used solely to distinguish one component from another. For example, a first component could be referred to as a second component, and similarly, a second component could be referred to as a first component without departing from the teachings of the utility model. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0028] The terms used herein are for the purpose of describing various embodiments only and are not intended to be limiting. As used herein, the singular is intended to include the plural, unless the context clearly indicates otherwise. It will also be understood that the terms "comprising" and / or "having" when used in this specification specify the presence of a stated feature, number, step, operation, component, element, or combination thereof, and do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, elements, or groups thereof.

[0029] Application Overview

[0030] In a conventional lead frame arrangement, the width of the through-slot is slightly smaller than the width of the pin, resulting in a narrower width of the portion of the pin where the through-slot is formed. Furthermore, since the pin is thin and long, the strength of the pin is relatively low. This increases the risk of deformation or bending of the middle portion of the pin during handling, transportation, trimming, and packaging.

[0031] Based on the above technical problems, the present application proposes a lead frame row with pins and through grooves, wherein the lead frame row with pins and through grooves has a simple structure, does not involve complex manufacturing processes and expensive materials, and has high economic efficiency. At the same time, for manufacturers, the lead frame row with pins and through grooves provided by the present application is easy to produce and low in cost, which is more conducive to controlling production costs and further conducive to product promotion and use.

[0032] Schematic lead frame row with through slots.

[0033] refer to Figures 2 to 4 According to a preferred embodiment of the present invention, a lead frame row with pins having through slots includes a plurality of lead frame groups 10, which are arranged side by side and connected in sequence. Each of the lead frame groups 10 includes a plurality of lead frame bases 101, and the lead frame bases 101 include a plurality of pins 1011, and each of the pins 1011 has a through slot 10111.

[0034] It should be noted that the width of the through slot 10111 is greater than two-thirds of the maximum width of the pin 1011, so the actual area of ​​the pin 1011 where the through slot 10111 is opened is small. During the process of picking up, transporting, packaging, etc., when the two ends of the pin 1011 are subjected to force, the middle section of the pin 1011 is easily deformed or bent.

[0035] In view of this, in the embodiment of the present application, Figure 2 and Figure 3 As shown, the middle section of each pin 1011 has a widening portion 10112, and the maximum width of the middle section of the pin 1011 is greater than the maximum width of the two ends of the pin 1011. It should be noted that by providing the widening portion 10112 in the middle section of the pin 1011, the structural strength of the middle section of the pin 1011 is increased, which can effectively reduce the risk of deformation of the middle section of the pin 1011 when the two ends of the pin 1011 are subjected to force. Compared with the prior art in which the width of the middle section and the two ends of the pin 1011 are the same, the embodiment of the present application has a lower risk of deformation of the middle section of the pin.

[0036] Furthermore, in the embodiment of the present application, the number of the lead frame bases 101 in each lead frame group 10 is two, and the pins 1011 of the two lead frame bases 101 in each lead frame group 10 are oriented in opposite directions and are arranged alternately.

[0037] It should be noted that by making the pins 1011 of the two lead frame bases 101 have overlapping areas in the length direction of the pins 1011, when the number of lead frame rows with pins 1011 and through slots 10111 is two or more rows, the overall width of the lead frame rows with pins 1011 and through slots 10111 is smaller, and because the pins 1011 are arranged more densely, after the lead frame group 10 is punched out by external stamping equipment, the structural strength of the pins 1011 part of each group of the lead frame group 10 is also higher.

[0038] Furthermore, in the application examples, Figure 2 As shown, each of the lead frame bases 101 includes four spaced apart pins 1011, a connecting portion 1012 and four chip seats 1013, the connecting portion 1012 is located between the pins 1011 and the chip seats 1013, and the two ends of the connecting portion 1012 are respectively connected to the four pins 1011 and the four chip seats 1013, and the pins 1011 of each lead frame base 101 are connected to the connecting portion 1012 of another lead frame base 101.

[0039] It should be noted that the connecting portion 1012 is a long strip. After punching out the lead frame row with pins and through grooves, the connecting portion 1012 in each lead frame base 101 can be cut into multiple sections by an external punching device, and the pins 1011 and the chip seat 1013 are made to correspond one to one, and divided into four components.

[0040] Furthermore, if Figure 2 As shown, the four chip seats 1013 include a first chip seat 10131, a second chip seat 10132, a third chip seat 10133 and a fourth chip seat 10134. The second chip seat 10132 and the third chip seat 10133 are flush with the side close to the first chip seat 10131, and the second chip seat 10132 and the third chip seat 10133 are both located between the first chip seat 10131 and the fourth chip seat 10134.

[0041] More specifically, both side edges of the first chip holder 10131 are straight edges, the second chip holder 10132 and the third chip holder 10133 have a hook portion 10135 on the side facing each other, the side of the fourth chip holder 10134 facing away from the third chip holder 10133 is a straight edge, the fourth chip holder 10134 has a groove 10136 on the side close to the third chip holder 10133, the third chip holder 10133 has a contoured protrusion 10137 on the side close to the fourth chip holder 10134, the contoured protrusion 10137 extends into the groove 10136 by a predetermined distance and is spaced a predetermined distance from the groove wall of the groove 10136, the hook portion 10135 of the third chip holder 10133 is located on the outside of the hook portion 10135 of the second chip holder 10132, and the two hook portions 10135 are directed in opposite directions.

[0042] In addition, if Figure 2 As shown, Figure 4 As shown, each of the chip holders 1013 has a bent section 10138 at one end close to the connecting portion 1012. By providing the bent section 10138, the two ends of each chip holder 1013 are spaced apart by a predetermined distance in the height direction. It should be noted that the two ends of each chip holder 1013 are arranged in parallel; in addition, each of the chip holders 1013 has a through hole 10139 at one end close to the connecting portion 1012.

[0043] Furthermore, if Figure 2 As shown, the chip pad 1013 of each lead frame base 101 has a plurality of cross marks 1014 , and the cross marks 1014 extend downward from the top surface of the chip pad 1013 by a predetermined distance.

[0044] More specifically, both ends of the first chip holder 10131 have a cross mark 1014 , and the second chip holder 10132 and the third chip holder 10133 have a cross mark 1014 on their sides facing away from the first chip holder 10131 .

[0045] It should be noted that the cross mark 1014 is the center of the solder paste to be printed. By engraving the cross mark 1014 on the chip holder 1013, subsequent personnel can print the solder paste at a designated position.

[0046] Furthermore, if Figure 2 As shown, the chip base 1013 of each lead frame substrate 101 has a plurality of grid patterns 1015 , and the grid patterns 1015 extend downward from the top surface of the chip base 1013 by a predetermined distance.

[0047] More specifically, the second chip seat 10132 and the third chip seat 10133 each have a grid pattern 1015 on one side close to the first chip seat 10131 , and both ends of the fourth chip seat 10134 each have a grid pattern 1015 .

[0048] It should be noted that, by providing the grid pattern 1015 on the chip seat 1013 , it helps to increase the tighter combination of the chip and the lead frame during packaging.

[0049] Furthermore, to facilitate packaging positioning, as Figure 2 As shown, the first chip seat 10131 and the fourth chip seat 10134 both have a positioning hole 1016. It should be noted that the positioning hole 1016 on the first chip seat 10131 is located between the two cross marks 1014, and the positioning hole 1016 on the fourth chip seat 10134 is located between the two grid patterns 1015.

[0050] In addition, if Figure 2 As shown, the chip seat 1013 has a placement hole 1017, and the placement hole 1017 is arranged between the second chip seat 10132 and the third chip seat 10133. More specifically, the second chip seat 10132 and the third chip seat 10133 both have a semicircular notch, and the semicircular notch and the second chip seat 10132 and the third chip seat 10133 together form the placement hole 1017 in the spacing area in the length direction of the pin 1011.

[0051] In summary, the lead frame array with through slots for pins according to the embodiment of the present application is explained, which provides the lead frame array with through slots for pins with advantages such as a lower risk of deformation of the middle section of the pins.

[0052] It is worth mentioning that in the embodiments of the present application, the lead frame array with through-slots for pins has a simple structure, does not involve complex manufacturing processes and expensive materials, and is highly economical. Furthermore, for manufacturers, the lead frame array with through-slots for pins provided in the present application is easy to produce and is low-cost, which is more conducive to controlling production costs and further promoting product promotion and use.

[0053] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are provided for illustrative purposes only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from these principles.

Claims

1. A lead frame row with through slots for pins, characterized in that: The lead frame row with pin through slots includes A plurality of lead frame groups, each of which includes a plurality of lead frame bases, each of which includes a plurality of pins, each of which has a through slot, and a middle section of each of which has a widening portion, and the maximum width of the middle section of the pin is greater than the maximum width of both ends of the pin.

2. The lead frame array with through slots for pins according to claim 1, characterized in that: Each of the lead frame groups includes two lead frame bases, and the pins of the two lead frame bases are oriented in opposite directions and are arranged alternately.

3. The lead frame array with through slots for pins according to claim 2, characterized in that: Each of the lead frame substrates comprises four pins arranged at intervals, a connecting portion and four chip seats, the connecting portion is located between the pins and the chip seat, and two ends of the connecting portion are respectively connected to the four pins and the four chip seats.

4. The lead frame array with through slots for pins according to claim 3, characterized in that: The four chip seats include a first chip seat, a second chip seat, a third chip seat and a fourth chip seat, the second chip seat and the third chip seat are flush with one side close to the first chip seat, and the second chip seat and the third chip seat are both located between the first chip seat and the fourth chip seat.

5. The lead frame array with through slots for pins according to claim 4, characterized in that: The chip seat of each lead frame substrate has a plurality of cross marks.

6. The lead frame array with through slots for pins according to claim 5, characterized in that: Both ends of the first chip base have a cross mark, and the second chip base and the third chip base have a cross mark on one side facing away from the first chip base.

7. The lead frame array with through slots for pins according to claim 4, characterized in that: The chip seat of each lead frame substrate is provided with a plurality of grid patterns.

8. The lead frame array with through slots for pins according to claim 7, characterized in that: The second chip seat and the third chip seat have a grid pattern on one side close to the first chip seat, and both ends of the fourth chip seat have a grid pattern.

9. The lead frame row with through slots for pins according to any one of claims 4 to 8, characterized in that: The first chip seat and the fourth chip seat each have a positioning hole.

10. The lead frame array with through slots for pins according to claim 9, characterized in that: The chip seat has a placement hole, and the placement hole is arranged between the second chip seat and the third chip seat.

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