Packaging device of perovskite solar cell

Abstract

The utility model belongs to the technical field of perovskite solar cell packaging, and particularly discloses a packaging device of a perovskite solar cell, which comprises a substrate, a transparent conductive layer and a perovskite assembly which are sequentially stacked from bottom to top, and the transparent conductive layer is also provided with a packaging assembly and a reinforcing bonding layer; wherein the packaging assembly is formed by multiple layers of packaging adhesives and is of a shell structure, transverse and longitudinal stacking areas are formed at the bottom edges of the periphery of the packaging assembly in the horizontal direction at least through the inner and outer layers of packaging adhesives, the perovskite assembly is completely wrapped in the shell, and the reinforcing bonding layer at least completely covers the transverse and longitudinal stacking areas. According to the utility model, the perovskite assembly is sealed in all directions from the horizontal direction and the vertical direction through the packaging assembly, and the packaging assembly and the reinforcing bonding layer are bonded with the transparent conductive layer, so that the erosion of water and oxygen to the perovskite assembly is blocked, and the thickness and the weight of the device are not greatly increased; therefore, the preparation of the flexible perovskite solar cell with high stability is facilitated.

Description

Technical Field

[0001] The utility model belongs to the technical field of titanium ore solar cell packaging, and in particular relates to a packaging device for a perovskite solar cell. Background Art

[0002] With the rapid development of new energy, photovoltaic power generation has been widely used in military, aerospace, industry, commerce, agriculture and communications. Perovskite solar cells are a new type of photovoltaic device. In just over ten years since 2009, the efficiency of small-area devices in the laboratory has exceeded 25%. Compared with crystalline silicon solar cells that occupy more than 90% of the market, perovskite solar cells are relatively cheaper and can be flexible. In addition, the efficiency is very close to the certified efficiency record of crystalline silicon cells. However, the stability of its devices is not ideal. Perovskite materials are easily decomposed under conditions such as water, oxygen, light, and heat, which seriously affects the photoelectric conversion efficiency, stability, and life of perovskite solar cells in outdoor use, hindering their further industrialization. Therefore, the main technical bottleneck facing perovskite solar cells is the long-term stability of the battery.

[0003] In order to solve the problem of poor stability of perovskite solar cells, the industry usually packages them before practical application. However, the existing technology usually coats UV-curable frame glue on the packaging glass / metal during packaging, or coats frame glue and fills it with desiccant, so that after the frame glue is cured, a relatively closed environment is provided for the photovoltaic module, thereby isolating water and oxygen from entering. The above traditional packaging technology can achieve an effective water / oxygen barrier effect, but it will increase the thickness and weight of the device, and is therefore particularly unfavorable for the preparation of flexible perovskite solar cells.

[0004] In view of this, this utility model is proposed. Utility Model Content

[0005] The purpose of the utility model is to overcome the shortcomings of the above-mentioned prior art and provide a packaging device for a perovskite solar cell. The packaging device provided by the utility model can not only effectively block the influence of water and oxygen on the perovskite component, and improve the service life of the perovskite solar cell in outdoor use, but also will not significantly increase the thickness and weight of the device, and is therefore conducive to the preparation of a highly stable and flexible perovskite solar cell.

[0006] The purpose of the utility model is to solve the problem through the following technical solutions:

[0007] The utility model provides a packaging device for a perovskite solar cell, comprising:

[0008] substrate;

[0009] A transparent conductive layer, wherein the transparent conductive layer is disposed on the upper portion of the substrate;

[0010] A perovskite component, wherein the perovskite component is disposed on the upper portion of the transparent conductive layer;

[0011] A packaging component, wherein the packaging component is formed by multiple layers of packaging glue and presents a shell structure, and at least two layers of inner and outer packaging glue are stacked horizontally outwardly at the bottom edge of the shell structure to form a transverse stacking area and a longitudinal stacking area, the packaging component is bonded to the upper part of the transparent conductive layer, and the perovskite component is completely enclosed in the accommodating chamber of the shell structure;

[0012] A reinforcing adhesive layer at least completely covers the transverse stacking area and the longitudinal stacking area and is bonded to the upper portion of the transparent conductive layer.

[0013] Furthermore, the packaging component is formed by three layers of packaging glue, including a first packaging glue layer, a second packaging glue layer and a third packaging glue layer arranged in sequence from the inside to the outside, the first packaging glue layer wraps the upper surface and four sides of the perovskite component, and the four sides of the first packaging glue layer extend outward in a horizontal direction and contact with the upper surface of the transparent conductive layer, the third packaging glue layer wraps the second packaging glue layer, and the four sides of the third packaging glue layer extend outward in a horizontal direction and are stacked on the first packaging glue layer.

[0014] Furthermore, the encapsulation adhesive material selected for the first encapsulation adhesive layer, the second encapsulation adhesive layer and the third encapsulation adhesive layer is an inorganic material or an organic material, and the encapsulation adhesive materials used in two adjacent encapsulation adhesive layers are different.

[0015] Furthermore, the packaging glue materials used for the first packaging glue layer and the third packaging glue layer are both inorganic materials, and the thickness is 50nm to 1μm;

[0016] The packaging glue material selected for the second packaging glue layer is an organic material, and the thickness is 50nm-10μm.

[0017] Furthermore, the inorganic material is any one of silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide, which can further enhance the barrier effect against water vapor, while also providing a flat surface for subsequent film formation to prevent defect expansion; the organic material is a high molecular polymer or resin material, such as colorless and transparent epoxy encapsulant, silicone encapsulant, polyurethane encapsulant, epoxy resin or acrylic resin, etc.

[0018] Furthermore, the first encapsulation adhesive layer, the second encapsulation adhesive layer and the third encapsulation adhesive layer are all formed by coating. Specifically, if the first encapsulation adhesive layer, the second encapsulation adhesive layer or the third encapsulation adhesive layer is made of inorganic material, the corresponding encapsulation adhesive layer is formed by PECVD, ALD or sputtering; if the first encapsulation adhesive layer, the second encapsulation adhesive layer or the third encapsulation adhesive layer is made of organic material, the corresponding encapsulation adhesive layer is formed by jet dispensing, spin coating, screen printing or inkjet printing.

[0019] Furthermore, the reinforcing adhesive layer completely covers the longitudinal packaging area of ​​the outer surface around the packaging component.

[0020] Furthermore, the reinforcing adhesive layer completely covers the longitudinal packaging area on the outer surface of the packaging component on all sides and the transverse packaging area covering the top outer surface of the packaging component, and the longitudinal packaging area and the transverse packaging area are transitionally connected as one.

[0021] Furthermore, the material of the reinforcing adhesive layer is UV curing glue or heat curing glue, or one or more of other curing glue materials, preferably a curing glue with water and oxygen barrier properties.

[0022] Furthermore, the perovskite component includes a first transmission layer, a perovskite layer, a second transmission layer and a back electrode layer stacked in sequence from bottom to top, the lower surface of the first transmission layer is in contact with the upper surface of the transparent conductive layer, and the upper surface of the back electrode layer is in contact with the top surface of the accommodating chamber of the packaging component;

[0023] Wherein, the first transport layer is a hole transport layer, and the second transport layer is an electron transport layer; or

[0024] The first transport layer is an electron transport layer, and the second transport layer is a hole transport layer.

[0025] Furthermore, the material of the substrate includes any one of ultra-clear glass plate, tempered glass plate, stainless steel plate, metal foil, polyethylene terephthalate plate or polyethylene naphthalate plate, and polyimide.

[0026] Compared with the prior art, the utility model has the following beneficial effects:

[0027] The packaging device of the perovskite solar cell provided by the utility model is provided with a shell-shaped packaging component on the transparent conductive layer, and the packaging component is formed by a multi-layer packaging adhesive, and at least two layers of inner and outer packaging adhesive are stacked horizontally outwardly at the bottom edge of the shell structure to form a transverse stacking area and a longitudinal stacking area, and at the same time, a reinforcing adhesive layer that at least completely covers the transverse stacking area and the longitudinal stacking area is provided outside the packaging component, that is, the perovskite component is multi-packaged in all directions from the horizontal direction and the vertical direction, thereby blocking the corrosion of water and oxygen to the perovskite component, and at the same time, the packaging component and the reinforcing adhesive layer are both bonded to the transparent conductive layer, thereby enhancing The sealing is improved to protect the inorganic layer stacking area outside the edge area, to avoid the infiltration of water and oxygen due to breakage caused by excessive stress, and further enhance the water and oxygen barrier ability of the packaging device, thereby improving the stability and service life of the perovskite solar cell. In addition, the packaging device only has a lightweight packaging component and a reinforced adhesive layer, and no other substances are introduced, so the thickness and weight of the perovskite solar cell device will not be significantly increased, which is conducive to the further preparation of highly stable and flexible perovskite solar cells. At the same time, the packaging device has a simple process, high packaging efficiency, and good effect, and can be used to package large-area perovskite solar cells. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings herein are incorporated into and constitute a part of this specification, and together with the description, are used to explain the principles of the present utility model.

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 It is a schematic cross-sectional structure diagram of a packaging device for a perovskite solar cell according to Embodiment 1 of the present utility model;

[0031] Figure 2 It is a schematic cross-sectional structure diagram of a packaging device of a perovskite solar cell according to Embodiment 2 of the utility model;

[0032] Figure 3 It is a schematic diagram of the cross-sectional structure of the packaging device of the perovskite solar cell in Example 3 of the utility model.

[0033] in:

[0034] 10 is a substrate;

[0035] 20 is a transparent conductive layer;

[0036] 30 is a perovskite component; 31 is a first transmission layer; 32 is a perovskite layer; 33 is a second transmission layer; 34 is a back electrode layer;

[0037] 40 is a packaging component; 41 is a first packaging glue layer; 42 is a second packaging glue layer; 43 is a third packaging glue layer; A is a horizontal stacking area; B is a vertical stacking area; C is a vertical packaging area; D is a horizontal packaging area;

[0038] 50 is a reinforcing bonding layer. DETAILED DESCRIPTION

[0039] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the utility model. Instead, they are only examples of devices consistent with some aspects of the utility model as detailed in the attached claims.

[0040] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0041] Example 1

[0042] The utility model provides a packaging device for a perovskite solar cell, comprising a substrate 10, a transparent conductive layer 20 and a perovskite component 30 stacked in sequence from bottom to top, a packaging component 40 and a reinforcing adhesive layer 50 bonded to the transparent conductive layer 20, the packaging component 40 is formed by multiple layers of packaging glue and presents a shell structure, and at least two layers of inner and outer packaging glue are stacked horizontally outwardly at the bottom edge of the shell structure to form a transverse stacking area A and a longitudinal stacking area B, the perovskite component 30 is completely enclosed in the accommodating chamber of the shell structure packaging component 40, and the reinforcing adhesive layer 50 at least completely covers the transverse stacking area A and the longitudinal stacking area B. From the above content, it can be known that the present invention can perform multiple packaging of the perovskite component 30 from the horizontal direction and the vertical direction through the combined effect of the packaging component 40 formed by the multi-layer packaging glue and the reinforcing adhesive layer 50, thereby preventing water and oxygen from entering the perovskite component 30 and causing its decomposition; at the same time, since the lower surfaces of the packaging component 40 and the reinforcing adhesive layer 50 are effectively bonded to the upper surface of the transparent conductive layer 20, the sealing is increased, and at the same time, the stacking area outside the surrounding edge area is protected to avoid water and oxygen infiltration caused by fracture due to excessive stress, thereby significantly improving the ability of the packaging device to block water and oxygen. In addition, the packaging device of the present invention has only a lightweight packaging component 40 and a reinforcing adhesive layer 50, so it will not significantly increase the thickness and weight of the perovskite solar cell device, which is conducive to the preparation of a highly stable and flexible perovskite solar cell.

[0043] See also Figure 1 In this embodiment, the packaging component 40 is formed by three layers of packaging glue, specifically including a first packaging glue layer 41, a second packaging glue layer 42 and a third packaging glue layer 43 arranged in sequence from the inside to the outside. The first packaging glue layer 41 wraps the upper surface and the periphery of the perovskite component 30, and the periphery bottom edge of the first packaging glue layer 41 extends outward in the horizontal direction and contacts with the upper surface of the transparent conductive layer 20. The third packaging glue layer 43 wraps the second packaging glue layer 42, and the periphery bottom edge of the third packaging glue layer 43 extends outward in the horizontal direction and is stacked on the first packaging glue layer 41, that is, the first packaging glue layer 41 and the third packaging glue layer 43 are stacked in the horizontal direction at the periphery bottom edge to form a horizontal stacking area A and a vertical stacking area B. The difference between this embodiment and the first packaging glue layer 41 and the third packaging glue layer 43 is that the periphery bottom edge of the second packaging glue layer 42 does not extend outward horizontally. Further, from the cross-sectional structure, Figure 1 It can be seen that the second packaging adhesive layer 42 has an "n"-shaped structure, but the first packaging adhesive layer 41 and the third packaging adhesive layer 43 not only have the "n"-shaped structure, but also extend outward in the horizontal direction at the bottom edges around them, thereby completely wrapping the second packaging adhesive layer 42.

[0044] In the present invention, the encapsulation glue material selected for the first encapsulation glue layer 41, the second encapsulation glue layer 42 and the third encapsulation glue layer 43 is an inorganic material or an organic material, and the encapsulation glue materials used for the two adjacent encapsulation glue layers are different, and the first encapsulation glue layer 41, the second encapsulation glue layer 42 and the third encapsulation glue layer 43 are all formed by coating. In this embodiment, the encapsulation glue materials selected for the first encapsulation glue layer 41 and the third encapsulation glue layer 43 are both inorganic materials, and the thickness is 50nm~1μm, and the inorganic encapsulation glue layer is formed by PECVD, ALD or sputtering during preparation; the encapsulation glue material selected for the second encapsulation glue layer 42 is an organic material, and the thickness is 50nm~10μm, and the organic encapsulation glue layer is formed by jet dispensing method, spin coating method, screen printing method or inkjet printing method during preparation.

[0045] Preferably, the inorganic material used in the first packaging glue layer 41 and the third packaging glue layer 43 in this embodiment is any one of silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide. The inorganic layer can further enhance the barrier effect against water vapor, and also provide a flat surface for subsequent film formation to prevent defect expansion. The organic material used in the second packaging glue layer 42 is a high molecular polymer or resin material, such as colorless and transparent epoxy packaging glue, silicone packaging glue, polyurethane packaging glue, epoxy resin or acrylic resin.

[0046] In this embodiment, the reinforcing adhesive layer 50 only covers the transverse stacking area A and the longitudinal stacking area B, and is bonded to the upper surface of the transparent conductive layer 20. In addition, the reinforcing adhesive layer 50 is preferably a UV curing adhesive and a thermal curing adhesive, or one or more of other curing adhesives, as long as they have the property of blocking water and oxygen. After the curing treatment, the surface still has a certain viscosity, and the packaging component 40 can be tightly bonded to the transparent conductive layer 20. It can also release stress and play a role in protecting the inorganic layer stacking area outside the edge area, avoiding water and oxygen infiltration caused by fracture due to excessive stress, and further improving the water and oxygen blocking ability of the packaging device.

[0047] The perovskite component 30 in the utility model includes a first transmission layer 31, a perovskite layer 32, a second transmission layer 33 and a back electrode layer 34 stacked in sequence from bottom to top, the lower surface of the first transmission layer 31 is in contact with the upper surface of the transparent conductive layer 20, and the upper surface of the back electrode layer 34 is in contact with the top surface of the accommodating chamber of the packaging component 40; wherein the first transmission layer 31 is a hole transmission layer, and the second transmission layer 33 is an electron transmission layer, that is, at this time, the type of the perovskite solar cell is an inverted perovskite solar cell; or the first transmission layer 31 is an electron transmission layer, and the second transmission layer 33 is a hole transmission layer, that is, at this time, the type of the perovskite solar cell is a positive perovskite solar cell. In other words, the packaging device of the utility model mainly composed of the packaging component 40 and the reinforcement adhesive layer 50 is fully suitable for packaging existing positive or inverted perovskite solar cells.

[0048] Specifically, the material of the hole transport layer in this embodiment includes NiO x , MoS, MoO, CuS, CuSCN, PTAA, PEDOT or Spiro-MeOTAD, or a combination of at least two thereof; the material of the perovskite layer 32 includes a halide crystal having an ABX3 structure, wherein A is at least one of methylamine, guanidine, and cesium, B is any one of Sn, Bi, Sb, Ge, Cu or Pb ions, and X is at least one of halogen F, Cl, Br, and I; the electron transport layer includes TiO2, SnO2, ZnO2, IZO, WO3, Nb2O5, C 60 , PCBM fullerene and derivatives, BaSnO3 or AZO; the material of the back electrode layer 34 includes any one of Au, Ag, Cu, Al, Cr, Mo, carbon material, fluorine-doped tin oxide, indium-doped tin oxide, aluminum-doped zinc oxide, boron-doped zinc oxide or aluminum-doped tin oxide, or a combination of at least two thereof.

[0049] In this embodiment, the material of the substrate 10 includes any one of ultra-clear glass plate, tempered glass plate, stainless steel plate, metal foil, polyethylene terephthalate plate or polyethylene naphthalate plate, and polyimide.

[0050] In this embodiment, the material of the transparent conductive layer 20 includes but is not limited to one or more of indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), indium-doped zinc oxide (IZO), fluorine-doped tin oxide (FTO), indium tungsten oxide (IWO), indium cerium oxide (ICO), and Ag nanowires.

[0051] The preparation process of the packaging device of the perovskite solar cell provided by the utility model is as follows:

[0052] 1) providing a substrate 10, and disposing a transparent conductive layer 20 on the substrate 10,

[0053] 2) stacking a first transmission layer 31, a perovskite layer 32, a second transmission layer 33 and a back electrode layer 34 in sequence on the transparent conductive layer 20 to obtain a perovskite component 30;

[0054] 3) A first encapsulation glue layer 41, a second encapsulation glue layer 42 and a third encapsulation glue layer 43 are sequentially arranged on the periphery of the perovskite component 30, and are cured to obtain the encapsulation component 40; wherein the first encapsulation glue layer 41 wraps the upper surface and surrounding of the perovskite component 30, and the bottom edges of the surrounding of the first encapsulation glue layer 41 extend outward and contact with the upper surface of the transparent conductive layer 20, and the third encapsulation glue layer 43 wraps the second encapsulation glue layer 42, and the bottom edges of the surrounding of the third encapsulation glue layer 43 extend outward in the horizontal direction and are stacked on the first encapsulation glue layer 41, forming a horizontal stacking area A and a vertical stacking area B;

[0055] 4) A reinforcing adhesive layer 50 is provided outside the transverse stacking area A and the longitudinal stacking area B for covering, and the reinforcing adhesive layer 50 is bonded to the upper surface of the transparent conductive layer 20, and finally the reinforcing adhesive layer 50 is cured to finally obtain a packaging device for a perovskite solar cell.

[0056] Example 2

[0057] See also Figure 2 The only difference between this embodiment and embodiment 1 is that, in this embodiment, in addition to covering the transverse stacking area A and the longitudinal stacking area B, the reinforcing adhesive layer 50 also completely covers the longitudinal packaging area C on the outer surface of the entire packaging component 40.

[0058] Example 3

[0059] See also Figure 3 The only difference between this embodiment and embodiment 1 is that, in this embodiment, in addition to covering the horizontal stacking area A and the vertical stacking area B, the reinforcing adhesive layer 50 also completely covers the longitudinal packaging area C on the outer surface of the entire packaging component 40 and the transverse packaging area D on the top outer surface of the entire packaging component 40, and the longitudinal packaging area C and the transverse packaging area D are transitionally connected as a whole.

[0060] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0061] It should be understood that the present invention is not limited to the above-described contents, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A packaging device for a perovskite solar cell, characterized in that: include: base(10); A transparent conductive layer (20), the transparent conductive layer (20) being arranged on an upper portion of the substrate (10); A perovskite component (30), wherein the perovskite component (30) is arranged on an upper portion of the transparent conductive layer (20); A packaging component (40), the packaging component (40) is formed by multiple layers of packaging glue and presents a shell structure, and at least two layers of packaging glue are stacked outwardly along the horizontal direction at the bottom edge of the four sides of the shell structure to form a transverse stacking area (A) and a longitudinal stacking area (B), the packaging component (40) is bonded to the upper part of the transparent conductive layer (20), and the perovskite component (30) is completely enclosed in the accommodating chamber of the shell structure; A reinforcing adhesive layer (50), wherein the reinforcing adhesive layer (50) at least completely covers the transverse stacking area (A) and the longitudinal stacking area (B) and is bonded to the upper part of the transparent conductive layer (20).

2. The packaging device for a perovskite solar cell according to claim 1, characterized in that: The packaging component (40) is formed by three layers of packaging glue, including a first packaging glue layer (41), a second packaging glue layer (42) and a third packaging glue layer (43) which are arranged in sequence from the inside to the outside, wherein the first packaging glue layer (41) wraps the upper surface and surrounding areas of the perovskite component (30), and the bottom edges of the surrounding areas of the first packaging glue layer (41) extend outwards in a horizontal direction and contact the upper surface of the transparent conductive layer (20), and the third packaging glue layer (43) wraps the second packaging glue layer (42), and the bottom edges of the surrounding areas of the third packaging glue layer (43) extend outwards in a horizontal direction and are stacked on the first packaging glue layer (41).

3. The packaging device of the perovskite solar cell according to claim 2, characterized in that: The packaging adhesive materials used for the first packaging adhesive layer (41), the second packaging adhesive layer (42) and the third packaging adhesive layer (43) are inorganic materials or organic materials, and the packaging adhesive materials used for two adjacent packaging adhesive layers are different.

4. The packaging device for a perovskite solar cell according to claim 3, characterized in that: The packaging glue materials used for the first packaging glue layer (41) and the third packaging glue layer (43) are both inorganic materials, and the thickness is 50nm to 1μm; The packaging glue material selected for the second packaging glue layer (42) is an organic material, and has a thickness of 50nm-10μm.

5. The packaging device for a perovskite solar cell according to claim 3, characterized in that: The inorganic material is any one of silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide, and the organic material is a high molecular polymer or a resin material.

6. The packaging device for a perovskite solar cell according to claim 2, characterized in that: If the first encapsulation adhesive layer (41), the second encapsulation adhesive layer (42) or the third encapsulation adhesive layer (43) is made of an inorganic material, the corresponding encapsulation adhesive layer is formed by PECVD, ALD or sputtering; if the first encapsulation adhesive layer (41), the second encapsulation adhesive layer (42) or the third encapsulation adhesive layer (43) is made of an organic material, the corresponding encapsulation adhesive layer is formed by a jet dispensing method, a spin coating method, a screen printing method or an inkjet printing method.

7. The packaging device of a perovskite solar cell according to claim 1, characterized in that: The reinforcing adhesive layer (50) completely covers the longitudinal packaging area (C) of the outer surface around the packaging component (40).

8. The packaging device for a perovskite solar cell according to claim 1, characterized in that: The reinforcing adhesive layer (50) completely covers the longitudinal packaging area (C) on the outer surface of the packaging component (40) on all sides and the transverse packaging area (D) covering the top outer surface of the packaging component (40), and the longitudinal packaging area (C) and the transverse packaging area (D) are transitionally connected as a whole.

9. The packaging device for a perovskite solar cell according to claim 1, characterized in that: The material of the reinforcing adhesive layer (50) is UV curing glue or thermal curing glue having water and oxygen barrier properties.

10. The packaging device for a perovskite solar cell according to any one of claims 1 to 9, characterized in that: The perovskite component (30) comprises a first transmission layer (31), a perovskite layer (32), a second transmission layer (33) and a back electrode layer (34) stacked in sequence from bottom to top, the lower surface of the first transmission layer (31) is in contact with the upper surface of the transparent conductive layer (20), and the upper surface of the back electrode layer (34) is in contact with the top surface of the accommodating chamber of the packaging component (40); Wherein, the first transport layer (31) is a hole transport layer, and the second transport layer (33) is an electron transport layer; or The first transport layer (31) is an electron transport layer, and the second transport layer (33) is a hole transport layer.

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