Semiconductor wafer cutting device

Abstract

The utility model discloses a semiconductor wafer cutting device, which belongs to the technical field of semiconductor wafer cutting and comprises a shell, a supporting plate is mounted at the top of the shell, a cutting machine is mounted at the bottom of the supporting plate in a sliding manner, a water collecting bin is mounted in the shell, and a filter tank is fixed in the middle of the top of the shell. And a fixing table is installed in the shell, the top end of the fixing table penetrates through and extends into the filtering groove, and an outer gear ring is rotationally installed on the outer side of the fixing table. Through cooperative use of the shell, the water collecting bin, the pump body, the liquid inlet pipe, the cooling pipe, the filter tank, the fixed table, the motor, the gear, the outer gear ring, the rotary drum, the flow guide hopper, the brush plate, the supporting plate and the cutting machine, the mesh dredging rate of the filter tank can be kept without manually cleaning the filter tank regularly, and the purpose of saving manpower and material resources is achieved; and circulating use of the cooling liquid is promoted, so that the practicability of the semiconductor wafer cutting device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer cutting, in particular to a semiconductor wafer cutting device. Background Art

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. As the demand for wafers increases, the efficiency of wafer processing and production needs to be improved. In the production and application of semiconductors, wafer cutting is indispensable, and the cutting quality of semiconductor wafers directly determines whether the semiconductor is qualified.

[0003] For example, the utility model with application number 202222254142.3 discloses a semiconductor wafer cutting device. By setting a protective device and a dust reduction device, the structure and function of the existing semiconductor wafer cutting device are increased, so that when cutting the semiconductor wafer, the cutting sleeve can be effectively isolated and protected, and effective dust reduction work can be performed inside it, ensuring that the operator nearby will not inhale dust into the body during cutting, which is safer. At the same time, the dust in the protective cover can be effectively reduced quickly, ensuring that when the cut semiconductor wafer is taken out, no dust will float out to pollute the environment.

[0004] Similar to the above application, there are still some shortcomings:

[0005] This type of semiconductor wafer cutting device blocks the dust generated during the cutting process through protective devices and dust suppression devices. However, water cooling is used in the process of internally cutting semiconductor wafers, and a large amount of debris and impurities will be generated. If not handled in time, it will not only affect the filtration of cooling water and reduce the efficiency of recycling, but also cause mesh blockage and sewage overflow.

[0006] Therefore, a semiconductor wafer cutting device is designed to optimize the above-mentioned problems. Utility Model Content

[0007] The main purpose of the utility model is to provide a semiconductor wafer cutting device to solve the related technical problems raised in the above background technology.

[0008] The purpose of the utility model can be achieved by adopting the following technical solutions:

[0009] A semiconductor wafer cutting device comprises a shell, a support plate is installed on the top of the shell, a cutting machine is slidably installed on the bottom of the support plate, a water collecting bin is installed inside the shell, a filter tank is fixed at the middle position of the top of the shell, a fixed platform is installed inside the shell, and the top of the fixed platform passes through and extends to the inside of the filter tank, an outer gear ring is rotatably installed on the outer side of the fixed platform, a rotating drum is fixed on the bottom of the outer gear ring, a motor is fixed inside the shell, a gear is fixed on the output shaft of the motor, and the gear is meshed with the rotating drum, a brush plate is symmetrically installed on the outer side of the outer gear ring, a pump body is installed inside the water collecting bin, a liquid inlet pipe is fixed to the input end of the pump body, a cooling pipe is fixed to the output end of the pump body, and the top of the cooling pipe passes through and extends to the top of the shell, and a guide bucket is symmetrically installed on the bottom of the filter tank.

[0010] Preferably: electric push rods are installed on both sides of the shell, mounting plates are fixed to the telescopic ends of the electric push rods, and sound insulation covers are fixed between the mounting plates.

[0011] Preferably, magnetic columns are evenly installed on the bottom of the shell, and magnetic tubes are sleeved on the outer sides of the magnetic columns.

[0012] Preferably, a protective layer is provided inside the soundproof cover, and the protective layer is an anti-wear protective layer.

[0013] Preferably, a reinforcement pad is provided at the bottom of the magnetic tube, and the reinforcement pad is a rubber reinforcement pad.

[0014] Preferably, a fixing opening is provided on one side of the shell, and a movable plate is installed inside the fixing opening.

[0015] The beneficial effects of the utility model are:

[0016] The utility model provides a semiconductor wafer cutting device, which cooperates with a shell, a water collecting bin, a pump body, a liquid inlet pipe, a cooling pipe, a filter tank, a fixed platform, a motor, a gear, an outer gear ring, a rotating drum, a guide bucket, a brush plate, a support plate and a cutting machine. The cutting machine is started to cut the semiconductor wafer on the fixed platform, and the pump body is started so that the liquid inlet pipe sprays the water in the water collecting bin onto the fixed platform through the cooling pipe. The cooled cooling liquid enters the filter tank, and enters the guide bucket after being filtered in the filter tank and flows back to the water collecting bin. The motor is started to drive the gear to rotate, which drives the rotating drum, the outer gear ring and the brush plate to rotate. The brush plate brushes out impurities blocked in the mesh holes on the bottom wall of the filter tank, so that the mesh holes are completely exposed, which promotes the filtration of sewage and the reciprocating use, and can eliminate the need for manual timing of the filter tank. Cleaning can maintain the mesh dredging rate of the filter tank, achieve the purpose of saving manpower and material resources, promote the circulation of cooling liquid, and thus improve the practicality of the semiconductor wafer cutting device; through the coordinated use of the electric push rod, the mounting plate and the sound insulation cover, the electric push rod is turned on so that the telescopic end pushes the mounting plate and the sound insulation cover to move upward, until the sound insulation cover completely protects the support plate and the top of the shell, which not only plays a role in noise reduction, but also the sound insulation cover can be raised and lowered for easy maintenance of the inside of the shell, thereby meeting people's use needs; through the coordinated use of the magnetic column and the magnetic tube, the up and down shaking of the shell during operation will drive the magnetic column at the bottom to move up and down, and under the reaction force of the magnetic column and the magnetic tube, part of the vibration potential energy is offset, thereby improving the stability of the semiconductor wafer cutting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a front cross-sectional view of the utility model;

[0018] Figure 2 For the utility model Figure 1 A magnified view of the structure at center;

[0019] Figure 3 It is a structural schematic diagram of the utility model.

[0020] In the figure: 1. Shell; 2. Water collecting tank; 3. Pump body; 4. Liquid inlet pipe; 5. Cooling pipe; 6. Filter tank; 7. Fixed platform; 8. Motor; 9. Gear; 10. External gear ring; 11. Rotating drum; 12. Guide bucket; 13. Brush plate; 14. Support plate; 15. Cutting machine; 16. Electric push rod; 17. Mounting plate; 18. Sound insulation cover; 19. Magnetic column; 20. Magnetic tube. DETAILED DESCRIPTION

[0021] In order to make the technical solution of the utility model more clear and specific to those skilled in the art, the utility model is further described in detail below in conjunction with embodiments and drawings, but the implementation methods of the utility model are not limited thereto.

[0022] Embodiment 1

[0023] like Figure 1-Figure 3 As shown, the present embodiment provides a semiconductor wafer cutting device, comprising a shell 1, a support plate 14 is installed on the top of the shell 1, a cutting machine 15 is slidably installed on the bottom of the support plate 14, a water collecting bin 2 is installed inside the shell 1, a filter tank 6 is fixed at the middle position of the top of the shell 1, a fixed platform 7 is installed inside the shell 1, and the top of the fixed platform 7 passes through and extends to the inside of the filter tank 6, an outer gear ring 10 is rotatably installed on the outer side of the fixed platform 7, a rotating drum 11 is fixed on the bottom of the outer gear ring 10, a motor 8 is fixed inside the shell 1, and the motor 8 is fixed to the bottom of the outer gear ring 10. The output shaft of the machine 8 is fixed with a gear 9, and the gear 9 is meshed with the rotating drum 11, and a brush plate 13 is symmetrically installed on the outer side of the outer gear ring 10, and a pump body 3 is installed inside the water collecting bin 2, and a liquid inlet pipe 4 is fixed to the input end of the pump body 3, and a cooling pipe 5 is fixed to the output end of the pump body 3, and the top of the cooling pipe 5 passes through and extends to the top of the shell 1, and a guide bucket 12 is symmetrically installed at the bottom of the filter tank 6, and electric push rods 16 are installed on both sides of the shell 1, and mounting plates 17 are fixed to the telescopic ends of the electric push rods 16, and sound insulation covers 18 are fixed between the mounting plates 17.

[0024] Through the coordinated use of the shell 1, the water collecting bin 2, the pump body 3, the liquid inlet pipe 4, the cooling pipe 5, the filter tank 6, the fixed table 7, the motor 8, the gear 9, the outer gear ring 10, the rotating drum 11, the guide bucket 12, the brush plate 13, the support plate 14 and the cutting machine 15, the cutting machine 15 is started to cut the semiconductor wafer on the fixed table 7, the pump body 3 is started so that the liquid inlet pipe 4 sprays the water in the water collecting bin 2 onto the fixed table 7 through the cooling pipe 5, the cooled cooling liquid enters the filter tank 6, and enters the guide bucket 12 after being filtered by the filter tank 6 and flows back to the water collecting bin 2, the motor 8 is started to drive the gear 9 to rotate, and the rotating drum 11, the outer gear ring 10 and the brush plate 13 are driven to rotate, and the brush plate 13 brushes the mesh in the bottom wall of the filter tank 6 The blocked impurities are brushed out, so that the mesh is completely exposed to promote the filtration and reciprocating use of sewage. The mesh dredging rate of the filter tank 6 can be maintained without manual regular cleaning of the filter tank 6, thereby saving manpower and material resources and promoting the reciprocating use of the cooling liquid, thereby improving the practicality of the semiconductor wafer cutting device; through the coordinated use of the electric push rod 16, the mounting plate 17 and the sound insulation cover 18, the electric push rod 16 is turned on so that the telescopic end pushes the mounting plate 17 and the sound insulation cover 18 to move upward, until the sound insulation cover 18 completely protects the support plate 14 and the top of the shell 1, which not only plays a role in noise reduction, but also the sound insulation cover 18 can be raised and lowered for easy maintenance of the inside of the shell 1, thereby meeting people's usage needs.

[0025] Embodiment 2

[0026] In this embodiment, if Figure 1-Figure 3 As shown, magnetic columns 19 are evenly installed on the bottom of the housing 1 , and magnetic tubes 20 are sleeved on the outer sides of the magnetic columns 19 .

[0027] By using the magnetic column 19 and the magnetic tube 20 in coordination, the up and down shaking of the shell 1 during operation will drive the magnetic column 19 at the bottom to move up and down, and the reaction force of the magnetic column 19 and the magnetic tube 20 will offset part of the vibration potential energy, thereby improving the stability of the semiconductor wafer cutting device.

[0028] In this embodiment, a protective layer is provided inside the sound insulation cover 18, and the protective layer is an anti-wear protective layer.

[0029] The anti-wear protective layer can better protect the noise insulation cover 18 from damage caused by flying debris.

[0030] In this embodiment, a reinforcement pad is disposed at the bottom of the magnetic tube 20 , and the reinforcement pad is a rubber reinforcement pad.

[0031] The anti-slip effect of the bottom is increased by setting the rubber reinforcement pad, thereby improving the overall stability.

[0032] In this embodiment, a fixing opening is opened on one side of the housing 1, and a movable plate is installed inside the fixing opening.

[0033] The arrangement of the fixed opening and the movable plate makes it easy to carry out maintenance work on the interior through the fixed opening.

[0034] The above is only a further embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the scope disclosed by the present invention according to the technical solution and concept of the present invention, which fall within the protection scope of the present invention.

Claims

1. A semiconductor wafer cutting device, characterized in that: The invention comprises a shell (1), a support plate (14) is installed on the top of the shell (1), a cutting machine (15) is slidably installed on the bottom of the support plate (14), a water collecting bin (2) is installed inside the shell (1), a filter tank (6) is fixed at the middle position of the top of the shell (1), a fixed platform (7) is installed inside the shell (1), and the top of the fixed platform (7) passes through and extends to the inside of the filter tank (6), an outer toothed ring (10) is rotatably installed on the outer side of the fixed platform (7), and a rotating drum (11) is fixed at the bottom of the outer toothed ring (10), A motor (8) is fixed inside the shell (1), a gear (9) is fixed to the output shaft of the motor (8), and the gear (9) is meshed with the drum (11), a brush plate (13) is symmetrically installed on the outer side of the outer gear ring (10), a pump body (3) is installed inside the water collecting bin (2), a liquid inlet pipe (4) is fixed to the input end of the pump body (3), a cooling pipe (5) is fixed to the output end of the pump body (3), and the top end of the cooling pipe (5) passes through and extends to the top of the shell (1), and a guide bucket (12) is symmetrically installed at the bottom of the filter tank (6).

2. A semiconductor wafer cutting device according to claim 1, characterized in that: Electric push rods (16) are installed on both sides of the housing (1), mounting plates (17) are fixed to the telescopic ends of the electric push rods (16), and soundproof covers (18) are fixed between the mounting plates (17).

3. A semiconductor wafer cutting device according to claim 1, characterized in that: Magnetic columns (19) are evenly mounted on the bottom of the housing (1), and magnetic tubes (20) are sleeved on the outer sides of the magnetic columns (19).

4. A semiconductor wafer cutting device according to claim 2, characterized in that: A protective layer is arranged inside the soundproof cover (18), and the protective layer is an anti-wear protective layer.

5. The semiconductor wafer cutting device according to claim 3, characterized in that: A reinforcement pad is provided at the bottom of the magnetic tube (20), and the reinforcement pad is a rubber reinforcement pad.

6. The semiconductor wafer cutting device according to claim 1, characterized in that: A fixing opening is provided on one side of the housing (1), and a movable plate is installed inside the fixing opening.

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