Temperature control system of circular knitting machine

Abstract

The utility model relates to a temperature control system of a circular knitting machine, which belongs to the field of circular knitting machines and comprises an upper needle dial heat exchange device and / or a lower needle cylinder heat exchange device. The upper dial heat exchange device comprises a first semiconductor chilling plate and a first active cooling device, the first semiconductor chilling plate is directly or indirectly connected with the dial seat, the first semiconductor chilling plate is directly or indirectly connected with the first active cooling device, and a pipeline of the first active cooling device is connected to the slip ring; the lower needle cylinder heat exchange device comprises a second semiconductor chilling plate and a second active cooling device, the second semiconductor chilling plate is directly or indirectly connected with the lower needle cylinder, the second semiconductor chilling plate is directly or indirectly connected with the second active cooling device, and a pipeline of the second active cooling device bypasses the cloth cutting mechanism and then is connected to the sliding ring; a pipeline of the slip ring is led out of the central shaft and then connected to a temperature control device. The temperature of the upper needle dial and / or the lower needle cylinder can be quickly adjusted, so that the whole machine works stably and reliably.

Description

Technical Field

[0001] The utility model belongs to the field of circular knitting machines, and in particular relates to a temperature control system for a circular knitting machine. Background Art

[0002] Circular knitting machines, also known as circular weft knitting machines, are widely used in the processing and production of clothing, home textiles and industrial knitted fabrics. They are mainly used to process knitted blank fabrics of various structures, which can be further processed into underwear, sweaters, socks, gloves, towels and other products. During the operation of the circular knitting machine, the knitting needles constantly generate heat by friction with the needle grooves of the upper needle disc and / or the lower needle cylinder. The high temperature will cause deformation of the movements between the various components, and will cause yarn breakage, which will cause product defects.

[0003] Existing circular knitting machines have designed a variety of heat dissipation methods for the upper needle plate or the lower needle cylinder, such as air blowing heat dissipation, oil spray heat dissipation, water cooling heat dissipation, etc., but these methods have poor heat dissipation effects. Not only is the cooling speed slow, but it also brings about problems such as complex structure, condensation water, easy thread breakage, oil emulsification, and environmental pollution. In addition, these methods do not take into account that when the climate is cold, low temperature will also affect the opening and operation of the circular knitting machine. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a temperature control system for a circular knitting machine to solve the defects in the prior art.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a circular knitting machine temperature control system, including an upper needle disc heat exchange device and / or a lower needle cylinder heat exchange device;

[0006] The upper needle disk heat exchange device is installed on the needle disk seat, and the upper needle disk heat exchange device includes a first semiconductor refrigeration plate, a first active cooling device and a first adapter plate, the first surface of the first semiconductor refrigeration plate is directly or indirectly connected to the surface of the needle disk seat, the second surface of the first semiconductor refrigeration plate is directly or indirectly connected to the surface of the first active cooling device, the first semiconductor refrigeration plate or the first active cooling device is installed on the first adapter plate, the first adapter plate is installed on the needle disk seat, and the pipelines of the first semiconductor refrigeration plate and the first active cooling device are connected to the slip ring;

[0007] The lower needle cylinder heat exchange device is installed on the lower needle cylinder, and the lower needle cylinder heat exchange device includes a second semiconductor refrigeration plate, a second active cooling device and a second adapter plate, the first surface of the second semiconductor refrigeration plate is directly or indirectly connected to the surface of the lower needle cylinder, the second surface of the second semiconductor refrigeration plate is directly or indirectly connected to the surface of the second active cooling device, the second semiconductor refrigeration plate or the second active cooling device is installed on the second adapter plate, the second adapter plate is installed on the lower needle cylinder, and the pipelines of the second semiconductor refrigeration plate and the second active cooling device are connected to the slip ring after bypassing the cloth cutting mechanism of the circular knitting machine;

[0008] The slip ring is installed on the central shaft of the circular knitting machine, and a pipeline of the slip ring is led out from the central shaft and connected to a temperature control device.

[0009] Preferably, the first active cooling device and the second active cooling device are both fans, and the temperature control device includes a temperature controller and a fan controller which are electrically connected.

[0010] Preferably, the first active cooling device and the second active cooling device are both water cooling heads, and the temperature control device includes an electrically connected thermostat and a constant temperature cooling and heating machine.

[0011] Preferably, a first filling layer is provided on the first surface of the first semiconductor refrigeration sheet, and a second filling layer is provided on the first surface of the second semiconductor refrigeration sheet.

[0012] Preferably, the upper needle disk heat exchange device also includes a first heat conducting plate, a first surface of the first heat conducting plate is directly or indirectly connected to the surface of the needle disk seat, and a second surface of the first heat conducting plate is directly or indirectly connected to the first surface of the first semiconductor refrigeration plate.

[0013] Preferably, the lower syringe heat exchange device further comprises a second heat conducting plate, a first surface of the second heat conducting plate is directly or indirectly connected to the surface of the lower syringe, and a second surface of the second heat conducting plate is directly or indirectly connected to the first surface of the second semiconductor refrigeration plate.

[0014] Preferably, the circular knitting machine temperature control system also includes an upper needle disk temperature sensor and / or a lower needle cylinder temperature sensor, the upper needle disk temperature sensor is used to sense the temperature of the upper needle disk, the needle disk seat or the first adapter plate, the lower needle cylinder temperature sensor is used to sense the temperature of the lower needle cylinder or the second adapter plate, the upper needle disk temperature sensor and / or the lower needle cylinder temperature sensor are electrically connected to a temperature controller, and the temperature controller is electrically connected to the first semiconductor refrigeration plate and / or the second semiconductor refrigeration plate.

[0015] Preferably, there are multiple upper needle disk heat exchange devices, and the multiple upper needle disk heat exchange devices are evenly installed on the needle disk seat.

[0016] Preferably, there are multiple lower syringe heat exchange devices, and the multiple lower syringe heat exchange devices are evenly installed on the lower syringe.

[0017] Compared with the prior art, the utility model has the following beneficial effects: through the combination of the first semiconductor refrigeration plate and / or the second semiconductor refrigeration plate, the first active cooling device and / or the second active cooling device, the slip ring and the temperature control device, the temperature of the upper needle disc and / or the lower needle cylinder can be quickly controlled within a set range, the circular knitting machine can be ensured to work stably and reliably, the working efficiency and service life of the equipment can be improved, the adaptability is wider, and the quality of the products produced is good;

[0018] Compared with the existing water-cooling heat dissipation structure directly arranged on the upper needle disk or the lower needle cylinder, the utility model first adopts a semiconductor refrigeration plate to quickly adjust the temperature of the upper needle disk and / or the lower needle cylinder, and then adopts an active cooling device to adjust the temperature of the semiconductor refrigeration plate. The temperature adjustment speed is faster, and the structure is simpler, the installation is convenient, and the cost is low. There is no need to modify the structure of the existing upper needle disk and / or lower needle cylinder. It is more practical and can both cool and heat, which is beneficial to ensure the normal opening and operation of the circular knitting machine when the climate is cold. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on the drawings in the following description without creative work.

[0020] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the utility model.

[0021] Figure 2 This is an enlarged view of the local structure of Example 1 of the utility model.

[0022] Figure 3 This is a schematic diagram of the structure of the upper needle disk heat exchange device in Examples 1 and 2 of the utility model.

[0023] Figure 4 It is a schematic diagram of the structure of the lower syringe heat exchange device in Examples 1 and 2 of the utility model.

[0024] Figure 5 This is a schematic diagram of the position of the first filling layer in Example 1 of the utility model.

[0025] Figure 6 This is a schematic diagram of the position of the second filling layer in Example 1 of the utility model.

[0026] Figure 7Schematic diagram of the position of the first heat conducting plate in Examples 1 and 2 of the utility model.

[0027] Figure 8 Schematic diagram of the position of the second heat conducting plate in Examples 1 and 2 of the utility model.

[0028] Fig. 9 This is a working principle block diagram of embodiments 1 and 2 of the utility model.

[0029] Fig.10 This is an enlarged view of the local structure of Example 2 of the utility model.

[0030] Fig.11 This is an enlarged view of the local structure of Example 3 of the utility model.

[0031] Fig.12 It is an enlarged view of the local structure of Example 4 of the utility model.

[0032] Fig.13 This is an enlarged view of the local structure of Example 5 of the utility model.

[0033] Fig.14 This is an enlarged view of the local structure of Example 6 of the utility model.

[0034] Markings in the figure:

[0035] 1. Circular knitting machine, 11. Upper needle disc, 111. Needle disc seat, 12. Lower needle cylinder, 13. Cloth cutting mechanism, 14. Slip ring, 15. Center axis;

[0036] 2. upper needle plate heat exchange device, 21. first semiconductor refrigeration sheet, 211. first filling layer, 22. first active cooling device, 23. first adapter plate, 24. first heat conduction plate;

[0037] 3. lower syringe heat exchange device, 31. second semiconductor refrigeration sheet, 311. second filling layer, 32. second active cooling device, 33. second adapter plate, 34. second heat conduction plate;

[0038] 41. Fan controller, 42. Constant temperature cooling and heating machine. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. In order to make the above-mentioned features and advantages of the utility model more obvious and easy to understand, the following embodiments are specifically cited and described in detail with the drawings.

[0040] Example 1: Figures 1 to 9 As shown, a circular knitting machine temperature control system is used for a double-sided circular knitting machine, comprising an upper needle disc heat exchange device 2 and a lower needle cylinder heat exchange device 3;

[0041] The upper needle disk heat exchange device 2 is installed on the needle disk seat 111, and the upper needle disk heat exchange device 2 includes a first semiconductor refrigeration plate 21, a first active cooling device 22 and a first adapter plate 23. The first surface of the first semiconductor refrigeration plate 21 is directly or indirectly connected to the surface of the needle disk seat 111, and the second surface of the first semiconductor refrigeration plate 21 is directly or indirectly connected to the surface of the first active cooling device 22. The first semiconductor refrigeration plate 21 or the first active cooling device 22 is installed on the first adapter plate 23, and the first adapter plate 23 is installed (such as fixed by bolts) on the needle disk seat 111. The pipelines of the first semiconductor refrigeration plate 21 and the first active cooling device 22 are connected to the slip ring 14;

[0042] The lower needle cylinder heat exchange device 3 is installed on the lower needle cylinder 12, and the lower needle cylinder heat exchange device 3 includes a second semiconductor refrigeration plate 31, a second active cooling device 32 and a second adapter plate 33. The first surface of the second semiconductor refrigeration plate 31 is directly or indirectly connected to the surface of the lower needle cylinder 12, and the second surface of the second semiconductor refrigeration plate 31 is directly or indirectly connected to the surface of the second active cooling device 32. The second semiconductor refrigeration plate 31 or the second active cooling device 32 is installed on the second adapter plate 33, and the second adapter plate 33 is installed (such as fixed by bolts) on the lower needle cylinder 12. The pipelines of the second semiconductor refrigeration plate 31 and the second active cooling device 32 are connected to the slip ring 14 after bypassing the cloth cutting mechanism 13 of the circular knitting machine 1, that is, the pipelines of the second semiconductor refrigeration plate 31 and the second active cooling device 32 are connected to the slip ring 14 from the cut portion of the grey cloth;

[0043] The slip ring 14 is installed on the central shaft 15 of the circular knitting machine, and the pipeline of the slip ring 14 is led out from the central shaft 15 and connected to the temperature control device.

[0044] In this embodiment, the first active cooling device 22 and the second active cooling device 32 are both water-cooled heads, and the temperature control device includes an electrically connected thermostat and a constant temperature cooling and heating machine 41. Among them, the thermostat and the constant temperature cooling and heating machine 41 can both adopt existing products, and the constant temperature cooling and heating machine 41 can also be called a constant temperature cooling and heating machine, a cold and hot integrated machine, etc., which transports cooling medium or heating medium (the medium can be water, oil, etc.) to the water-cooled head, and then transports the heat generated by the second surface of the first semiconductor cooling sheet 21 and the second semiconductor cooling sheet 31, or heats the second surface of the first semiconductor cooling sheet 21 and the second semiconductor cooling sheet 31.

[0045] In this embodiment, the first adapter plate 23 mainly serves to fix the upper needle disk heat exchange device 2 on the needle disk seat 111. It can be specifically arranged on the surface of the first semiconductor refrigeration plate 21 close to the needle disk seat 111, and it also serves to conduct heat. Of course, in other embodiments, it can also be arranged between the first semiconductor refrigeration plate 21 and the first active cooling device 22, and can also be arranged on the surface of the first active cooling device 22 away from the first semiconductor refrigeration plate 21.

[0046] In this embodiment, the second adapter plate 33 mainly serves to fix the lower syringe heat exchange device 3 on the lower syringe 12. It can be specifically arranged on the surface of the second semiconductor refrigeration plate 31 close to the lower syringe 12, and it also serves to conduct heat. Of course, in other embodiments, it can also be arranged between the second semiconductor refrigeration plate 31 and the second active cooling device 32, and can also be arranged on the surface of the second active cooling device 32 away from the second semiconductor refrigeration plate 31.

[0047] In this embodiment, in order to better fit the contact, the first semiconductor refrigeration sheet 21 may be provided with a first filling layer 211 on both surfaces, so that the first semiconductor refrigeration sheet 21 is in good contact with the needle plate seat 111 and the first active cooling device 22, and the second semiconductor refrigeration sheet 31 may be provided with a second filling layer 311 on both surfaces, so that the second semiconductor refrigeration sheet 31 is in good contact with the lower needle cylinder 12 and the second active cooling device 32. The first filling layer 211 and the second filling layer 311 may preferably be, but not limited to, a thermal conductive silicone grease layer, which has high thermal conductivity, excellent thermal conductivity, wide operating temperature, good operating stability, low viscosity and good construction performance.

[0048] In this embodiment, in order to better transfer heat, the upper needle disk heat exchange device 2 may further include a first heat conducting plate 24, wherein the first surface of the first heat conducting plate 24 is directly or indirectly connected to the surface of the needle disk seat 111, and the second surface of the first heat conducting plate 24 is directly or indirectly connected to the first surface of the first semiconductor refrigeration plate 21, and the contact area is increased by the first heat conducting plate 24 to improve the efficiency of heat transfer; the lower syringe heat exchange device 3 may further include a second heat conducting plate 34, wherein the first surface of the second heat conducting plate 34 is directly or indirectly connected to the surface of the lower syringe 12, and the second surface of the second heat conducting plate 34 is directly or indirectly connected to the first surface of the second semiconductor refrigeration plate 31, and the contact area is increased by the second heat conducting plate 34 to improve the efficiency of heat transfer.

[0049] In this embodiment, in order to improve the temperature control effect, the number of the upper needle disk heat exchange device 2 can be multiple, and the multiple upper needle disk heat exchange devices 2 can be evenly installed on the needle disk seat 111, and the pipelines of the multiple upper needle disk heat exchange devices 2 can be connected in parallel, so that the upper needle disk 11 as a whole is evenly cooled or heated; the number of the lower syringe heat exchange device 3 can be multiple, and the multiple lower syringe heat exchange devices 3 can be evenly installed on the lower syringe 12, and the pipelines of the multiple lower syringe heat exchange devices 3 can be connected in series, so that the lower syringe 12 as a whole is evenly cooled or heated.

[0050] In this embodiment, in order to facilitate temperature control, the circular knitting machine temperature control system may further include an upper needle dial temperature sensor and a lower needle cylinder temperature sensor. The upper needle dial temperature sensor is used to sense the temperature of the upper needle dial 11, the needle dial seat 111 or the first adapter plate 23, and the lower needle cylinder temperature sensor is used to sense the temperature of the lower needle cylinder 12 or the second adapter plate 33. The upper needle dial temperature sensor and the lower needle cylinder temperature sensor are electrically connected to a temperature controller, and the temperature controller is electrically connected to the first semiconductor refrigeration plate 21 and the second semiconductor refrigeration plate 31.

[0051] The working principle of this embodiment is as follows:

[0052] When the upper needle disk temperature sensor detects that the temperature of the upper needle disk 11, the needle disk seat 111 or the first adapter plate 23 of the double-sided circular knitting machine is too high, the thermostat controls the first surface of the first semiconductor refrigeration plate 21 to absorb heat, and directly quickly cools the needle disk seat 111 or indirectly quickly cools the needle disk seat 111 through the first heat conducting plate 24, thereby realizing rapid cooling of the upper needle disk 11, and the second surface of the first semiconductor refrigeration plate 21 releases heat and conducts it to the first active cooling device 22, and at the same time, the thermostat controls the constant temperature heating and cooling machine 41 to transport cooling medium to the first active cooling device 22 (i.e., the water cooling head), and takes away the heat of the first active cooling device 22 through the cooling medium;

[0053] When the upper needle disk temperature sensor detects that the temperature of the upper needle disk 11, the needle disk seat 111 or the first adapter plate 23 of the double-sided circular knitting machine is too low, the thermostat changes the current direction of the first semiconductor refrigeration sheet 21, so that the first surface of the first semiconductor refrigeration sheet 21 releases heat, and the needle disk seat 111 is directly and quickly heated or the needle disk seat 111 is indirectly and quickly heated through the first heat conducting plate 24, thereby realizing rapid heating of the upper needle disk 11, and the second surface of the first semiconductor refrigeration sheet 21 absorbs heat and cools down the first active cooling device 22, and at the same time, the thermostat controls the constant temperature heating and cooling machine 41 to transport the heating medium to the first active cooling device 22, and the first active cooling device 22 is heated and heated back to temperature through the heating medium;

[0054] When the lower needle cylinder temperature sensor detects that the temperature of the lower needle cylinder 12 or the second adapter plate 33 of the double-sided circular knitting machine is too high, the thermostat controls the first surface of the second semiconductor refrigeration plate 31 to absorb heat, and directly quickly cools the lower needle cylinder 12 or indirectly quickly cools the lower needle cylinder 12 through the second heat conduction plate 34, and the second surface of the second semiconductor refrigeration plate 31 releases heat and conducts it to the second active cooling device 32 (i.e., the water cooling head). At the same time, the thermostat controls the constant temperature cooling and heating machine 41 to transport cooling medium to the second active cooling device 32, and the heat of the second active cooling device 32 is taken away by the cooling medium.

[0055] When the lower needle cylinder temperature sensor detects that the temperature of the lower needle cylinder 12 or the second adapter plate 33 of the double-sided circular knitting machine is too low, the thermostat changes the current direction of the second semiconductor refrigeration sheet 31, so that the first surface of the second semiconductor refrigeration sheet 31 releases heat, and the lower needle cylinder 12 is directly and quickly heated or indirectly and quickly heated through the second heat conducting plate 34. The second surface of the second semiconductor refrigeration sheet 31 absorbs heat and cools down the second active cooling device 32. At the same time, the thermostat controls the constant temperature heating and cooling machine 41 to transport the heating medium to the second active cooling device 32, and the second active cooling device 32 is heated and heated back to temperature through the heating medium.

[0056] This embodiment realizes rapid control of the temperatures of the upper needle disk 11 and the lower needle cylinder 12 within a set range through a combination of an upper needle disk temperature sensor, a lower needle cylinder temperature sensor, a temperature controller, a first semiconductor refrigeration plate 21, a second semiconductor refrigeration plate 31, a first active cooling device 22, a second active cooling device 32, a slip ring 14, and a constant temperature heating and cooling machine 41, thereby ensuring that the double-sided circular knitting machine works stably and reliably, improving the working efficiency and service life of the equipment, having a wider adaptability, and producing products of good quality.

[0057] Example 2: Fig.10 Shown and referenced Figures 3 to 9, a circular knitting machine temperature control system, used for a double-sided circular knitting machine, comprising an upper needle disc heat exchange device 2 and a lower needle cylinder heat exchange device 3;

[0058] The upper needle disk heat exchange device 2 is installed on the needle disk seat 111, and the upper needle disk heat exchange device 2 includes a first semiconductor refrigeration plate 21, a first active cooling device 22 and a first adapter plate 23. The first surface of the first semiconductor refrigeration plate 21 is directly or indirectly connected to the surface of the needle disk seat 111, and the second surface of the first semiconductor refrigeration plate 21 is directly or indirectly connected to the surface of the first active cooling device 22. The first semiconductor refrigeration plate 21 or the first active cooling device 22 is installed on the first adapter plate 23, and the first adapter plate 23 is installed (such as fixed by bolts) on the needle disk seat 111. The pipelines of the first semiconductor refrigeration plate 21 and the first active cooling device 22 are connected to the slip ring 14;

[0059] The lower needle cylinder heat exchange device 3 is installed on the lower needle cylinder 12, and the lower needle cylinder heat exchange device 3 includes a second semiconductor refrigeration plate 31, a second active cooling device 32 and a second adapter plate 33. The first surface of the second semiconductor refrigeration plate 31 is directly or indirectly connected to the surface of the lower needle cylinder 12, and the second surface of the second semiconductor refrigeration plate 31 is directly or indirectly connected to the surface of the second active cooling device 32. The second semiconductor refrigeration plate 31 or the second active cooling device 32 is installed on the second adapter plate 33, and the second adapter plate 33 is installed (such as fixed by bolts) on the lower needle cylinder 12. The pipelines of the second semiconductor refrigeration plate 31 and the second active cooling device 32 are connected to the slip ring 14 after bypassing the cloth cutting mechanism 13 of the circular knitting machine 1, that is, the pipelines of the second semiconductor refrigeration plate 31 and the second active cooling device 32 are connected to the slip ring 14 from the cut portion of the grey cloth;

[0060] The slip ring 14 is installed on the central shaft 15 of the circular knitting machine, and the pipeline of the slip ring 14 is led out from the central shaft 15 and connected to the temperature control device.

[0061] In this embodiment, the first active cooling device 22 and the second active cooling device 32 are fans, and the temperature control device includes an electrically connected thermostat and a fan controller 42. The thermostat, the fan and the fan controller 42 can all be existing products, and the fan controller 42 is used to control the operation of the fan, which will not be described in detail here.

[0062] In this embodiment, the first adapter plate 23 mainly serves to fix the upper needle disk heat exchange device 2 on the needle disk seat 111. It can be specifically arranged on the surface of the first semiconductor refrigeration plate 21 close to the needle disk seat 111, and it also serves to conduct heat. Of course, in other embodiments, it can also be arranged between the first semiconductor refrigeration plate 21 and the first active cooling device 22.

[0063] In this embodiment, the second adapter plate 33 mainly serves to fix the lower syringe heat exchange device 3 on the lower syringe 12. It can be specifically arranged on the surface of the second semiconductor refrigeration plate 31 close to the lower syringe 12, and it also serves to conduct heat. Of course, in other embodiments, it can also be arranged between the second semiconductor refrigeration plate 31 and the second active cooling device 32.

[0064] In this embodiment, in order to better fit the contact, the first surface of the first semiconductor refrigeration sheet 21 may be provided with a first filling layer 211, so that the first semiconductor refrigeration sheet 21 is in good contact with the needle plate seat 111, and the first surface of the second semiconductor refrigeration sheet 31 may be provided with a second filling layer 311, so that the second semiconductor refrigeration sheet 31 is in good contact with the lower needle cylinder 12. The first filling layer 211 and the second filling layer 311 may preferably be, but not limited to, a thermal conductive silicone grease layer, which has high thermal conductivity, excellent thermal conductivity, wide operating temperature, good operating stability, low viscosity and good construction performance.

[0065] In this embodiment, in order to better transfer heat, the upper needle disk heat exchange device 2 may further include a first heat conducting plate 24, wherein the first surface of the first heat conducting plate 24 is directly or indirectly connected to the surface of the needle disk seat 111, and the second surface of the first heat conducting plate 24 is directly or indirectly connected to the first surface of the first semiconductor refrigeration plate 21, and the contact area is increased by the first heat conducting plate 24 to improve the efficiency of heat transfer; the lower syringe heat exchange device 3 may further include a second heat conducting plate 34, wherein the first surface of the second heat conducting plate 34 is directly or indirectly connected to the surface of the lower syringe 12, and the second surface of the second heat conducting plate 34 is directly or indirectly connected to the first surface of the second semiconductor refrigeration plate 31, and the contact area is increased by the second heat conducting plate 34 to improve the efficiency of heat transfer.

[0066] In this embodiment, in order to improve the temperature control effect, the number of the upper needle disk heat exchange device 2 can be multiple, and the multiple upper needle disk heat exchange devices 2 can be evenly installed on the needle disk seat 111, and the pipelines of the multiple upper needle disk heat exchange devices 2 can be connected in parallel, so that the upper needle disk 11 as a whole is evenly cooled or heated; the number of the lower syringe heat exchange device 3 can be multiple, and the multiple lower syringe heat exchange devices 3 can be evenly installed on the lower syringe 12, and the pipelines of the multiple lower syringe heat exchange devices 3 can be connected in parallel, so that the lower syringe 12 as a whole is evenly cooled or heated.

[0067] In this embodiment, in order to facilitate temperature control, the circular knitting machine temperature control system may further include an upper needle dial temperature sensor and a lower needle cylinder temperature sensor. The upper needle dial temperature sensor is used to sense the temperature of the upper needle dial 11, the needle dial seat 111 or the first adapter plate 23, and the lower needle cylinder temperature sensor is used to sense the temperature of the lower needle cylinder 12 or the second adapter plate 33. The upper needle dial temperature sensor and the lower needle cylinder temperature sensor are electrically connected to a temperature control device, and the temperature control device is electrically connected to a constant temperature heating and cooling machine 41 and a first semiconductor refrigeration plate 21 and a second semiconductor refrigeration plate 31.

[0068] The working principle of this embodiment is as follows:

[0069] When the upper needle disk temperature sensor detects that the temperature of the upper needle disk 11, the needle disk seat 111 or the first adapter plate 23 of the double-sided circular knitting machine is too high, the temperature controller controls the first surface of the first semiconductor refrigeration plate 21 to absorb heat, and directly quickly cools the needle disk seat 111 or indirectly quickly cools the needle disk seat 111 through the first heat conducting plate 24, thereby realizing rapid cooling of the upper needle disk 11, and at the same time, the fan controller 42 controls the first active cooling device 22 to cool the second surface of the first semiconductor refrigeration plate 21;

[0070] When the upper needle disk temperature sensor detects that the temperature of the upper needle disk 11, the needle disk seat 111 or the first adapter plate 23 of the double-sided circular knitting machine is too low, the temperature controller changes the current direction of the first semiconductor refrigeration plate 21, so that the first surface of the first semiconductor refrigeration plate 21 releases heat, and the needle disk seat 111 is directly and quickly heated or the needle disk seat 111 is indirectly and quickly heated through the first heat conducting plate 24, thereby realizing the rapid heating of the upper needle disk 11. At this time, the fan controller 42 controls the first active cooling device 22 not to work;

[0071] When the lower needle cylinder temperature sensor detects that the temperature of the lower needle cylinder 12 or the second adapter plate 33 of the double-sided circular knitting machine is too high, the temperature controller controls the first surface of the second semiconductor refrigeration plate 31 to absorb heat, and directly quickly cools the lower needle cylinder 12 or indirectly quickly cools the lower needle cylinder 12 through the second heat conducting plate 34, and at the same time, the fan controller 42 controls the second active cooling device 32 to cool the second surface of the second semiconductor refrigeration plate 31;

[0072] When the lower needle cylinder temperature sensor detects that the temperature of the lower needle cylinder 12 or the second adapter plate 33 of the double-sided circular knitting machine is too low, the temperature controller changes the current direction of the second semiconductor refrigeration plate 31, so that the first surface of the second semiconductor refrigeration plate 31 releases heat, and the lower needle cylinder 12 is directly and quickly heated or indirectly and quickly heated through the second heat conducting plate 34. At this time, the fan controller 42 controls the second active cooling device 32 not to work;

[0073] This embodiment realizes rapid control of the temperatures of the upper needle disk 11 and the lower needle cylinder 12 within a set range through a combination of an upper needle disk temperature sensor, a lower needle cylinder temperature sensor, a temperature controller, a first semiconductor refrigeration plate 21, a second semiconductor refrigeration plate 31, a first active cooling device 22, a second active cooling device 32, a slip ring 14, and a fan controller, thereby ensuring that the double-sided circular knitting machine works stably and reliably, improving the working efficiency and service life of the equipment, having a wider adaptability, and producing products of good quality.

[0074] Example 3: Fig.11 As shown, a circular knitting machine temperature control system, which is different from the first embodiment in that it is used for a single-sided circular knitting machine or a double-sided circular knitting machine, and only includes a lower needle cylinder heat exchange device 3, and does not include an upper needle disc heat exchange device.

[0075] Example 4: Fig.12 As shown, a circular knitting machine temperature control system is used for a double-sided circular knitting machine. The difference between the system and the embodiment 1 is that it only includes an upper needle disc heat exchange device 2 but does not include a lower needle cylinder heat exchange device.

[0076] Example 5: Fig.13 As shown, a circular knitting machine temperature control system, which is different from the second embodiment in that it is used for a single-sided circular knitting machine or a double-sided circular knitting machine, and only includes a lower needle cylinder heat exchange device 3, and does not include an upper needle disc heat exchange device.

[0077] Example 6: Fig.14 As shown, a circular knitting machine temperature control system is used for a double-sided circular knitting machine. The difference between the system and the embodiment 2 is that the system only includes an upper needle disc heat exchange device 2, but does not include a lower needle cylinder heat exchange device.

[0078] It is particularly important to explain that the slip ring is a prior art, which is an electrical component responsible for connecting the rotating body and transmitting energy and signals, and will not be described in detail here.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A temperature control system for a circular knitting machine, characterized in that: It comprises an upper needle disk heat exchange device and / or a lower needle cylinder heat exchange device; the upper needle disk heat exchange device is mounted on the needle disk seat, the upper needle disk heat exchange device comprises a first semiconductor refrigeration sheet, a first active cooling device and a first adapter plate, the first surface of the first semiconductor refrigeration sheet is directly or indirectly connected to the surface of the needle disk seat, the second surface of the first semiconductor refrigeration sheet is directly or indirectly connected to the surface of the first active cooling device, the first semiconductor refrigeration sheet or the first active cooling device is mounted on the first adapter plate, the first adapter plate is mounted on the needle disk seat, and the pipelines of the first semiconductor refrigeration sheet and the first active cooling device are connected to the slip ring; The lower needle cylinder heat exchange device is installed on the lower needle cylinder, and the lower needle cylinder heat exchange device includes a second semiconductor refrigeration plate, a second active cooling device and a second adapter plate, the first surface of the second semiconductor refrigeration plate is directly or indirectly connected to the surface of the lower needle cylinder, the second surface of the second semiconductor refrigeration plate is directly or indirectly connected to the surface of the second active cooling device, the second semiconductor refrigeration plate or the second active cooling device is installed on the second adapter plate, the second adapter plate is installed on the lower needle cylinder, and the pipelines of the second semiconductor refrigeration plate and the second active cooling device are connected to the slip ring after bypassing the cloth cutting mechanism of the circular knitting machine; The slip ring is installed on the central shaft of the circular knitting machine, and the pipeline of the slip ring is led out from the central shaft and connected to the temperature control device.

2. The circular knitting machine temperature control system according to claim 1, characterized in that: The first active cooling device and the second active cooling device are both fans, and the temperature control device includes a temperature controller and a fan controller that are electrically connected.

3. The circular knitting machine temperature control system according to claim 1, characterized in that: The first active cooling device and the second active cooling device are both water cooling heads, and the temperature control device includes an electrically connected thermostat and a constant temperature cooling and heating machine.

4. The circular knitting machine temperature control system according to claim 1, characterized in that: A first filling layer is disposed on the first surface of the first semiconductor refrigeration sheet, and a second filling layer is disposed on the first surface of the second semiconductor refrigeration sheet.

5. The circular knitting machine temperature control system according to claim 1, characterized in that: The upper needle disk heat exchange device also includes a first heat conducting plate, a first surface of the first heat conducting plate is directly or indirectly connected to the surface of the needle disk seat, and a second surface of the first heat conducting plate is directly or indirectly connected to the first surface of the first semiconductor refrigeration plate.

6. The circular knitting machine temperature control system according to claim 1, characterized in that: The lower syringe heat exchange device also includes a second heat conducting plate, a first surface of the second heat conducting plate is directly or indirectly connected to the surface of the lower syringe, and a second surface of the second heat conducting plate is directly or indirectly connected to the first surface of the second semiconductor refrigeration plate.

7. The circular knitting machine temperature control system according to claim 1, characterized in that: It also includes an upper needle disk temperature sensor and / or a lower needle cylinder temperature sensor, wherein the upper needle disk temperature sensor is used to sense the temperature of the upper needle disk, the needle disk seat or the first adapter plate, and the lower needle cylinder temperature sensor is used to sense the temperature of the lower syringe or the second adapter plate. The upper needle disk temperature sensor and / or the lower needle cylinder temperature sensor are electrically connected to a temperature controller, and the temperature controller is electrically connected to the first semiconductor refrigeration plate and / or the second semiconductor refrigeration plate.

8. The circular knitting machine temperature control system according to claim 1, characterized in that: There are multiple upper needle disk heat exchange devices, and the multiple upper needle disk heat exchange devices are evenly installed on the needle disk seat.

9. The circular knitting machine temperature control system according to claim 1, characterized in that: There are multiple lower syringe heat exchange devices, and the multiple lower syringe heat exchange devices are evenly installed on the lower syringe.

Images