Chip defect detection device

Abstract

The utility model provides a chip defect detection device, belongs to the field of chip defect detection, aims to solve the problem that an existing chip defect detection device cannot conveniently and stably adjust and detect defects of a wafer without patterns, and comprises an optical platform and a guide block, a first translation table, a hydraulic rod, an adjusting plate and a third servo motor are fixedly installed on the top end face of the optical platform, a first servo motor is installed in the first translation table, the output end of the first servo motor is connected with a first threaded rod, and the first threaded rod is rotationally connected into the first translation table. The first threaded rod can drive the first sliding block to move leftwards or rightwards in the first translation table, and the second threaded rod can drive the second sliding block to move forwards or backwards in the first sliding block, so that the second translation table can be driven to move forwards, backwards or leftwards and rightwards conveniently and stably; the scanning device is used for scanning different positions of a to-be-tested chip.

Description

Technical Field

[0001] The utility model relates to the field of chip defect detection, and in particular to a chip defect detection device. Background Art

[0002] In the chip manufacturing process, factors such as human operation, material defects or equipment failures can cause various defects such as impurities, cracks, short circuits, etc. on the chip. If these defects are not detected and repaired in time, they may cause the chip performance to decline, the function to fail or even be completely damaged. Therefore, chip defect detection is very important to ensure the quality and reliability of the chip. Existing chip defect detection methods include optical microscopy, laser scanning and X-ray imaging. Among them, the optical microscope detects defects by observing the magnified image of the chip surface. It has a high resolution and can detect very small defects, but it is slow and requires manual operation, and cannot detect defects inside the chip. The laser scanning method scans the chip with a laser beam and detects the change in the intensity of its reflected light to determine whether there is a defect. It has a high resolution and a fast detection speed, but it has strict environmental requirements and a high cost. The X-ray imaging method detects defects by irradiating the chip and recording the intensity of the X-rays passing through the chip. It can detect defects inside the chip, but it is expensive, has strict environmental requirements, and requires a long detection time.

[0003] These methods all have some limitations, especially for defect detection of unpatterned wafers. Unpatterned wafers refer to wafers that have not yet formed visible patterns in the early stages of chip manufacturing. Traditional defect detection methods often do not work at this stage because they are mainly based on the detection of patterns. In addition, these methods also have problems such as slow speed, low resolution and high cost. Event cameras provide a new solution for defect detection of unpatterned wafers. Event cameras are asynchronous sensors designed based on neuron principles. They can detect defects by recording brightness changes on the wafer surface without knowing the location and shape of the defects in advance, which makes defect detection more flexible and efficient, while also reducing costs. Therefore, we have made improvements to this and proposed a chip defect detection device. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that the existing chip defect detection device cannot perform convenient and stable adjustment detection on the defects of the non-patterned wafer.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A chip defect detection device is provided to improve the above problems.

[0007] The specific application is as follows:

[0008] The optical platform comprises an optical platform and a guide block, wherein a first translation stage, a hydraulic rod, an adjustment plate and a third servo motor are fixedly mounted on the top surface of the optical platform, a first servo motor is mounted in the first translation stage, an output end of the first servo motor is connected with a first threaded rod, the first threaded rod is rotatably connected in the first translation stage, a first sliding block is threadedly connected on the first threaded rod, the first sliding block is slidably connected in the first translation stage, a second servo motor is mounted in the first sliding block, an output end of the second servo motor is connected with a second threaded rod, the second threaded rod is rotatably connected in the first sliding block, a second sliding block is threadedly connected on the second threaded rod, the second sliding block is slidably connected in the first sliding block, a second translation stage is fixedly connected at the top end of the second sliding block, a mounting plate is fixedly connected at the top end of the hydraulic rod, an event camera is bolted on the mounting plate, a guide groove is provided on the adjustment plate, the guide block is slidably connected in the guide groove, a limit frame is fixedly connected on the guide block, a third threaded rod is threadedly connected on the limit frame, a rubber block is rotatably connected at the bottom end of the third threaded rod, and a white light source device is arranged in the limit frame.

[0009] As a preferred technical solution of the present application, the first threaded rod is connected to the bottom middle part of the first sliding block, the top end surface of the first sliding block is in contact with the bottom end surface of the second translation stage, and the second sliding block is fixed to the bottom center part of the second translation stage.

[0010] As a preferred technical solution of the present application, the vertical center line of the event camera and the vertical center line of the first translation stage are located on the same center line, and the length of the event camera is smaller than the length of the hydraulic rod.

[0011] As a preferred technical solution of the present application, the top and guide groove of the adjustment plate are both arc-shaped, the adjustment plate is symmetrically distributed on both sides of the limit frame, the adjustment plate corresponds one-to-one with the guide block through the guide groove, and the guide block is arc-shaped.

[0012] As a preferred technical solution of the present application, the output end of the third servo motor is connected to a worm, the worm is meshingly connected to a worm wheel, the worm wheel is fixedly connected to a transmission shaft, the transmission shaft is rotatably connected to an adjustment plate, the transmission shaft is fixedly connected to a coil, a traction rope is wound around the coil, the top end of the traction rope is fixedly connected to a guide block, the inner top end of the guide groove is fixedly connected to a connecting spring, and the bottom end of the connecting spring is fixedly connected to the guide block.

[0013] As a preferred technical solution of the present application, the guide block is fixed at the middle part of the side end of the limit frame, and the guide block corresponds one-to-one with the coil through the traction rope.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] In the scheme of this application:

[0016] 1. The first threaded rod can drive the first sliding block to move left or right in the first translation stage, and the second threaded rod can drive the second sliding block to move forward or backward in the first sliding block, thereby driving the second translation stage to perform convenient and stable forward and backward displacement or left and right displacement, which is used to scan different positions of the chip to be tested, and identify defects on the surface of the chip, and finally display the coded image, the position and type of the defect of the chip to be tested, and the hydraulic rod can drive the event camera to move upward or downward through the mounting plate, which is used to control the precise focus of the event camera and the chip to be tested, improve the measurement accuracy, ensure the accuracy of chip detection work, and thus improve the detection efficiency and detection accuracy of the chip, with simple structure, low cost, easy operation, and convenient for popularization and use;

[0017] 2. The worm and worm gear drive the coil on the transmission shaft to reel in and unreel the traction rope, and the connecting spring drives the white light source device in the limit frame to rotate at a uniform speed along the track of the guide groove. For the same position of the chip, the light intensity information of different irradiation angles can be compared, and the light intensity information difference map can be obtained for subsequent defect detection. It can effectively detect various types and forms of defects on the surface of the non-patterned wafer, such as scratches, foreign matter, protrusions, dislocations, missing, pollutants, etc., thereby improving the quality and efficiency of chip manufacturing;

[0018] 3. By rotating the third threaded rod and cooperating with the rubber block, the white light source device in the limit frame can be conveniently and stably disassembled and installed, thereby ensuring the convenience of subsequent inspection and maintenance of the white light source device, increasing the diversity of use of the detection device, and at the same time improving the service life of the detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the overall three-dimensional structure of the chip defect detection device provided in this application;

[0020] Figure 2 This is a schematic diagram of the overall main structure of the chip defect detection device provided by the present application;

[0021] Figure 3 A schematic diagram of a side cross-sectional structure of a first translation stage of a chip defect detection device provided in the present application;

[0022] Figure 4 A schematic diagram of the worm gear structure of the chip defect detection device provided in this application;

[0023] Figure 5A schematic diagram of the guide groove structure of the chip defect detection device provided in this application;

[0024] Figure 6 A schematic diagram of a side cross-sectional structure of an adjustment plate of a chip defect detection device provided in the present application;

[0025] Figure 7 This is a schematic diagram of the main cross-sectional structure of the limit frame of the chip defect detection device provided in this application.

[0026] Markings in the figure: 1. optical platform; 2. first translation stage; 3. first servo motor; 4. first threaded rod; 5. first sliding block; 6. second servo motor; 7. second threaded rod; 8. second sliding block; 9. second translation stage; 10. hydraulic rod; 11. mounting plate; 12. event camera; 13. adjustment plate; 14. guide groove; 15. third servo motor; 16. worm; 17. worm gear; 18. transmission shaft; 19. coil; 20. traction rope; 21. guide block; 22. limit frame; 23. third threaded rod; 24. rubber block; 25. white light source device; 26. connecting spring; 27. computer processing device. DETAILED DESCRIPTION

[0027] To make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be described clearly and completely in conjunction with the accompanying drawings. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments.

[0028] Therefore, the following detailed description of the embodiments of the present invention is not intended to limit the scope of the present invention to be protected, but merely represents some embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the present utility model, it should be noted that the orientation or position relationship indicated by the terms "upper", "lower", etc. is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art. Such terms are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0032] Embodiment 1:

[0033] like Figure 1-Figure 7 As shown, this embodiment proposes a chip defect detection device, including an optical platform 1 and a guide block 21, a first translation platform 2, a hydraulic rod 10, an adjustment plate 13 and a third servo motor 15 are fixedly mounted on the top surface of the optical platform 1, a first servo motor 3 is mounted in the first translation platform 2, an output end of the first servo motor 3 is connected to a first threaded rod 4, the first threaded rod 4 is rotatably connected in the first translation platform 2, a first sliding block 5 is threadedly connected to the first threaded rod 4, the first sliding block 5 is slidably connected in the first translation platform 2, a second servo motor 6 is mounted in the first sliding block 5, an output end of the second servo motor 6 is connected to a second threaded rod 7, and the second threaded rod 8 is connected to the output end of the second servo motor 6. The rod 7 is rotatably connected in the first sliding block 5, the second threaded rod 7 is threadedly connected with the second sliding block 8, the second sliding block 8 is slidably connected in the first sliding block 5, the top end of the second sliding block 8 is fixedly connected with the second translation platform 9, the top end of the hydraulic rod 10 is fixedly connected with the mounting plate 11, the mounting plate 11 is bolted with the event camera 12, the adjustment plate 13 is provided with a guide groove 14, the guide block 21 is slidably connected in the guide groove 14, the guide block 21 is fixedly connected with a limit frame 22, the limit frame 22 is threadedly connected with a third threaded rod 23, the bottom end of the third threaded rod 23 is rotatably connected with a rubber block 24, and a white light source device 25 is arranged in the limit frame 22.

[0034] Embodiment 2:

[0035] The solution in Example 1 is further introduced below in combination with a specific working method, as described below:

[0036] like Figure 1-Figure 3As shown, as a preferred embodiment, on the basis of the above method, further, the first threaded rod 4 is connected to the middle part of the bottom of the first sliding block 5, the top end surface of the first sliding block 5 is in contact with the bottom end surface of the second translation stage 9, and the second sliding block 8 is fixed to the bottom center part of the second translation stage 9. The first threaded rod 4 can drive the first sliding block 5 to move left or right in the first translation stage 2, and the second threaded rod 7 can drive the second sliding block 8 to move forward or backward in the first sliding block 5, thereby driving the second translation stage 9 to perform convenient and stable forward and backward displacement or left and right displacement, which is used to scan different positions of the chip to be tested, identify defects on the chip surface, and finally display the coded image, the defect position and type of the chip to be tested.

[0037] like Figure 1 and Figure 2 As shown, as a preferred embodiment, on the basis of the above-mentioned method, further, the vertical center line of the event camera 12 and the vertical center line of the first translation stage 2 are located on the same center line, and the length of the event camera 12 is less than the length of the hydraulic rod 10. The hydraulic rod 10 can drive the event camera 12 to move upward or downward through the mounting plate 11, so as to control the precise focus of the event camera 12 and the chip to be tested, improve the measurement accuracy, ensure the accuracy of chip detection, and thus improve the detection efficiency and detection accuracy of the chip.

[0038] like Figure 1 and Figure 4-Figure 7 As shown, as a preferred embodiment, on the basis of the above-mentioned manner, further, the top of the adjusting plate 13 and the guide groove 14 are both in an arc shape, the adjusting plates 13 are symmetrically distributed on both sides of the limit frame 22, the adjusting plates 13 correspond one to one with the guide blocks 21 through the guide grooves 14, the guide blocks 21 are in an arc shape, the output end of the third servo motor 15 is connected to a worm 16, the worm 16 is meshedly connected to a worm wheel 17, the worm wheel 17 is fixedly connected to a transmission shaft 18, the transmission shaft 18 is rotatably connected to the adjusting plate 13, the transmission shaft 18 is fixedly connected to a coil 19, a traction rope 20 is wound around the coil 19, the top end of the traction rope 20 is fixedly connected to the guide block 21, and the inner top end of the guide groove 14 is fixedly connected to a connecting rod 18. A connecting spring 26 is connected, and the bottom end of the connecting spring 26 is fixedly connected to the guide block 21. The guide block 21 is fixed in the middle part of the side end of the limit frame 22. The guide block 21 corresponds to the coil 19 one by one through the traction rope 20. The drive of the worm 16 and the worm wheel 17 can drive the coil 19 on the transmission shaft 18 to reel and unreel the traction rope 20. In conjunction with the connecting spring 26, the white light source device 25 in the limit frame 22 can be driven to rotate at a uniform speed along the trajectory of the guide groove 14. For the same position of the chip, the light intensity information of different irradiation angles can be compared, and the light intensity information differential map can be obtained for subsequent defect detection, which can effectively detect various types and forms of defects on the surface of the non-patterned wafer.

[0039] Specifically, when the chip defect detection device is in use: first, the staff can place the chip to be detected on the second translation stage 9, and then the staff can drive the hydraulic rod 10 on the optical platform 1. Under the driving action of the hydraulic rod 10, the event camera 12 can be driven to move upward or downward through the mounting plate 11 to control the precise focus of the event camera 12 and the chip to be tested, thereby improving the measurement accuracy. Then the staff can drive the third servo motor 15 on the optical platform 1. At this time, under the driving action of the third servo motor 15, the worm 16 can be driven to rotate stably, and under the rotation action of the worm 16, the meshing worm wheel 17 can drive the coil 19 on the transmission shaft 18 to rotate stably. At this time, under the rotation action of the coil 19, the traction rope 20 can be wound at a uniform speed. At this time, under the winding action of the traction rope 20, The guide block 21 can be pulled to move at a uniform speed in the guide groove 14 on the adjustment plate 13. At this time, under the uniform movement of the guide block 21, the internal white light source device 25 can be driven to rotate at a uniform speed through the limit frame 22. During the uniform rotation of the white light source device 25, the angle of the white light irradiated by the white light source device 25 can be uniformly adjusted on the surface of the chip. At this time, the event camera 12 is used to capture the white light scattered on the chip surface. By uniformly adjusting the irradiation angle of the white light, the light intensity information of different irradiation angles can be compared for the same position of the chip, and a light intensity information difference map can be obtained for subsequent defect detection. In conjunction with the computer processing device 27, various types and forms of defects on the surface of the non-patterned wafer can be effectively detected, such as scratches, foreign matter, protrusions, dislocations, missing, pollutants, etc., thereby improving the quality and efficiency of chip manufacturing.

[0040] Similarly, when the white light source device 25 needs to be reset, it is only necessary to drive the worm 16 to rotate in the opposite direction, and the worm wheel 17 connected by meshing can drive the coil 19 on the transmission shaft 18 to rotate in the opposite direction. At this time, under the reverse rotation of the coil 19, the traction rope 20 can be unwound at a uniform speed. At this time, during the unwinding process of the traction rope 20, under the elastic contraction of the connecting spring 26, the guide block 21 can be driven to move upward in the guide groove 14 on the adjustment plate 13 to reset, so that the internal white light source device 25 can be driven to move upward and reset through the limit frame 22, thereby ensuring the stability and convenience of the subsequent repeated working state of the white light source device 25.

[0041] During the chip inspection process, the staff can drive the first servo motor 3 in the first translation stage 2 to drive the first threaded rod 4 to rotate stably. At this time, under the rotation of the first threaded rod 4, the first sliding block 5 connected by thread can drive the second translation stage 9 to move left or right through the second sliding block 8. The staff can drive the second servo motor 6 in the first sliding block 5 to drive the second threaded rod 7 to rotate stably. At this time, under the rotation of the second threaded rod 7, the second sliding block 8 connected by thread can drive the second translation stage 9 to move forward or backward in the first sliding block 5. By being able to drive the second translation stage 9 to perform convenient and stable forward and backward shifts or left and right shifts, it is used to scan different positions of the chip to be tested and identify defects on the chip surface, and finally display the coded image, the defect position and type of the chip to be tested.

[0042] The above embodiments are only used to illustrate the utility model but not to limit the technical solutions described in the utility model. Although the present invention has been described in detail with reference to the above embodiments, the utility model is not limited to the above specific implementation methods. Therefore, any modification or equivalent replacement of the utility model; and all technical solutions and improvements that do not deviate from the spirit and scope of the utility model are included in the scope of the claims of the utility model.

Claims

1. A chip defect detection device, comprising an optical platform (1) and a guide block (21), characterized in that: A first translation platform (2), a hydraulic rod (10), an adjustment plate (13) and a third servo motor (15) are fixedly mounted on the top surface of the optical platform (1); a first servo motor (3) is mounted inside the first translation platform (2); an output end of the first servo motor (3) is connected to a first threaded rod (4); the first threaded rod (4) is rotatably connected inside the first translation platform (2); a first sliding block (5) is threadedly connected to the first threaded rod (4); the first sliding block (5) is slidably connected inside the first translation platform (2); a second servo motor (6) is mounted inside the first sliding block (5); an output end of the second servo motor (6) is connected to a second threaded rod (7); the second threaded rod (7) is rotatably connected inside the first sliding block (5); A second sliding block (8) is threadedly connected to the rod (7), and the second sliding block (8) is slidably connected to the first sliding block (5). The top end of the second sliding block (8) is fixedly connected to a second translation platform (9). The top end of the hydraulic rod (10) is fixedly connected to a mounting plate (11), and an event camera (12) is bolted to the mounting plate (11). A guide groove (14) is provided on the adjustment plate (13), and the guide block (21) is slidably connected to the guide groove (14). A limit frame (22) is fixedly connected to the guide block (21), and a third threaded rod (23) is threadedly connected to the limit frame (22). The bottom end of the third threaded rod (23) is rotatably connected to a rubber block (24), and a white light source device (25) is arranged in the limit frame (22).

2. A chip defect detection device according to claim 1, characterized in that: The first threaded rod (4) is connected to the middle part of the bottom of the first sliding block (5), the top end surface of the first sliding block (5) is in contact with the bottom end surface of the second translation platform (9), and the second sliding block (8) is fixed to the center part of the bottom of the second translation platform (9).

3. A chip defect detection device according to claim 1, characterized in that: The vertical center line of the event camera (12) and the vertical center line of the first translation platform (2) are located on the same center line, and the length of the event camera (12) is smaller than the length of the hydraulic rod (10).

4. A chip defect detection device according to claim 1, characterized in that: The top of the adjustment plate (13) and the guide groove (14) are both in the shape of an arc. The adjustment plates (13) are symmetrically distributed on both sides of the limit frame (22). The adjustment plates (13) correspond one-to-one with the guide blocks (21) through the guide grooves (14). The guide blocks (21) are in the shape of an arc.

5. The chip defect detection device according to claim 1, characterized in that: The output end of the third servo motor (15) is connected to a worm (16), the worm (16) is meshedly connected to a worm wheel (17), the worm wheel (17) is fixedly connected to a transmission shaft (18), the transmission shaft (18) is rotatably connected to the adjustment plate (13), the transmission shaft (18) is fixedly connected to a coil (19), a traction rope (20) is wound around the coil (19), the top end of the traction rope (20) is fixedly connected to a guide block (21), the inner top end of the guide groove (14) is fixedly connected to a connecting spring (26), and the bottom end of the connecting spring (26) is fixedly connected to the guide block (21).

6. A chip defect detection device according to claim 5, characterized in that: The guide block (21) is fixed at the middle part of the side end of the limiting frame (22), and the guide block (21) corresponds to the coil (19) one by one through the traction rope (20).

Images