Power device aging test system

Abstract

The utility model provides a power device aging test system, which comprises a frame, an electrical layer and a test single layer, the electrical layer and the test single layer are fixed in the frame in a laminated manner, the test single layer comprises a drive board unit and an aging unit, and the drive board unit is connected with the aging unit. Comprising an aging assembly attached to the power device and a driving assembly used for driving the power device, and the aging assembly and the driving assembly are both driven by the driving board unit. According to the utility model, the aging test process of the power device is completed through the test single layer arranged in the frame, and the power device is fixedly arranged in the aging unit in the test process and is driven by the driving board to complete the test process. The combination of the heat insulation plate and the heat sink is used for providing an aging environment for the power device and preventing heat from being dissipated to the circuit and the PCB, so that the service life of the test system is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field related to chip aging test, in particular to a power device aging test system. Background Art

[0002] The current aging methods are basically non-contact, where the product is installed in a socket and then placed in a temperature chamber for aging. In the existing technology, the socket, circuit, and PCB aging board connected to the product are all aged at the same temperature in the temperature chamber, which causes great damage to the entire circuit and PCB board.

[0003] Furthermore, in the aging process of the prior art, each product corresponds to a socket and undergoes a separate aging test process, which makes it impossible to conduct batch testing, resulting in high production costs, low space utilization, and low production capacity of the entire equipment. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the defects of the prior art. The utility model proposes a power device aging test system, which performs aging tests on products in batches, eliminates defective products, ensures the yield, and reduces the damage to the entire circuit and PCB board during the aging test.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a power device aging test system, including a frame and an electrical layer and a test layer fixed in the frame in a stacked manner, the test layer including a driving board unit and an aging unit, the aging unit including an aging component arranged to fit the power device and a driving component for driving the power device, the aging component and the driving component are both driven by the driving board unit.

[0006] Furthermore, the aging unit is a double-sided structure, including a tray for loading power devices, the tray is clamped between the driving component and the aging component, the aging component is in close contact with the power device, and the driving component is used to connect the power device and the driving board unit.

[0007] Furthermore, the aging component is also a double-sided structure, including a heating PCB board, a heat sink and a heat insulation board. The heat sink is attached to one side of the heating PCB board, and the heat insulation board presses and fixes the heat sink to one side of the heating PCB board. End plates and tail plates are also arranged at both ends of the heating PCB board.

[0008] Furthermore, the heat insulation board is a hollow structure, the heat sink can be embedded in the hollow area of ​​the heat insulation board, and the thickness of the heat sink is the same as the thickness of the heat insulation board.

[0009] Furthermore, the driving assembly includes a probe seat, and a plurality of probes are fixedly arranged throughout the thickness direction of the probe seat, and the positions of the probes correspond to the positions of the power devices loaded on the tray; an upper cover PCB board is fixedly arranged on the outer side of the probe seat, and the upper cover PCB board is used to be connected to the driving board unit; a plurality of rubber strips are fixedly arranged on the side of the probe seat facing the heat sink, and the probe seat is fixed to the outer side of the thermal insulation board.

[0010] Furthermore, the driving board unit includes a driving board and a socket for plugging the driving board, the socket is fixedly arranged on the mounting bracket, and the upper cover PCB board is plugged into the other side of the socket.

[0011] Furthermore, a proximity switch, a probe and a positioning pin seat are fixedly arranged on the mounting bracket, and the proximity switch, the probe and the positioning pin seat are in contact with the end plate.

[0012] Furthermore, the test single layer is a frame structure, the drive board unit and the aging unit are fixed in the test single layer, and a control power supply and electrical components are also arranged in the test single layer. The control power supply supplies energy to the drive board unit and the aging unit through the electrical components.

[0013] Furthermore, a partition is provided in the test single layer for dividing the test single layer into an upper and lower layer, the control power supply and the electrical components are fixedly arranged on the partition, and the drive board unit and the aging unit are fixedly arranged below the partition;

[0014] A back plate is also arranged below the partition, the driving plate unit and the aging unit are respectively arranged on both sides of the back plate, the mounting bracket is fixedly arranged on the back plate, a guide rail is arranged based on the mounting area of ​​the aging unit, and the aging unit can reciprocate along the guide rail.

[0015] Furthermore, each test layer is regulated by the electrical layer, and a plurality of brackets are arranged within the frame, and the test layer and the electrical layer are supported by the brackets.

[0016] Compared with the prior art, the beneficial effects of the utility model include:

[0017] 1) The aging test process of the power device is completed by the test single layer set in the frame, wherein the power device is fixed in the aging unit during the test process, and the driver board drives the test process. The combination of the heat insulation board and the heat sink is used to provide an aging environment for the power device and prevent heat from escaping to the circuit and PCB board, thereby ensuring the service life of the test system;

[0018] 2) A tray is provided in the aging unit to position and support the power device. The slots provided on the tray make good use of the space of the tray, so that the aging test process of multiple power devices can be completed at one time in the aging unit, which reduces the production cost, improves the space utilization rate, and significantly improves the production capacity of the entire test system;

[0019] 3) By setting up guide rails in the test single layer, the drive board unit and the aging unit can rely on the guide rails to complete precise positioning, effectively reducing the time for changing test batches and ensuring the production capacity of the entire test system. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The disclosure of the present invention is described with reference to the accompanying drawings. It should be understood that the drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In the accompanying drawings, the same reference numerals are used to refer to the same components. Among them:

[0021] Figure 1 The overall structure of the power device aging test system is schematically shown;

[0022] Figure 2 The exploded structure of the aged unit is shown schematically;

[0023] Figure 3 The exploded structure of the aged component is shown schematically;

[0024] Figure 4 The cross-sectional structure of the drive assembly is schematically shown;

[0025] Figure 5 The overall structure of the drive plate unit is schematically shown;

[0026] Figure 6 The schematic shows the internal structure and layout of the test single layer.

[0027] Numbers in the figure: 1-frame, 2-electrical layer, 3-test single layer, 4-drive board unit, 5-aging unit, 6-aging assembly, 7-drive assembly, 8-tray, 9-heating PCB board, 10-heat sink, 11-insulation board, 12-end plate, 13-tail plate, 14-probe seat, 15-upper cover PCB board, 16-rubber strip, 17-socket, 18-proximity switch, 19-probe, 20-locating pin seat, 21-control power supply, 22-electrical components. DETAILED DESCRIPTION

[0028] It is easy to understand that according to the technical solution of the utility model, without changing the essential spirit of the utility model, a person skilled in the art can propose a variety of interchangeable structural modes and implementation modes. Therefore, the following specific implementation modes and drawings are only exemplary descriptions of the technical solution of the utility model, and should not be regarded as the entirety of the utility model or as a limitation or restriction to the technical solution of the utility model.

[0029] Figure 1 The overall structure of the power device aging test system is schematically shown. A power device aging test system such as Figure 1 As shown, it includes a frame 1 and an electrical layer 2 and a test layer 3 fixed in the frame 1 in a stacked manner. The test layer 3 includes a driving board unit 4 and an aging unit 5. The aging unit 5 includes an aging component 6 arranged to fit the power device and a driving component 7 for driving the power device. The aging component 6 and the driving component 7 are both driven by the driving board unit 4.

[0030] Figure 2 The exploded structure of the aging unit 5 is schematically shown, as Figure 2 As shown, the aging unit 5 is a double-sided structure, including a tray 8 for loading power devices, the tray 8 is sandwiched between the drive assembly 7 and the aging assembly 6, and a plurality of embedding grooves for placing power devices are opened in the middle area of ​​the tray 8. The power devices can be embedded in the aforementioned embedding grooves, and the aging assembly 6 is in close contact with the aforementioned power devices. The drive assembly 7 is in contact with the terminal portion of the aforementioned power device, which is used to connect the power device and the drive board unit 4, and to supply energy to the power device through the drive board unit 4. The power device is fixed to the two sides of the aging unit 5 by applying the tray 8 on the opposite sides of the aging unit 5, and the drive assembly 7 is fixed to the outer edge of the tray 8.

[0031] Figure 3 The exploded structure of the aged component 6 is schematically shown, combined with Figure 3 The aging component 6 is described in detail. The aging component 6 is also a double-sided structure, including a heating PCB board 9, a heat sink 10 and a heat insulation board 11. The heat sink 10 is attached to one side of the heating PCB board 9. The heat insulation board 11 presses and fixes the heat sink 10 to one side of the heating PCB board 9. End plates 12 and tail plates 13 are also provided at both ends of the heating PCB board 9. Terminals for supplying power to the heating PCB board 9 are provided on the end plate 12, and are connected to the driving board unit 4 through the end plate 12.

[0032] It is worth noting that the aforementioned insulation board 11 is a hollow structure, and the heat sink 10 can be embedded in the hollow area of ​​the insulation board 11, and the thickness of the heat sink 10 is the same as the thickness of the insulation board 11, so that the heat sink 10 can be embedded in the hollow area of ​​the insulation board 11, and when the heat sink 10 and the insulation board 11 are fixed as one, the heights of the two are the same, which is convenient for the tray 8 to be fixed in the aging component 6 and the driving component 7.

[0033] Figure 4 The cross-sectional structure of the drive assembly 7 is schematically shown. Figure 4 The structure of the drive assembly 7 is described in detail. The drive assembly 7 includes a probe seat 14, and a plurality of probes 19 are fixedly arranged in the thickness direction of the probe seat 14. The position of the probe 19 corresponds to the position of the power device loaded on the tray 8. An upper cover PCB board 15 is fixedly arranged on the outer side of the probe seat 14. One end of the probe 19 contacts the upper cover PCB board 15, and the other end contacts the power device, so that the power device is connected to the upper cover PCB board 15, which is convenient for the test process. The upper cover PCB board 15 is connected to the drive unit to carry out the test process of the power device. A plurality of rubber strips 16 are fixedly arranged on the side of the probe seat 14 facing the heat sink 10. The probe seat 14 is fixed to the outer side of the heat insulation board 11 for pressing the power device.

[0034] By arranging the power devices on the tray 8, and then placing the tray 8 in the aging base and the upper cover assembly, the aging component 6 provides an aging environment for the power devices, and the driving component 7 powers on the power devices to achieve batch aging testing of the products, which has extremely high testing capacity; in addition, the heat sink 10 arranged on the aging component 6 is close to the power device, and the heat insulation board 11 is arranged to prevent heat dissipation from causing damage to the circuit and the PCB board.

[0035] Figure 5 The overall structure of the drive plate unit 4 is schematically shown, combined with Figure 5 The driving board unit 4 is described in detail. The driving board unit 4 includes a driving board and a socket 17 for plugging the driving board, the socket 17 is fixedly arranged on the mounting bracket, the aforementioned heating PCB board 9 is plugged into the other side of the socket 17, and the driving board and the upper cover PCB board 15 are connected through the provided socket 17, so that the driving board drives the power device connected to the upper cover PCB board 15, so as to complete the energy supply and regulation of the power device, and feed back the test data of the power device to the test terminal.

[0036] A proximity switch 18, a probe 19 and a positioning pin seat 20 are also fixedly arranged on the aforementioned mounting bracket. The positioning pin seat 20 is arranged at the upper and lower ends of the mounting bracket and is arranged in parallel with the probe 19 and the proximity switch 18. Based on the aforementioned end plate 12, the same number of terminals as those located on the mounting bracket are fixedly arranged, and the terminal position corresponds to the probe 19. A positioning pin shaft that can cooperate with the positioning pin seat 20 is also arranged on the end plate 12. The proximity switch 18 arranged on the mounting bracket detects the installation status of the upper cover PCB board 15 and the driving board in the aging unit 5, thereby determining whether to supply energy to the heating PCB board 9.

[0037] The aforementioned test single layer 3 is a frame 1 structure, and the drive board unit 4 and the aging unit 5 are fixedly arranged in the test single layer 3. A control power supply 21 and electrical components 22 are also arranged in the test single layer 3. The control power supply 21 supplies energy to the drive board unit 4 and the aging unit 5 through the electrical components 22.

[0038] Figure 6 The internal structure and layout of the test single layer 3 are schematically shown, combined with Figure 6 The internal arrangement of the test single layer 3 is described. A partition is provided in the test single layer 3 to separate the test single layer 3 into two layers, the control power supply 21 and the electrical components 22 are fixedly provided on the partition of the test single layer 3 (i.e., the upper layer), and the drive board unit 4 and the aging unit 5 are fixedly provided below the partition (i.e., the lower layer). A back plate is also provided in the lower layer, and the drive board unit 4 and the aging unit 5 are respectively provided on both sides of the back plate, and the back plate is used as a mounting bracket. The aforementioned socket 17, proximity switch 18, probe 19 and positioning pin seat 20 are fixed on the back plate. In order to facilitate the fixing of the drive board, a bottom plate is fixedly provided on the bottom surface of the test single layer 3 on the side of the aforementioned back plate where the proximity switch 18, probe 19 and positioning pin seat 20 are not provided, and a guide rail is provided on the bottom plate to facilitate the fixing of the drive board and the quick plugging of the drive board and the socket 17. A guide rail is also provided on the side facing the back panel where the proximity switch 18, the probe 19 and the positioning pin seat 20 are provided. The width of the guide rail is the same as that of the aging unit 5, which facilitates the rapid plug-in process of the aging unit 5. It is worth noting that the end plate 12 is plugged into the back panel. To further fix the aging unit 5, a claw is fixed on the tail plate 13. After the aging unit 5 is completely pushed into the test single layer 3 through the guide rail, the claw is embedded in the side wall of the test single layer 3, and the aging unit 5 is doubly fixed through the claw and the socket 17 to ensure the stability of the aging test process.

[0039] It is worth noting that cooling fans are provided on the partition in the middle and the panel facing the driving board unit 4 to avoid heat deposition in the test single layer 3. In some embodiments, the control power supply 21 is arranged in the upper layer in a stacked manner, and can be arranged in the upper layer in other ways, which is not limited by the present invention.

[0040] Multiple groups of single-layer brackets for supporting the electrical layer 2 and the test single layer 3 are arranged inside the frame 1, and a door panel for closing is arranged, which is fixed on the frame 1 by a hinge, and casters for moving the entire power device aging test system are fixed under the frame 1. The test single layer 3 of each layer is regulated by the electrical layer 2 and the test data is collected and transmitted to the test terminal to eliminate defective power devices and ensure the yield.

[0041] The technical scope of the present invention is not limited to the contents described above. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical concept of the present invention, and these deformations and modifications should all fall within the protection scope of the present invention.

Claims

1. A power device aging test system, characterized in that: The invention comprises a frame (1), and an electrical layer (2) and a test layer (3) fixed in a stacked manner within the frame (1); the test layer (3) comprises a drive board unit (4) and an aging unit (5); the aging unit (5) comprises an aging component (6) arranged to fit a power device and a drive component (7) for driving the power device; the aging component (6) and the drive component (7) are both driven by the drive board unit (4).

2. The power device aging test system according to claim 1, characterized in that: The aging unit (5) is a double-sided structure, comprising a tray (8) for loading power devices, the tray (8) being sandwiched between a drive component (7) and an aging component (6), the aging component (6) being in close contact with the power device, and the drive component (7) being used to connect the power device and the drive board unit (4).

3. The power device aging test system according to claim 2, characterized in that: The aging component (6) is also a double-sided structure, comprising a heating PCB board (9), a heat sink (10) and a heat insulation board (11), wherein the heat sink (10) is attached to one side of the heating PCB board (9), and the heat insulation board (11) presses and fixes the heat sink (10) to one side of the heating PCB board (9), and end plates (12) and tail plates (13) are also arranged at both ends of the heating PCB board (9).

4. The power device aging test system according to claim 3, characterized in that: The heat insulation board (11) is a hollow structure, the heat sink (10) can be embedded in the hollow area of ​​the heat insulation board (11), and the thickness of the heat sink (10) is the same as the thickness of the heat insulation board (11).

5. The power device aging test system according to claim 4, characterized in that: The driving assembly (7) comprises a probe seat (14), and a plurality of probes are fixedly arranged in the thickness direction of the probe seat (14), and the positions of the probes correspond to the positions of the power devices loaded on the tray (8); an upper cover PCB board (15) is fixedly arranged on the outer side of the probe seat (14), and the upper cover PCB board (15) is used to connect with the driving board unit (4); a plurality of rubber strips (16) are fixedly arranged on the side of the probe seat (14) facing the heat sink (10), and the probe seat (14) is fixed to the outer side of the heat insulation board (11).

6. The power device aging test system according to claim 5, characterized in that: The driving board unit (4) comprises a driving board and a socket (17) for plugging the driving board, the socket (17) being fixedly arranged on the mounting bracket, and the upper cover PCB board (15) being plugged into the other side of the socket (17).

7. The power device aging test system according to claim 6, characterized in that: A proximity switch (18), a probe (19) and a positioning pin seat (20) are also fixedly arranged on the mounting bracket, and the proximity switch (18), the probe (19) and the positioning pin seat (20) are in contact with the end plate (12).

8. The power device aging test system according to claim 1, characterized in that: The test single layer (3) is a frame (1) structure, the drive board unit (4) and the aging unit (5) are fixed in the test single layer (3), and a control power supply (21) and electrical components (22) are also arranged in the test single layer (3), and the control power supply (21) supplies energy to the drive board unit (4) and the aging unit (5) through the electrical components (22).

9. The power device aging test system according to claim 8, characterized in that: A partition plate for dividing the test single layer (3) into an upper and lower layer is also provided in the test single layer (3); the control power supply (21) and the electrical components (22) are fixedly arranged on the partition plate, and the drive board unit (4) and the aging unit (5) are fixedly arranged below the partition plate; A back plate is also provided below the partition, the drive plate unit (4) and the aging unit (5) are respectively provided on both sides of the back plate, a mounting bracket is fixedly provided on the back plate, a guide rail is provided based on the mounting area of ​​the aging unit (5), and the aging unit (5) can reciprocate along the guide rail.

10. The power device aging test system according to claim 1, characterized in that: Each test single layer (3) is regulated by the electrical layer (2), and a plurality of brackets are arranged inside the frame (1), and the test single layer (3) and the electrical layer (2) are supported by the brackets.

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