Full-screen fingerprint identification device and electronic equipment

Abstract

The utility model discloses a full-screen fingerprint identification device and electronic equipment, and the device comprises a transparent substrate which comprises a visible area and a frame area, and the frame area is disposed at the periphery of the visible area and is provided with a binding position; the fingerprint sensing layer is arranged in a visible area on the surface of the transparent substrate, and the fingerprint sensing layer is a nano-copper film. According to the utility model, the nano-copper fingerprint induction pattern and the ITO fingerprint induction pattern which are mutually laminated and the nano-copper wiring pattern and the ITO wiring pattern which are mutually laminated are formed by simultaneously etching the nano-copper film and the ITO conducting layer, so that full-screen fingerprint identification can be realized, fingerprint induction resistance and wiring resistance are reduced, the manufacturing process is simple, the price is low, and the production cost is low. The device can also be used on curved surfaces.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic screens, and in particular to a full-screen fingerprint recognition device and an electronic device. Background Art

[0002] Fingerprint recognition technology has now been applied to a variety of display devices. For example, on smartphones, fingerprint recognition has become one of the standard configurations. In order to adapt to the design requirements of full-screen displays and to further increase the screen-to-body ratio, full-screen fingerprint recognition devices have attracted the attention of more and more manufacturers.

[0003] The current full-screen fingerprint recognition device is made of ITO-coated glass. The ITO film on the ITO-coated glass is etched through a yellow light process to form a fingerprint sensing pattern. However, the resistivity of ITO is relatively large. As the screen size increases, the resistance of the fingerprint sensing pattern becomes larger and the induced current becomes smaller, which will affect the sensing accuracy and response speed of fingerprint recognition. Utility Model Content

[0004] In order to solve the deficiencies of the above-mentioned prior art, the utility model provides a full-screen fingerprint recognition device and an electronic device, which can realize full-screen fingerprint recognition and reduce fingerprint sensing resistance and wiring resistance by simultaneously etching a nano-copper film and an ITO conductive layer to form mutually stacked nano-copper fingerprint sensing patterns and ITO fingerprint sensing patterns and mutually stacked nano-copper wiring patterns and ITO wiring patterns, so as to simplify the manufacturing process, reduce the price, and can also be used on curved surfaces.

[0005] The technical problem to be solved by the utility model is achieved by the following technical solution: A full-screen fingerprint recognition device, comprising a transparent substrate, including a visible area and a frame area, wherein the frame area is arranged around the visible area;

[0006] The fingerprint sensing layer comprises a nano copper film and an ITO conductive layer stacked in sequence, wherein the ITO conductive layer is arranged on the upper surface of the transparent substrate;

[0007] The nano-copper film covers the visible area and the frame area, including a nano-copper electrode pattern located on the visible area and a nano-copper wiring pattern located on the frame area;

[0008] The ITO conductive layer covers the visible area and the frame area, including an ITO electrode pattern located on the visible area and an ITO wiring pattern located on the frame area;

[0009] The nano copper electrode pattern overlaps with the ITO electrode pattern, and the nano copper wiring pattern overlaps with the ITO wiring pattern.

[0010] As another preferred embodiment of the full-screen fingerprint recognition device of the present invention, the fingerprint sensing layer is formed by a yellow light process.

[0011] As another preferred embodiment of the full-screen fingerprint recognition device of the present invention, a first optical adhesive layer is provided on the lower surface of the transparent substrate.

[0012] As another preferred embodiment of the full-screen fingerprint recognition device of the present invention, the transparent substrate is bonded to the display screen through the first optical adhesive layer.

[0013] As another preferred embodiment of the full-screen fingerprint recognition device of the present invention, the transparent substrate border area is silk-screened with an ink layer.

[0014] As another preferred embodiment of the full-screen fingerprint recognition device of the present invention, a pin binding position is provided on the side of the fingerprint sensing layer, and the pin binding position is electrically connected to the FPC.

[0015] As another preferred embodiment of the full-screen fingerprint recognition device of the present invention, a second optical adhesive layer is provided on the surface of the fingerprint sensing layer.

[0016] As another preferred embodiment of the full-screen fingerprint recognition device of the present invention, a protective cover plate is provided on the upper surface of the second optical adhesive layer.

[0017] As another preferred embodiment of the full-screen fingerprint recognition device of the present invention, the first optical adhesive layer and the second optical adhesive layer are OCA adhesive layers or OCR adhesive layers.

[0018] An electronic device comprises a full-screen fingerprint recognition device as described in any one of the above items.

[0019] The utility model has the following beneficial effects: a full-screen fingerprint recognition device, comprising: a transparent substrate, comprising a visible area and a frame area, wherein the frame area is arranged around the visible area; a fingerprint sensing layer, comprising a nano copper film and an ITO conductive layer stacked in sequence, wherein the ITO conductive layer is arranged on the upper surface of the transparent substrate; the nano copper film covers the visible area and the frame area, comprising a nano copper electrode pattern located on the visible area and a nano copper wiring pattern located on the frame area; the ITO conductive layer covers the visible area and the frame area, comprising an ITO electrode pattern located on the visible area and an ITO wiring pattern located on the frame area; the nano copper electrode pattern overlaps with the ITO electrode pattern, and the nano copper wiring pattern overlaps with the ITO wiring pattern. The utility model simultaneously etches the nano-copper film and the ITO conductive layer to form mutually stacked nano-copper fingerprint sensing patterns and ITO fingerprint sensing patterns and mutually stacked nano-copper wiring patterns and ITO wiring patterns, thereby realizing full-screen fingerprint recognition and reducing fingerprint sensing resistance and wiring resistance, making the manufacturing process simple, inexpensive, and also usable on curved surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A schematic diagram of the nano copper film structure of the full-screen fingerprint recognition device provided by the utility model;

[0022] Figure 2 A schematic diagram of the fingerprint sensing layer structure of the full-screen fingerprint recognition device provided by the utility model;

[0023] Figure 3 A schematic diagram of the fingerprint sensing layer stacking structure of the full-screen fingerprint recognition device provided by the present invention;

[0024] Figure 4 A schematic diagram of the transparent substrate structure of the full-screen fingerprint recognition device provided by the utility model;

[0025] Figure 5 This is a schematic diagram of the stacking structure of the full-screen fingerprint recognition device provided by the utility model.

[0026] 1. Transparent substrate; 11. Visible area; 12. Frame area; 13. Ink layer; 2. Fingerprint sensing layer; 21. Nano copper film; 22. ITO conductive layer; 3. Pin binding position; 4. FPC; 5. First optical adhesive layer; 6. Second optical adhesive layer; 7. Protective cover. DETAILED DESCRIPTION

[0027] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0028] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Embodiment 1

[0032] like Figures 1 to 4 As shown, a full-screen fingerprint recognition device is characterized by comprising a transparent substrate 1, including a visible area 11 and a frame area 12, wherein the frame area 12 is arranged around the visible area 11;

[0033] The fingerprint sensing layer 2 comprises a nano copper film 21 and an ITO conductive layer 22 stacked in sequence, wherein the ITO conductive layer 22 is disposed on the upper surface of the transparent substrate 1;

[0034] The nano-copper film 21 covers the visible area 11 and the border area 12 , including a nano-copper electrode pattern located on the visible area 11 and a nano-copper wiring pattern located on the border area 12 ;

[0035] The ITO conductive layer 22 covers the visible area 11 and the frame area 12, including an ITO electrode pattern located on the visible area 11 and an ITO wiring pattern located on the frame area 12;

[0036] The nano copper electrode pattern overlaps with the ITO electrode pattern, and the nano copper wiring pattern overlaps with the ITO wiring pattern.

[0037] The utility model simultaneously etches the nano-copper film 21 and the ITO conductive layer 22 to form mutually stacked nano-copper fingerprint sensing patterns and ITO fingerprint sensing patterns and mutually stacked nano-copper wiring patterns and ITO wiring patterns, thereby realizing full-screen fingerprint recognition. The mutually stacked nano-copper fingerprint sensing patterns and ITO fingerprint sensing patterns increase the cross-sectional area of ​​the fingerprint sensing patterns and can reduce the fingerprint sensing resistance. Similarly, the mutually stacked nano-copper wiring patterns and ITO wiring patterns also increase the cross-sectional area of ​​the wiring patterns and can reduce the wiring resistance, thereby making the manufacturing process simple, inexpensive, and can also be used on curved surfaces.

[0038] The transparent substrate 1 may be a rigid substrate such as a glass substrate, a plastic substrate or a sapphire substrate, or may be a flexible substrate such as a flexible film or ultra-thin glass.

[0039] Furthermore, the fingerprint sensing layer 2 is formed by using a yellow light process.

[0040] It should be noted that the yellow light process is a commonly used microelectronics processing technology. The photoresist is covered on the surface of the silicon wafer through photolithography technology, and then UV light is projected on the photoresist to form the desired pattern. In this embodiment, the fingerprint sensing layer is formed by the yellow light process, which can accurately form a fingerprint sensing pattern on the nano copper film, thereby improving the accuracy and stability of fingerprint recognition. In addition, the yellow light process has the advantages of simple process, low cost, and high production efficiency. It is suitable for large-scale production, can reduce production costs, and improve production efficiency. Therefore, the use of the yellow light process to form the fingerprint sensing layer can not only realize full-screen fingerprint recognition, but also reduce production costs, improve production efficiency, and is suitable for large-scale production.

[0041] In another preferred implementation of this embodiment, the fingerprint sensing layer 2 is a transparent anode pattern arranged in an array, which can realize full-screen fingerprint recognition.

[0042] Embodiment 2

[0043] like Figure 5As shown, a first optical adhesive layer 5 is provided on the lower surface of the transparent substrate 1 .

[0044] Furthermore, the transparent substrate 1 is bonded to the display screen through the first optical adhesive layer 5 .

[0045] The first optical adhesive layer 5 and the second optical adhesive layer 6 are OCA adhesive layers or OCR adhesive layers.

[0046] Among them, OCA glue Optically Clear Adhesive and OCR glue Optical Clear Resin are both transparent optical adhesive layers, which are commonly used in electronic display screens, touch screens, optical devices and other fields.

[0047] OCA glue is an adhesive with high transparency and excellent optical properties. It is usually made of polymer materials and has good adhesion and weather resistance. The OCA glue layer can be used to bond the transparent substrate and the display screen together to provide better visual effects and protect the screen from the external environment. The OCA glue layer has high transparency, low refractive index and low scattering properties, which can reduce the reflection and scattering of light and improve the contrast and brightness of the display. In addition, the OCA glue layer also has good heat resistance and moisture resistance, and can maintain stability under various environmental conditions.

[0048] Optical Clear Resin is an optical grade epoxy resin and also a transparent optical adhesive layer. The OCR adhesive layer is usually made of polymer resin with high transparency and excellent optical properties. It is often used for encapsulation and protection of optical devices, such as optical lenses, optical filters, etc. The OCR adhesive layer has high refractive index and low scattering properties, which can improve the light transmission performance and optical effect of optical devices. In addition, the OCR adhesive layer also has good chemical resistance and heat resistance, and can maintain stability under various environmental conditions.

[0049] In general, OCA glue and OCR glue are transparent optical adhesive layers used to provide protection and enhance the visual effects and performance of displays, touch screens and optical devices.

[0050] In another preferred embodiment of the present embodiment, the border area 12 of the transparent substrate 1 is screen-printed with an ink layer 13. The ink layer 13 shields the border wiring to prevent the border wiring from being seen from the front of the touch screen. The utility model does not specifically limit the shape of the touch screen area 11 and the border area 12, which can be rectangular, or other polygonal or irregular shapes.

[0051] The ink layer 13 is usually prepared by mixing raw materials such as pigment, resin, solvent, etc. Among them, pigment is a key component of black ink, and commonly used black pigments include carbon black, ferrite, carbon black, etc. Resin is a binder of black ink, which can make the pigment evenly dispersed in the ink and tightly bonded to the surface of the material to be printed. Solvent is a diluent of black ink, which can adjust the viscosity and fluidity of the ink to make it suitable for printing operations.

[0052] The preparation process of black ink generally includes the steps of grinding pigment, mixing resin and solvent, filtering and adjusting. The prepared black ink can be applied to the manufacture of touch screens by printing, spraying, etc. to form black borders and other patterns.

[0053] Furthermore, a pin binding position 3 is provided on the side of the fingerprint sensing layer 2, and the pin binding position 3 is electrically connected to the FPC 4.

[0054] Furthermore, a second optical adhesive layer 6 is disposed on the surface of the fingerprint sensing layer 2. A protective cover plate 7 is disposed on the upper surface of the second optical adhesive layer 6.

[0055] Embodiment 3

[0056] The utility model also provides an electronic device having a full-screen fingerprint recognition device provided by the above utility model embodiment, comprising: a transparent substrate 1, comprising a visible area 11 and a frame area 12, wherein the frame area 12 is arranged around the visible area 11;

[0057] The fingerprint sensing layer 2 comprises a nano copper film 21 and an ITO conductive layer 22 stacked in sequence, wherein the ITO conductive layer 22 is disposed on the upper surface of the transparent substrate 1;

[0058] The nano-copper film 21 covers the visible area 11 and the border area 12 , including a nano-copper electrode pattern located on the visible area 11 and a nano-copper wiring pattern located on the border area 12 ;

[0059] The ITO conductive layer 22 covers the visible area 11 and the frame area 12, including an ITO electrode pattern located on the visible area 11 and an ITO wiring pattern located on the frame area 12;

[0060] The nano copper electrode pattern overlaps with the ITO electrode pattern, and the nano copper wiring pattern overlaps with the ITO wiring pattern.

[0061] The utility model simultaneously etches the nano-copper film and the ITO conductive layer to form mutually stacked nano-copper fingerprint sensing patterns and ITO fingerprint sensing patterns and mutually stacked nano-copper wiring patterns and ITO wiring patterns, thereby realizing full-screen fingerprint recognition and reducing fingerprint sensing resistance and wiring resistance, making the manufacturing process simple, inexpensive, and also usable on curved surfaces.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the utility model rather than to limit them. Although the embodiments of the utility model are described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the embodiments of the utility model can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A full-screen fingerprint recognition device, characterized in that: Comprising: a transparent substrate (1), comprising a visible area (11) and a frame area (12), wherein the frame area (12) is arranged around the visible area (11); A fingerprint sensing layer (2), comprising a nano copper film (21) and an ITO conductive layer (22) stacked in sequence, wherein the ITO conductive layer (22) is arranged on the upper surface of the transparent substrate (1); The nano-copper film (21) covers the visible area (11) and the border area (12), and comprises a nano-copper electrode pattern located on the visible area (11) and a nano-copper wiring pattern located on the border area (12); The ITO conductive layer (22) covers the visible area (11) and the frame area (12), and comprises an ITO electrode pattern located on the visible area (11) and an ITO wiring pattern located on the frame area (12); The nano copper electrode pattern overlaps with the ITO electrode pattern, and the nano copper wiring pattern overlaps with the ITO wiring pattern.

2. The full-screen fingerprint recognition device according to claim 1, characterized in that: The fingerprint sensing layer (2) is formed by using a yellow light process.

3. The full-screen fingerprint recognition device according to claim 1, characterized in that: The lower surface of the transparent substrate (1) is provided with a first optical adhesive layer (5).

4. The full-screen fingerprint recognition device according to claim 3, characterized in that: The transparent substrate (1) is bonded to the display screen via the first optical adhesive layer (5).

5. The full-screen fingerprint recognition device according to claim 1, characterized in that: The transparent substrate (1) has a silk-screen ink layer (13) in the border area (12).

6. The full-screen fingerprint recognition device according to claim 1, characterized in that: A pin binding position (3) is provided on the side of the fingerprint sensing layer (2), and the pin binding position (3) is electrically connected to the FPC (4).

7. The full-screen fingerprint recognition device according to claim 1, characterized in that: A second optical adhesive layer (6) is provided on the surface of the fingerprint sensing layer (2).

8. The full-screen fingerprint recognition device according to claim 7, characterized in that: A protective cover plate (7) is provided on the upper surface of the second optical adhesive layer (6).

9. An electronic device, characterized in that: A full-screen fingerprint recognition device comprising any one of claims 1-8.

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