Side edge fingerprint module and electronic equipment
By setting the same thickness 2D reinforced steel sheet with the same thickness and installation grooves on the 3D reinforced steel sheet, the tilt and warning of the side fingerprint module when the side fingerprint module is improved, and the SMT has been improved. The yield and manufacturing efficiency of the items.
Patent Information
- Application Number
- CN202421188722.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-28
AI Technical Summary
The existing side fingerprint modules have problems with inclination and warpage when installing SMT patches, resulting in low yield and high production costs of SMT punching.
Set the first 2D reinforced steel sheet and the second 2D reinforcement steel sheet with the same thickness on the FPC's second surface, and set up a installation slot and positioning slot on the 3D reinforcement steel sheet to ensure that the FPC is kept when SMT patching in SMT patch. Flat, avoid tilt and warp.
It improves the success rate and yield of SMT, reducing production costs, and improving the flatness and manufacturing efficiency of FPC.
Smart Images

Figure CN222420989U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of fingerprint identification, in particular to a side fingerprint module and electronic equipment. Background Art
[0002] With the rapid development of the mobile Internet era, mobile phones have more integrated functions. Nowadays, the size of mobile phone screens has also reached a critical point. In order to pursue better visual effects, another form of appearance innovation-full screen came into being. The arrival of full screen will inevitably lead to changes in fingerprint recognition technology. One of the design solutions is to place the fingerprint recognition component on the side of the phone to make a side fingerprint solution.
[0003] However, with the needs of end customers and the trend of thinner mobile phones, the side fingerprint module is developing in a narrower direction. Currently, the narrowest width of the side fingerprint is 1.8mm. The side fingerprint module requires SMT (surface mount technology) patches when LGA (Land Grid Array, which literally means grid array packaging), and reinforcing steel sheets need to be set in advance at the corresponding patches on the FPC (flexible circuit board). When manufacturing the structure of the existing side fingerprint module, the 3D reinforcing steel sheet and the 2D reinforcing steel sheet must be bonded to the FPC before SMT patching. Due to the difference in height between the 3D reinforcing steel sheet and the 2D reinforcing steel sheet, there are problems with inclination and warping during SMT patching, resulting in low yield of SMT parts and high production costs for this solution structure. Utility Model Content
[0004] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a side fingerprint module and an electronic device to solve the problem of low yield of the side fingerprint module during SMT assembly in the prior art.
[0005] The purpose of the utility model is achieved through the following technical solutions:
[0006] The utility model provides a side fingerprint module, including an FPC, a first 2D reinforcing steel sheet, a second 2D reinforcing steel sheet, a 3D reinforcing steel sheet, a fingerprint chip and a switch, wherein the FPC has a first surface and a second surface arranged opposite to each other, the fingerprint chip and the switch are both arranged on the first surface, the first 2D reinforcing steel sheet and the second 2D reinforcing steel sheet are both arranged on the second surface and have the same thickness; the FPC is provided with a first patch area and a second patch area, the fingerprint chip and the first 2D reinforcing steel sheet cooperate with each other and are both arranged in the first patch area, the switch and the second 2D reinforcing steel sheet cooperate with each other and are both arranged in the second patch area;
[0007] When the FPC is in a bent state, the first patch area corresponds to the second patch area, and the 3D reinforcing steel sheet is connected between the first 2D reinforcing steel sheet and the second 2D reinforcing steel sheet.
[0008] Furthermore, the 3D reinforcing steel sheet is provided with a mounting groove for mounting the second 2D reinforcing steel sheet, and when the FPC is in a bent state, the second 2D reinforcing steel sheet is mounted in the mounting groove.
[0009] Furthermore, a positioning groove is provided on the side wall of the installation groove, and a positioning protrusion cooperating with the positioning groove is provided on the second 2D reinforcing steel sheet.
[0010] Furthermore, the 3D reinforcing steel sheet is provided with a protrusion, which protrudes from the surface of the 3D reinforcing steel sheet and forms the installation groove with the surface of the 3D reinforcing steel sheet.
[0011] Furthermore, the thickness of the protrusion is equal to the depth of the mounting groove.
[0012] Furthermore, the depth of the installation groove is greater than or equal to the thickness of the second 2D reinforcing steel sheet.
[0013] Furthermore, the 3D reinforcing steel sheet is provided with weight-reducing holes.
[0014] Furthermore, the side fingerprint module includes a third 2D reinforcing steel sheet, the FPC is provided with a third patch area, the third 2D reinforcing steel sheet is provided on the second surface and located in the third patch area, and the third 2D reinforcing steel sheet has the same thickness as the first 2D reinforcing steel sheet and the second 2D reinforcing steel sheet.
[0015] Furthermore, an extension direction of the third patch area is perpendicular to a line connecting the first patch area and the second patch area.
[0016] The present application also provides an electronic device, comprising the side fingerprint module as described above.
[0017] The beneficial effects of the utility model are as follows: by respectively setting the first 2D reinforcing steel sheet and the second 2D reinforcing steel sheet of the same thickness in the first patch area and the second patch area of the second surface of the FPC, the problem of inclination and warping of the FPC during SMT patching is avoided, and the FPC is ensured to be flat during SMT patching, which is conducive to increasing the success rate of SMT mounting and improving the yield rate of SMT mounting; a large number of components can be laid out in a continuous piece, the cost of the FPC soft board is low, and the UPH (units per hour) efficiency of manufacturing is improved. When the 3D reinforcing steel sheet is bent on the FPC, the 3D reinforcing steel sheet acts as a bracket and is connected between the first 2D reinforcing steel sheet and the second 2D reinforcing steel sheet, so as to avoid the 3D reinforcing steel sheet affecting the flatness of the FPC during SMT mounting. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the top view of the side fingerprint module of the utility model before being bent;
[0019] Figure 2 This is a schematic diagram of the side structure of the side fingerprint module of the utility model before being bent;
[0020] Figure 3 This is a schematic diagram of the upward structure of the side fingerprint module of the utility model before being bent;
[0021] Figure 4 It is a schematic diagram of the side structure of the side fingerprint module of the utility model after being bent.
[0022] In the figure: FPC10, first surface 101, second surface 102, first patch area 11, second patch area 12, third patch area 13, first 2D reinforcing steel sheet 21, second 2D reinforcing steel sheet 22, positioning protrusion 221, third 2D reinforcing steel sheet 23, 3D reinforcing steel sheet 30, mounting groove 301, positioning groove 302, weight reduction hole 303, bump 31, fingerprint chip 41, switch 42. DETAILED DESCRIPTION
[0023] The following will use the terms commonly used by those skilled in the art to convey the essence of their work to other technicians in the field to describe the application concepts of the present disclosure. However, these application concepts can be embodied in many different forms and should not be considered to be limited to the embodiments described herein. These embodiments are provided to make the present disclosure more detailed and complete, and to fully convey the scope of its inclusion to those skilled in the art. It should also be noted that these embodiments are not mutually exclusive. Components, steps or elements from one embodiment may be assumed to exist or be used in another embodiment. Without departing from the scope of the embodiments of the present disclosure, various alternatives and / or equivalent implementations may be used to replace the specific embodiments shown and described. The present application is intended to cover any modifications or variations of the embodiments discussed herein. It is obvious to those skilled in the art that only some of the described aspects can be used to practice alternative embodiments. This article describes specific numbers, materials and configurations in the embodiments for the purpose of illustration, however, those skilled in the art can also practice alternative embodiments without these specific details. In other cases, well-known features may be omitted or simplified so as not to make the illustrative embodiments difficult to understand.
[0024] In the description of this application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on this application. It should also be understood that the terms "first" and "second" used herein are only used to distinguish names, and are not used to limit quantity and order.
[0025] In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two elements.
[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the specific implementation methods, structures, features and functions of the side fingerprint module and electronic device proposed by the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments:
[0027] Figure 1 It is a schematic diagram of the top structure of the side fingerprint module of the utility model before being bent. Figure 2It is a side view structural schematic diagram of the side fingerprint module of the utility model before being bent. Figure 3 It is a schematic diagram of the upward structure of the side fingerprint module of the utility model before being bent. Figure 4 It is a schematic diagram of the side structure of the side fingerprint module of the utility model after being bent.
[0028] like Figures 1 to 4 As shown, a side fingerprint module provided by the first embodiment of the utility model includes FPC10, a first 2D reinforcing steel sheet 21, a second 2D reinforcing steel sheet 22, a 3D reinforcing steel sheet 30, a fingerprint chip 41 and a switch 42. The FPC10 has a first surface 101 and a second surface 102 arranged opposite to each other, the fingerprint chip 41 and the switch 42 are both arranged on the first surface 101, the first 2D reinforcing steel sheet 21 and the second 2D reinforcing steel sheet 22 are both arranged on the second surface 102 and have the same thickness. The FPC10 is provided with a first patch area 11 and a second patch area 12, the fingerprint chip 41 and the first 2D reinforcing steel sheet 21 cooperate with each other and are both arranged in the first patch area 11, the switch 42 and the second 2D reinforcing steel sheet 22 cooperate with each other and are both arranged in the second patch area 12. The first surface 101 and the second surface 102 of the FPC 10 both have a first patch area 11 and a second patch area 12, that is, the first surface 101 of the FPC 10 has a first patch area 11 and a second patch area 12, and the same area on the second surface 102 of the FPC 10 also has a first patch area 11 and a second patch area 12. For example, the fingerprint chip 41 is arranged in the first patch area 11 of the first surface 101, the switch 42 is arranged in the second patch area 12 of the first surface 101, the first 2D reinforcing steel sheet 21 is arranged in the first patch area 11 of the second surface 102, and the second 2D reinforcing steel sheet 22 is arranged in the second patch area 12 of the second surface 102.
[0029] When the FPC 10 is in a bent state, the first patch area 11 corresponds to the second patch area 12, and the 3D reinforcing steel sheet 30 is connected between the first 2D reinforcing steel sheet 21 and the second 2D reinforcing steel sheet 22, that is, one side of the 3D reinforcing steel sheet 30 is connected to the first 2D reinforcing steel sheet 21, and the other side opposite is connected to the second 2D reinforcing steel sheet 22. The fingerprint chip 41 is used for fingerprint recognition, and the switch 42 is used as the on / off button of the electronic device.
[0030] The utility model arranges the first 2D reinforcing steel sheet 21 and the second 2D reinforcing steel sheet 22 of the same thickness respectively on the first patch area 11 and the second patch area 12 of the second surface 102 of the FPC 10, thereby avoiding the problems of inclination and warping of the FPC 10 during SMT patch mounting, ensuring that the FPC 10 is flat during SMT patch mounting, which is beneficial to increasing the success rate of SMT mounting and improving the yield rate of SMT mounting; and the 3D reinforcing steel sheet 30 is connected between the first 2D reinforcing steel sheet 21 and the second 2D reinforcing steel sheet 22 when the FPC 10 is bent, thereby avoiding the 3D reinforcing steel sheet 30 affecting the flatness of the FPC 10 during SMT mounting.
[0031] Furthermore, the 3D reinforcing steel sheet 30 is provided with a mounting groove 301 for mounting the second 2D reinforcing steel sheet 22. When the FPC 10 is in a bent state, the second 2D reinforcing steel sheet 22 is mounted in the mounting groove 301. A positioning groove 302 is provided on the side wall of the mounting groove 301, and a positioning protrusion 221 matching the positioning groove 302 is provided on the second 2D reinforcing steel sheet 22. When the FPC 10 is bent, the second 2D reinforcing steel sheet 22 and the 3D reinforcing steel sheet 30 are easily installed and positioned.
[0032] Furthermore, a convex block 31 is provided on the 3D reinforcing steel sheet 30 , and the convex block 31 protrudes from the surface of the 3D reinforcing steel sheet 30 and forms a mounting groove 301 with the surface of the 3D reinforcing steel sheet 30 . The thickness of the convex block 31 is equal to the depth of the mounting groove 301 .
[0033] Furthermore, the depth of the mounting groove 301 is greater than or equal to the thickness of the second 2D reinforcing steel sheet 22 , thereby ensuring that the second patch area 12 of the second surface 102 of the FPC10 is in contact with the 3D reinforcing steel sheet 30 after the FPC10 is bent, thereby providing certain support to the FPC10 .
[0034] Furthermore, the 3D reinforcing steel sheet 30 is provided with weight-reducing holes 303 to remove excess material on the 3D reinforcing steel sheet 30 , thereby reducing the weight of the side fingerprint module. There are two weight-reducing holes 303 , which are located near the two ends of the 3D reinforcing steel sheet 30 .
[0035] In this embodiment, the side fingerprint module includes a third 2D reinforcing steel sheet 23, the FPC 10 is provided with a third patch area 13, the third 2D reinforcing steel sheet 23 is provided on the second surface 102 and is located in the third patch area 13, and the third 2D reinforcing steel sheet 23 has the same thickness as the first 2D reinforcing steel sheet 21 and the second 2D reinforcing steel sheet 22. The third patch area 13 can be bound with a connector to connect the side fingerprint module with the electronic device for electrical signal connection.
[0036] Furthermore, the extension direction of the third patch area 13 is perpendicular to the line connecting the first patch area 11 and the second patch area 12 , that is, the FPC 10 is in a T-shaped structure when unfolded.
[0037] The production method of the side fingerprint module is as follows:
[0038] Provide FPC10, attach the first 2D reinforcing steel sheet 21, the second 2D reinforcing steel sheet 22 and the third 2D reinforcing steel sheet 23 of the same thickness to the second surface 102 of FPC10; turn over FPC10, and use SMT to weld the fingerprint chip 41, the switch 42 and the connector to the first surface 101 of FPC10; the above steps are usually completed by the semi-finished product supplier (such as the manufacturer of the semi-finished FPC). Therefore, the semi-finished product supplier only needs to attach the 2D reinforcing steel sheet, and does not need to attach the 3D reinforcing steel sheet 30.
[0039] The following steps are usually performed by finished product manufacturers: laser classification → manual sheet arrangement → UV glue application → UF glue application → glue application on the first 2D reinforcing steel sheet 21 → attaching the 3D reinforcing steel sheet 30 to the first 2D reinforcing steel sheet 21 → pre-bending FPC10 → UV & UF glue inspection → UF glue baking → FPC10 flattening → attaching folding double-sided tape on the second 2D reinforcing steel sheet 22 → FPC10 folding → manual board removal → pressure keeping after folding → microscope inspection. By respectively arranging the first 2D reinforcing steel sheet 21 and the second 2D reinforcing steel sheet 22 of the same thickness in the first patch area 11 and the second patch area 12 of the second surface 102 of the FPC10, the 3D reinforcing steel sheet 30 is connected between the first 2D reinforcing steel sheet 21 and the second 2D reinforcing steel sheet 22 when the FPC10 is bent. Therefore, the attachment process of the 3D reinforcing steel sheet 30 can be arranged after SMT mounting, thereby avoiding the problems of inclination and warping of the FPC10 during SMT mounting, ensuring that the FPC10 is flat during SMT mounting, and helping to increase the success rate of SMT mounting.
[0040] The present application also provides an electronic device, comprising the side fingerprint module as described above.
[0041] The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the profession can make some changes or modifications to the technical contents disclosed above without departing from the scope of the technical solution of the present invention, which are equivalent embodiments of equivalent changes. However, any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the protection scope of the technical solution of the present invention.
Claims
1. A side fingerprint module, characterized in that: The invention comprises an FPC (10), a first 2D reinforcing steel sheet (21), a second 2D reinforcing steel sheet (22), a 3D reinforcing steel sheet (30), a fingerprint chip (41) and a switch (42); the FPC (10) has a first surface (101) and a second surface (102) arranged opposite to each other; the fingerprint chip (41) and the switch (42) are both arranged on the first surface (101); the first 2D reinforcing steel sheet (21) and the second 2D reinforcing steel sheet (22) are both arranged on the second surface (102) and have the same thickness; the FPC (10) is provided with a first patch area (11) and a second patch area (12); the fingerprint chip (41) and the first 2D reinforcing steel sheet (21) cooperate with each other and are both arranged in the first patch area (11); the switch (42) and the second 2D reinforcing steel sheet (22) cooperate with each other and are both arranged in the second patch area (12); When the FPC (10) is in a bent state, the first patch area (11) and the second patch area (12) correspond to each other, and the 3D reinforcing steel sheet (30) is connected between the first 2D reinforcing steel sheet (21) and the second 2D reinforcing steel sheet (22).
2. The side fingerprint module according to claim 1, characterized in that: The 3D reinforcing steel sheet (30) is provided with a mounting groove (301) for mounting the second 2D reinforcing steel sheet (22); when the FPC (10) is in a bent state, the second 2D reinforcing steel sheet (22) is mounted in the mounting groove (301).
3. The side fingerprint module according to claim 2, characterized in that: A positioning groove (302) is provided on the side wall of the installation groove (301), and a positioning protrusion (221) matching with the positioning groove (302) is provided on the second 2D reinforcing steel sheet (22).
4. The side fingerprint module according to claim 2 or 3, characterized in that: The 3D reinforcing steel sheet (30) is provided with a protrusion (31), the protrusion (31) protrudes from the surface of the 3D reinforcing steel sheet (30) and forms the installation groove (301) with the surface of the 3D reinforcing steel sheet (30).
5. The side fingerprint module according to claim 4, characterized in that: The thickness of the protrusion (31) is equal to the depth of the mounting groove (301).
6. The side fingerprint module according to claim 2, characterized in that: The depth of the installation groove (301) is greater than or equal to the thickness of the second 2D reinforcing steel sheet (22).
7. The side fingerprint module according to claim 1, characterized in that: The 3D reinforcing steel sheet (30) is provided with a weight-reducing hole (303).
8. The side fingerprint module according to claim 1, characterized in that: The side fingerprint module comprises a third 2D reinforcing steel sheet (23), the FPC (10) is provided with a third patch area (13), the third 2D reinforcing steel sheet (23) is provided on the second surface (102) and is located in the third patch area (13), and the third 2D reinforcing steel sheet (23) has the same thickness as the first 2D reinforcing steel sheet (21) and the second 2D reinforcing steel sheet (22).
9. The side fingerprint module according to claim 8, characterized in that: The extension direction of the third patch area (13) is perpendicular to the line connecting the first patch area (11) and the second patch area (12).
10. An electronic device, characterized in that: It comprises a side fingerprint module as described in any one of claims 1 to 9.