Auxiliary temperature control device and peak annealing equipment

Abstract

The utility model provides an auxiliary temperature control device. The auxiliary temperature control device comprises an electrochromic composite film, an insulating layer and a liquid cooling layer which are stacked in sequence, the electrochromic composite film is electrically connected with an external circuit, the external circuit controls the electrochromic composite film to change color and transparency, the insulating layer is used for reflecting or conducting heat radiation, and the liquid cooling layer is used for taking away heat energy transmitted by the insulating layer. The utility model further provides peak annealing equipment comprising the device. According to the device and the peak annealing equipment, heating can be accelerated during heating, cooling can be accelerated during cooling, and therefore the heating and cooling rate of the peak annealing equipment is overall improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to an auxiliary temperature control device and a spike annealing device. Background Art

[0002] In the manufacturing process of CMOS devices below 0.13μm, spike annealing equipment is required. Its main application is to activate doped ions and repair lattice damage caused by ion implantation after the source and drain electrodes are implanted. The advantage of spike annealing is that the annealing duration is short and it can effectively avoid the diffusion effect of doped ions.

[0003] Earlier spike annealing equipment used top bulb heating, magnetic levitation rotation and fiber optic temperature measurement to achieve spike thermal annealing. The top bulb and the chamber are separated by a transparent quartz glass plate. The overall arrangement of the bulb is consistent with the size of the wafer. The bulbs from the center to the edge area are divided into several areas with different temperatures. Later, in order to increase the heating and cooling rates, a set of bulbs were added under the wafer, with the same distribution and structure as the top bulbs. To further increase the response speed, the equipment manufacturer replaced the bulb with a quartz lamp tube, and the light-emitting device in the center of the quartz lamp tube is a metal wire. This heating method heats up faster and responds faster. At the same time, an insulating layer (also called a reflector) is added to the back of the lamp tube, and the cooling method of the upper and lower reflectors corresponding to the two heat sources is achieved by liquid cooling.

[0004] For spike annealing equipment, the peak residence time (Residence Time) T-50 has always been the core parameter of the equipment. With the development of semiconductor technology, the size of the layout is getting smaller and smaller, and the requirements for the peak annealing time are becoming more and more stringent. This also puts forward further requirements for the rapid temperature rise and fall of the equipment, that is, the time requirements for T-50 are getting higher and higher, and new devices and equipment are needed to meet this requirement. Utility Model Content

[0005] In view of the above-mentioned practical needs, the purpose of the present application is to provide an auxiliary temperature control device and a peak annealing equipment to solve the problem that the peak annealing equipment in the prior art cannot meet the increasing requirements for the heating and cooling rates.

[0006] An embodiment of the present application provides an auxiliary temperature control device, which includes an electrochromic composite film, an insulating layer and a liquid cooling layer stacked in sequence, the electrochromic composite film is electrically connected to an external circuit, the external circuit controls the electrochromic composite film to change color and transparency, the insulating layer is used to reflect or conduct thermal radiation, and the liquid cooling layer is used to take away the heat energy transferred by the insulating layer.

[0007] In some embodiments, the electrochromic composite film changes color and transparency including a first state and a second state, wherein the first state is transparent and colorless, and the second state is a non-transparent second color.

[0008] In some embodiments, the operating temperature range of the electrochromic composite film is 0° C. to 400° C., and the time range for the first state to change to the second state is 0.2 seconds to 0.4 seconds.

[0009] In some embodiments, the external circuit is connected to a controller, and the controller is used to adjust the voltage of the external circuit to change the color and transparency of the electrochromic composite film.

[0010] In some embodiments, the insulating layer is a first color, and is used to reflect the thermal radiation when the electrochromic composite film is in the first state.

[0011] In some embodiments, the insulating layer is made of alumina ceramic.

[0012] In some embodiments, the liquid cooling layer is provided with at least two parallel cooling liquid paths, and the coolant in two adjacent cooling liquid paths flows in opposite directions.

[0013] In some embodiments, the liquid cooling layer is a water-cooling heat sink.

[0014] In some embodiments, any one of the cooling liquid circuits is provided with a flow controller.

[0015] An embodiment of the present application also provides a spike annealing device, comprising a chamber, a heat source and the auxiliary temperature control device described in the above embodiment, wherein a wafer is placed in the chamber, the heat source is arranged parallel to the upper and lower sides of the wafer outside the chamber, and the device is arranged parallel to the other side of the heat source relative to the wafer.

[0016] As described above, an auxiliary temperature control device and a spike annealing equipment of the present application have the following beneficial effects: by adding an electrochromic composite film between the heat source and the insulating layer, during the heating and cooling stages of the spike annealing process, in conjunction with the corresponding color of the reflective plate, it can accelerate both the heating and cooling during heating and cooling, thereby improving the overall heating and cooling rates of the spike annealing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The following figures describe in detail the exemplary embodiments disclosed in this application. The same reference numerals represent similar structures in several views of the drawings. Those skilled in the art will understand that these embodiments are non-limiting, exemplary embodiments, and the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of this application. Other embodiments may also accomplish the inventive intent in this application. It should be understood that the drawings are not drawn to scale.

[0018] in:

[0019] Figure 1 is a spike annealing device shown in some embodiments;

[0020] Figure 2 is a schematic diagram of a device for increasing the heating and cooling rate according to some embodiments of the present application;

[0021] Figure 3 This is a schematic diagram of connecting an electrochromic composite film to an external circuit according to some embodiments of the present application;

[0022] Figure 4 is a schematic diagram of a cooling liquid path of a liquid cooling layer according to some embodiments of the present application;

[0023] Figure 5 yes Figure 4 AA section schematic diagram of the coolant path in FIG.

[0024] Figure 6 It is a spike annealing device shown in some embodiments of the present application. DETAILED DESCRIPTION

[0025] The following description provides specific application scenarios and requirements of the present application, with the purpose of enabling those skilled in the art to make and use the content in the present application. It will be apparent to those skilled in the art that various local modifications to the disclosed embodiments are apparent, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the embodiments shown, but to the widest scope consistent with the claims.

[0026] The core parameter T-50 of the peak annealing equipment refers to the total time of heating from fifty degrees below the peak temperature to the peak temperature, and then cooling from the peak temperature by fifty degrees. During the peak annealing process, the cooling of the chamber where the wafer is located mainly depends on the flowing gas. When the time requirement of T-50 becomes higher and higher, the influence of the temperature of the upper and lower heat source areas on the temperature of the wafer chamber becomes more and more obvious. Because of the extremely short time period of the peak annealing equipment, the heat is transferred between the heat source and the wafer in the form of thermal radiation. Based on this principle, the way to shorten the T-50 time mainly relies on improving the energy utilization rate of thermal radiation.

[0027] In some embodiments, Figure 1 A spike annealing device 100 is shown, comprising a chamber 1, a heat source 2, an insulating layer 3 and a cooling system 4. A wafer 5 is placed in the chamber 1, the heat source 2 is arranged outside the chamber 1 on both sides of the wafer 5, and the insulating layer 3 and the cooling system 4 are arranged on the other side of the heat source 2 relative to the wafer 5.

[0028] The cooling of the chamber 1 where the wafer 5 is located is more dependent on the flowing gas, and the temperature of the areas where the upper and lower heat sources 2 are located also has a significant impact on the chamber 1. Because the heat in the spike annealing equipment is mostly transferred between the heat source 2 and the wafer 5 in the form of thermal radiation, the way to shorten the T-50 time mainly depends on improving the energy utilization rate of thermal radiation. Therefore, the insulating layer 3 plays two roles. On the one hand, when the temperature is increased, the insulating layer 3 can reflect the thermal radiation of the heat source 2 and accelerate the increase in the temperature of the chamber 1; on the other hand, when the temperature is reduced, the insulating layer 3 can absorb the heat radiated by the heat source 2 and be taken away by the cooling system 4, accelerating the decrease in the temperature of the chamber 1.

[0029] Furthermore, the color of the insulating layer 3 also affects the heating and cooling rate. For example, the first color insulating layer is conducive to reflecting the thermal radiation of the heat source 2, which can help accelerate the heating; while the second color insulating layer is more conducive to absorbing the heat of the thermal radiation and being taken away by the cooling system, which can help accelerate the cooling. The first color insulating layer and the second color insulating layer each have their own advantages. Refer to Table 1, which compares the T-50 data of a first color insulating layer and a second color insulating layer. When the first color insulating layer is used, the T-50 is 2.05 seconds; when the second color insulating layer is used, the T-50 is 1.70 seconds. Changing the color of the insulating layer from the first color to the second color can increase the heating and cooling rate. The T-50 time is shortened by 0.35s and the T-50 is shortened by 0.5s. 第一颜色 >T-50 第二颜色 However, the use of the first color insulating layer or the second color insulating layer respectively fails to achieve the T-50 time of 1.5 seconds required by the spike annealing process.

[0030] Table 1 Comparison of the first color insulation layer and the second color insulation layer T-50

[0031] Insulation color Process temperature (℃) T-50 Requirements(S) T-50 Actual(S) First Color 900 1.5 2.05 Secondary Color 900 1.5 1.70

[0032] In order to achieve the 1.5-second T-50 time required by the spike annealing process, the advantages of the two-color insulating layer can be fully combined and utilized. The present application provides an auxiliary temperature control device, which adds an electrochromic composite film outside the insulating layer. Taking advantage of the different characteristics of different colors for reflecting or absorbing thermal radiation, the most suitable color is used in different spike annealing stages. The real-time color change is achieved in the present application by adjusting the electric field applied to the electrochromic composite film. In the different stages of the spike annealing temperature rise and fall, the insulating layer presents different colors, and the overall temperature rise and fall rate is improved, so that the T-50 time can meet the high requirements of the rapidly developing spike annealing process.

[0033] The technical solution of the present application is described in detail below with reference to the embodiments and drawings.

[0034] refer to Figure 2 and Figure 3 , Figure 2 201 is a schematic diagram of an auxiliary temperature control device according to some embodiments of the present application. The auxiliary temperature control device 201 includes an electrochromic composite film 16, an insulating layer 13 and a liquid cooling layer 14 stacked in sequence. The electrochromic composite film 16 is electrically connected to an external circuit 17, and the external circuit 17 controls the electrochromic composite film 16 to change color and transparency. The insulating layer 13 is used to reflect or conduct thermal radiation. The liquid cooling layer 14 is used to take away the heat energy transferred by the insulating layer 13. Among them, the auxiliary temperature control device 201 is arranged on one side of the heat source 12, and the surfaces of the electrochromic composite film 16, the insulating layer 13 and the liquid cooling layer 14 of the auxiliary temperature control device 201 are in close contact with each other to ensure that the thermal conductivity is large enough. The electrochromic composite film 16 is close to the insulating layer 13, which is equivalent to a reflective plate that changes, and is used to reflect or conduct the thermal radiation of the heat source 12. In some embodiments, the liquid cooling layer 14 is a water-cooled heat dissipation device.

[0035] In some embodiments, heat source 12 is a quartz tube and the central light emitting device is a metal wire.

[0036] In some embodiments, the electrochromic composite film 16 changes color and transparency including a first state and a second state, wherein the first state is transparent and colorless, and the second state is a non-transparent second color. Under different electric field control, the change of color and transparency is continuous and reversible. This application uses colorless and transparent and non-transparent second color as the main application range of the electrochromic composite film 16.

[0037] In some embodiments, the insulating layer 13 is a first color. Thus, when the electrochromic composite film 16 is colorless and transparent, the electrochromic composite film 16 and the insulating layer 13 are viewed from the heat source 12, and the combination of the electrochromic composite film 16 and the insulating layer 13 is presented as a reflective plate of the first color, reflecting the heat radiation of the heat source 12 and accelerating the temperature rise; when the electrochromic composite film 16 is a non-transparent second color, the electrochromic composite film 16 and the insulating layer 13 are viewed from the heat source 12, and the combination of the electrochromic composite film 16 and the insulating layer 13 is presented as a heat absorbing plate of the second color, absorbing the heat radiated by the heat source 12, and the heat is taken away by the liquid cooling layer 14, accelerating the temperature drop. For example, the first color is white, and the second color is black.

[0038] The electrochromic composite film 16 is combined with the insulating layer 13 to form a reflector that can adjust the color (that is, the reflector can change from the first color to the second color or from the second color to the first color). In some embodiments, the measured T-50 data after using the electrochromic composite film 16 is shown in Table 2. The color of the reflector changes from the first color to the second color, which can increase the cooling rate and shorten the T-50 time by 0.35s; the color of the reflector switches between the first color and the second color. Compared with the insulating layer that is fixed to the second color, the cooling rate remains unchanged, and the heating rate can be increased by 0.35s, so T-50 can be reduced to 1.35s, which meets the T-50 requirements of the spike annealing process.

[0039] Table 2 T-50 measured data after using electrochromic composite film

[0040] Reflector color Process temperature (℃) T-50 Requirements(S) T-50 Actual(S) change 900 1.5 1.35

[0041] In some embodiments, the material of the insulating layer 13 is alumina ceramics, which can meet the process requirements of good insulation and thermal conductivity.

[0042] In some embodiments, reference Figure 3 As shown, the electrochromic composite film 16 is electrically connected to the negative electrode and the positive electrode of the external circuit 17 .

[0043] In some embodiments, the operating temperature range of the electrochromic composite film 16 is 0°C to 400°C, and the time range from the first state to the second state is 0.2 seconds to 0.4 seconds. The transparency change interval of the electrochromic composite film 16 meets the heat absorption demand for radiant heat between the near-ultraviolet and infrared intervals. In actual working conditions, the process temperature in the quartz chamber reaches 900°C. After the liquid cooling layer 14 is set, the liquid cooling layer 14 can control the temperature of the auxiliary temperature control device 201 below 100°C. The highest normal working temperature of the electrochromic composite film 16 reaches 400°C, which is fully applicable to the requirements of high temperature and discoloration time in the working environment, and meets the actual working conditions. The application of the electrochromic composite film described in this application is only used as an example. The principle of the electrochromic composite film can be specifically referred to the relevant articles published in the Journal of the American Chemical Society (JACS), which will not be repeated here.

[0044] In some embodiments, the external circuit 17 provides an adjustable voltage. The external circuit 17 is connected to the controller 18, and the voltage of the external circuit 17 is controlled by the controller 18 to control the color and transparency of the electrochromic composite film 16. For example, the transparency of the electrochromic composite film 16 varies between 0% and 100%, and the color also varies differently. When the transparency is 0% (i.e., non-transparent), the color of the electrochromic composite film is presented as the second color; when the transparency of the electrochromic composite film is 100% (i.e., transparent), the electrochromic composite film 16 is colorless, and the electrochromic composite film 16 and the insulating layer 13 present the first color together. Specifically, when the electrochromic composite film 16 is in the second color, the corresponding light transmittance is 0% and the heat energy absorption rate is the highest, thereby improving the absorption rate of heat energy by the auxiliary temperature control device 201 of the present application; when the electrochromic composite film 16 is colorless and transparent, the corresponding light transmittance is 100%, thereby improving the reflectivity of heat energy by the auxiliary temperature control device 201 of the present application by utilizing the first color of the insulating layer 13.

[0045] In some embodiments, reference Figure 4 and Figure 5 The liquid cooling layer 14 is provided with at least two parallel cooling liquid paths 141, and the coolant flows in the two adjacent cooling liquid paths 141 in opposite directions (refer to Figure 5). The liquid cooling layer 14 is tightly attached to the back of the insulating layer 13 on the other side of the electrochromic composite film 16, and flows rapidly at a flow rate of 2 to 5 L / min. In some embodiments, the heat source 12 will rapidly heat up to 1000°C in the T-50 stage, and the liquid cooling layer 14 will absorb a large amount of heat energy, resulting in the liquid temperature of the outlet section of the cooling liquid path 141 being significantly higher than that of the inlet section, which is not conducive to the heat dissipation of the metal plate (not shown) in the outlet section area. To solve this problem, some embodiments of the present application use two adjacent parallel cooling liquid paths 141 but with opposite liquid flow directions to ensure uniform cooling of the metal plate of the liquid cooling layer 14. It should be noted that the figure shows two cooling liquid paths 141, which can actually be 2N paths (N is a positive integer), such as 4, 6, 8 or 10, as long as the coolant flows in opposite directions in the two adjacent cooling liquid paths 141.

[0046] In some embodiments, reference Figure 4 As shown, any one of the cooling liquid circuits 141 is provided with a flow controller to flexibly adapt to different requirements of different processes. The flow controller includes a valve controller 142 and / or a flow meter 143, wherein the valve controller 142 is used to control the flow of the cooling liquid, and the flow meter 143 is used to measure the flow of the cooling liquid, wherein the valve controller 142 may also include a pressure regulating valve and a hand valve. Preferably, the valve controller 142 is provided at the cooling liquid inlet end, and the flow meter 143 is provided at the cooling liquid outlet end.

[0047] In some embodiments, reference Figure 6 As shown, the present application also provides a spike annealing device 200, including a chamber 11, a heat source 12 and the auxiliary temperature control device 201 described in the above embodiment. A wafer 15 is placed in the chamber 11, and the heat source 12 is arranged outside the chamber 11 on the upper and lower sides of the wafer 15, and the auxiliary temperature control device 201 is arranged on the other side of the heat source 12 relative to the wafer 15.

[0048] In some embodiments, the chamber 11 is a transparent quartz chamber, which is resistant to high temperature and corrosion, has good thermal stability, good light transmittance, and good electrical insulation performance, and the heat energy radiated by the heat source 12 can smoothly enter the chamber 11.

[0049] The temperature rise and fall process of the spike annealing equipment 200 , as well as the synchronous change control thereof, are controlled by the controller 18 .

[0050] In some embodiments, the control process principle of the spike annealing device 200 is as follows:

[0051] Heating stage: In order to improve the utilization rate of the heat radiation of the heat source 12, the voltage is set to make the electrochromic composite film 16 colorless and transparent, and the insulating layer 13 of the first color is used to increase the reflectivity and improve the heating rate.

[0052] Cooling stage: To increase the cooling rate, the voltage is changed to make the electrochromic composite film 16 a non-transparent second color, thereby increasing the heat absorption rate, and taking away the heat through the liquid cooling layer 14 on one side of the electrochromic composite film 16 to increase the cooling rate.

[0053] Change start-up stage: before the heat source 12 heats, the controller 18 controls the voltage of the external circuit 17 to make the electrochromic composite film 16 fade to a light color (i.e., the first color) state first, and the electrochromic composite film 16 begins to color to a dark color (i.e., the second color) state 0.3 seconds before the power of the heat source 12 reaches its peak, and the change is completed within 0.2s-0.4s, ensuring that the wafer 15 is in a dark color state when it needs to be cooled.

[0054] The beneficial effects that may be brought about by the embodiments of the present application include but are not limited to: an auxiliary temperature control device and a spike annealing device of the present application, by adding an electrochromic composite film between the heat source and the insulating layer, the electrochromic composite film and the insulating layer are tightly attached to form a variable reflective plate, in the heating stage of the spike annealing process, the corresponding reflective plate color is a first color, and in the cooling stage of the spike annealing process, the corresponding reflective plate color is a second color, which can accelerate both the heating rate and the cooling rate, thereby improving the overall heating and cooling rates.

[0055] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other beneficial effects that may be obtained.

[0056] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this application. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this application.

[0057] It should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", and "fix" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a rotating connection or a sliding connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood in combination with specific circumstances.

[0058] In addition, when terms such as "first", "second", and "third" are used in the specification of this application to describe various features, these terms are only used to distinguish these features and cannot be understood as indicating or implying the relationship between the features, the relative importance, or implicitly indicating the number of features indicated.

[0059] In addition, the present specification describes exemplary embodiments by reference to idealized exemplary cross-sectional views and / or plan views and / or stereograms. Therefore, differences from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are foreseeable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but should include deviations in shapes caused by, for example, manufacturing. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device nor to limit the scope of the exemplary embodiments.

[0060] At the same time, the present application uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in the present application does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0061] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0062] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of the present application. Other variations may also fall within the scope of the present application. Therefore, as an example and not a limitation, the alternative configurations of the embodiments of the present application may be considered to be consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims

1. An auxiliary temperature control device, characterized in that: The auxiliary temperature control device includes an electrochromic composite film, an insulating layer and a liquid cooling layer stacked in sequence, the electrochromic composite film is electrically connected to an external circuit, the external circuit controls the electrochromic composite film to change color and transparency, the insulating layer is used to reflect or conduct thermal radiation, and the liquid cooling layer is used to take away the heat energy transferred by the insulating layer.

2. The auxiliary temperature control device according to claim 1, characterized in that: The electrochromic composite film changes color and transparency including a first state and a second state, wherein the first state is transparent and colorless, and the second state is a non-transparent second color.

3. The auxiliary temperature control device according to claim 2, characterized in that: The operating temperature range of the electrochromic composite film is 0° C. to 400° C., and the time range for the first state to change to the second state is 0.2 seconds to 0.4 seconds.

4. The auxiliary temperature control device according to claim 1, characterized in that: The external circuit is connected to a controller, and the voltage of the external circuit is adjusted by the controller to change the color and transparency of the electrochromic composite film.

5. The auxiliary temperature control device according to claim 2, characterized in that: The insulating layer is a first color and is used to reflect the thermal radiation when the electrochromic composite film is in the first state.

6. The auxiliary temperature control device according to claim 5, characterized in that: The material of the insulating layer is alumina ceramic.

7. The auxiliary temperature control device according to claim 1, characterized in that: The liquid cooling layer is provided with at least two parallel cooling liquid paths, and the cooling liquids in two adjacent cooling liquid paths flow in opposite directions.

8. The auxiliary temperature control device according to claim 7, characterized in that: The liquid cooling layer is a water cooling heat dissipation device.

9. The auxiliary temperature control device according to claim 7, characterized in that: Any one of the cooling liquid paths is provided with a flow controller.

10. A spike annealing device, characterized in that: It comprises a chamber, a heat source and the auxiliary temperature control device according to any one of claims 1 to 9, wherein a wafer is placed in the chamber, the heat source is arranged parallel to the upper and lower sides of the wafer outside the chamber, and the device is arranged parallel to the other side of the heat source relative to the wafer.

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