Socket assembly and power supply

Abstract

The utility model provides a socket assembly and a power supply, the socket assembly comprises a socket shell, a plurality of input terminals, a plurality of output terminals and an anti-interference module, the socket shell comprises a bottom plate and a side wall, and the bottom plate is provided with an inner surface and an outer surface; the plurality of input terminals are connected with the bottom plate and extend from the inner surface of the bottom plate to the outer surface of the bottom plate; the plurality of output terminals are connected with the outer surface of the bottom plate, each output terminal is connected with one input terminal, and at least two output terminals extend along the same direction; the anti-interference module comprises a circuit board and at least two Y capacitors, the circuit board is connected with the output terminal, and the Y capacitors are arranged on the side, facing the outer surface of the bottom plate, of the circuit board. According to the invention, the capability of inhibiting electromagnetic interference (EMI) of the socket assembly is enhanced, the space occupied by the socket assembly is reduced, and the power density of the power supply is further improved.

Description

Technical Field

[0001] The present application relates to electronic component manufacturing technology, and in particular to a socket assembly and a power supply. Background Art

[0002] A power supply is a device that provides electrical energy to electronic devices. It can convert primary electrical energy into secondary electrical energy suitable for various electrical users to meet the usage requirements of different electronic devices.

[0003] In the server power supply system, in order to prevent the electromagnetic interference (EMI) generated inside the power supply from affecting devices other than the power supply, the existing solution often adopts the method of connecting a capacitor across the socket at the input end of the power supply and wrapping the capacitor with a metal layer. Specifically, the socket is provided with multiple terminals, which penetrate the socket to form an input end and an output end on both sides of the socket. A lead is connected to the output end of the terminal and a capacitor is welded thereto. The outside of the capacitor is also wrapped with a metal layer. By welding the capacitor, a circuit for discharging electromagnetic interference is formed inside the power supply, so that the electromagnetic interference generated inside the power supply will not leak out.

[0004] However, for the electromagnetic interference (EMI) suppression solution in the prior art, the leads and capacitors connected to the output end of the terminal will occupy a portion of the space of the power output end, thereby hindering the further improvement of the power density of the power supply. Utility Model Content

[0005] In order to overcome the above-mentioned defects under the relevant technology, the purpose of the present application is to provide a socket assembly and a power supply. The present application is conducive to reducing the volume of the socket assembly, reducing the space occupied by the socket assembly at the power output end, improving the power density of the power supply, and further enhancing the socket assembly's ability to suppress electromagnetic interference.

[0006] In one aspect, the present application provides a socket assembly, comprising:

[0007] The socket housing comprises a bottom plate and side walls, wherein the bottom plate has an inner surface and an outer surface;

[0008] A plurality of input terminals connected to the bottom plate and extending from the inner surface of the bottom plate to the outer surface of the bottom plate;

[0009] A plurality of output terminals connected to the outer surface of the bottom plate, wherein each output terminal is connected to an input terminal, and at least two output terminals extend in the same direction;

[0010] The anti-interference module comprises a circuit board and at least two Y capacitors, wherein the circuit board is connected to the output terminal, and the Y capacitor is arranged on a side of the outer surface of the circuit board facing the bottom plate.

[0011] In a possible implementation, each output terminal has a through hole, and each input terminal is inserted through the through hole to be electrically connected to the corresponding output terminal.

[0012] In one possible implementation, the multiple output terminals include a first output terminal, a second output terminal and a third output terminal, the first output terminal is a positive output terminal, the second output terminal is a negative output terminal, the third output terminal is a ground output terminal, and the first output terminal and the second output terminal extend in the same direction.

[0013] In a possible implementation manner, a connecting portion is provided on any output terminal, and the output terminal is connected to the circuit board via the connecting portion.

[0014] In a possible implementation, the connecting portion includes a first connecting portion, a second connecting portion and a third connecting portion, which are respectively arranged on the first output terminal, the second output terminal and the third output terminal, and the two ends of one of the at least two Y capacitors are respectively electrically connected to the first connecting portion and the third connecting portion, and the two ends of the other of the at least two Y capacitors are respectively electrically connected to the second connecting portion and the third connecting portion.

[0015] In a possible implementation, the connection portion is connected to the circuit board by reflow soldering or wave soldering.

[0016] In a possible implementation, the connecting portion and the output terminal are integrally formed.

[0017] In a possible implementation, at least two Y capacitors are connected to the circuit board by reflow soldering.

[0018] In a possible implementation manner, a metal shielding layer is further provided on a side of the interior of the circuit board facing the socket housing.

[0019] In a possible implementation, the input terminal is used to electrically connect to a connector outside the socket assembly.

[0020] In a possible implementation, the first output terminal and the second output terminal are used to vertically connect to a system board outside the socket assembly.

[0021] In a possible implementation, a plurality of input terminals are disposed in a groove formed by the bottom plate and the side wall.

[0022] On the other hand, the present application provides a power supply, including a housing, in which a power supply mainboard and a socket assembly as described in any of the above items are arranged, and the socket assembly is vertically connected to the power supply mainboard through an output terminal.

[0023] The present application provides a socket assembly and a power supply, wherein the socket assembly comprises a socket housing, a plurality of input terminals, a plurality of output terminals and an anti-interference module, wherein the socket housing comprises a bottom plate and a side wall, wherein the bottom plate has an inner surface and an outer surface; the plurality of input terminals are connected to the bottom plate and extend from the inner surface of the bottom plate to the outer surface of the bottom plate; the plurality of output terminals are connected to the outer surface of the bottom plate, wherein each output terminal is connected to an input terminal, and at least two output terminals extend in the same direction; the anti-interference module comprises a circuit board and at least two Y capacitors, wherein the circuit board is connected to the input terminal and the output terminal, and the Y capacitor is arranged on the side of the circuit board facing the outer surface of the bottom plate. The present application enhances the ability of the socket assembly to suppress electromagnetic interference (EMI) interference by connecting the output terminal to the circuit board of the anti-interference module, and arranging the Y capacitor on the side of the circuit board facing the outer surface of the bottom plate, and at the same time, saves the volume of the socket assembly on the side of the output terminal, reduces the space occupied by the socket assembly at the output end of the power supply, and effectively improves the power density of the power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technical descriptions. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A simplified structural diagram of a socket assembly provided in an embodiment of the present application at a first viewing angle;

[0026] Figure 2 A simplified structural diagram of a socket assembly provided in an embodiment of the present application at a second viewing angle;

[0027] Figure 3 A simplified structural diagram of a socket assembly provided in an embodiment of the present application without the anti-interference module;

[0028] Figure 4 A simplified structural diagram of an anti-interference module provided in one embodiment of the present application.

[0029] Reference numerals:

[0030] 100-socket housing; 110-bottom plate; 111-inner surface; 112-outer surface; 120-side wall;

[0031] 200-input terminal;

[0032] 300 - output terminal; 310 - first output terminal; 320 - second output terminal; 330 - third output terminal; 340 - first connection part; 350 - second connection part; 360 - third connection part;

[0033] 400-anti-interference module; 410-circuit board; 420-Y capacitor; 421-capacitor body; 422-pin. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0035] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0036] As described in the background art, the leads and capacitors connected to the output end of the socket in the related art solution will occupy a portion of the space of the power output end, thereby affecting the improvement of the power density of the power supply.

[0037] In view of this, an embodiment of the present application aims to provide a socket assembly and a power supply, wherein a plurality of input terminals and a plurality of output terminals are provided in the socket shell, and at least two output terminals extend in the same direction, the output terminals are connected to the circuit board of the anti-interference module, and the Y capacitor is arranged on the side of the outer surface of the circuit board facing the base plate, thereby helping to save the volume of the socket assembly on the output terminal side, reducing the space occupied by the socket assembly at the power supply output end, and helping to improve the power density of the power supply.

[0038] The contents of the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand the contents of the present application in more detail.

[0039] Figure 1 A simplified structural diagram of a socket assembly provided in an embodiment of the present application at a first viewing angle; Figure 2 A simplified structural diagram of a socket assembly provided in an embodiment of the present application at a second viewing angle; Figure 3 A simplified structural diagram of a socket assembly provided in an embodiment of the present application without the anti-interference module; Figure 4 A simplified structural diagram of an anti-interference module provided in one embodiment of the present application.

[0040] Please refer to Figure 1-Figure 4 , this embodiment provides a socket assembly, including:

[0041] The socket housing 100 includes a bottom plate 110 and side walls 120. The bottom plate 110 can be vertically connected to the side walls 120. The specific number of the side walls 120 can be set as needed, for example, it can be set according to the shape of the socket housing 100. In this embodiment, four side walls 120 are connected end to end in sequence. The socket housing 100 is generally in the shape of a rectangular parallelepiped. The bottom plate 110 of this embodiment has an inner surface 111 and an outer surface 112 opposite to each other. The side walls 120 surround the bottom plate 110 and form a groove with the inner surface 111 to accommodate the terminal.

[0042] The plurality of input terminals 200 are connected to the bottom plate 110 and extend from the inner surface 111 of the bottom plate 110 to the outer surface 112 of the bottom plate 110; that is, the plurality of input terminals 200 of the present embodiment are disposed through the bottom plate 110. In addition, the plurality of input terminals 200 do not extend beyond the groove formed by the side wall 120 and the inner surface 111 of the bottom plate 110.

[0043] In this embodiment, the input terminal 200 is used to electrically connect to a connector outside the socket assembly.

[0044] A plurality of output terminals 300 are connected to the outer surface 112 of the bottom plate 110, wherein each output terminal 300 is connected to an input terminal 200. In this embodiment, three output terminals 300 and three input terminals 200 may be provided, wherein the three output terminals 300 are sequentially a first output terminal 310, a second output terminal 320 and a third output terminal 330, and each output terminal 300 is respectively connected to an input terminal 200. In this embodiment, at least two output terminals 300 (e.g., the first output terminal 310 and the second output terminal 320) extend in the same direction so as to realize electrical connection with external parts. Optionally, a through hole may be provided on each output terminal 300, and the input terminal 200 is inserted into the through hole and welded to the through hole, so as to realize electrical connection between the input terminal 200 and the corresponding output terminal 300.

[0045] The anti-interference module 400 includes a circuit board 410 and at least two Y capacitors 420, wherein the circuit board 410 is connected to a plurality of output terminals 300, that is, the circuit board 410 can be indirectly connected to the input terminal 200 by connecting to the output terminal 300. In this embodiment, the input terminal 200 can be arranged perpendicular to the bottom plate 110, and the output terminal 300 can be arranged parallel to the bottom plate 110. Further, the output terminal 300 can be substantially attached to the outer surface 112 of the bottom plate 110, so that the output terminal 300 occupies a smaller output terminal space. In addition, the circuit board 410 of this embodiment can be arranged parallel to the bottom plate 110, and the Y capacitor 420 is arranged on the side of the circuit board 410 facing the outer surface 112 of the bottom plate 110. The arrangement of the Y capacitor 420 will not increase the output terminal space, thereby helping to save the volume of the socket assembly on the side of the output terminal 300.

[0046] From the above description, it can be seen that in this embodiment, the output terminal 300 is connected to the circuit board 410 of the anti-interference module 400, and the Y capacitor 420 is arranged on the side of the circuit board 410 facing the outer surface of the base plate 110. While enhancing the electromagnetic interference suppression ability of the socket assembly, it saves the volume of the socket assembly on the side of the output terminal 300, reduces the space occupied by the socket assembly at the power output end, and is beneficial to the improvement of the power density of the power supply.

[0047] In one possible implementation, at least two Y capacitors 420 of this embodiment can be soldered to the circuit board 410 by reflow soldering. Reflow soldering is a soldering process mainly used to solder electronic components to circuit boards. This process uses solder paste (a mixture of solder and flux) to connect electronic components to contact pads, and then melts the solder by controlling the temperature to permanently bond the electronic components to the circuit board. The advantage of reflow soldering technology is that the temperature is easy to control, oxidation can be avoided during the soldering process, and the manufacturing cost is easier to control. Figure 4 As shown, the Y capacitor 420 includes a capacitor body 421 and pins 422 arranged on both sides of the capacitor body 421. The capacitor body 421 is surface-mounted on the circuit board 410, and is welded to the circuit board 410 through the pins 422 on both sides. The above structure is conducive to reducing the size between the bottom plate 110 and the circuit board 410 occupied by the Y capacitor 420, thereby helping to save the volume of the socket assembly on the output terminal 300 side.

[0048] Please continue to refer to Figure 3In a possible implementation, the plurality of output terminals 300 of this embodiment include a first output terminal 310, a second output terminal 320 and a third output terminal 330, wherein the first output terminal 310 is a positive output terminal, the second output terminal 320 is a negative output terminal, and the third output terminal 330 is a ground output terminal. In addition, the first output terminal 310 and the second output terminal 320 extend in the same direction and extend beyond the socket housing 100, so as to facilitate electrical connection with external parts. The extension direction of the third output terminal 330 can be set arbitrarily as needed, as long as the grounding requirement is met, for example, the third output terminal 330 can also be parallel to the first output terminal 310 and the second output terminal 320.

[0049] Furthermore, the first output terminal 310 and the second output terminal 320 of the present embodiment are used to vertically connect with a system board outside the socket assembly. The system board may be, for example, a power supply mainboard in a power supply. Vertical welding is conducive to realizing automated plug-in operations and improving the degree of automation.

[0050] Optionally, any output terminal 300 of the present embodiment is provided with a connection portion, the connection portion is connected to the circuit board 410 by reflow soldering or wave soldering, and the output terminal 300 is connected to the circuit board 410 through the connection portion. Specifically, the connection portion includes a first connection portion 340 connected to the first output terminal 310, a second connection portion 350 connected to the second output terminal 320, and a third connection portion 360 connected to the third output terminal 330.

[0051] In some embodiments, the connection portion is connected to the circuit board 410 by reflow soldering. The structures of the first connection portion 340, the second connection portion 350 and the third connection portion 360 are similar, and all include a bending portion connected to the base plate 110 and a parallel portion parallel to the base plate 110. The bending portion is connected to the base plate 110, and an electrical connection with the circuit board 410 is achieved through the parallel portion, thereby increasing the contact area with the circuit board 410.

[0052] In some embodiments, the connection portion is connected to the circuit board 410 by wave soldering. The structures of the first connection portion 340, the second connection portion 350 and the third connection portion 360 are similar, and all include a bending portion connected to the base plate 110 and an extension portion that vertically passes through the circuit board 410. The bending portion is connected to the base plate 110, and the electrical connection with the circuit board 410 is achieved through the extension portion.

[0053] In some embodiments, the connection portion is connected to the circuit board 410 by wave soldering. The structures of the first connection portion 340, the second connection portion 350 and the third connection portion 360 are similar, and each includes an extension portion, through which the connection with the base plate 110 and the circuit board 410 is achieved.

[0054] Furthermore, two pins 422 of one of the two Y capacitors are electrically connected to the first connection portion 340 and the third connection portion 360 respectively, and two pins 422 of the other Y capacitor are electrically connected to the second connection portion 350 and the third connection portion 360 respectively.

[0055] In this embodiment, the connection part and the output terminal 300 can be integrally formed. Specifically, in this embodiment, the first connection part 340 is integrally formed with the first output terminal 310, the second connection part 350 is integrally formed with the second output terminal 320, and the third connection part 360 is integrally formed with the third output terminal 330; the first connection part 340, the second connection part 350 and the third connection part 360 can be integrally formed with the corresponding output terminal 300 through a bending process.

[0056] In a possible implementation, the circuit board 410 of this embodiment is further provided with a metal shielding layer on the side facing the socket housing 100, and the metal shielding layer can improve the radiation interference to the outside of the socket assembly. The metal shielding layer is provided inside the circuit board 410 and close to the side of the socket housing.

[0057] This embodiment also provides a power supply, including a shell, in which a power supply mainboard and a socket assembly as in the above embodiment are arranged. The socket assembly is vertically connected to the power supply mainboard via an output terminal. The vertical welding of the output terminal and the power supply mainboard is conducive to realizing automated plug-in operations and improving the degree of automation.

[0058] Since the power supply of this embodiment adopts the socket assembly in the above-mentioned embodiment, a circuit for discharging electromagnetic interference can be formed inside the power supply through the Y capacitor 420 on the circuit board 410, so that the electromagnetic interference generated inside the power supply will not leak out, and the Y capacitor 420 is arranged on the side of the circuit board 410 facing the outer surface of the base plate 110, which is beneficial to saving the volume of the socket assembly on the side of the output terminal 300, reducing the space occupied by the socket assembly at the output end of the power supply, and is beneficial to improving the power density of the power supply.

[0059] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0060] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] It should be noted that in the description of this application, the terms "first" and "second" are only used to facilitate the description of different components, and cannot be understood as indicating or implying a sequential relationship, relative importance, or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

[0062] The various embodiments or implementation methods in the present application are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0063] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A socket assembly, characterized in that: include: A socket housing, comprising a bottom plate and side walls, wherein the bottom plate has an inner surface and an outer surface; a plurality of input terminals connected to the base plate and extending from the inner surface of the base plate to the outer surface of the base plate; A plurality of output terminals connected to the outer surface of the bottom plate, wherein each of the output terminals is connected to one of the input terminals, and at least two of the output terminals extend in the same direction; The anti-interference module comprises a circuit board and at least two Y capacitors, wherein the circuit board is connected to the output terminal, and the Y capacitors are arranged on a side of the circuit board facing the outer surface of the bottom plate.

2. The socket assembly according to claim 1, characterized in that: Each of the output terminals has a through hole, and each of the input terminals is passed through the through hole to be electrically connected with the corresponding output terminal.

3. The socket assembly according to claim 1, characterized in that: The plurality of output terminals include a first output terminal, a second output terminal and a third output terminal, the first output terminal is a positive output terminal, the second output terminal is a negative output terminal, the third output terminal is a ground output terminal, and the first output terminal and the second output terminal extend in the same direction.

4. The socket assembly according to claim 3, characterized in that: Any of the output terminals is provided with a connecting portion, and the output terminal is connected to the circuit board via the connecting portion.

5. The socket assembly according to claim 4, characterized in that: The connecting portion includes a first connecting portion, a second connecting portion and a third connecting portion, which are respectively arranged on the first output terminal, the second output terminal and the third output terminal, and the two ends of one of the at least two Y capacitors are respectively electrically connected to the first connecting portion and the third connecting portion, and the two ends of the other of the at least two Y capacitors are respectively electrically connected to the second connecting portion and the third connecting portion.

6. The socket assembly according to claim 4, characterized in that: The connecting portion is connected to the circuit board by reflow soldering or wave soldering.

7. The socket assembly according to claim 4, characterized in that: The connecting portion and the output terminal are integrally formed.

8. The socket assembly according to claim 1, wherein: The at least two Y capacitors are connected to the circuit board by reflow soldering.

9. The socket assembly according to claim 1, wherein: A metal shielding layer is also provided on the inner side of the circuit board facing the socket housing.

10. The socket assembly according to claim 1, wherein: The input terminal is used to be electrically connected to a connector outside the socket assembly.

11. The socket assembly according to claim 3, characterized in that: The first output terminal and the second output terminal are used to vertically connect to a system board outside the socket assembly.

12. The socket assembly according to claim 1, wherein: The plurality of input terminals are disposed in grooves formed by the bottom plate and the side wall.

13. A power supply, characterized in that: It comprises a shell, in which a power supply mainboard and a socket assembly according to any one of claims 1 to 12 are arranged, and the socket assembly is vertically connected to the power supply mainboard through the output terminal.

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