Novel dielectric LTCC (Low Temperature Co-Fired Ceramic) multilayer band-pass filter

Abstract

A novel dielectric LTCC multilayer band-pass filter can be used in 5G mobile communication facilities and other various communication devices, and the Balun band-pass filter adopts a lumped parameter design structure, utilizes an LTCC technology, and is formed by low-temperature co-firing at about 800-900 DEG C. The dielectric LTCC multilayer band-pass filter has the advantages that the dielectric LTCC multilayer band-pass filter can be applied to 5G mobile communication facilities and other various communication devices; the novel dielectric LTCC multilayer band-pass filter comprises an LTCC ceramic substrate, a terminal stud arranged on the outer side of the substrate and a circuit layer arranged in the substrate, and the circuit layer in the substrate is of a laminated structure. According to the utility model, on the basis of the LTCC technology, the special electrical performance requirement of the dielectric LTCC multilayer band-pass filter is realized by adopting the lumped parameter model design. The LTCC multi-layer band-pass filter effectively realizes the characteristics of a dielectric LTCC multi-layer band-pass filter, has the advantages of being low in loss, small in size, high in reliability, low in cost, suitable for large-scale production and the like, and further adapts to the development trend of integration and miniaturization of new electronic components.

Description

Technical Field

[0001] The utility model discloses a bandpass filter, in particular a novel dielectric LTCC multilayer bandpass filter, which can be used in 5G mobile communication facilities and various other communication equipment. Background Art

[0002] As a high-density packaging technology with a wide range of applications, Low Temperature Co-fired Ceramic (LTCC) has become the preferred way for future electronic component integration and modularization due to its excellent electronic, mechanical and thermal properties. It is widely used in the modular design of multi-layer chip circuits.

[0003] The RF microwave components and modules designed and produced based on LTCC technology include balun filters, filters, multiplexers, duplexers, antennas, couplers, bridges, baluns, receiving front-end modules, antenna switch modules, etc. In addition to the advantages in cost and integrated packaging, it has many advantages in wiring line width and line spacing, low impedance metallization, design diversity and high-frequency performance.

[0004] As modern electronic devices continue to develop towards miniaturization and high frequency, they have been widely used in miniaturized electronic devices. In the field of mobile communications, communication products have more and more functions, and available spectrum resources are particularly important. At this time, filters of various frequency bands are needed to separate different signals. At present, there is a lack of dedicated bandpass filters in the 5G field. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art that there is a lack of dedicated 5G bandpass filters, the utility model provides a new dielectric LTCC multilayer bandpass filter, which adopts a lumped parameter design structure, utilizes LTCC technology, and is then formed by low-temperature co-firing at about 800°C to 900°C. The new dielectric LTCC multilayer bandpass filter includes an LTCC ceramic substrate, a wiring terminal disposed outside the substrate, and a circuit layer disposed inside the substrate, and the circuit layer inside the substrate is a laminated structure.

[0006] The utility model solves the technical problem by adopting the following technical solution: a novel dielectric LTCC multilayer bandpass filter, the filter comprises a ceramic substrate, an input end, an output end and an internal circuit structure layer arranged in the ceramic substrate, the input end and the output end are arranged at both ends of the ceramic substrate, a ground pin is arranged outside the ceramic substrate, and the internal circuit structure layer comprises:

[0007] In the first layer, a first metal plane conductor is printed on the ceramic substrate. The first metal plane conductor is rectangular, and two long sides thereof extend outwards to connect to the external ground pin of the product;

[0008] In the second layer, three mutually insulated metal plane conductors are printed on the ceramic substrate, which are the second metal plane conductor, the third metal plane conductor and the fourth metal plane conductor;

[0009] The third layer, two mutually insulated metal planes are printed on the ceramic substrate, which are the fifth metal plane conductor and the sixth metal plane conductor respectively, the fifth metal plane conductor is connected to the first lead metal sheet through the first metal connecting line, the first lead metal sheet is connected to the input end, the sixth metal plane conductor is connected to the second lead metal sheet through the second metal connecting line, the second lead metal sheet is connected to the output end, the fifth metal plane conductor, the first metal connecting line and the first lead metal sheet form a "concave" shape structure, and the sixth metal plane conductor, the second metal connecting line and the second lead metal sheet form a "concave" shape structure;

[0010] The fourth layer, two mutually insulated metal planes are printed on the ceramic substrate, which are the seventh metal plane conductor and the eighth metal plane conductor;

[0011] The fifth layer has three mutually insulated metal planes printed on the ceramic substrate, which are respectively a ninth metal plane conductor, a tenth metal plane conductor and an eleventh metal plane conductor. The ninth metal plane conductor is connected to the second metal plane conductor in the second layer through a first metal connection point column, the tenth metal plane conductor is connected to the third metal plane conductor in the second layer through a second metal connection point column, and the eleventh metal plane conductor is connected to the fourth metal plane conductor in the second layer through a third metal connection point column;

[0012] The sixth layer, two metal planes are printed on the ceramic substrate, which are the twelfth metal plane conductor and the thirteenth metal plane conductor, and the twelfth metal plane conductor and the thirteenth metal plane conductor are connected by a third metal connecting wire;

[0013] The seventh layer, two metal planes are printed on the ceramic substrate, which are the fourteenth metal plane conductor and the fifteenth metal plane conductor, and the fourteenth metal plane conductor and the fifteenth metal plane conductor are connected by a fourth metal connecting wire;

[0014] The eighth layer has three mutually insulated metal planes printed on the ceramic substrate, namely the sixteenth metal plane conductor, the seventeenth metal plane conductor, and the eighteenth metal plane conductor. The sixteenth metal plane conductor is connected to the first metal plane conductor in the first layer through the first group of metal connection point columns. The seventeenth metal plane conductor is connected to the first metal plane conductor in the first layer through the second group of metal connection point columns. The eighteenth metal plane conductor is connected to the first metal plane conductor in the first layer through the third group of metal connection point columns. The sixteenth metal plane conductor is connected to the ninth metal plane conductor in the fifth layer through the fourth group of metal connection point columns. The seventeenth metal plane conductor is connected to the tenth metal plane conductor in the fifth layer through the fifth group of metal connection point columns. The eighteenth metal plane conductor is connected to the eleventh metal plane conductor in the fifth layer through the sixth group of metal connection point columns.

[0015] The technical solution adopted by the present utility model to solve its technical problems further includes:

[0016] The grounding pins include a first grounding pin and a second grounding pin, and the first grounding pin and the second grounding pin are symmetrically arranged on both sides of the ceramic substrate.

[0017] The second metal plane conductor, the third metal plane conductor, and the fourth metal plane conductor are arranged in a "pin" - shaped structure.

[0018] The first group of metal connection point columns includes a fourth metal connection point column, a fifth metal connection point column, a sixth metal connection point column, and a seventh metal connection point column. The second group of metal connection point columns includes an eighth metal connection point column, a ninth metal connection point column, a tenth metal connection point column, and an eleventh metal connection point column. The third group of metal connection point columns includes a twelfth metal connection point column, a thirteenth metal connection point column, a fourteenth metal connection point column, and a fifteenth metal connection point column.

[0019] The fourth group of metal connection point columns includes a sixteenth metal connection point column, a seventeenth metal connection point column, an eighteenth metal connection point column, and a nineteenth metal connection point column. The fifth group of metal connection point columns includes a twentieth metal connection point column, a twenty - first metal connection point column, a twenty - second metal connection point column, and a twenty - third metal connection point column. The sixth group of metal connection point columns includes a twenty - fourth metal connection point column, a twenty - fifth metal connection point column, a twenty - sixth metal connection point column, and a twenty - seventh metal connection point column.

[0020] The beneficial effects of the utility model are as follows: the utility model is based on LTCC (low temperature co-fired ceramic) technology and adopts lumped parameter model design to realize the special electrical performance requirements of dielectric LTCC multilayer bandpass filter. The utility model effectively realizes the characteristics of dielectric LTCC multilayer bandpass filter, and has the advantages of low loss, small size, high reliability, low cost and suitability for large-scale production, and also adapts to the development trend of new electronic component integration and miniaturization.

[0021] The utility model will be further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is the equivalent circuit diagram of the dielectric LTCC multilayer bandpass filter of the utility model.

[0023] Figure 2 The figure is a schematic diagram of the three-dimensional structure of the dielectric LTCC multilayer bandpass filter of the utility model.

[0024] Figure 3 This is a schematic diagram of the internal structure of the dielectric LTCC multilayer bandpass filter of the utility model.

[0025] Figure 4 It is a schematic diagram of the planar structure of the first layer in the dielectric LTCC multilayer bandpass filter of the utility model.

[0026] Figure 5 This is a schematic diagram of the planar structure of the second layer circuit in the dielectric LTCC multilayer bandpass filter of the utility model.

[0027] Figure 6 It is a schematic diagram of the planar structure of the third layer circuit in the dielectric LTCC multilayer bandpass filter of the utility model.

[0028] Figure 7 This is a schematic diagram of the planar structure of the fourth layer circuit in the dielectric LTCC multilayer bandpass filter of the utility model.

[0029] Figure 8 This is a schematic diagram of the planar structure of the fifth layer circuit in the dielectric LTCC multilayer bandpass filter of the utility model.

[0030] Fig. 9 This is a schematic diagram of the planar structure of the sixth layer circuit in the dielectric LTCC multilayer bandpass filter of the utility model.

[0031] Fig.10 It is a schematic diagram of the planar structure of the seventh layer in the dielectric LTCC multilayer bandpass filter of the utility model.

[0032] Fig.11 It is a schematic diagram of the planar structure of the eighth layer in the dielectric LTCC multilayer bandpass filter of the utility model.

[0033] Fig.12 This is a product electrical frequency response curve of the dielectric LTCC multilayer bandpass filter of the utility model. DETAILED DESCRIPTION

[0034] This embodiment is a preferred implementation mode of the utility model. Other embodiments whose principles and basic structures are the same or similar to those of this embodiment are within the protection scope of the utility model.

[0035] Please see attached Figure 1 The utility model discloses a novel dielectric LTCC multilayer bandpass filter equivalent circuit, which is composed of a 3rd-order band cross-coupling filter circuit. The equivalent circuit includes an input end, an output end, an inductor L1, an inductor L2, a transmission line L3, a transmission line L4, a transmission line L5, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9 and a capacitor C10. The inductor L1, the capacitor C2, the capacitor C4, the capacitor C6, the capacitor C8 and the inductor L2 are sequentially connected in series between the input end and the output end. A grounding capacitor C1 is connected between the common end of the inductor L1 and the capacitor C2 and the ground. A grounding transmission line L3 and a grounding capacitor C3 connected in parallel are connected between the common end of the capacitor C2 and the ground. A grounding transmission line L4 and a grounding capacitor C5 connected in parallel are connected between the common end of the capacitor C4 and the ground. A grounding transmission line L4 and a grounding capacitor C5 connected in parallel are connected between the common end of the capacitor C6 and the ground. The grounded transmission line L5 and the grounded capacitor C7 are connected in parallel, the grounded capacitor C9 is connected between the common end of the inductor L2 and the capacitor C8 and the ground, and the capacitor C10 is connected between the common end of the capacitor C2 and the capacitor C4 and the common end of the capacitor C6 and the capacitor C8. The resonator of the third-order bandpass filter is composed of the transmission line L3, the transmission line L4, the transmission line L5 and the capacitor C3, the capacitor C5, and the capacitor C7 in parallel; in addition, the inductor L1 and the inductor L2 are the coupling inductors of the input and output ends respectively, and the grounded capacitor C1 and the grounded capacitor C9 are formed at the same time, which is equivalent to adding a low-pass filter to the input and output ends; the capacitor C2 and the capacitor C8 are the input coupling capacitor and the output coupling capacitor of the third-order cross-coupled bandpass filter; the capacitor C4 is the coupling capacitor between the first-order resonator and the second-order resonator; the capacitor C6 is the coupling capacitor between the second-order resonator and the third-order resonator; the capacitor C10 is the coupling capacitor between the first-order resonator and the third-order resonator.

[0036] Please refer to the attached Figure 2 To Attachment Fig.11The utility model mainly protects a filter capable of realizing the equivalent circuit of the above-mentioned novel dielectric LTCC multilayer bandpass filter, comprising: a ceramic substrate 9, an input end 10a, an output end 10b and an internal circuit structure layer arranged in the ceramic substrate 9. In this embodiment, the input end 10a and the output end 10b are respectively arranged at both ends of the ceramic substrate 9 for connecting to an external circuit, and the other two sides of the ceramic substrate 9 are respectively provided with a first grounding pin 11a and a second grounding pin 11b, and the first grounding pin 11a and the second grounding pin 11b are symmetrically arranged on both sides of the ceramic substrate 9. The ceramic substrate 9 is the main body of the utility model, and adopts a rectangular parallelepiped structure. The ceramic substrate 9 is mainly composed of aluminum oxide (Al2O3), calcium oxide (CaO), magnesium oxide (MgO) and silicon oxide (SiO2). The internal circuit structure layer is distributed inside the ceramic substrate 9. There are 8 internal circuit structure layers in total. The internal circuit structure layers are as follows from bottom to top (with the direction in the attached figure as the direction):

[0037] The first layer is a first metal plane conductor 1 printed on the ceramic substrate 9. The first layer can be printed on a ceramic dielectric substrate. The first layer is used as the ground plane of the product of the utility model. The first metal plane conductor 1 is rectangular, and its two long sides extend outward and are exposed, and are connected to the first ground pin 11a and the second ground pin 11b outside the product.

[0038] In the second layer, three mutually insulated metal plane conductors are printed on the ceramic substrate 9, which are the second metal plane conductor 2a, the third metal plane conductor 2b and the fourth metal plane conductor 2c. The three mutually insulated metal plane conductors are arranged in a "pin" shape structure and can be printed on a ceramic dielectric substrate. The second metal plane conductor 2a, the third metal plane conductor 2b and the fourth metal plane conductor 2c form a grounding capacitor C3, a grounding capacitor C5 and a grounding capacitor C7 with the first plane metal conductor 1 of the first layer respectively;

[0039] The third layer is printed with two mutually insulated metal planes on the ceramic substrate 9, which are the fifth metal plane conductor 3e and the sixth metal plane conductor 3h. The fifth metal plane conductor 3e and the sixth metal plane conductor 3h respectively form a grounding capacitor C1 and a grounding capacitor C9 with the first plane metal conductor 1 of the first layer. The fifth metal plane conductor 3e is connected to the first lead metal sheet 3g through the first metal connecting line 3d. The first lead metal sheet 3g is connected to the input terminal 10a. The sixth metal plane conductor 3h is connected to the second lead metal sheet 3f through the second metal connecting line 3i. The second lead metal sheet 3f is connected to the output terminal 10b. The fifth metal plane conductor 3e, the first metal connecting line 3d and the first lead metal sheet 3g form a "concave" shape structure to form an input inductance L1. The sixth metal plane conductor 3h, the second metal connecting line 3i and the second lead metal sheet 3f form a "concave" shape structure to form an output inductance L2.

[0040] The fourth layer is printed on the ceramic substrate 9 with two mutually insulated metal planes, which are the seventh metal plane conductor 4a and the eighth metal plane conductor 4b, and can be printed on a ceramic dielectric substrate;

[0041] The fifth layer is printed with three mutually insulated metal planes on the ceramic substrate 9, which are the ninth metal plane conductor 5a, the tenth metal plane conductor 5b and the eleventh metal plane conductor 5c. The printing can be performed on a ceramic dielectric substrate. A capacitor C2 is formed between the ninth metal plane conductor 5a and the seventh metal plane conductor 4a in the fourth layer. A capacitor C8 is formed between the eleventh metal plane conductor 5c and the eighth metal plane conductor 4b in the fourth layer. The ninth metal plane conductor 5a is connected to the second metal plane conductor 2a in the second layer through the first metal connection point column 3a. The tenth metal plane conductor 5b is connected to the third metal plane conductor 2b in the second layer through the second metal connection point column 3b. The eleventh metal plane conductor 5c is connected to the fourth metal plane conductor 2c in the second layer through the third metal connection point column 3c.

[0042] The sixth layer has two metal planes printed on the ceramic substrate 9, which are the twelfth metal plane conductor 6a and the thirteenth metal plane conductor 6c. The twelfth metal plane conductor 6a and the thirteenth metal plane conductor 6c are connected by a third metal connecting line 6b. When printing, they can be printed on a ceramic dielectric substrate. The twelfth metal plane conductor 6a and the thirteenth metal plane conductor 6c and the ninth metal plane conductor 5a, the tenth metal plane conductor 5b and the eleventh metal plane conductor 5c in the fifth layer form two series capacitors between the resonators, and finally form a cross-coupling capacitor C10 between the first-stage resonator and the third-stage resonator.

[0043] The seventh layer has two metal planes printed on the ceramic substrate 9, which are the fourteenth metal plane conductor 7a and the fifteenth metal plane conductor 7c. The printing can be performed on a ceramic dielectric substrate. The fourteenth metal plane conductor 7a and the fifteenth metal plane conductor 7c are connected by a fourth metal connecting wire 7b. The fourteenth metal plane conductor 7a and the fifteenth metal plane conductor 7c form an inter-stage coupling capacitor C4 and a coupling capacitor C6 with the ninth metal plane conductor 5a and the eleventh metal plane conductor 5c in the fifth layer.

[0044] In the eighth layer, three mutually insulated metal planes are printed on the ceramic substrate 9, which are the sixteenth metal plane conductor 8a, the seventeenth metal plane conductor 8b and the eighteenth metal plane conductor 8c. The sixteenth metal plane conductor 8a is connected to the first metal plane conductor 1 in the first layer through the first group of metal connection point columns, the seventeenth metal plane conductor 8b is connected to the first metal plane conductor 1 in the first layer through the second group of metal connection point columns, and the eighteenth metal plane conductor 8c is connected to the first metal plane conductor 1 in the first layer through the third group of metal connection point columns. The metal connection point column group is connected to the first metal plane conductor 1 in the first layer, the first group of metal connection point column groups includes the fourth metal connection point column 2d, the fifth metal connection point column 2e, the sixth metal connection point column 2f and the seventh metal connection point column 2g, the second group of metal connection point column groups includes the eighth metal connection point column 2h, the ninth metal connection point column 2i, the tenth metal connection point column 2j and the eleventh metal connection point column 2k, the third group of metal connection point column groups includes the twelfth metal connection point column 2m, the thirteenth metal connection point column 2n, the fourteenth metal connection point column 2 The contact post 2p and the fifteenth metal connection point post 2q, the sixteenth metal plane conductor 8a is connected to the ninth metal plane conductor 5a in the fifth layer through the fourth group of metal connection point posts, the seventeenth metal plane conductor 8b is connected to the tenth metal plane conductor 5b in the fifth layer through the fifth group of metal connection point posts, and the eighteenth metal plane conductor 8c is connected to the eleventh metal plane conductor 5c in the fifth layer through the sixth group of metal connection point posts, and finally the transmission lines L3, L4 and L5 in the circuit structure are realized. The fourth group of metal connection point posts The point column group includes a sixteenth metal connection point column 6d, a seventeenth metal connection point column 6e, an eighteenth metal connection point column 6f and a nineteenth metal connection point column 6g, the fifth group of metal connection point column groups includes a twentieth metal connection point column 6h, a twenty-first metal connection point column 6i, a twenty-second metal connection point column 6j and a twenty-third metal connection point column 6k, and the sixth group of metal connection point column groups includes a twenty-fourth metal connection point column 6m, a twenty-fifth metal connection point column 6n, a twenty-sixth metal connection point column 6p and a twenty-seventh metal connection point column 6q.

[0045] Please refer to the attached Fig.12The operating frequency band of this dielectric LTCC multilayer bandpass filter is 5.935GHz~6.425GHz. In the frequency range of 3.5GHz to 9GHz, the transmission loss S21, the signal transmission curve from electrode 10a to electrode 10b port S(1,2) and the return loss curve of electrode 10a S(1,1), the return loss curve of electrode 10b S(2,2).

[0046] The utility model is based on LTCC (low temperature co-fired ceramic) technology and adopts lumped parameter model design to realize the special electrical performance requirements of dielectric LTCC multilayer bandpass filter. The utility model effectively realizes the characteristics of dielectric LTCC multilayer bandpass filter, and has the advantages of low loss, small size, high reliability, low cost and suitable for large-scale production. In addition, it also adapts to the development trend of new electronic component integration and miniaturization.

Claims

1. A novel dielectric LTCC multilayer bandpass filter, characterized by: The filter comprises a ceramic substrate (9), an input end (10a), an output end (10b), and an internal circuit structure layer arranged in the ceramic substrate (9), wherein the input end (10a) and the output end (10b) are arranged at two ends of the ceramic substrate (9), a ground pin is arranged outside the ceramic substrate (9), and the internal circuit structure layer comprises: The first layer includes a first metal plane conductor (1) printed on a ceramic substrate (9), the first metal plane conductor (1) being rectangular in shape, with two long sides extending outwards to be connected to an external ground pin of the product; The second layer comprises three mutually insulated metal plane conductors printed on the ceramic substrate (9), which are respectively a second metal plane conductor (2a), a third metal plane conductor (2b) and a fourth metal plane conductor (2c); The third layer includes two mutually insulated metal planes printed on a ceramic substrate (9), which are respectively a fifth metal plane conductor (3e) and a sixth metal plane conductor (3h); the fifth metal plane conductor (3e) is connected to a first lead metal sheet (3g) via a first metal connection line (3d); the first lead metal sheet (3g) is connected to an input terminal (10a); the sixth metal plane conductor (3h) is connected to a second lead metal sheet (3f) via a second metal connection line (3i); the second lead metal sheet (3f) is connected to an output terminal (10b); the fifth metal plane conductor (3e), the first metal connection line (3d) and the first lead metal sheet (3g) form a "concave"-shaped structure; and the sixth metal plane conductor (3h), the second metal connection line (3i) and the second lead metal sheet (3f) form a "concave"-shaped structure; The fourth layer has two mutually insulated metal planes printed on the ceramic substrate (9), which are the seventh metal plane conductor (4a) and the eighth metal plane conductor (4b); The fifth layer has three mutually insulated metal planes printed on the ceramic substrate (9), which are respectively a ninth metal plane conductor (5a), a tenth metal plane conductor (5b) and an eleventh metal plane conductor (5c); the ninth metal plane conductor (5a) is connected to the second metal plane conductor (2a) in the second layer via a first metal connection point column (3a); the tenth metal plane conductor (5b) is connected to the third metal plane conductor (2b) in the second layer via a second metal connection point column (3b); and the eleventh metal plane conductor (5c) is connected to the fourth metal plane conductor (2c) in the second layer via a third metal connection point column (3c); The sixth layer has two metal planes printed on the ceramic substrate (9), which are respectively a twelfth metal plane conductor (6a) and a thirteenth metal plane conductor (6c), and the twelfth metal plane conductor (6a) and the thirteenth metal plane conductor (6c) are connected via a third metal connecting wire (6b); The seventh layer has two metal planes printed on the ceramic substrate (9), which are respectively a fourteenth metal plane conductor (7a) and a fifteenth metal plane conductor (7c), and the fourteenth metal plane conductor (7a) and the fifteenth metal plane conductor (7c) are connected via a fourth metal connecting wire (7b); In the eighth layer, three mutually insulated metal planes are printed on the ceramic substrate (9), which are the sixteenth metal plane conductor (8a), the seventeenth metal plane conductor (8b) and the eighteenth metal plane conductor (8c). The sixteenth metal plane conductor (8a) is connected to the first metal plane conductor (1) in the first layer through the first group of metal connection point columns, the seventeenth metal plane conductor (8b) is connected to the first metal plane conductor (1) in the first layer through the second group of metal connection point columns, the eighteenth metal plane conductor (8c) is connected to the first metal plane conductor (1) in the first layer through the third group of metal connection point columns, the sixteenth metal plane conductor (8a) is connected to the ninth metal plane conductor (5a) in the fifth layer through the fourth group of metal connection point columns, the seventeenth metal plane conductor (8b) is connected to the tenth metal plane conductor (5b) in the fifth layer through the fifth group of metal connection point columns, and the eighteenth metal plane conductor (8c) is connected to the eleventh metal plane conductor (5c) in the fifth layer through the sixth group of metal connection point columns.

2. The novel dielectric LTCC multilayer bandpass filter according to claim 1 is characterized in that: The grounding pin comprises a first grounding pin (11a) and a second grounding pin (11b), and the first grounding pin (11a) and the second grounding pin (11b) are symmetrically arranged on both sides of the ceramic substrate (9).

3. The novel dielectric LTCC multilayer bandpass filter according to claim 1 is characterized in that: The second metal plane conductor (2a), the third metal plane conductor (2b) and the fourth metal plane conductor (2c) are arranged in a "pin"-shaped structure.

4. The novel dielectric LTCC multilayer bandpass filter according to claim 1 is characterized in that: The first group of metal connection point columns includes a fourth metal connection point column (2d), a fifth metal connection point column (2e), a sixth metal connection point column (2f) and a seventh metal connection point column (2g), the second group of metal connection point columns includes an eighth metal connection point column (2h), a ninth metal connection point column (2i), a tenth metal connection point column (2j) and an eleventh metal connection point column (2k), and the third group of metal connection point columns includes a twelfth metal connection point column (2m), a thirteenth metal connection point column (2n), a fourteenth metal connection point column (2p) and a fifteenth metal connection point column (2q).

5. The novel dielectric LTCC multilayer bandpass filter according to claim 1 is characterized in that: The fourth group of metal connection point columns includes a sixteenth metal connection point column (6d), a seventeenth metal connection point column (6e), an eighteenth metal connection point column (6f) and a nineteenth metal connection point column (6g), the fifth group of metal connection point columns includes a twentieth metal connection point column (6h), a twenty-first metal connection point column (6i), a twenty-second metal connection point column (6j) and a twenty-third metal connection point column (6k), and the sixth group of metal connection point columns includes a twenty-fourth metal connection point column (6m), a twenty-fifth metal connection point column (6n), a twenty-sixth metal connection point column (6p) and a twenty-seventh metal connection point column (6q).

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