Internal heat dissipation structure of ultrasonic power supply

Abstract

The utility model discloses an internal heat dissipation structure of an ultrasonic power supply, and particularly relates to the field of ultrasonic equipment, the internal heat dissipation structure comprises a radiator, a plurality of heat dissipation fins are fixedly installed at the front end of the radiator, and a heat dissipation assembly is fixedly installed on the radiator and located above the heat dissipation fins; the heat dissipation assembly comprises a rear installation plate, two fixed side plates are symmetrically and fixedly installed on the front end face of the top of the rear installation plate, an installation plate is fixedly installed between the two fixed side plates, a heat dissipation fan is fixedly installed on the upper end face of the front end of the installation plate, and a refrigeration plate is fixedly installed on the lower end face of the installation plate, located on the front side of the radiator and located over the heat dissipation fins. A plurality of vent holes are uniformly formed in the lower end of the refrigeration plate; the air outlet end of the cooling fan fixedly communicates with the upper end of the refrigeration plate through a connecting pipe. According to the utility model, the interior of the ultrasonic power supply can be conveniently and automatically cooled, the cooling effect is good, the automation degree is high, and the practicability is high.

Description

Technical Field

[0001] The utility model relates to the field of ultrasonic equipment, in particular to an internal heat dissipation structure of an ultrasonic power supply. Background Art

[0002] Ultrasonic power supplies usually only have one fan placed on the back of the chassis for heat dissipation. There are hot spots and cold spots inside the chassis, and one fan can only dissipate heat for the entire chassis, but cannot eliminate the internal uneven heat. When the ambient temperature is very high in some places, the hot spots inside the chassis are obvious, and in actual applications, the internal transformer and inductor may burn out.

[0003] The authorized patent with application number: 202021821122.4 includes a base plate, wheels, fixed foot cups, a feed hopper, a discharge port, and a lifting platform. Wheels and fixed foot cups are provided at the bottom of the base plate, the lifting platform is installed on the base plate, a feed hopper is provided on the lifting platform, and a discharge port is provided at the bottom of the feed hopper. It is characterized in that an ultrasonic vibrator is installed in the feed hopper, and a fan and an electric box are provided under the feed hopper. The feed hopper, fan and electric box rise and fall with the lifting platform, and the discharge port is obliquely arranged at the bottom of the feed hopper, and the end of the discharge port protrudes from the base plate.

[0004] The above-mentioned comparative documents include the following issues:

[0005] The cooling air blown out by the cooling fan is at room temperature, which results in a very limited cooling effect in hot weather.

[0006] Therefore, we made improvements and proposed an internal heat dissipation structure for an ultrasonic power supply. Utility Model Content

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0008] The utility model discloses an internal heat dissipation structure of an ultrasonic power supply, comprising a radiator, a plurality of heat dissipation fins are fixedly installed at the front end of the radiator, and a heat dissipation component is fixedly installed on the radiator and above the heat dissipation fins;

[0009] The heat dissipation assembly includes a mounting rear plate, two fixed side plates are symmetrically fixedly mounted on the front end surface of the top of the mounting rear plate, a mounting plate is fixedly mounted between the two fixed side plates, a heat dissipation fan is fixedly mounted on the upper end surface of the front end of the mounting plate, a cooling plate is fixedly mounted on the lower end surface of the mounting plate and is located on the front side of the radiator and directly above the cooling fins, and a plurality of ventilation holes are evenly opened at the lower end of the cooling plate;

[0010] The air outlet end of the heat dissipation fan is fixedly connected with the upper end of the refrigeration plate through a connecting pipe.

[0011] As a preferred technical solution of the utility model, the left end of the refrigeration plate is fixedly connected to a first connector, and the right end of the refrigeration plate is fixedly connected to a second connector;

[0012] The first connector and the second connector are both fixedly connected to the refrigeration assembly.

[0013] As a preferred technical solution of the utility model, the refrigeration assembly includes a refrigeration box, a first connecting pipe is fixedly connected to the left end of the refrigeration box, the other end of the first connecting pipe is fixedly connected to an air intake shell, and a plurality of air intake heads are fixedly connected to the upper end of the air intake shell at equal distances, and one of the plurality of air intake heads is fixedly connected to the first connecting head through an air intake hose.

[0014] As a preferred technical solution of the utility model, the right end of the refrigeration box is fixedly connected to a second connecting pipe, the other end of the second connecting pipe is fixedly connected to an air outlet shell, and the upper end of the air outlet shell is fixedly connected to multiple air outlet heads at equal distances, and one of the multiple air outlet heads is fixedly connected to the second connecting head through an air outlet hose.

[0015] As a preferred technical solution of the utility model, a semiconductor refrigeration plate is fixedly installed on the upper end of the refrigeration box, and the lower cooling end of the semiconductor refrigeration plate passes through the upper end of the refrigeration box and extends to the inside of the refrigeration box, and the upper heating end of the semiconductor refrigeration plate is located outside the refrigeration box.

[0016] As a preferred technical solution of the present utility model, a circulation pump is fixedly installed on the first connecting pipeline.

[0017] As a preferred technical solution of the utility model, switch valves are fixedly installed on the air inlet head and the air outlet head.

[0018] The beneficial effects of the utility model are:

[0019] 1. The internal heat dissipation structure of this ultrasonic power supply can blow air into the cooling plate by starting the heat dissipation fan. The blown air flow is evenly blown to the heat dissipation fins through the vents, thereby improving the heat dissipation effect of the heat dissipation fins, and further improving the heat dissipation effect of the heat dissipation fins on the radiator.

[0020] 2. In the internal heat dissipation structure of the ultrasonic power supply, the refrigeration component can be connected to multiple heat dissipation components at the same time, so that the refrigeration component can be used in multiple refrigerators at the same time. The refrigerator can be installed on the heating element of the internal circuit board of the ultrasonic power supply, and the heating element of the internal circuit board of the ultrasonic power supply can be dissipated by the refrigerator; when the refrigeration component is in use, the refrigeration box can be placed outside the ultrasonic power supply, and then multiple air inlet heads can be connected to multiple air inlet hoses. The multiple air inlet hoses can be inserted into the ultrasonic power supply and respectively connected to the first connectors on the multiple heat dissipation components.

[0021] 3. The internal heat dissipation structure of the ultrasonic power supply is then started. The semiconductor refrigeration plate and the circulation pump are then started. The circulation pump can allow the gas in the refrigeration plate to enter the refrigeration box through the air inlet shell, the air inlet hose, the air inlet head, the air inlet shell, and the first connecting pipe in turn. The semiconductor refrigeration plate works and its refrigeration end can refrigerate the gas to turn the gas into cold air. The cold air passes through the second connecting hose, the air outlet shell, the air outlet head, the air outlet hose, and the second connecting head in turn back to the refrigeration plate. The heat dissipation fan works and can blow the cold air onto the heat dissipation fins, which can improve the heat dissipation effect of the heat dissipation fins on the radiator, thereby improving the heat dissipation effect of the radiator.

[0022] The utility model can be convenient for automatically dissipating the heat inside the ultrasonic power supply, has good heat dissipation effect, high automation degree and high practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 This is a schematic diagram of the internal heat dissipation structure of an ultrasonic power supply of the utility model;

[0025] Figure 2 This is a schematic diagram of the structure of a refrigeration component in the internal heat dissipation structure of an ultrasonic power supply of the utility model;

[0026] Figure 3 The utility model is a structural schematic diagram of a heat dissipation component in an internal heat dissipation structure of an ultrasonic power supply.

[0027] In the figure: 1. Radiator; 2. Refrigeration component; 3. Heat dissipation component; 4. Heat dissipation fins;

[0028] 201, refrigeration box; 202, first connecting pipe; 203, air inlet shell; 204, air inlet head; 205, air inlet hose; 206, air outlet hose; 207, air outlet head; 208, air outlet shell; 209, second connecting hose; 210, semiconductor refrigeration sheet; 211 circulation pump;

[0029] 301, installation rear plate; 302, refrigeration plate; 303, first connector; 304, fixed side plate; 305, installation plate; 306, cooling fan; 307, second connector. DETAILED DESCRIPTION

[0030] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0031] Example: Figure 1-3 As shown, the utility model is an internal heat dissipation structure of an ultrasonic power supply, comprising a radiator 1, a plurality of heat dissipation fins 4 are fixedly installed at the front end of the radiator 1, and a heat dissipation component 3 is fixedly installed on the radiator 1 and above the heat dissipation fins 4;

[0032] The heat dissipation assembly 3 includes a mounting rear plate 301, two fixed side plates 304 are symmetrically fixedly mounted on the top front end surface of the mounting rear plate 301, a mounting plate 305 is fixedly mounted between the two fixed side plates 304, a heat dissipation fan 306 is fixedly mounted on the upper end surface of the front end of the mounting plate 305, a cooling plate 302 is fixedly mounted on the lower end surface of the mounting plate 305 and located at the front side of the radiator 1 and directly above the heat dissipation fins 4, and a plurality of ventilation holes are evenly opened at the lower end of the cooling plate 302;

[0033] The air outlet end of the heat dissipation fan 306 is fixedly connected to the upper end of the refrigeration plate 302 through a connecting pipe.

[0034] By starting the cooling fan 306, the cooling fan 306 can blow air into the refrigeration plate 302, and the blown air flow is evenly blown to the cooling fins 4 through the vents, thereby improving the cooling effect of the cooling fins 4, and then improving the cooling effect of the cooling fins 4 on the radiator 1, and then improving the cooling effect of the radiator 1 on the inside of the ultrasonic power supply.

[0035] In this embodiment, Figure 2-3 As shown, the left end of the refrigeration plate 302 is fixedly connected with a first connector 303, and the right end of the refrigeration plate 302 is fixedly connected with a second connector 307; the first connector 303 and the second connector 307 are both fixedly connected to the refrigeration assembly 2; the refrigeration assembly 2 includes a refrigeration box 201, the left end of the refrigeration box 201 is fixedly connected with a first connecting pipe 202, the other end of the first connecting pipe 202 is fixedly connected with an air intake shell 203, and the upper end of the air intake shell 203 is equidistantly fixedly connected with a plurality of air intake heads 204, one of the plurality of air intake heads 204 is fixedly connected with the first connector 303 through an air intake hose 205; the right end of the refrigeration box 201 is fixedly connected with a second connecting pipe 20 9. The other end of the second connecting pipe 209 is fixedly connected to an air outlet shell 208, and a plurality of air outlet heads 207 are fixedly connected to the upper end of the air outlet shell 208 at equal intervals, and one of the plurality of air outlet heads 207 is fixedly connected to the second connecting head 307 through an air outlet hose 206; a semiconductor refrigeration plate 210 is fixedly installed on the upper end of the refrigeration box 201, and the cooling end of the lower end of the semiconductor refrigeration plate 210 passes through the upper end of the refrigeration box 201 and extends to the inside of the refrigeration box 201, and the heating end of the upper end of the semiconductor refrigeration plate 210 is located outside the refrigeration box 201; a circulating pump 211 is fixedly installed on the first connecting pipe 202; and switch valves are fixedly installed on the air inlet head 204 and the air outlet head 207.

[0036] The refrigeration component 2 in the utility model can be connected to multiple heat dissipation components 3 at the same time, so that the refrigeration component 2 can be used in multiple refrigerators at the same time. The refrigerator can be installed on the heating element of the internal circuit board of the ultrasonic power supply, and the heating element of the internal circuit board of the ultrasonic power supply can be cooled by the refrigerator;

[0037] When the refrigeration assembly 2 is in use, the refrigeration box 201 can be placed outside the ultrasonic power supply, and then the multiple air inlet heads 204 can be connected to the multiple air inlet hoses 205. The multiple air inlet hoses 205 can be inserted into the ultrasonic power supply and respectively connected to the first connectors 303 on the multiple heat dissipation assemblies 3;

[0038] Connecting multiple air outlet heads 207 to multiple air outlet hoses 206, inserting multiple air outlet hoses 206 into the ultrasonic power supply, and respectively connecting to the second connectors 307 on multiple heat dissipation components 3;

[0039] And open the switch valve on the air inlet head 204 connected with the air inlet hose 205, and open the switch valve on the air outlet head 207 connected with the air outlet hose 206;

[0040] Then start the semiconductor refrigeration plate 210 and the circulation pump 211. The circulation pump 211 can allow the gas in the refrigeration plate 302 to enter the refrigeration box 201 through the air inlet shell 203, the air inlet hose 205, the air inlet head 204, the air inlet shell 203, and the first connecting pipe 202 in sequence. The semiconductor refrigeration plate 210 can cool the gas at its refrigeration end to turn the gas into cold air. The cold air returns to the refrigeration plate 302 through the second connecting hose 209, the air outlet shell 208, the air outlet head 207, the air outlet hose 206 and the second connecting head 307 in sequence. The cooling fan 306 can blow the cold air onto the cooling fins 4 when it is working, which can improve the heat dissipation effect of the cooling fins 4 on the radiator 1, thereby improving the heat dissipation effect of the radiator 1.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An internal heat dissipation structure of an ultrasonic power supply, characterized in that: It comprises a radiator (1), a plurality of heat dissipation fins (4) are fixedly mounted on the front end of the radiator (1), and a heat dissipation component (3) is fixedly mounted on the radiator (1) and above the heat dissipation fins (4); The heat dissipation assembly (3) comprises a mounting rear plate (301), two fixed side plates (304) are symmetrically fixedly mounted on the top front end surface of the mounting rear plate (301), a mounting plate (305) is fixedly mounted between the two fixed side plates (304), a heat dissipation fan (306) is fixedly mounted on the upper end surface of the front end portion of the mounting plate (305), a cooling plate (302) is fixedly mounted on the lower end surface of the mounting plate (305) and is located on the front side of the radiator (1) and directly above the cooling fins (4), and a plurality of ventilation holes are evenly arranged on the lower end of the cooling plate (302); The air outlet end of the heat dissipation fan (306) is fixedly connected to the upper end of the refrigeration plate (302) via a connecting pipe.

2. The internal heat dissipation structure of an ultrasonic power supply according to claim 1, characterized in that: The left end of the refrigeration plate (302) is fixedly connected to a first connector (303), and the right end of the refrigeration plate (302) is fixedly connected to a second connector (307); The first connector (303) and the second connector (307) are both fixedly connected to the refrigeration assembly (2).

3. The internal heat dissipation structure of an ultrasonic power supply according to claim 2, characterized in that: The refrigeration assembly (2) comprises a refrigeration box (201), the left end of the refrigeration box (201) is fixedly connected to a first connecting pipe (202), the other end of the first connecting pipe (202) is fixedly connected to an air intake shell (203), the upper end of the air intake shell (203) is fixedly connected to a plurality of air intake heads (204) at equal intervals, and one of the plurality of air intake heads (204) is fixedly connected to the first connecting head (303) via an air intake hose (205).

4. The internal heat dissipation structure of an ultrasonic power supply according to claim 3, characterized in that: The right end of the refrigeration box (201) is fixedly connected to a second connecting pipe (209), the other end of the second connecting pipe (209) is fixedly connected to an air outlet shell (208), the upper end of the air outlet shell (208) is fixedly connected to a plurality of air outlet heads (207) at equal intervals, and one of the plurality of air outlet heads (207) is fixedly connected to a second connecting head (307) via an air outlet hose (206).

5. The internal heat dissipation structure of an ultrasonic power supply according to claim 4, characterized in that: A semiconductor refrigeration sheet (210) is fixedly mounted on the upper end of the refrigeration box (201), and a cooling end at the lower end of the semiconductor refrigeration sheet (210) passes through the upper end of the refrigeration box (201) and extends into the interior of the refrigeration box (201), while a heating end at the upper end of the semiconductor refrigeration sheet (210) is located outside the refrigeration box (201).

6. The internal heat dissipation structure of an ultrasonic power supply according to claim 5, characterized in that: A circulation pump (211) is fixedly installed on the first connecting pipe (202).

7. The internal heat dissipation structure of an ultrasonic power supply according to claim 6, characterized in that: Switch valves are fixedly mounted on the air inlet head (204) and the air outlet head (207).

Images