Power supply module
By adopting the combination of the vertical stacking structure of the three -layer circuit board and the thermal conductivity, the problem of heat dissipation difficulties of small power modules is solved, and the effect of occupying small and high heat dissipation efficiency is achieved.
Patent Information
- Application Number
- CN202421055846.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-15
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-15
AI Technical Summary
The existing vertical power supply modules face heat dissipation problems during the reduction of size, which is difficult to meet the industry's demand for smaller sizes and efficient heat dissipation.
The power module of the vertical stacking architecture of the three -layer circuit board is used to set up heating elements by dispersing different circuit boards and setting heat conductors between circuit boards to achieve effective transmission and distribution of calories.
The small and cooling efficiency of the power module's occupation area and the high heat dissipation efficiency have been realized, and the problem of difficult heat dissipation of small power modules has been solved.
Smart Images
Figure CN222424553U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power electronics, and in particular to a power supply module with a vertical power supply architecture. Background Art
[0002] At present, power modules with vertical power supply architecture are gradually being adopted by integrated systems in the field of power electronics due to their excellent performance advantages.
[0003] Existing vertical power supply modules usually adopt a double-board stacking architecture. Figure 1 and Figure 2 , Figure 1 is a side view of a power module with a double-board stacking architecture in the prior art. Figure 2 The schematic diagram of the combination of a power module and an electric device in a dual-board stacking structure in the prior art. The power module 10 is formed as a whole by stacking a circuit board 11 and a circuit board 12 in a longitudinal manner, and is electrically connected to a system board 21 of an electric device 20 by welding through a BGA (ball grid array package) welding ball 13 arranged under the circuit board 12. Among them, the power supply unit 22 of the electric device 20 and the power module 10 are arranged on both sides of the system board 21 respectively.
[0004] The vertical power supply module of the prior art is widely used in the current power electronics field because of its short power transmission path and low energy loss. However, the development of related industries requires that the vertical power supply module adopts a smaller size architecture. At the same time, as the size is further reduced, the heat dissipation problem of the power module becomes particularly important.
[0005] Therefore, it is necessary to develop a vertical power supply module to solve the problems faced by the prior art. It should be noted that the information disclosed in the above prior art section is only used to enhance the understanding of the background of the utility model, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Utility Model Content
[0006] The utility model aims to provide a power supply module with small occupied area and high heat dissipation efficiency.
[0007] In order to achieve the above-mentioned purpose, the utility model provides a power module for supplying power to an electrical device. The power module includes a first circuit board, a second circuit board, a third circuit board and a heat-conducting member. The first circuit board is provided with a heat-dissipating member. The second circuit board is stacked and arranged with the first circuit board and connected to each other, wherein the second circuit board is provided with at least one heating element, and the at least one heating element and the heat-dissipating member are respectively located on surfaces of the second circuit board and the first circuit board that are opposite to each other. The third circuit board is stacked and arranged with the second circuit board and connected to each other, and is connected to the electrical device. The heat-conducting member is arranged between the first circuit board and the second circuit board, and includes a first heat-conducting member and a second heat-conducting member. The first heat-conducting member extends in a direction perpendicular to the plane where the second circuit board is located, and contacts the heat-dissipating member on the first circuit board. The second heat-conducting member extends in a direction parallel to the plane where the second circuit board is located, and contacts at least one heating element on the second circuit board, wherein the first heat-conducting member and the second heat-conducting member are connected to each other.
[0008] According to one embodiment of the present invention, a projection area of the first heat-conducting component on the plane where the second circuit board is located is smaller than a projection area of the second heat-conducting component on the plane where the second circuit board is located.
[0009] According to one embodiment of the present invention, the first heat-conducting component is also in contact with the second circuit board.
[0010] According to one embodiment of the present invention, the second heat-conducting component is disposed on one side or both sides of the first heat-conducting component.
[0011] According to one embodiment of the present invention, the first heat-conducting component and the second heat-conducting component are integrally formed.
[0012] According to one embodiment of the present invention, there are multiple heating elements, and the multiple heating elements form at least one heat source matrix on the second circuit board, and the second heat-conducting component is in contact with the heat source matrix.
[0013] According to one embodiment of the present invention, the heat dissipation component includes a metal sheet.
[0014] According to one embodiment of the present invention, the heat conducting member includes a metal heat conducting member or a non-metal heat conducting member.
[0015] According to one embodiment of the present invention, the heating element includes a magnetic core or a power semiconductor switch.
[0016] According to one embodiment of the present invention, a plurality of ball grid array package welding balls are provided on the surface of the third circuit board opposite to the electrical device so as to be electrically connected to the electrical device.
[0017] The power module of the utility model adopts a three-layer circuit board structure different from the prior art, and combines the method of dispersing heating elements on different circuit boards and arranging heat conducting parts between the circuit boards, so as to achieve the effect that the power module occupies a small area and has high heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a side view of a power module with a double-board stacking architecture in the prior art.
[0019] Figure 2 It is a schematic diagram of the combination of a power module and an electrical device in a double-board stacking architecture in the prior art.
[0020] Figure 3A It is a schematic diagram of an exploded view of a power module according to an embodiment of the utility model.
[0021] Figure 3B It is a schematic diagram of another angle of decomposition of the power module of an embodiment of the utility model.
[0022] Figure 4A It is a schematic diagram of a heat conducting member according to an embodiment of the utility model.
[0023] Figure 4B It is a schematic diagram from another angle of the heat conducting member of the embodiment of the utility model.
[0024] Figure 5 It is a schematic diagram of the heat conduction path between the power module and the heat conducting member in the embodiment of the utility model.
[0025] The reference numerals are as follows:
[0026] 10: Power module
[0027] 11, 12: Circuit board
[0028] 13: BGA solder balls
[0029] 20: Electrical equipment
[0030] 21: System board
[0031] 22: Power supply unit
[0032] 30: Power module
[0033] 31: First circuit board
[0034] 311: Heat dissipation components
[0035] 32: Second circuit board
[0036] 321: Heating element
[0037] 321a, 321b: Heat source matrix
[0038] 33: The third circuit board
[0039] 331: BGA solder ball
[0040] 34: Heat conducting parts
[0041] 341: First Surface
[0042] 3411: First contact area
[0043] 342: Second Surface
[0044] 3421: Second contact area
[0045] 343: First heat conducting component
[0046] 344: Second heat conducting component DETAILED DESCRIPTION
[0047] Some typical embodiments of the features and advantages of the present utility model will be described in detail in the following description. It should be understood that the present utility model can have various changes in different ways without departing from the scope of the present utility model, and the description and drawings therein are essentially used for illustration rather than for limiting the present utility model.
[0048] It should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium.
[0049] In the following, some embodiments of the present invention are described in detail in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.
[0050] See also Figure 3A and Figure 3B , Figure 3A It is an exploded schematic diagram of the power module of the embodiment of the utility model. Figure 3BIt is another angle decomposition schematic diagram of the power module of the embodiment of the utility model. The utility model discloses a power module 30 with a three-layer circuit board vertically stacked structure, which includes a first circuit board 31, a second circuit board 32, a third circuit board 33 and a heat conductor 34. The first circuit board 31, the second circuit board 32 and the third circuit board 33 are stacked vertically in sequence, and the first circuit board 31 is connected to the second circuit board 32, the second circuit board 32 is connected to the third circuit board 33, and a BGA (ball grid array package) solder ball 331 is provided on the side of the third circuit board 33 away from the second circuit board 32 for connecting to an electrical device (not shown) and supplying power.
[0051] Different from the power module using a double-board stacking architecture in the prior art, the power module 30 of the present invention uses a three-layer circuit board to disperse the electrical components on three circuit boards. Under the condition of the same output power, the overall size of the power module 30 is effectively reduced, and the area occupied by the module on the system board of the electrical equipment is greatly reduced, thereby improving the integration capability of the electrical equipment system.
[0052] For a power module with a three-layer circuit board vertically stacked architecture, the heat dissipation of the heating element on the middle circuit board (the second circuit board 32) is extremely important. Since the power module 30 is small in size and has many electrical components inside the module, the heat generated by the heating element 321 on the second circuit board 32 is difficult to dissipate, thereby affecting the overall performance of the power module 30. In this regard, the utility model sets a heat conductor 34 between the first circuit board 31 and the second circuit board 32, and sets the heating element 321 on the second circuit board 32 on the surface of the second circuit board 32 facing the first circuit board 31, and at the same time, sets a heat dissipation component 311 on the surface of the first circuit board 31 facing the second circuit board 32, thereby, the heat generated by the heating element 321 on the second circuit board 30 can be conducted to the heat dissipation component 311 of the first circuit board 31 via the heat conductor 34, and finally dissipated into the air, so as to achieve better heat dissipation of the second circuit board 32. Further, the heat dissipation component 311 of the utility model includes but is not limited to metal sheets, such as copper sheets. In addition, the heating element 321 on the second circuit board 32 of the utility model includes but is not limited to magnetic cores, power semiconductor switches, etc.
[0053] It should be noted that in actual operation, the electrical components on the first circuit board 31 or the third circuit board 33 will also generate heat during operation. However, the heat generated by these electrical components is easier to dissipate. Therefore, the heating elements referred to in the present invention specifically refer to the heating elements located on the second circuit board 32.
[0054] See also Figure 3A-3B and Figure 4A-4B ,in, Figure 4ASchematic diagram of a heat conducting member according to an embodiment of the utility model. Figure 4B It is another angle schematic diagram of the heat-conducting member of the embodiment of the utility model. The heat-conducting member 34 includes a first heat-conducting component 343 and a second heat-conducting component 344, wherein the first heat-conducting component 343 extends in a direction perpendicular to the plane where the second circuit board 32 is located, and the second heat-conducting component 344 extends in a direction parallel to the plane where the second circuit board 32 is located, and extends on both sides of the first heat-conducting component 343, that is, the heat-conducting member 34 is formed into a transverse wing-shaped structure. Further, the heat-conducting member 34 includes a first surface 341 facing the first circuit board 31 and a second surface 342 facing the second circuit board 32, wherein a first contact area 3411 is provided on the first surface 341 for contacting the heat dissipation component 311 on the first circuit board 31, and a second contact area 3421 is provided on the second surface 342 for contacting the heating element 321 arranged on the second circuit board 32.
[0055] Please refer to Figure 5 , Figure 5 Schematic diagram of the heat conduction path between the power module and the heat conducting member in the embodiment of the utility model. Figure 5 As shown by the inner arrow, the heat generated by the heating element 321 on the second circuit board 32 is firstly conducted to the second heat conducting component 344 , then conducted to the heat dissipating component 311 of the first circuit board 31 via the first heat conducting component 342 , and finally dissipated into the air.
[0056] In some embodiments, the projection area of the first heat-conducting component 343 on the plane where the second circuit board 31 is located is smaller than the projection area of the second heat-conducting component 344 on the plane where the second circuit board 31 is located, that is, the projection area of the second contact area 3421 is larger than the projection area of the first contact area 3411. With such a configuration, the second heat-conducting component 344 can further cover more heating elements on the second circuit board 32, and at the same time, the first heat-conducting component 343 does not occupy too much space on the first circuit board 31, which is conducive to reducing the size of the power module 30 while improving the heat dissipation efficiency.
[0057] In some embodiments, the first heat-conducting component 343 is also in contact with the second circuit board 32 , thereby reducing the stress of the first circuit board 31 and protecting the heating element 321 located on the second circuit board 32 .
[0058] In some embodiments, the second heat conducting component 344 may be disposed on one side or both sides of the first heat conducting component 343. Furthermore, the first heat conducting component 343 and the second heat conducting component 344 may be two independent components or may be an integrally formed component.
[0059] In addition, the heat conducting member 34 of the present invention is made of a heat conducting material, so that even if the projection areas of the first contact area 3411 and the second contact area 3421 are not equal, the heat generated from the heat generating component 321 can still be smoothly transferred from the second contact area 3421, and conducted in the heat conducting member 34, and finally transferred to the heat dissipation component 311 through the first contact area 3411. The heat conducting member 34 can be a metal heat conducting member, such as copper, aluminum, etc.; the heat conducting member 34 can also be a non-metal heat conducting member, such as heat conducting ceramics, silicon heat conducting members, etc., but it is not limited thereto, and any heat conducting member with heat conducting effect belongs to the scope claimed by the present invention.
[0060] Furthermore, the plurality of heating elements 321 on the second circuit board 32 can be dispersedly arranged and divided into heat source matrices 321a and 321b, and the second heat conducting component 344 is in contact with the heat source matrices 321a and 321b respectively. By designing the second heat conducting component 344 and the first heat conducting component 343 of the heat conducting member 34 in different extension directions, the second heat conducting component 344 can be designed according to the position and shape of the heating element 321 / heating matrix 321a and 321b, without having to specifically consider the position, size and layout of the heat dissipation component 311 on the first circuit board 31 and other electrical components, further increasing the flexibility of setting the heating element 321 on the second circuit board 32. In other words, the shape of the heat conducting member 34 of the utility model can be adjusted according to the position of the heating element 321 and the heat source matrix 321a and 321b on the second circuit board 31 and the heat dissipation component 311 and other electrical components on the first circuit board 31, thereby retaining the setting space of the electrical components on each circuit board.
[0061] In addition, in order to achieve good contact between the heat conducting member 34 and the heating element 321, the heating element 321 on the second circuit board 32 is set based on the element height, that is, the heating elements 321 included in each heat source matrix have substantially similar element heights, such as substantially equal heights. Figure 3A As shown, the heating elements 321 in the heat source matrix 321a have similar or equal element heights, and the heating elements 321 in the heat source matrix 321b have similar or equal element heights.
[0062] In addition, the heat conducting member 34 and the heat dissipating component 311 may be in direct contact, or may be glued or attached with a heat conducting medium, or may be fixed by welding, screwing, etc. Similarly, the heat conducting member 34 and the heating component 321 may be in direct contact, or may be glued or attached with a heat conducting medium, or may be fixed by welding, screwing, etc. However, this may vary depending on the actual implementation and is not limited thereby.
[0063] In summary, the utility model provides a power module with a three-layer circuit board vertical stacking structure that is different from the prior art, and combines the method of dispersing heating elements on different circuit boards and arranging heat conductive parts between circuit boards to achieve the effect that the power module occupies a small area and has high heat dissipation efficiency.
[0064] It should be noted that the above are only preferred embodiments for illustrating the present invention, and the present invention is not limited to the embodiments described. The scope of the present invention is determined by the appended claims. The present invention can be modified in various ways by those skilled in the art, but they are not beyond the protection of the appended claims.
Claims
1. A power module for supplying power to an electrical device, characterized in that: include: A first circuit board is provided with a heat dissipation component; A second circuit board is stacked and connected with the first circuit board, wherein the second circuit board is provided with at least one heating element, and the at least one heating element and the heat dissipation component are respectively located on surfaces of the second circuit board and the first circuit board that are opposite to each other; a third circuit board, stacked and connected with the second circuit board, and connected with the electrical device; as well as A heat conducting member, disposed between the first circuit board and the second circuit board, comprising: a first heat-conducting component extending in a direction perpendicular to the plane where the second circuit board is located and contacting the heat-dissipating component on the first circuit board; A second heat-conducting component extends in a direction parallel to the plane where the second circuit board is located and contacts at least one of the heating elements on the second circuit board; Wherein, the first heat conducting component and the second heat conducting component are connected to each other.
2. The power module according to claim 1, characterized in that: The projected area of the first heat-conducting component on the plane where the second circuit board is located is smaller than the projected area of the second heat-conducting component on the plane where the second circuit board is located.
3. The power module according to claim 1, characterized in that: The first heat conducting component is also in contact with the second circuit board.
4. The power module according to claim 1, characterized in that: The second heat conducting component is disposed on one side or both sides of the first heat conducting component.
5. The power module according to claim 3 or 4, characterized in that: The first heat conducting component and the second heat conducting component are integrally formed.
6. The power module according to claim 1, characterized in that: There are a plurality of heating elements, and the plurality of heating elements form at least one heat source matrix on the second circuit board, and the second heat conducting component is in contact with the heat source matrix.
7. The power module according to claim 1, characterized in that: The heat dissipation component includes a metal sheet.
8. The power module according to claim 1, characterized in that: The heat conducting member includes a metal heat conducting member or a non-metal heat conducting member.
9. The power module according to claim 1, characterized in that: The heating element includes a magnetic core or a power semiconductor switch.
10. The power module according to claim 1, characterized in that: A plurality of ball grid array package welding balls are arranged on the surface of the third circuit board opposite to the electric device so as to be electrically connected with the electric device.