Optical sensor and electronic device
By setting up light transmittance shielding layers outside the top layer or other surfaces of the optical sensor, and connecting the ground wire electrical connection with the substrate, the optical sensor is solved the problem of interference signals due to signal coupling, and the effect of improving the signal -to -noise ratio and performance.
Patent Information
- Application Number
- CN202420137559.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-19
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-01-19
AI Technical Summary
In electronic devices, optical sensors are easily coupled to the signal of the screen module, which can easily generate interference signals, affecting their signal acquisition performance.
The top layer or other surfaces except the bottom of the optical sensor is set up outside the surface of the substrate, and the light transmitting conductive shielding layer is set to shield the interference signal and connect to the ground wire of the substrate to increase the signal -to -noise ratio.
Effectively block the interference signals, ensure the transmission of environmental light, while improving the signal -to -noise ratio and overall performance of the optical sensor.
Smart Images
Figure CN222424614U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electronic technology, and more specifically, to an optical sensor and electronic equipment. Background Art
[0002] As electronic devices become thinner and lighter, the application of full screens and narrow bezels leaves less and less space for optical sensors, giving rise to products with under-screen ambient light sensors and proximity sensors. System integration also brings about signal interference between subsystems. The coupling of the electrical signal of the screen module with the optical sensor generates interference signals, which affects the signal acquisition of the optical sensor. Utility Model Content
[0003] In view of the deficiencies in the prior art, the utility model innovatively provides an optical sensor and an electronic device, in which a light-transmitting conductive shielding layer is arranged on the top layer of the optical sensor or other surfaces except the bottom of the substrate to shield interference signals, thereby ensuring the transmittance of ambient light while improving the signal-to-noise ratio and improving the performance of the optical sensor.
[0004] In order to achieve the above technical objectives, the utility model discloses an optical sensor in the first aspect, including a substrate, an optical sensor chip and a light-transmitting conductive shielding layer.
[0005] The optical sensor chip is disposed above the substrate and is electrically connected to the substrate.
[0006] The light-transmitting conductive shielding layer is arranged above the optical sensor chip and covers the substrate and the optical sensor chip, or the light-transmitting conductive shielding layer is arranged around and above the optical sensor chip and the substrate in a shell shape with an open bottom, and the light-transmitting conductive shielding layer is electrically connected to the ground wire of the substrate.
[0007] Furthermore, when the light-transmitting conductive shielding layer is arranged above the optical sensor chip and covers the substrate and the optical sensor chip, the light-transmitting conductive shielding layer is electrically connected to the ground wire of the substrate through a first connecting member, and two ends of the first connecting member are electrically connected to the light-transmitting conductive shielding layer and the substrate respectively.
[0008] Furthermore, the first connecting member is a circuit board, a conductive column or a first welding wire.
[0009] Furthermore, the circuit board is electrically connected to the substrate via a silver paste layer, a solder layer or a DAF film.
[0010] Furthermore, the conductive column is electrically connected to the substrate through a silver paste layer, a solder layer or a DAF film.
[0011] Furthermore, when the light-transmitting conductive shielding layer is arranged above the optical sensor chip and covers the substrate and the optical sensor chip, the light-transmitting conductive shielding layer is electrically connected to the ground wire of the substrate through a second connecting member, the second connecting member is a second welding wire, the second welding wire is bent, one end of the second welding wire is electrically connected to the substrate, and the bending part of the second welding wire is electrically connected to the light-transmitting conductive shielding layer.
[0012] Further, when the light-transmitting conductive shielding layer is in a shell shape with an open bottom, the light-transmitting conductive shielding layer is electrically connected to a side portion of the substrate.
[0013] Furthermore, the light-transmitting conductive shielding layer is formed on the substrate by sputtering, evaporation or printing.
[0014] Furthermore, the optical sensor chip is encapsulated with a transparent encapsulation layer, and the transparent encapsulation layer is arranged on the substrate and located between the optical sensor chip and the light-transmitting conductive shielding layer.
[0015] Furthermore, the optical sensor chip is fixedly connected to the substrate via a silver paste layer, a solder layer or a DAF film, and / or the optical sensor chip is electrically connected to the substrate via a third bonding wire.
[0016] Furthermore, it also includes a first chip, which is arranged above the substrate and electrically connected to the substrate. The first chip is one or more of a control chip, a light intensity sensing chip, and a color temperature sensing chip.
[0017] Furthermore, the first chip is fixedly connected to the substrate via a silver paste layer, a solder layer or a DAF film, and / or the first chip is electrically connected to the substrate via a fourth bonding wire.
[0018] In order to achieve the above technical purpose, the second aspect of the utility model discloses an electronic device, including the optical sensor described in the first aspect.
[0019] The beneficial effects of the utility model are:
[0020] The optical sensor of the utility model is provided with a light-transmitting conductive shielding layer on the top layer of the optical sensor or other surfaces except the bottom of the substrate to shield interference signals, thereby ensuring the transmittance of ambient light and improving the signal-to-noise ratio, thereby improving the performance of the optical sensor. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a side view of the optical sensor according to the first embodiment of the utility model.
[0022] Figure 2It is a side view of the optical sensor according to the second embodiment of the present utility model.
[0023] Figure 3 It is a side view of an optical sensor according to the third embodiment of the present utility model.
[0024] Figure 4 It is a side view of an optical sensor according to a fourth embodiment of the present utility model.
[0025] Figure 5 It is a longitudinal cross-sectional view of an optical sensor according to a fifth embodiment of the present utility model.
[0026] In the figure,
[0027] 1. Substrate; 2. Optical sensor chip; 3. Transparent conductive shielding layer; 4. First connecting piece; 41. Circuit board; 42. Conductive column; 43. First welding wire; 5. Second connecting piece; 51. Second welding wire; 6. Transparent encapsulation layer; 7. Silver paste layer, solder layer or DAF film; 8. Third welding wire; 9. First chip; 10. Fourth welding wire. DETAILED DESCRIPTION
[0028] The optical sensor and the electronic device provided by the utility model are explained and illustrated in detail below in conjunction with the drawings of the specification.
[0029] This embodiment specifically discloses an optical sensor, such as Figure 1-5 As shown, it includes a substrate 1, an optical sensor chip 2 and a light-transmitting conductive shielding layer 3. The optical sensor chip 2 is arranged above the substrate 1 and electrically connected to the substrate 1. Specifically, the optical sensor chip 2 is fixedly connected to the substrate 1 through a silver paste layer, a solder layer or a DAF film (Die Attach Film) 7, and / or the optical sensor chip 2 is electrically connected to the substrate 1 through a third welding wire 8, one end of the third welding wire 8 is electrically connected to the optical sensor chip 2, and the other end is electrically connected to the substrate 1. A circuit is arranged in the substrate 1, so that the substrate 1 serves as a carrier of the package and can be interconnected with external signals. The light-transmitting conductive shielding layer 3 is arranged above the optical sensor chip 2 and covers the substrate 1 and the optical sensor chip 2 (such as Figure 1-4 As shown), or the light-transmitting conductive shielding layer 3 is in the shape of a shell with an open bottom and is arranged around and above the optical sensor chip 2 and the substrate 1 (as shown Figure 5 As shown), the light-transmitting conductive shielding layer 3 is electrically connected to the ground line of the substrate 1.
[0030] The screen module above the optical sensor can generate interference signals to the upper surface of the entire optical sensor. Therefore, the light-transmitting conductive shielding layer 3 of the present application covers the upper surface of the entire substrate 1 and the optical sensor chip 2, that is, the light-transmitting conductive shielding layer 3 is set on the top layer of the optical sensor; or, the light-transmitting conductive shielding layer 3 is set on other surfaces of the optical sensor except the bottom of the substrate 1, and other components of the optical sensor are set in the light-transmitting conductive shielding layer 3, so as to improve the shielding capability, effectively shield the interference signals, ensure the transmittance of ambient light, and improve the signal-to-noise ratio, thereby improving the performance of the optical sensor.
[0031] Optionally, the light-transmitting conductive shielding layer 3 is formed by sputtering on the substrate, or by evaporating or printing. Preferably, the light-transmitting conductive shielding layer 3 is made of an organic or inorganic material with a light transmittance greater than 90%. More preferably, the material of the light-transmitting conductive shielding layer 3 includes at least one of indium tin oxide, indium zinc oxide, or nanosilver to meet the light transmittance requirement of the optical receiving area of the optical sensor chip 2.
[0032] In some embodiments, Figure 1-3 As shown, when the light-transmitting conductive shielding layer 3 is arranged above the optical sensor chip 2 and covers the substrate 1 and the optical sensor chip 2, the light-transmitting conductive shielding layer 3 is electrically connected to the ground wire of the substrate 1 through the first connecting member 4, and the two ends of the first connecting member 4 are electrically connected to the light-transmitting conductive shielding layer 3 and the substrate 1 respectively.
[0033] Optionally, the first connecting member 4 is a circuit board 41, a conductive column 42 or a first welding wire 43. Figure 1 As shown, the circuit board 41 can be arranged perpendicular to the substrate 1, or the circuit board 41 can be arranged obliquely, and the two ends of the circuit board 41 are electrically connected to the light-transmitting conductive shielding layer 3 and the substrate 1 respectively. Specifically, the circuit board 41 is electrically connected to the substrate 1 through a silver paste layer, a solder layer or a DAF film 7, and a silver paste layer, a solder layer or a DAF film 7 is provided between the bottom end of the circuit board 41 and the upper surface of the substrate 1 to realize the electrical connection between the circuit board 41 and the circuit inside the substrate 1, and then realize the electrical connection with the ground wire of the substrate 1; the circuit board 41 can be a printed circuit board, a flexible circuit board or other circuit boards with conductive lines. Figure 2 As shown, the conductive column 42 can be arranged perpendicular to the substrate 1, or it can be arranged obliquely. The two ends of the conductive column 42 are electrically connected to the transparent conductive shielding layer 3 and the substrate 1 respectively. Specifically, the conductive column 42 is electrically connected to the substrate 1 through a silver paste layer, a solder layer or a DAF film 7. A silver paste layer, a solder layer or a DAF film 7 is provided between the bottom end of the conductive column 42 and the upper surface of the substrate 1 to realize the electrical connection between the conductive column 42 and the circuit inside the substrate 1, and then realize the electrical connection with the ground wire of the substrate 1; preferably, the conductive column 42 is a metal column, and more preferably a copper column. Figure 3As shown, the two ends of the first welding wire 43 are electrically connected to the light-transmitting conductive shielding layer 3 and the substrate 1 respectively, the top of the first welding wire 43 is electrically connected to the light-transmitting conductive shielding layer 3, and the bottom of the first welding wire 43 is electrically connected to the circuit inside the substrate 1, thereby realizing electrical connection with the ground wire of the substrate 1; the wire diameter of the first welding wire 43 can be larger than the third welding wire 8, and the material can be the same as or different from the third welding wire 8. The first connecting member 4 is a circuit board 41, a conductive column 42 or a first welding wire 43, which is convenient to obtain materials and has a simple packaging process.
[0034] In other embodiments, Figure 4 As shown, when the light-transmitting conductive shielding layer 3 is arranged above the optical sensor chip 2 and covers the substrate 1 and the optical sensor chip 2, the light-transmitting conductive shielding layer 3 is electrically connected to the ground wire of the substrate 1 through the second connecting member 5. The second connecting member 5 is a second welding wire 51. The second welding wire 51 is bent. One end of the second welding wire 51 is electrically connected to the substrate 1, and the bending part of the second welding wire 51 is electrically connected to the light-transmitting conductive shielding layer 3. Optionally, the other end of the second welding wire 51 can be used as a free end and not connected to any component; optionally, the other end of the second welding wire 51 can also be electrically connected to the substrate 1. Figure 4 As shown, the second welding wire 51 is bent into a U-shape, and the top bending part of the second welding wire 51 is electrically connected to the light-transmitting conductive shielding layer 3. The bending part of the second welding wire 51 is electrically connected to the light-transmitting conductive shielding layer 3, which can increase the contact area with the light-transmitting conductive shielding layer 3 and ensure the reliability of the connection. The wire diameter and material of the second welding wire 51 can be the same as those of the third welding wire 8, reducing the material selection process.
[0035] In other embodiments, Figure 5 As shown, when the light-transmitting conductive shielding layer 3 is in the shape of a shell with an opening at the bottom, the light-transmitting conductive shielding layer 3 is arranged around and above the optical sensor chip 2 and the substrate 1, and the side of the light-transmitting conductive shielding layer 3 is electrically connected to the side of the substrate 1, so as to realize the electrical connection between the light-transmitting conductive shielding layer 3 and the internal circuit of the substrate 1, and then realize the electrical connection with the ground line of the substrate 1. No additional connector is required, which reduces the processing steps and reduces the cost.
[0036] Optional, such as Figure 1-5As shown, the optical sensor chip 2 is encapsulated with a transparent encapsulation layer 6, and the transparent encapsulation layer 6 seals and protects the optical sensor chip 2. Preferably, the transparent encapsulation layer 6 is an EMC (Epoxy Molding Compound) layer, and the transparent encapsulation layer 6 is arranged on the substrate 1, and the bottom is fixedly connected to the upper surface of the substrate 1, and the transparent encapsulation layer 6 is located between the optical sensor chip 2 and the light-transmitting conductive shielding layer 3. Preferably, the transparent encapsulation layer 6 encapsulates other components on the substrate 1 together, that is, the optical sensor chip 2, the third welding wire 8 and the circuit board 41 are encapsulated together, or the optical sensor chip 2, the third welding wire 8 and the conductive column 42 are encapsulated together, or the optical sensor chip 2, the third welding wire 8 and the first welding wire 43 are encapsulated together, or the optical sensor chip 2, the third welding wire 8 and the second welding wire 51 are encapsulated together. When the transparent encapsulation layer 6 encapsulates the second welding wire 51, the portion where the second welding wire 51 is connected to the light-transmitting conductive shielding layer 3 is exposed on the top thereof by laser or cutting. The transparent encapsulation layer 6 is arranged between the optical sensor chip 2 and the light-transmitting conductive shielding layer 3. When the light-transmitting conductive shielding layer 3 is arranged above the optical sensor chip 2 and covers the substrate 1 and the optical sensor chip 2, the transparent encapsulation layer 6 serves as a substrate, and the light-transmitting conductive shielding layer 3 is formed on the upper surface of the transparent encapsulation layer 6 by sputtering, evaporation or printing. When the light-transmitting conductive shielding layer 3 is arranged in a shell shape with an open bottom around and above the optical sensor chip 2 and the substrate 1, the transparent encapsulation layer 6 is also arranged in the light-transmitting conductive shielding layer 3, and the light-transmitting conductive shielding layer 3 is formed on the upper surface of the transparent encapsulation layer 6, the side of the transparent encapsulation layer 6 and the side of the substrate 1 by sputtering, evaporation or printing.
[0037] In some embodiments, the optical sensor of the present application further includes a first chip 9, which is arranged above the substrate 1 and electrically connected to the substrate 1. The first chip 9 is one or more of a control chip, a light intensity sensing chip, and a color temperature sensing chip. The specific type of the first chip 9 is adaptively selected according to the application scenario requirements. The first chip 9 is fixedly connected to the substrate 1 through a silver paste layer, a solder layer or a DAF film 7, and / or the first chip 9 is electrically connected to the substrate 1 through a fourth welding wire 10, and the fourth welding wire 10 can use the same wire diameter and material as the third welding wire 8. The first chip 9 is also encapsulated in the transparent encapsulation layer 6. When the light-transmitting conductive shielding layer 3 is arranged above the optical sensor chip 2 and covers the substrate 1 and the optical sensor chip 2, the light-transmitting conductive shielding layer 3 can extend to the top of the first chip 9 and cover the first chip 9; when the light-transmitting conductive shielding layer 3 is arranged in a shell shape with a bottom opening around and above the optical sensor chip 2 and the substrate 1, the light-transmitting conductive shielding layer 3 also sets the first chip 9 inside.
[0038] The present application integrates a light-transmitting conductive shielding layer 3 which plays a signal shielding role on the optical sensor, which can effectively reduce the signal interference of the screen module on the optical sensor, improve the signal-to-noise ratio of the optical sensor while ensuring the transmittance, and improve the performance of the optical sensor; there is no need to add an additional shielding layer between the optical sensor and the screen, thereby reducing costs.
[0039] The light-transmitting conductive shielding layer 3 of the present application can be arranged on the top layer of the optical sensor or on other surfaces except the bottom surface of the substrate 1, which can be flexibly selected according to the specific application scenario of the optical sensor, and can effectively control the cost and improve the performance of the optical sensor.
[0040] The optical sensor disclosed in this application can be applied to all products involving optical sensors, such as under-screen proximity sensors, ambient light sensors, color temperature sensors and other optical sensor products.
[0041] The present application also discloses an electronic device, including the optical sensor described in the above embodiment. The electronic device is an electronic device with a display screen, which can be a laptop, a mobile phone, a tablet computer, a desktop computer, a gaming device, an in-vehicle electronic device, a wearable smart device, etc.
[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0043] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0044] In the description of this specification, the description with reference to the terms "this embodiment", "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any at least one embodiment or example. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement and simple improvement made to the essential content of the present invention shall be included in the protection scope of the present invention.
Claims
1. An optical sensor, characterized in that: It comprises a substrate (1), an optical sensor chip (2) and a light-transmitting conductive shielding layer (3). The optical sensor chip (2) is arranged above the substrate (1) and is electrically connected to the substrate (1). The light-transmitting conductive shielding layer (3) is arranged above the optical sensor chip (2) and covers the substrate (1) and the optical sensor chip (2), or the light-transmitting conductive shielding layer (3) is arranged around and above the optical sensor chip (2) and the substrate (1) in the shape of a shell with an open bottom, and the light-transmitting conductive shielding layer (3) is electrically connected to the ground wire of the substrate (1).
2. The optical sensor according to claim 1, characterized in that When the light-transmitting conductive shielding layer (3) is arranged above the optical sensor chip (2) and covers the substrate (1) and the optical sensor chip (2), the light-transmitting conductive shielding layer (3) is electrically connected to the ground wire of the substrate (1) via a first connecting member (4), and two ends of the first connecting member (4) are electrically connected to the light-transmitting conductive shielding layer (3) and the substrate (1), respectively.
3. The optical sensor according to claim 2, characterized in that The first connecting member (4) is one of a circuit board (41), a conductive column (42) or a first welding wire (43).
4. The optical sensor according to claim 3, characterized in that The circuit board (41) is electrically connected to the substrate (1) via one of a silver paste layer, a solder layer or a DAF film (7).
5. The optical sensor according to claim 3, characterized in that The conductive column (42) is electrically connected to the substrate (1) via one of a silver paste layer, a solder layer or a DAF film (7).
6. The optical sensor according to claim 1, characterized in that When the light-transmitting conductive shielding layer (3) is arranged above the optical sensor chip (2) and covers the substrate (1) and the optical sensor chip (2), the light-transmitting conductive shielding layer (3) is electrically connected to the ground wire of the substrate (1) via a second connecting member (5); the second connecting member (5) is a second welding wire (51); the second welding wire (51) is bent; one end of the second welding wire (51) is electrically connected to the substrate (1); and the bent portion of the second welding wire (51) is electrically connected to the light-transmitting conductive shielding layer (3).
7. The optical sensor according to claim 1, characterized in that When the light-transmitting conductive shielding layer (3) is in the shape of a shell with an open bottom, the light-transmitting conductive shielding layer (3) is electrically connected to the side of the substrate (1).
8. The optical sensor according to claim 1, characterized in that The light-transmitting conductive shielding layer (3) is formed on a substrate by sputtering, evaporation or printing to form an electric shielding layer.
9. The optical sensor according to any one of claims 1 to 8, characterized in that: The optical sensor chip (2) is encapsulated with a transparent encapsulation layer (6), and the transparent encapsulation layer (6) is arranged on the substrate (1) and located between the optical sensor chip (2) and the light-transmitting conductive shielding layer (3).
10. The optical sensor according to claim 1, characterized in that The optical sensor chip (2) is fixedly connected to the substrate (1) via one of a silver paste layer, a solder layer or a DAF film (7), and / or the optical sensor chip (2) is electrically connected to the substrate (1) via a third welding wire (8).
11. The optical sensor according to claim 1, characterized in that It also includes a first chip (9), which is arranged above the substrate (1) and electrically connected to the substrate (1), and the first chip (9) is one or more of a control chip, a light intensity sensing chip, and a color temperature sensing chip.
12. The optical sensor according to claim 11, characterized in that The first chip (9) is fixedly connected to the substrate (1) via one of a silver paste layer, a solder layer or a DAF film (7), and / or the first chip (9) is electrically connected to the substrate (1) via a fourth bonding wire (10).
13. An electronic device, characterized in that: The optical sensor comprises the optical sensor according to any one of claims 1 to 12.