Packaging structure of perovskite battery assembly

Abstract

The utility model belongs to the technical field of perovskite solar cell packaging, and particularly discloses a packaging structure of a perovskite cell module, which sequentially comprises a substrate, a transparent conductive layer, a perovskite functional layer, a packaging module and a packaging cover plate from bottom to top, the packaging assembly comprises a first packaging adhesive, a buffer structure adhesive and a second packaging adhesive which are different in viscosity; wherein the first packaging adhesive is arranged between the transparent conductive layer and the packaging cover plate and forms a sealed space, the perovskite functional layer is covered with the passivation layer, and the perovskite functional layer and the passivation layer are both located in the sealed space; the buffer structural adhesive and the second packaging adhesive are filled in the residual sealing space, and the buffer structural adhesive is located between the passivation layer and the first packaging adhesive. According to the utility model, the corrosion of water and oxygen to the perovskite functional layer can be effectively blocked through multiple sealing barriers, and meanwhile, by adding the buffer structural adhesive, not only is the selection range of materials of the packaging assembly enlarged, but also the sealing effect of the packaging assembly is improved, so that the service life of the cell is greatly prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of perovskite solar cell packaging, and in particular relates to a packaging structure of a perovskite battery component. Background Art

[0002] As the global ecological environment and energy shortage problems become increasingly serious, clean and renewable energy has attracted more and more attention from the world, especially solar photovoltaic technology, which is the frontier field of renewable energy development. Since the first report in 2009, the photoelectric conversion efficiency of perovskite solar cells has been increasing year by year, and has now exceeded 25%. In addition, due to its low manufacturing cost and excellent photoelectric performance, it has shown great commercial potential. However, if large-scale production and commercial application are to be achieved, there are still many difficulties to overcome. Among the various influencing factors, moisture is considered to be one of the biggest challenges. The high hydrophilicity of perovskite makes it easy for the material to absorb moisture from the surrounding environment and induce the formation of hydrate products, thereby affecting the photoelectric conversion efficiency and destroying the long-term stability of perovskite cells. Therefore, in order to ensure that the battery components can operate stably in various outdoor environments (sun, rain, etc.) for a long time, the packaging of the battery components becomes particularly important.

[0003] At present, the packaging technology of perovskite battery components is still immature. The common method is to use glass cover plates on the top and bottom, melt the organic packaging film in the middle, and apply packaging glue on the edge, which is similar to the packaging of silicon battery components. However, since the requirements of perovskite batteries for water vapor permeation are higher than those of silicon battery components, under this packaging method, as water vapor permeation accumulates, the outdoor working life of perovskite batteries will be greatly reduced. In addition, this packaging method still has certain process problems: for example, after the packaging glue is applied, if too much pressure is applied during the pressing process of the two substrates, the packaging will fail; if the pressure is too small, bubbles will be generated in the gaps and corners, and effective contact will not be achieved, affecting the packaging performance, and it is impossible to achieve sufficient defect-free contact between the substrate and the package.

[0004] In view of this, this utility model is proposed. Utility Model Content

[0005] The purpose of the utility model is to overcome the shortcomings of the above-mentioned prior art and provide a packaging structure of a perovskite battery assembly, which is mainly used to improve the stability of the perovskite battery assembly, thereby extending the service life of the perovskite battery and laying the foundation for large-scale production and commercial application.

[0006] The purpose of the utility model is to solve the problem through the following technical solutions:

[0007] The utility model provides a packaging structure of a perovskite battery component, comprising a substrate, a transparent conductive layer, a perovskite functional layer, a packaging component and a packaging cover plate stacked in sequence from bottom to top, wherein the packaging component comprises a first packaging glue, a buffer structure glue and a second packaging glue, and the first packaging glue, the buffer structure glue and the second packaging glue all use resins with different viscosities;

[0008] The first packaging glue is arranged at the edge between the transparent conductive layer and the packaging cover plate, and is bonded to the two to form a sealed space, the upper surface and surrounding of the perovskite functional layer are covered with a passivation layer, the lower surfaces of the perovskite functional layer and the passivation layer are in contact with the upper surface of the transparent conductive layer, and the perovskite functional layer and the passivation layer are both located in the sealed space;

[0009] The buffer structure glue and the second packaging glue are both filled in the remaining sealed space. The buffer structure glue is composed of a plurality of buffer colloids arranged at intervals, and the shape of a circle formed by the plurality of buffer colloids is the same as the shape of the first packaging glue. The buffer structure glue is located between the passivation layer and the first packaging glue.

[0010] Furthermore, the viscosity of the buffer structure glue is between the viscosity of the first packaging glue and the viscosity of the second packaging glue, and the viscosity of the first packaging glue is greater than the viscosity of the second packaging glue.

[0011] Furthermore, the viscosity of the first packaging glue is greater than or equal to 40 cps and less than or equal to 10000 cps, and the viscosity of the second packaging glue is greater than or equal to 10 cps and less than 10000 cps. Preferably, the viscosity of the buffer structure glue is greater than 10 cps and less than or equal to 100 cps.

[0012] It should be noted that the viscosities of the first packaging glue, the buffer structural glue and the second packaging glue can be selected according to actual packaging requirements. For example, the viscosity of the first packaging glue is 40cps, 60cps, 80cps, 100cps, 300cps, 500ps, 1000cps, 3000cps, 5000cps, 8000cps, 10000cps and the like, which are not listed one by one; the viscosity of the second packaging glue is 10cps, 20cps, 40cps, 60cps, 80cps, 200cps, 400ps, 900cps, 2000cps, 4000cps, 7000cps, 9000cps and the like, which are not listed one by one; the viscosity of the buffer structural glue can be 15cps, 20cps, 30cps, 50cps, 80cps, 100cps and the like, which are not listed one by one.

[0013] Furthermore, the thickness of the buffer structure adhesive is smaller than the thickness of the first packaging adhesive.

[0014] Furthermore, the thickness of the first encapsulation glue and the second encapsulation glue is greater than 5μm and less than or equal to 100μm, and the thickness of the buffer structure glue is greater than or equal to 5μm and less than or equal to 50μm. Preferably, the optional thickness of the first encapsulation glue and the second encapsulation glue is 6μm, 10μm, 20μm, 40μm, 80μm, 100μm, etc., which are not listed one by one; the optional thickness of the buffer structure glue is 5μm, 8μm, 15μm, 30μm, 40μm, 50μm, etc., which are not listed one by one.

[0015] Furthermore, the first packaging glue is epoxy resin, the buffer structure glue is epoxy resin or acrylic resin, the second packaging glue is acrylic resin, and the first packaging glue, the buffer structure glue and the second packaging glue are all made by thermal curing or UV curing.

[0016] It should be noted that the buffer structure adhesive of the utility model is formed by a curable resin, and the surface of the resin still has a certain viscosity after the curing treatment, that is, the buffer structure adhesive is in a gel-like state with a certain viscosity after curing. Therefore, on the one hand, the transition from the high viscosity of the first encapsulation adhesive to the low viscosity of the second encapsulation adhesive can be achieved in terms of viscosity, and the three materials that meet the above viscosity relationship make the preparation process easier to achieve; on the other hand, when the three materials are cured during the preparation process, the first encapsulation adhesive and the second encapsulation adhesive are both hardened, and the buffer structure adhesive does not harden. The buffer structure adhesive can use its own viscosity to alleviate the impact of the second encapsulation adhesive and the deformation of the second encapsulation adhesive during curing, that is, the buffer structure adhesive can play a buffering role in the curing of the first encapsulation adhesive and the second encapsulation adhesive materials, so as to ensure the stability of the morphology of the first encapsulation adhesive, and alleviate the problems of bubbles, uneven edges and impact at the junction of the first encapsulation adhesive and the second encapsulation adhesive. In addition, the addition of the buffer structure adhesive can narrow the viscosity gap between the first encapsulation adhesive and the second encapsulation adhesive in material selection, increase the viscosity selection range of the first encapsulation adhesive material and the second encapsulation adhesive material, and make the first encapsulation adhesive material and the second encapsulation adhesive material easier to match.

[0017] Furthermore, the buffer structural adhesive is in the shape of a rectangle, which is composed of multiple first buffer colloids and four second buffer colloids. Each of the second buffer colloids is "L"-shaped and is respectively arranged at the four corners of the rectangle. Multiple first buffer colloids are arranged in rows or columns with spacing between two adjacent second buffer colloids.

[0018] Furthermore, the material of the passivation layer is one of silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide, and the thickness of the passivation layer is 50 nm to 2 μm.

[0019] Furthermore, the perovskite functional layer includes a hole transport layer, a perovskite light absorption layer, an electron transport layer and a back electrode layer stacked in sequence from bottom to top, the lower surface of the hole transport layer is in contact with the upper surface of the transparent conductive layer, and the upper surface of the back electrode layer is in contact with the inner top surface of the passivation layer;

[0020] Alternatively, the perovskite functional layer includes an electron transport layer, a perovskite light absorption layer, a hole transport layer and a back electrode layer stacked in sequence from bottom to top, the lower surface of the electron transport layer contacts the upper surface of the transparent conductive layer, and the upper surface of the back electrode layer contacts the top surface of the passivation layer.

[0021] Furthermore, the substrate and the package cover are made of any one of ultra-clear glass, tempered glass, stainless steel, metal foil, polyethylene terephthalate or polyethylene naphthalate, and polyimide.

[0022] Compared with the prior art, the utility model has the following beneficial effects:

[0023] The packaging structure provided by the utility model has a first barrier formed by a first packaging glue, a second barrier formed by a buffer structure glue and a second packaging glue, and a third barrier formed by a passivation layer between the transparent conductive layer and the packaging cover plate. The three barriers can be superimposed to seal and protect the perovskite functional layer, so that the perovskite functional layer is completely sealed, which can effectively block the corrosion of water and oxygen in the environment to the perovskite functional layer, thereby improving the service life of the battery; in addition, in the utility model, the viscosity of the first packaging glue is greater than the viscosity of the second packaging glue, and a buffer structure glue with a viscosity between the two is also provided, which has the following advantages:

[0024] First, it can ensure the stability of the morphology of the first encapsulation glue, effectively alleviate the problems of bubbles, uneven edges and glue punching at the junction of the first encapsulation glue and the second encapsulation glue, and improve the sealing effect of the package assembly;

[0025] Second, it is conducive to the coating of the fluid encapsulation layer, which can effectively reduce the uniformity and cracking problems of the later materials, so that the battery can operate stably and reliably for a long time, further improving the service life of the battery;

[0026] Third, the viscosity difference between the first packaging glue and the second packaging glue in material selection can be narrowed, and the viscosity selection range of the first packaging glue material and the second packaging glue material can be expanded, so that the first packaging glue material and the second packaging glue material are easier to match. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings herein are incorporated into and constitute a part of this specification, and together with the description, are used to explain the principles of the present utility model.

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 It is a schematic cross-sectional structure diagram of the packaging structure of the perovskite battery assembly of the utility model;

[0030] Figure 2 It is a schematic cross-sectional structure diagram of another packaging structure of a perovskite battery assembly of the utility model;

[0031] Figure 3 It is a schematic diagram of the top view structure of the packaging component of the utility model.

[0032] in:

[0033] 1 is a substrate;

[0034] 2 is a transparent conductive layer;

[0035] 3 is a perovskite functional layer; 31 is an electron transport layer; 32 is a perovskite light absorption layer; 33 is a hole transport layer; 34 is a back electrode layer;

[0036] 4 is a passivation layer;

[0037] 5 is a packaging component; 51 is a first packaging glue; 52 is a buffer structure glue; 53 is a second packaging glue; 52-1 is a first buffer colloid; 52-2 is a second buffer colloid;

[0038] 6 is a packaging cover. DETAILED DESCRIPTION

[0039] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the utility model. Instead, they are only examples consistent with some aspects of the utility model described in detail in the attached claims.

[0040] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0041] Example 1

[0042] See also Figures 1 to 3An embodiment of the utility model provides a packaging structure of a perovskite battery component, including a substrate 1, a transparent conductive layer 2, a perovskite functional layer 3, a packaging component 5 and a packaging cover plate 6 stacked in sequence from bottom to top, the packaging component 5 includes a first packaging glue 51, a buffer structure glue 52 and a second packaging glue 53, and the first packaging glue 51, the buffer structure glue 52 and the second packaging glue 53 are all made of resins with different viscosities. Among them, the first packaging glue 51 is arranged at the edge between the transparent conductive layer 2 and the packaging cover plate 6, and is bonded to the transparent conductive layer 2 and the packaging cover plate 6 to form a sealed space. The upper surface and surrounding areas of the perovskite functional layer 3 are covered with a passivation layer 4. The lower surfaces of the perovskite functional layer 3 and the passivation layer 4 are in contact with the upper surface of the transparent conductive layer 2, and the perovskite functional layer 3 and the passivation layer 4 are both located in the sealed space; the buffer structure glue 52 and the second packaging glue 53 are both filled in the remaining sealed space (that is, the space formed by the upper surface of the transparent conductive layer 2, the upper surface and surrounding areas of the passivation layer 4, the inner surface of the first packaging glue 51 and the lower surface of the packaging cover plate 6), the buffer structure glue 52 is composed of a plurality of buffer colloids arranged at intervals, and the shape of a circle formed by the plurality of buffer colloids is the same as the shape of the first packaging glue 51, and the buffer structure glue 52 is located between the passivation layer 4 and the first packaging glue 51. Preferably, the buffer structure glue 52 is located in the middle of the two, that is, there is a gap with both.

[0043] In the present invention, the viscosity of the buffer structure glue 52 is between the viscosity of the first packaging glue 51 and the viscosity of the second packaging glue 53, and the viscosity of the first packaging glue 51 is greater than the viscosity of the second packaging glue 53, and the thickness of the buffer structure glue 52 should be less than the thickness of the first packaging glue 51. Such a setting is conducive to the coating of the fluid packaging layer, which can effectively reduce the uniformity of the later materials and other cracking problems, so that the battery can operate stably and reliably for a long time.

[0044] Furthermore, when applying the first packaging glue 51, the buffer structure glue 52 and the second packaging glue 53, they can be applied in corresponding shapes in corresponding areas. Among them, since the first packaging glue 51 is formed around the edge of the transparent conductive layer 2, and the transparent conductive layer 2 is rectangular in this embodiment, the first packaging glue 51 is in the shape of a rectangular frame as a whole in this embodiment.

[0045] Specifically, in the present invention, the viscosity of the first packaging glue 51 is greater than or equal to 40cps and less than or equal to 10000cps, and the viscosity of the second packaging glue 53 is greater than or equal to 10cps and less than 10000cps; at the same time, the thickness of the first packaging glue 51 and the second packaging glue 53 are both greater than 5μm and less than or equal to 100μm, and the thickness of the buffer structure glue 52 is greater than or equal to 5μm and less than or equal to 50μm. The viscosity and thickness of the above three glues are selected and used according to actual conditions while meeting the above conditions. It should be noted that the specific viscosity of the buffer structural glue 52 is not particularly limited in the present invention, as long as its viscosity is between the viscosity of the first packaging glue 51 and the second packaging glue 53, the technical personnel in this field can set it according to the actual situation. Preferably, the viscosity of the buffer structural glue 52 is greater than 10cps and less than or equal to 100cps; the setting of the buffer structural glue 52 can achieve a transition from low viscosity to high viscosity, increase the viscosity selection range of the first packaging glue 51 material and the second packaging glue 53 material, and make the two materials easier to match; at the same time, since the buffer structural glue 52 has a higher viscosity than the second packaging glue 53, it is beneficial to reduce the glue rushing phenomenon when the second packaging glue 53 flows to the first packaging glue 51 again, which can further improve the stability of the morphology of the first packaging glue 51 and improve the sealing effect of the packaging component 5.

[0046] It can be seen from the above settings that the utility model is provided with a triple sealing protection barrier outside the perovskite functional layer 3, so as to completely seal the perovskite functional layer 3, and then can effectively block the corrosion of the perovskite functional layer 3 by water and oxygen in the environment, thereby improving the service life of the battery. Specifically, the triple sealing protection barrier includes: the outermost layer is the first sealing protection barrier formed by bonding and fixing the packaging cover plate 6 and the transparent conductive layer 2 together by the first packaging glue 51; the innermost layer is the passivation layer 4 directly covering the outer surface of the perovskite functional layer 3, forming the third sealing protection barrier; the middle layer is the buffer structure glue 52 and the second packaging glue 53 filled between the passivation layer 4 and the first packaging glue 51, forming the second sealing protection barrier. Among them, in addition to serving as a sealing protection barrier, the passivation layer 4 can also prevent the second packaging glue 53 from directly contacting the perovskite functional layer 3, thereby affecting the working performance of the perovskite solar cell; in addition, the addition of the buffer structural glue 52 can buffer the curing of the first packaging glue 51 and the second packaging glue 53 materials, so as to ensure the stability of the morphology of the first packaging glue 51 and alleviate the problems of bubbles, uneven edges and glue punching at the junction of the first packaging glue 51 and the second packaging glue 53.

[0047] Preferably, the first encapsulation glue 51 is epoxy resin, the buffer structure glue 52 is epoxy resin or acrylic resin, the second encapsulation glue 53 is acrylic resin, and the first encapsulation glue 51, the buffer structure glue 52 and the second encapsulation glue 53 are all made by thermal curing or UV curing. Specifically, it is applied to the substrate by inkjet printing, spraying, roller coating, scraper coating, screen printing, dispensing machine dispensing, coating machine coating or spin coating, and then a polymer film is formed by heating or ultraviolet exposure curing, which can be selected according to specific circumstances. The temperature when thermal curing is used can be between 50°C and 100°C. The specific temperature value is determined according to the viscosity and specific composition of the first encapsulation glue 51 and the second encapsulation glue 53, but the temperature should not exceed 100°C to avoid adverse effects on the process.

[0048] In this embodiment, since the viscosity of the first encapsulation glue 51 is greater than the viscosity of the second encapsulation glue 53, the second encapsulation glue 53 is coated by inkjet printing to improve the preparation quality of the second encapsulation glue 53. It should be noted that it is not suitable to adopt the natural curing method. Since most encapsulation materials have a long curing time, the perovskite solar cell is easily accelerated to oxidize or enter dust when exposed to the air for a long time, affecting the product quality. The advantage of adopting the above structure and process is that it can solve the problem that the three-dimensional network structure formed by the traditional encapsulation layer after curing and cross-linking easily generates large internal stress, causing the encapsulation glue to crack and become brittle, thereby resulting in a decrease in sealing performance, thereby improving the service life of the perovskite solar cell.

[0049] like Figure 3 As shown, the shape of the buffer structure glue 52 in the embodiment of the utility model and the shape of the first packaging glue 51 are both rectangular. Among them, the buffer structure glue 52 is composed of multiple first buffer colloids 52-1 and four second buffer colloids 52-2, each of the second buffer colloids 52-2 is right-angled, that is, "L"-shaped, and is arranged at the four corners of the rectangle, and multiple first buffer colloids 52-1 are arranged in rows or columns between two adjacent "L"-shaped second buffer colloids 52-2. Through such an arrangement, not only can the diffusion speed of the second packaging glue 53 to the first packaging glue 51 be slowed down, but also the diffusion speed of the second packaging glue 53 in multiple directions can be made the same, and the diffusion speed at the four corners is also effectively buffered, so that there are no bubbles when the second packaging glue 53 is in full contact with the first packaging glue 51, and the first packaging glue 51 will not be washed away, so that the packaging effect of the packaging component 5 is better.

[0050] The utility model does not impose any restriction on the specific shape of the first packaging glue 51, as long as the first packaging glue 51 can be connected between the transparent conductive layer 2 and the packaging cover plate 6 to form a sealed space, and the sealed space can completely accommodate the perovskite functional layer 3 arranged on the upper surface of the transparent conductive layer 2. Usually, since the perovskite functional layer 3 is generally rectangular, the first packaging glue 51 as a whole is generally a rectangular frame.

[0051] Specifically, the material of the substrate 1 and the packaging cover plate 6 in the utility model includes any one of ultra-white glass plate, tempered glass plate, stainless steel plate, metal foil, polyethylene terephthalate plate or polyethylene naphthalate plate, and polyimide, which can be selected according to different perovskite solar cells.

[0052] The material of the transparent conductive layer 2 in the utility model includes one or more of indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), indium-doped zinc oxide (IZO), fluorine-doped tin oxide (FTO), indium tungsten oxide (IWO), indium cerium oxide (ICO), and Ag nanowires, and the thickness of the transparent conductive layer 2 is generally set to 80nm to 400nm.

[0053] The perovskite functional layer 3 in the utility model comprises a hole transport layer 33, a perovskite light absorption layer 32, an electron transport layer 31 and a back electrode layer 34 which are stacked in sequence from bottom to top. The lower surface of the hole transport layer 33 contacts the upper surface of the transparent conductive layer 2, and the upper surface of the back electrode layer 34 contacts the inner top surface of the passivation layer 4, forming a positive perovskite solar cell such as Figure 1 As shown; or the electron transport layer 31 and the hole transport layer 33 are interchanged to form a positive perovskite solar cell, such as Figure 2 shown.

[0054] Furthermore, the material of the electron transport layer 31 includes TiO2, SnO2, ZnO2, IZO, WO3, Nb2O5, C 60 , PCBM fullerene and derivatives, BaSnO3 or AZO, the thickness of the electron transport layer 31 is 5nm to 100nm; the material of the perovskite light absorption layer 32 is a narrow bandgap perovskite light-absorbing material, including a halide crystal with an ABX3 structure; wherein A is at least one of methylamine, guanidine, and cesium, B is any one of Sn, Bi, Sb, Ge, Cu or Pb ions, and X is at least one of halogen F, Cl, Br, and I. The thickness of the perovskite light absorption layer 32 is 80nm to 500nm; the material of the hole transport layer 33 includes any one of NiOx, MoS, MoO, CuS, CuSCN, PTAA, PEDOT or Spiro-MeOTAD, or a combination of at least two of them. Typical but non-limiting combinations include NiO xand MoS; the material of the back electrode layer 34 includes any one or a combination of at least two of Au, Ag, Cu, Al, Cr, Mo, carbon material, fluorine-doped tin oxide, indium-doped tin oxide, aluminum-doped zinc oxide, boron-doped zinc oxide or aluminum-doped tin oxide.

[0055] The material of the passivation layer 4 in the utility model is one of silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide, and its thickness is generally set to 50nm to 2μm, and the specific thickness is determined according to the actual situation. The purpose of setting the passivation layer 4 is to further enhance the barrier effect against water vapor, and at the same time, it can also provide a flat surface for subsequent film formation to prevent defect expansion.

[0056] In some applications, the passivation layer 4 may be an organic passivation layer. The material used to prepare the organic passivation layer includes any one of arylene diamine derivatives, carbazole derivatives (derivatives containing carbazole groups and heterocyclic groups bonded to carbazole groups), phosphorus-oxy derivatives and quinolinone derivatives.

[0057] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0058] It should be understood that the present invention is not limited to the above-described contents, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A packaging structure of a perovskite battery assembly, comprising a substrate (1), a transparent conductive layer (2), a perovskite functional layer (3), a packaging assembly (5) and a packaging cover plate (6) stacked in sequence from bottom to top, characterized in that: The packaging component (5) comprises a first packaging glue (51), a buffer structure glue (52) and a second packaging glue (53); the first packaging glue (51), the buffer structure glue (52) and the second packaging glue (53) are all made of resin, and the viscosity of the buffer structure glue (52) is between the viscosity of the first packaging glue (51) and the viscosity of the second packaging glue (53); the viscosity of the first packaging glue (51) is greater than the viscosity of the second packaging glue (53); The first packaging glue (51) is arranged at the edge between the transparent conductive layer (2) and the packaging cover plate (6), and is bonded to the two to form a sealed space; the upper surface and surrounding areas of the perovskite functional layer (3) are covered with a passivation layer (4); the lower surfaces of the perovskite functional layer (3) and the passivation layer (4) are in contact with the upper surface of the transparent conductive layer (2), and the perovskite functional layer (3) and the passivation layer (4) are both located in the sealed space; The buffer structure glue (52) and the second packaging glue (53) are both filled in the remaining sealed space. The buffer structure glue (52) is composed of a plurality of buffer colloids arranged at intervals, and the shape of a circle formed by the plurality of buffer colloids is the same as the shape of the first packaging glue (51). The buffer structure glue (52) is located between the passivation layer (4) and the first packaging glue (51).

2. The packaging structure of the perovskite battery assembly according to claim 1, characterized in that: The viscosity of the first packaging glue (51) is greater than or equal to 40 cps and less than or equal to 10,000 cps, and the viscosity of the second packaging glue (53) is greater than or equal to 10 cps and less than 10,000 cps.

3. The packaging structure of the perovskite battery assembly according to claim 1, characterized in that: The thickness of the buffer structure adhesive (52) is smaller than the thickness of the first packaging adhesive (51).

4. The packaging structure of the perovskite battery assembly according to claim 3, characterized in that: The thickness of the first packaging glue (51) and the second packaging glue (53) are both greater than 5 μm and less than or equal to 100 μm, and the thickness of the buffer structure glue (52) is greater than or equal to 5 μm and less than or equal to 50 μm.

5. The packaging structure of the perovskite battery assembly according to claim 1, characterized in that: The first packaging glue (51) is epoxy resin, the buffer structure glue (52) is epoxy resin or acrylic resin, and the second packaging glue (53) is acrylic resin. The first packaging glue (51), the buffer structure glue (52) and the second packaging glue (53) are all made by thermal curing or UV curing.

6. The packaging structure of the perovskite battery assembly according to claim 1, characterized in that: The buffer structure adhesive (52) is rectangular in shape and consists of a plurality of first buffer colloids (52-1) and four second buffer colloids (52-2). Each of the second buffer colloids (52-2) is "L"-shaped and is arranged at the four corners of the rectangle respectively. The plurality of first buffer colloids (52-1) are arranged in rows or columns with spacing between two adjacent second buffer colloids (52-2).

7. The packaging structure of the perovskite battery assembly according to claim 1, characterized in that: The material of the passivation layer (4) is one of silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide, and the thickness of the passivation layer (4) is 50 nm to 2 μm.

8. The packaging structure of the perovskite battery assembly according to claim 1, characterized in that: The perovskite functional layer (3) comprises a hole transport layer (33), a perovskite light absorption layer (32), an electron transport layer (31) and a back electrode layer (34) which are stacked in sequence from bottom to top, the lower surface of the hole transport layer (33) is in contact with the upper surface of the transparent conductive layer (2), and the upper surface of the back electrode layer (34) is in contact with the inner top surface of the passivation layer (4); Alternatively, the perovskite functional layer (3) comprises an electron transport layer (31), a perovskite light absorption layer (32), a hole transport layer (33) and a back electrode layer (34) which are stacked in sequence from bottom to top, wherein the lower surface of the electron transport layer (31) contacts the upper surface of the transparent conductive layer (2), and the upper surface of the back electrode layer (34) contacts the inner top surface of the passivation layer (4).

9. The packaging structure of the perovskite battery assembly according to any one of claims 1 to 8, characterized in that: The material of the substrate (1) and the packaging cover plate (6) is any one of ultra-white glass plate, tempered glass plate, stainless steel plate, metal foil, polyethylene terephthalate plate or polyethylene naphthalate plate, and polyimide.

Images