Packaging structure of perovskite solar cell module

Abstract

The utility model belongs to the technical field of perovskite solar cells, and particularly relates to a packaging structure of a perovskite solar cell module, which comprises a substrate, a transparent conductive layer, a perovskite module and a passivation unit which are sequentially laminated from bottom to top, and the passivation unit covers the upper surface and the periphery of the perovskite module. The passivation unit is arranged on the transparent conductive layer, the bottom surface of the passivation unit is in contact with the upper surface of the transparent conductive layer, a packaging cover plate is arranged above the passivation unit, frame glue is arranged between the transparent conductive layer and the packaging cover plate, and the frame glue is located on the periphery of the passivation unit and used for forming a sealed space between the passivation unit and the packaging cover plate. And a packaging assembly is arranged in the frame glue. The perovskite solar cell is good in packaging effect and wide in application, effectively reduces water vapor entering the perovskite assembly, and improves the stability and the service life of the perovskite solar cell.

Description

Technical Field

[0001] The utility model belongs to the technical field of perovskite solar cells, and in particular relates to a packaging structure of a perovskite solar cell component. Background Art

[0002] In recent years, with the continuous improvement of environmental awareness worldwide, people's desire to pursue green energy has gradually become stronger. Against this background, the research and development and industrialization of the photovoltaic industry have been advancing with each passing day. Among the many forms of photovoltaic cells, thin-film solar cells have attracted many companies to join in the research and development due to their soft characteristics and large-scale production characteristics. Among them, the most competitive and promising is the perovskite solar cell, which has high photoelectric conversion efficiency, low cost, and simple process steps. It is a new type of energy material.

[0003] Due to the unique properties of perovskite solar cells, their photoelectric conversion layer is easily affected by water vapor in the environment and undergoes irreversible decomposition and deterioration, thereby affecting the photoelectric conversion efficiency of perovskite solar cells. Therefore, in order to ensure the service life of perovskite cells outdoors, battery packaging becomes particularly important.

[0004] In the prior art, when perovskite solar cells are packaged, butyl adhesive is usually placed between the upper and lower glass cover plates of the photovoltaic module. During outdoor use, the bonding interface between the butyl adhesive and the glass is easily invaded by water vapor, which reduces the bonding strength between the butyl adhesive and the glass, and the butyl adhesive delaminates from the glass, causing the photovoltaic module packaging to fail, reducing the reliability of the module and shortening the service life of the module. In order to solve the problems of deliquescence and lead leakage of perovskite solar cells, it is urgent to design a suitable packaging structure to meet indoor and outdoor scene applications.

[0005] In view of this, the present inventor provides a packaging structure of a perovskite solar cell module to solve the above technical problems. Utility Model Content

[0006] The purpose of the utility model is to overcome the shortcomings of the above-mentioned prior art and provide a packaging structure of a perovskite solar cell component. The packaging structure realizes multiple sealing by arranging a frame glue between the transparent conductive layer and the packaging cover plate, and arranging a packaging component in the frame glue. At the same time, a passivation unit is arranged on the perovskite component, and the passivation unit is bonded to the frame glue, thereby increasing the sealing of the packaging structure, improving the packaging effect, ensuring the maximum possible isolation of water vapor from entering the perovskite component, and improving the stability and service life of the perovskite solar cell.

[0007] The purpose of the utility model is to solve the problem through the following technical solutions:

[0008] The utility model provides a packaging structure of a perovskite solar cell component, comprising a substrate, a transparent conductive layer, a perovskite component and a passivation unit which are sequentially stacked from bottom to top, wherein the passivation unit covers the upper surface and surroundings of the perovskite component, and the bottom surface of the passivation unit contacts the upper surface of the transparent conductive layer, a packaging cover plate is arranged above the passivation unit, a sealant is arranged between the transparent conductive layer and the packaging cover plate, and the sealant is located around the passivation unit to form a sealed space between the passivation unit and the packaging cover plate, and a packaging component is arranged in the sealant.

[0009] Furthermore, the packaging component includes a first packaging glue, a second packaging glue and a third packaging glue which are sequentially arranged along a horizontal direction, and the first packaging glue is arranged closer to the passivation unit relative to the second packaging glue.

[0010] Furthermore, the first packaging glue, the second packaging glue and the third packaging glue are all arranged on the upper surface of the transparent conductive layer.

[0011] Furthermore, the upper surface of the transparent conductive layer and the lower surface of the packaging cover are simultaneously provided with a first packaging glue, a second packaging glue and a third packaging glue, and the first packaging glue on the transparent conductive layer is opposite to and spaced from the first packaging glue on the packaging cover, the second packaging glue on the transparent conductive layer is opposite to and spaced from the second packaging glue on the packaging cover, and the third packaging glue on the transparent conductive layer is opposite to and spaced from the third packaging glue on the packaging cover.

[0012] Further optionally, the materials of the first packaging glue, the second packaging glue and the third packaging glue are selected from inorganic materials or organic materials, and any two adjacent packaging glues are made of different materials, and the outermost layer is preferably an inorganic material.

[0013] Furthermore, the thickness of the first packaging glue, the second packaging glue and the third packaging glue are all smaller than the thickness of the frame glue.

[0014] Furthermore, the thickness of the sealant is 5 μm to 100 μm.

[0015] Furthermore, the thickness of the first packaging glue, the second packaging glue and the third packaging glue are all 50nm-10μm. If an inorganic material is selected, the thickness is 50nm-1μm. If an organic material is selected, the thickness is 50nm-10μm.

[0016] Specifically, the thicknesses of the first packaging glue, the second packaging glue, and the third packaging glue may be set to be different or the same, which is not limited here, as long as they are within the set thickness range.

[0017] The intervals between the first packaging glue, the second packaging glue and the third packaging glue are not set, and they can be set closely or with gaps between them.

[0018] Specifically, when the encapsulation glue is selected from inorganic materials, it is preferably formed by PECVD, ALD or sputtering. The inorganic material can be Al2O3, SiO2, HfO2, ZrO2, ZnO, Ta2O5, CeO2, La2O3, CoOx, MoO 3、 Any one of SrTiO, TiO2, SnO2, Nb2O5, Y2O3, MgO, BaTiO3, In2O3, NiO, V2O5, WO3.

[0019] Specifically, when the encapsulation glue is made of organic material, it is preferably formed by jet dispensing, spin coating, screen printing or inkjet printing, and the organic material may be a high molecular polymer or a resin material.

[0020] Furthermore, the passivation unit includes a first passivation layer and a second passivation layer, the first passivation layer covers the upper surface and surrounding areas of the perovskite component, and the bottom surface of the first passivation layer contacts the upper surface of the transparent conductive layer, the second passivation layer covers the upper surface and surrounding areas of the first passivation layer, and the bottom surface of the second passivation layer contacts the upper surface of the transparent conductive layer, and the inner surface of the frame glue contacts the surrounding areas of the second passivation layer.

[0021] Furthermore, the thickness of the first passivation layer and the second passivation layer are both 50 nm to 2 μm; the first passivation layer and the second passivation layer are made of inorganic material or organic material.

[0022] More preferably, the material of the first passivation layer is an inorganic material, and the material of the second passivation layer is an organic material. Of course, the material of the first passivation layer can also be an organic material, and the material of the second passivation layer can be an inorganic material.

[0023] Specifically, the passivation layer is an inorganic material, which includes any one of silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide, which can further enhance the barrier effect against water vapor and provide a flat surface for subsequent film formation to prevent defect expansion.

[0024] Specifically, the organic material of the passivation layer includes any one of arylene diamine derivatives, carbazole derivatives (derivatives containing carbazole groups and heterocyclic groups bonded to carbazole groups), phosphorus-oxy derivatives and quinolinone derivatives.

[0025] It should be noted that if the second passivation layer is made of inorganic material, during the packaging process, the inorganic material is in direct contact with the sealant, which enhances the adhesion between the sealant and the second passivation layer, thereby achieving the purpose of improving the packaging effect.

[0026] Furthermore, the material of the frame glue includes curable UV glue, such as colorless and transparent epoxy encapsulation glue, silicone encapsulation glue, polyurethane encapsulation glue, epoxy resin, acrylic resin, etc. The surface of the resin still has a certain viscosity after curing, similar to the state of gel, and can cover the packaging components during lamination.

[0027] It should be noted that the frame glue has the function of preventing water vapor from invading the interior of the perovskite component. Therefore, a multiple sealing barrier is formed for the perovskite solar cell component through the frame glue, the first packaging glue, the second packaging glue, the third packaging glue and the passivation unit, which can effectively block the influence of water vapor on the perovskite solar cell.

[0028] Furthermore, the frame glue and packaging components are both made by thermal curing or UV curing.

[0029] Furthermore, the material of the transparent conductive layer includes but is not limited to one or more of indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), indium-doped zinc oxide (IZO), fluorine-doped tin oxide (FTO), indium tungsten oxide (IWO), indium cerium oxide (ICO), and Ag nanowires.

[0030] Furthermore, the perovskite component includes a first transport layer, a perovskite layer, a second transport layer and a back electrode layer stacked in sequence from bottom to top; the first transport layer is a hole transport layer, and the second transport layer is an electron transport layer; or the first transport layer is an electron transport layer, and the second transport layer is a hole transport layer.

[0031] Furthermore, the material of the hole transport layer includes NiO x , MoS, MoO, CuS, CuSCN, PTAA, PEDOT, Spiro-MeOTAD, any one or a combination of at least two, a typical but non-limiting combination includes NiO x Combination with MoS.

[0032] Furthermore, the material of the perovskite layer is a narrow bandgap perovskite light-absorbing material, including a halide crystal with an ABX3 structure, wherein A is at least one of methylamine, guanidine, and cesium, B is any one of Sn, Bi, Sb, Ge, Cu, and Pb ions, and X is at least one of the halogens F, Cl, Br, and I.

[0033] Furthermore, the electron transport layer includes TiO2, SnO2, ZnO2, IZO, WO3, Nb2O5, C 60 , PCBM fullerene and its derivatives, BaSnO3, one or more of AZO.

[0034] Furthermore, the material of the back electrode layer includes any one of Au, Ag, Cu, Al, Cr, Mo, carbon material, fluorine-doped tin oxide, indium-doped tin oxide, aluminum-doped zinc oxide, boron-doped zinc oxide, and aluminum-doped tin oxide, or a combination of at least two thereof.

[0035] Furthermore, the material of the substrate and the packaging cover plate includes any one of ultra-clear glass plate, tempered glass plate, stainless steel plate, metal foil, polyethylene terephthalate plate or polyethylene naphthalate plate, and polyimide.

[0036] Compared with the prior art, the technical solution provided by the utility model has the following beneficial effects:

[0037] The utility model provides a packaging structure of a perovskite solar cell module. The packaging structure realizes multiple sealing by setting a sealant between a transparent conductive layer and a packaging cover plate, and setting a packaging component in the sealant, thereby increasing sealing performance, achieving good packaging effect, effectively reducing water vapor from entering the perovskite module, and solving the problem that the bonding interface between butyl glue and glass is easily disturbed by water vapor, resulting in decreased bonding strength; at the same time, a passivation unit is set on the perovskite module, and the passivation unit can wrap the top wall and four side walls of the perovskite module, so that the horizontal direction and vertical direction of the perovskite module are multiple protected, and the passivation unit is bonded to the sealant to increase sealing performance, and combined with the packaging cover plate set on the passivation unit, the perovskite module is further multiple protected, and can effectively block the influence of water vapor on the perovskite solar cell module, thereby improving the stability and service life of the perovskite solar cell. The packaging structure has simple process, high packaging efficiency, and is suitable for perovskite solar cell packaging of different areas, and has wide application and good packaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings herein are incorporated into and constitute a part of this specification, and together with the description, are used to explain the principles of the present utility model.

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0040] Figure 1 A cross-sectional view of the packaging structure of a perovskite solar cell module according to Example 1 of the utility model;

[0041] Figure 2 A cross-sectional view of the packaging structure of a perovskite solar cell module according to Example 2 of the utility model;

[0042] Figure 3This is a cross-sectional view of the packaging structure of the perovskite solar cell module of Example 3 of the utility model.

[0043] Among them: 1. substrate; 2. transparent conductive layer; 3. perovskite component; 4. passivation unit; 5. frame glue; 6. packaging component; 7. packaging cover; 31. first transmission layer; 32 is perovskite layer; 33. second transmission layer; 34. back electrode layer; 41. first passivation layer; 42. second passivation layer; 61. first packaging glue; 62. second packaging glue; 63. third packaging glue. DETAILED DESCRIPTION

[0044] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the utility model. Instead, they are only examples of devices consistent with some aspects of the utility model as detailed in the attached claims.

[0045] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0046] Example 1

[0047] See also Figure 1 The utility model provides a packaging structure of a perovskite solar cell component, comprising a substrate 1, a transparent conductive layer 2, a perovskite component 3 and a passivation unit 4 which are stacked in sequence from bottom to top, the passivation unit 4 covers the upper surface and surroundings of the perovskite component 3, and the bottom surface of the passivation unit 4 contacts the upper surface of the transparent conductive layer 2, a packaging cover plate 7 is arranged above the passivation unit 4, a frame glue 5 is arranged between the transparent conductive layer 2 and the packaging cover plate 7, and the frame glue 5 is located around the passivation unit 4, for forming a sealed space between the passivation unit 4 and the packaging cover plate 7, and a packaging component 6 is arranged in the frame glue 5.

[0048] Furthermore, the packaging component 6 includes a first packaging glue 61 , a second packaging glue 62 and a third packaging glue 63 which are sequentially arranged along a horizontal direction, and the first packaging glue 61 is arranged closer to the passivation unit 4 than the second packaging glue 62 .

[0049] In this embodiment, the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 are arranged at equal intervals on the upper surface of the transparent conductive layer 2, and the first packaging glue 61 and the third packaging glue 63 are organic materials, and the second packaging glue 62 is an inorganic material. Specifically, the inorganic material is Al2O3, and the second packaging glue 62 is formed by the PECVD method; the organic material is a high molecular polymer material, and the first packaging glue 61 and the third packaging glue 63 are formed by a jet dispensing method.

[0050] In this embodiment, the thickness of the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 are all less than the thickness of the frame glue 5. Specifically, the thickness of the frame glue 5 is 50μm, the thickness of the first packaging glue 61 is 5μm, the thickness of the second packaging glue 62 is 500nm, and the thickness of the third packaging glue 63 is 5μm.

[0051] Furthermore, the passivation unit 4 includes a first passivation layer 41 and a second passivation layer 42, the first passivation layer 41 covers the upper surface and surroundings of the perovskite component 3, and the bottom surface of the first passivation layer 41 contacts the upper surface of the transparent conductive layer 2, the second passivation layer 42 covers the upper surface and surroundings of the first passivation layer 41, and the bottom surface of the second passivation layer 42 contacts the upper surface of the transparent conductive layer 2, and the inner surface of the frame glue 5 contacts the surroundings of the second passivation layer 42.

[0052] In this embodiment, the first passivation layer 41 is an organic material, specifically a derivative of aryl diamine, and the second passivation layer 42 is an inorganic material, specifically a silicon nitride layer. During the packaging process, the silicon nitride layer is in direct contact with the frame glue 5, and the adhesion between the two is strong, thereby improving the adhesion between the frame glue 5 and the second passivation layer 42 to achieve the purpose of high-quality sealing.

[0053] In this embodiment, the thickness of the first passivation layer 41 is 1 μm, and the thickness of the second passivation layer 42 is 1 μm.

[0054] In this embodiment, the sealant 5 and the packaging component 6 are respectively made by thermal curing, and the material of the sealant 5 is a colorless and transparent epoxy-type packaging glue, which has the function of preventing water vapor from invading the interior of the perovskite component 3. By providing the first packaging glue 61, the second packaging glue 62, the third packaging glue 63 and the passivation unit 4, a multiple sealing barrier is formed for the perovskite solar cell component, which can effectively block the influence of water vapor on the perovskite solar cell.

[0055] Furthermore, the perovskite component 3 includes a first transmission layer 31, a perovskite layer 32, a second transmission layer 33 and a back electrode layer 34 stacked in sequence from bottom to top; specifically, the first transmission layer 31 is a hole transmission layer, and the second transmission layer 33 is an electron transmission layer. Specifically, the material of the hole transmission layer is NiO xand MoS; the material of the perovskite layer 32 is selected from narrow-bandgap perovskite light-absorbing materials, including halide crystals with an ABX3 structure, A is methylamine, B is Sn, and X is halogen F; the material of the electron transport layer is selected from TiO2, and the material of the back electrode layer 34 is selected from Au.

[0056] In this embodiment, the transparent conductive layer 2 is made of indium tin oxide (ITO); the substrate 1 and the package cover 7 are made of ultra-white glass.

[0057] The specific process of this packaging structure in practical application is as follows:

[0058] Step 1, providing a substrate 1, and disposing a transparent conductive layer 2 on the substrate 1;

[0059] Step 2: forming a first transmission layer 31, a perovskite layer 32, a second transmission layer 33 and a back electrode layer 34 in sequence on the transparent conductive layer 2 to obtain a perovskite component 3;

[0060] Step 3, sequentially disposing a first passivation layer 41 and a second passivation layer 42 on the perovskite component 3 to obtain a passivation unit 4;

[0061] Step 4: on the upper surface of the transparent conductive layer 2 and around the passivation unit 4, a first packaging glue 61, a second packaging glue 62 and a third packaging glue 63 are sequentially provided by a jet dispensing method;

[0062] Step 5, providing a packaging cover plate 7, and coating the surface of the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 with a frame glue 5 between the transparent conductive layer 2 and the packaging cover plate 7, so that the frame glue 5 is adhered to the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 as a whole, and the frame glue 5 adheres the packaging cover plate 7 and the transparent conductive layer 2 together;

[0063] Step 6: thermally cure the frame glue 5 to complete the packaging of the perovskite solar cell module.

[0064] Example 2

[0065] See also Figure 2 The utility model provides a packaging structure of a perovskite solar cell component, comprising a substrate 1, a transparent conductive layer 2, a perovskite component 3 and a passivation unit 4 which are stacked in sequence from bottom to top, the passivation unit 4 covers the upper surface and surroundings of the perovskite component 3, and the bottom surface of the passivation unit 4 contacts the upper surface of the transparent conductive layer 2, a packaging cover plate 7 is arranged above the passivation unit 4, a frame glue 5 is arranged between the transparent conductive layer 2 and the packaging cover plate 7, and the frame glue 5 is located around the passivation unit 4, for forming a sealed space between the passivation unit 4 and the packaging cover plate 7, and a packaging component 6 is arranged in the frame glue 5.

[0066] Furthermore, the packaging component 6 includes a first packaging glue 61 , a second packaging glue 62 and a third packaging glue 63 which are sequentially arranged along a horizontal direction, and the first packaging glue 61 is arranged closer to the passivation unit 4 than the second packaging glue 62 .

[0067] In this embodiment, the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 are arranged at equal intervals on the upper surface of the transparent conductive layer 2, and the first packaging glue 61 and the third packaging glue 63 are inorganic materials, and the second packaging glue 62 is an organic material. Specifically, the inorganic material is SiO2, and the first packaging glue 61 and the third packaging glue 63 are formed by sputtering. The organic material is a resin material, and the second packaging glue 62 is formed by spin coating.

[0068] In this embodiment, the thickness of the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 are all less than the thickness of the frame glue 5. Specifically, the thickness of the frame glue 5 is 5μm, the thickness of the first packaging glue 61 is 50nm, the thickness of the second packaging glue 62 is 1μm, and the thickness of the third packaging glue 63 is 50nm.

[0069] Furthermore, the passivation unit 4 includes a first passivation layer 41 and a second passivation layer 42, the first passivation layer 41 covers the upper surface and surroundings of the perovskite component 3, and the bottom surface of the first passivation layer 41 contacts the upper surface of the transparent conductive layer 2, the second passivation layer 42 covers the upper surface and surroundings of the first passivation layer 41, and the bottom surface of the second passivation layer 42 contacts the upper surface of the transparent conductive layer 2, and the inner surface of the frame glue 5 contacts the surroundings of the second passivation layer 42.

[0070] In this embodiment, the first passivation layer 41 is an inorganic material, specifically silicon oxide, and the second passivation layer 42 is an organic material, specifically a carbazole derivative (containing a carbazole group and a heterocyclic derivative bonded to the carbazole group).

[0071] In this embodiment, the thickness of the first passivation layer 41 is 50 nm, and the thickness of the second passivation layer 42 is 50 nm.

[0072] In this embodiment, the sealant 5 and the packaging component 6 are respectively made by UV curing. The material of the sealant 5 is epoxy resin. The resin still has a certain viscosity on the surface after curing, similar to the state of gel. When pressed, it can cover the packaging component 6, which has the function of preventing water vapor from invading the inside of the perovskite component 3. By setting the first packaging glue 61, the second packaging glue 62, the third packaging glue 63 and the passivation unit 4, the multiple sealing barriers formed on the perovskite solar cell component can effectively block the influence of water vapor on the perovskite solar cell.

[0073] Furthermore, the perovskite component 3 includes a first transmission layer 31, a perovskite layer 32, a second transmission layer 33 and a back electrode layer 34 stacked in sequence from bottom to top; specifically, the first transmission layer 31 is an electron transmission layer, and the second transmission layer 33 is a hole transmission layer. Specifically, the material of the hole transmission layer is NiO x The material of the perovskite layer 32 is a narrow-bandgap perovskite light-absorbing material, including a halide crystal with an ABX3 structure, where A is a carboxamidine group, B is Bi, and X is a halogen Cl; the material of the electron transport layer is SnO2, and the material of the back electrode layer 34 is Ag.

[0074] In this embodiment, the transparent conductive layer 2 is made of aluminum-doped zinc oxide (AZO); the substrate 1 and the packaging cover plate 7 are made of tempered glass.

[0075] The process of actual application of the packaging structure in this embodiment is consistent with the process in Embodiment 1, and will not be repeated here.

[0076] Example 3

[0077] See also Figure 3 The utility model provides a packaging structure of a perovskite solar cell component, comprising a substrate 1, a transparent conductive layer 2, a perovskite component 3 and a passivation unit 4 which are stacked in sequence from bottom to top, the passivation unit 4 covers the upper surface and surroundings of the perovskite component 3, and the bottom surface of the passivation unit 4 contacts the upper surface of the transparent conductive layer 2, a packaging cover plate 7 is arranged above the passivation unit 4, a frame glue 5 is arranged between the transparent conductive layer 2 and the packaging cover plate 7, and the frame glue 5 is located around the passivation unit 4, for forming a sealed space between the passivation unit 4 and the packaging cover plate 7, and a packaging component 6 is arranged in the frame glue 5.

[0078] Furthermore, the packaging component 6 includes a first packaging glue 61 , a second packaging glue 62 and a third packaging glue 63 which are sequentially arranged along a horizontal direction, and the first packaging glue 61 is arranged closer to the passivation unit 4 than the second packaging glue 62 .

[0079] In this embodiment, the upper surface of the transparent conductive layer 2 and the lower surface of the packaging cover plate 7 are simultaneously provided with a first packaging glue 61, a second packaging glue 62 and a third packaging glue 63, and the first packaging glue 61 on the transparent conductive layer 2 is directly opposite to the first packaging glue 61 on the packaging cover plate 7 and is arranged at intervals, the second packaging glue 62 on the transparent conductive layer 2 is directly opposite to the second packaging glue 62 on the packaging cover plate 7 and is arranged at intervals, and the third packaging glue 63 on the transparent conductive layer 2 is directly opposite to the third packaging glue 63 on the packaging cover plate 7 and is arranged at intervals.

[0080] Specifically, the first packaging glue 61 and the third packaging glue 63 on the transparent conductive layer 2 are inorganic materials, and the second packaging glue 62 is an organic material; the first packaging glue 61 and the third packaging glue 63 on the packaging cover plate 7 are organic materials, and the second packaging glue 62 is an inorganic material. The inorganic material is Al2O3, formed by the PECVD method, and the organic material is a high molecular polymer material, formed by the jet dispensing method.

[0081] In this embodiment, the thicknesses of the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 are all less than the thickness of the frame glue 5. Specifically, the thickness of the frame glue 5 is 100 μm, the thickness of the first packaging glue 61 on the transparent conductive layer 2 is 50 nm, the thickness of the second packaging glue 62 is 10 μm, the thickness of the third packaging glue 63 is 50 nm, the thickness of the first packaging glue 61 on the packaging cover plate 7 is 10 μm, the thickness of the second packaging glue 62 is 50 nm, and the thickness of the third packaging glue 63 is 10 μm.

[0082] Furthermore, the passivation unit 4 includes a first passivation layer 41 and a second passivation layer 42, the first passivation layer 41 covers the upper surface and surroundings of the perovskite component 3, and the bottom surface of the first passivation layer 41 contacts the upper surface of the transparent conductive layer 2, the second passivation layer 42 covers the upper surface and surroundings of the first passivation layer 41, and the bottom surface of the second passivation layer 42 contacts the upper surface of the transparent conductive layer 2, and the inner surface of the frame glue 5 contacts the surroundings of the second passivation layer 42.

[0083] In this embodiment, the first passivation layer 41 is an organic material, specifically a phosphorus-oxygen derivative, and the second passivation layer 42 is an inorganic material, specifically a silicon oxynitride layer. During the packaging process, the silicon oxynitride layer is in direct contact with the frame glue 5, and the adhesion between the frame glue 5 and the silicon oxynitride material is strong, thereby improving the adhesion between the frame glue 5 and the second passivation layer 42 to achieve the purpose of high-quality sealing.

[0084] In this embodiment, the thickness of the first passivation layer 41 is 2 μm, and the thickness of the second passivation layer 42 is 2 μm.

[0085] In this embodiment, the sealant 5 and the packaging component 6 are respectively made by thermal curing, and the material of the sealant 5 is a colorless and transparent epoxy-type packaging glue, which has the function of preventing water vapor from invading the interior of the perovskite component 3. By providing the first packaging glue 61, the second packaging glue 62, the third packaging glue 63 and the passivation unit 4, a multiple sealing barrier is formed for the perovskite solar cell component, which can effectively block the influence of water vapor on the perovskite solar cell.

[0086] Furthermore, the perovskite component 3 includes a first transmission layer 31, a perovskite layer 32, a second transmission layer 33 and a back electrode layer 34 stacked in sequence from bottom to top; specifically, the first transmission layer 31 is a hole transmission layer, and the second transmission layer 33 is an electron transmission layer. Specifically, the material of the hole transmission layer is NiO x and MoS; the material of the perovskite layer 32 is selected from narrow-bandgap perovskite light-absorbing materials, including halide crystals with an ABX3 structure, A is methylamine, B is Sn, and X is halogen F; the material of the electron transport layer is selected from TiO2, and the material of the back electrode layer 34 is selected from Au.

[0087] In this embodiment, the transparent conductive layer 2 is made of indium tin oxide (ITO); the substrate 1 and the package cover 7 are made of ultra-white glass.

[0088] The specific process of this packaging structure in practical application is as follows:

[0089] Step 1, providing a substrate 1, and disposing a transparent conductive layer 2 on the substrate 1;

[0090] Step 2: forming a first transmission layer 31, a perovskite layer 32, a second transmission layer 33 and a back electrode layer 34 in sequence on the transparent conductive layer 2 to obtain a perovskite component 3;

[0091] Step 3, sequentially disposing a first passivation layer 41 and a second passivation layer 42 on the perovskite component 3 to obtain a passivation unit 4;

[0092] Step 4: on the upper surface of the transparent conductive layer 2 and around the passivation unit 4, a first packaging glue 61, a second packaging glue 62 and a third packaging glue 63 are sequentially provided by a jet dispensing method;

[0093] Step 5, providing a packaging cover plate 7, and sequentially disposing the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 on the lower surface of the packaging cover plate 7 by using a jet dispensing method, which are opposite to the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 on the transparent conductive layer 2;

[0094] Step 6, coating the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 with the frame glue 5 between the transparent conductive layer 2 and the packaging cover plate 7, so that the frame glue 5 is adhered to the first packaging glue 61, the second packaging glue 62 and the third packaging glue 63 as a whole, and the frame glue 5 adheres the packaging cover plate 7 and the transparent conductive layer 2 together;

[0095] Step 7: thermally cure the frame glue 5 to complete the packaging of the perovskite solar cell module.

[0096] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0097] It should be understood that the present invention is not limited to the above-described contents, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A packaging structure of a perovskite solar cell module, characterized in that: The invention comprises a substrate (1), a transparent conductive layer (2), a perovskite component (3) and a passivation unit (4) which are sequentially stacked from bottom to top, wherein the passivation unit (4) covers the upper surface and surrounding areas of the perovskite component (3), and the bottom surface of the passivation unit (4) is in contact with the upper surface of the transparent conductive layer (2), a packaging cover plate (7) is arranged above the passivation unit (4), a sealant (5) is arranged between the transparent conductive layer (2) and the packaging cover plate (7), and the sealant (5) is located around the passivation unit (4) to form a sealed space between the passivation unit (4) and the packaging cover plate (7), and a packaging component (6) is arranged in the sealant (5).

2. The packaging structure of the perovskite solar cell module according to claim 1, characterized in that: The packaging component (6) comprises a first packaging glue (61), a second packaging glue (62) and a third packaging glue (63) which are arranged in sequence along a horizontal direction, and the first packaging glue (61) is arranged closer to the passivation unit (4) relative to the second packaging glue (62).

3. The packaging structure of the perovskite solar cell module according to claim 2, characterized in that: The first packaging glue (61), the second packaging glue (62) and the third packaging glue (63) are all arranged on the upper surface of the transparent conductive layer (2).

4. The packaging structure of the perovskite solar cell module according to claim 2, characterized in that: The upper surface of the transparent conductive layer (2) and the lower surface of the packaging cover plate (7) are simultaneously provided with a first packaging glue (61), a second packaging glue (62) and a third packaging glue (63); the first packaging glue (61) on the transparent conductive layer (2) is opposite to and spaced from the first packaging glue (61) on the packaging cover plate (7); the second packaging glue (62) on the transparent conductive layer (2) is opposite to and spaced from the second packaging glue (62) on the packaging cover plate (7); and the third packaging glue (63) on the transparent conductive layer (2) is opposite to and spaced from the third packaging glue (63) on the packaging cover plate (7).

5. The packaging structure of a perovskite solar cell module according to any one of claims 2 to 4, characterized in that: The materials of the first packaging glue (61), the second packaging glue (62) and the third packaging glue (63) are inorganic materials or organic materials, and any two adjacent packaging glues are made of different materials.

6. The packaging structure of the perovskite solar cell module according to claim 5, characterized in that: The thickness of the first packaging glue (61), the second packaging glue (62) and the third packaging glue (63) are all smaller than the thickness of the frame glue (5).

7. The packaging structure of the perovskite solar cell module according to claim 6, characterized in that: The thickness of the sealant (5) is 5 μm to 100 μm.

8. The packaging structure of the perovskite solar cell module according to claim 6, characterized in that: The thickness of the first packaging glue (61), the second packaging glue (62) and the third packaging glue (63) are all 50nm-10μm. If inorganic materials are selected, the thickness is 50nm-1μm. If organic materials are selected, the thickness is 50nm-10μm.

9. The packaging structure of the perovskite solar cell module according to claim 1, characterized in that: The passivation unit (4) comprises a first passivation layer (41) and a second passivation layer (42); the first passivation layer (41) covers the upper surface and surroundings of the perovskite component (3), and the bottom surface of the first passivation layer (41) contacts the upper surface of the transparent conductive layer (2); the second passivation layer (42) covers the upper surface and surroundings of the first passivation layer (41), and the bottom surface of the second passivation layer (42) contacts the upper surface of the transparent conductive layer (2); and the inner surface of the frame glue (5) contacts the surroundings of the second passivation layer (42).

10. The packaging structure of the perovskite solar cell module according to claim 9, characterized in that: The thickness of the first passivation layer (41) and the second passivation layer (42) are both 50 nm to 2 μm; the first passivation layer (41) and the second passivation layer (42) are made of inorganic material or organic material.

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