Cutting device for semiconductor processing

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a cutting device for semiconductor processing, which comprises a bottom plate, a fixed pipe fixedly mounted in the middle of the top of the bottom plate, a first bearing fixedly sleeved on the outer wall of the fixed pipe, and four support rods fixedly mounted on the outer ring wall of the first bearing, a round storage plate is arranged above the fixing pipe, the ends, away from the first bearings, of the four supporting rods are fixedly connected to the bottom of the storage plate, a support is fixedly installed at the top of the bottom plate, a first through opening is formed in the middle of the transverse straight portion of the support, and a third bearing is fixedly installed in the first through opening. And a rotating part is fixedly inserted between the inner ring walls of the third bearings in a penetrating manner, a groove is formed in the bottom of the rotating part, and a lower pressing rod is movably inserted in the groove. And the semiconductor wafer can be cut in different sizes by moving the laser emitter in the notch.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing, in particular to a cutting device for semiconductor processing. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Whether from the perspective of science and technology or economic development, semiconductors are of great importance. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with the core units of semiconductors. Semiconductors need to be cut during the processing of semiconductors. However, when cutting semiconductor wafers, common devices are not convenient for cutting wafers of different sizes, and the position of the wafers to be cut cannot be fixed during the cutting process, so that the position of the wafers is easily offset during the cutting process. For this reason, the present application proposes a cutting device for semiconductor processing. Utility Model Content

[0003] In order to solve the problems raised in the above background technology, the utility model provides the following technical solutions: a cutting device for semiconductor processing, comprising a bottom plate, a fixed tube is fixedly installed at the middle position of the top of the bottom plate, a first bearing is fixedly sleeved on the outer wall of the fixed tube, four support rods are fixedly installed on the outer ring wall of the first bearing, a circular storage plate is arranged above the fixed tube, one end of the four support rods away from the first bearing is fixedly connected to the bottom of the storage plate, a bracket is fixedly installed on the top of the bottom plate, a first through hole is opened at the middle position of the horizontal part of the bracket, a third bearing is fixedly installed in the first through hole, a rotating part passes through and is fixedly inserted between the inner ring walls of the third bearing, a groove is opened at the bottom of the rotating part, a pressing rod is movably inserted in the groove, a hydraulic rod is fixedly installed on the top of the rotating part, the telescopic end of the hydraulic rod extends into the groove and is fixedly connected to the top of the pressing rod, a supporting plate is fixedly installed between two vertical parts of the bracket, a second through hole is opened at the middle position of the supporting plate, a notch is opened at the top of the supporting plate and located on the right side of the second through hole, and a laser transmitter is movably installed in the notch.

[0004] Preferably, the bottom end of the rotating part is located in the second through opening on the support plate, slide grooves are provided on both sides of the inner wall of the groove, sliders are fixedly installed on both sides of the outer wall of the laser emitter, a pointer pointing upward is fixedly installed at the end of one of the sliders away from the laser emitter, and scale markings are provided from the middle to the right end of the front side of the support plate, and the needle tip of the pointer points to the scale markings on the front side of the support plate.

[0005] Preferably, a first bevel gear is fixedly mounted on the side wall at the top of the rotating part, a motor is fixedly mounted on the top of the bracket, a second bevel gear is fixedly mounted on the output end of the motor, and the bottom of the side wall of the second bevel gear is meshingly connected with the side wall of the first bevel gear.

[0006] Preferably, a non-slip rubber layer is provided at the bottom end of the pressing rod.

[0007] Preferably, a second bearing is fixedly mounted on the inner wall of the fixed tube, a rotating rod is fixedly mounted at the middle position of the bottom of the storage plate, and the bottom end of the rotating rod extends into the fixed tube and is fixedly connected to the inner ring wall of the second bearing.

[0008] Preferably, the center of the rotating part, the center of the rotating rod and the center of the storage plate are all located on the same vertical axis.

[0009] Compared with the prior art, the beneficial effects of the utility model are:

[0010] The hydraulic rod is controlled to push the lower pressure rod downward in the groove so that the bottom end of the lower pressure rod can be against the top of the semiconductor wafer, so that the position of the semiconductor wafer to be cut on the placement plate can be fixed, and the semiconductor wafer can be cut into different sizes by moving the laser emitter in the slot. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 It is a structural schematic diagram of a partial section of the utility model;

[0014] Figure 3 It is an enlarged structural schematic diagram of A of the utility model;

[0015] Figure 4 This is a schematic diagram of the structure of the support plate of the utility model;

[0016] Figure 5 It is a cross-sectional structural diagram of the connection between the hydraulic rod and the pressure rod of the utility model;

[0017] Figure 6 This is a schematic diagram of the cross-sectional structure of the connection between the rotating rod and the fixed pipe of the utility model;

[0018] In the figure: 1. bottom plate; 2. fixing tube; 3. first bearing; 4. support rod; 5. storage plate; 6. rotating rod; 7. second bearing; 8. bracket; 9. third bearing; 10. rotating part; 11. hydraulic rod; 12. groove; 13. pressing rod; 14. first bevel gear; 15. second bevel gear; 16. motor; 17. support plate; 18. second opening; 19. notch; 20. laser transmitter; 21. slide groove; 22. slider; 23. pointer. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0020] Depend on Figure 1-6 The utility model includes a bottom plate 1, a fixed tube 2 is fixedly installed at the middle position of the top of the bottom plate 1, a first bearing 3 is fixedly sleeved on the outer wall of the fixed tube 2, four support rods 4 are fixedly installed on the outer ring wall of the first bearing 3, a circular storage plate 5 is arranged above the fixed tube 2, one end of the four support rods 4 away from the first bearing 3 is fixedly connected to the bottom of the storage plate 5, a bracket 8 is fixedly installed on the top of the bottom plate 1, a first opening is opened at the middle position of the horizontal part of the bracket 8, a third bearing 9 is fixedly installed in the first opening, and between the inner ring walls of the third bearing 9 A rotating part 10 is penetrated and fixedly inserted, a groove 12 is opened at the bottom of the rotating part 10, a pressing rod 13 is movably inserted in the groove 12, a hydraulic rod 11 is fixedly installed on the top of the rotating part 10, the telescopic end of the hydraulic rod 11 extends into the groove 12 and is fixedly connected to the top of the pressing rod 13, a support plate 17 is fixedly installed between the two vertical parts of the bracket 8, a second opening 18 is opened in the middle position of the support plate 17, a slot 19 is opened at the top of the support plate 17 and on the right side of the second opening 18, and a laser emitter 20 is movably installed in the slot 19.

[0021] At the same time, the bottom end of the rotating part 10 is located in the second through opening 18 on the support plate 17, and slide grooves 21 are provided on both sides of the inner wall of the notch 19. Slide blocks 22 are fixedly installed on both sides of the outer wall of the laser emitter 20. A pointer 23 pointing upward is fixedly installed at one end of one of the slide blocks 22 away from the laser emitter 20. Scale markings are provided from the middle to the right end of the front side of the support plate 17. The needle tip of the pointer 23 points to the scale markings on the front side of the support plate 17. The moving position of the laser emitter 20 can be determined by the pointer 23, thereby determining the cutting radius of the laser emitter 20 relative to the semiconductor wafer on the object plate 5.

[0022] In addition, a first bevel gear 14 is fixedly installed on the side wall at the top of the rotating part 10, a motor 16 is fixedly installed on the top of the bracket 8, and a second bevel gear 15 is fixedly installed on the output end of the motor 16. The bottom of the side wall of the second bevel gear 15 is meshingly connected with the side wall of the first bevel gear 14. The operation of the motor 16 can drive the second bevel gear 15 to drive the first bevel gear 14 to rotate, thereby driving the rotating part 10 to rotate, and the bottom end of the lower pressure rod 13 is pressed on the semiconductor wafer. Through the mutual squeezing of the two, the storage plate 5 can be driven to rotate together.

[0023] In addition, a non-slip rubber layer is provided at the bottom end of the pressing rod 13, which can increase the friction between the bottom end of the pressing rod 13 and the wafer and protect the wafer.

[0024] In addition, a second bearing 7 is fixedly installed on the inner wall of the fixed tube 2, and a rotating rod 6 is fixedly installed at the middle position of the bottom of the storage plate 5. The bottom end of the rotating rod 6 extends into the fixed tube 2 and is fixedly connected to the inner ring wall of the second bearing 7. Through the connection between the rotating rod 6 and the second bearing 7, the stability of the storage plate 5 during rotation can be further enhanced.

[0025] Furthermore, the center of the rotating portion 10 , the center of the rotating rod 6 , and the center of the storage plate 5 are all located on the same vertical axis.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cutting device for semiconductor processing, comprising a base plate (1), characterized in that: A fixing tube (2) is fixedly installed at the middle position of the top of the bottom plate (1), a first bearing (3) is fixedly sleeved on the outer wall of the fixing tube (2), four support rods (4) are fixedly installed on the outer ring wall of the first bearing (3), a circular storage plate (5) is arranged above the fixing tube (2), one end of the four support rods (4) away from the first bearing (3) is fixedly connected to the bottom of the storage plate (5), a bracket (8) is fixedly installed on the top of the bottom plate (1), a first opening is opened at the middle position of the horizontal part of the bracket (8), a third bearing (9) is fixedly installed in the first opening, and a rotating shaft (9) is inserted and fixedly connected between the inner ring walls of the third bearing (9) A movable part (10) is provided at the bottom of the rotating part (10), a groove (12) is provided, a lower pressure rod (13) is movably inserted in the groove (12), a hydraulic rod (11) is fixedly installed on the top of the rotating part (10), the telescopic end of the hydraulic rod (11) extends into the groove (12) and is fixedly connected to the top of the lower pressure rod (13), a support plate (17) is fixedly installed between the two vertical parts of the bracket (8), a second opening (18) is provided at the middle position of the support plate (17), a slot (19) is provided at the top of the support plate (17) and located on the right side of the second opening (18), and a laser emitter (20) is movably installed in the slot (19).

2. A semiconductor processing cutting device according to claim 1, characterized in that: The bottom end of the rotating part (10) is located in the second opening (18) on the support plate (17), and the inner wall of the notch (19) is provided with a slide groove (21) on both sides, and the outer wall of the laser emitter (20) is fixedly installed with a slider (22) on both sides, and a pointer (23) pointing upward is fixedly installed at one end of one of the sliders (22) away from the laser emitter (20), and a scale mark is provided from the middle to the right end of the front side of the support plate (17), and the needle of the pointer (23) points to the scale mark on the front side of the support plate (17).

3. A semiconductor processing cutting device according to claim 1, characterized in that: A first bevel gear (14) is fixedly mounted on the side wall at the top of the rotating part (10), a motor (16) is fixedly mounted on the top of the bracket (8), a second bevel gear (15) is fixedly mounted on the output end of the motor (16), and the bottom of the side wall of the second bevel gear (15) is meshingly connected with the side wall of the first bevel gear (14).

4. A semiconductor processing cutting device according to claim 1, characterized in that: The bottom end of the pressing rod (13) is provided with an anti-skid rubber layer.

5. A semiconductor processing cutting device according to claim 1, characterized in that: A second bearing (7) is fixedly mounted on the inner wall of the fixed tube (2), and a rotating rod (6) is fixedly mounted at the middle position of the bottom of the storage plate (5), wherein the bottom end of the rotating rod (6) extends into the fixed tube (2) and is fixedly connected to the inner wall of the second bearing (7).

6. A semiconductor processing cutting device according to claim 5, characterized in that: The center of the rotating part (10), the center of the rotating rod (6) and the center of the storage plate (5) are all located on the same vertical axis.

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