Chemical method circulating molybdenum wire gold plating device

Abstract

The utility model belongs to the technical field of electroplating, and particularly relates to a chemical method circulating molybdenum wire gold plating device. The molybdenum wire gold plating device comprises a gold plating liquid storage tank (1), a circulating pipeline (3), a sealed chemical plating liquid box (5), an anode (6), a molybdenum wire cathode (7) and a power supply (8), a liquid outlet of the gold plating liquid storage tank (1) is communicated to the sealed chemical plating liquid box (5) through the circulating pipeline (3), and a liquid outlet of the sealed chemical plating liquid box (5) is communicated to the gold plating liquid storage tank (1) through the circulating pipeline (3); the filtering device (2) and the circulating pump (4) are arranged on the circulating pipeline (3); and an anode (6) and a molybdenum wire cathode (7) are arranged in the sealed chemical plating solution box (5). According to the device, accurate control over the electroplating process is achieved, the production efficiency is improved, the corrosion resistance of a plating layer can be improved, and the service life of a product is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of electroplating, and in particular relates to a chemical method circulating molybdenum wire gold plating device. Background Art

[0002] Metal mesh is the core product of large mesh antennas to form microwave radio frequency signal transmission, which plays the role of reflecting electromagnetic waves. The performance of metal mesh affects the passive intermodulation (PIM) and communication capabilities of the communication system. The metal mesh woven with gold-plated molybdenum wire has the characteristics of light weight, good softness, and repeated folding, making it widely used in large mesh antennas in space. The advantage of molybdenum wire is that it is relatively stable in space environment and has good strength. The gold plating on the outside is because the electrical properties of gold are good and the reflective performance is relatively good. Plating a layer of gold on the outside of the metal molybdenum wire not only makes its reflective performance better, but also plays an antioxidant role during ground transmission. The discovery and improvement of this material has made the metal wire antenna lighter, larger and less energy-consuming. Compared with traditional solidified satellite antennas, the received signal is also stronger. Metal mesh is a key component of satellite antennas to reflect electromagnetic waves and a basic material for satellite-borne mesh antennas. Gold-plated molybdenum wire can make satellite antennas both light and stable. This material has the characteristics of high strength, low thermal expansion coefficient, not easy to break, and high reflectivity. It is an excellent "selected material" for manufacturing space deployable mesh antenna reflectors.

[0003] Traditional molybdenum wire gold plating technology mainly relies on physical and chemical methods, but both have certain technical problems and defects:

[0004] Physical gold plating:

[0005] 1) High cost: First, vacuum equipment such as vacuum evaporation furnaces, sputtering machines, etc. are not only expensive, but also require regular maintenance and upgrades to maintain their high vacuum state and working accuracy; second, the gold or other precious metal targets used are relatively expensive. At the same time, in order to obtain high-quality coatings, high-purity metal sources and gases are also required; third, a large amount of electrical energy or thermal energy is usually required to drive the equipment and maintain the required temperature or pressure conditions; fourth, the process is complex and requires professional technicians to operate and maintain, which also increases labor costs.

[0006] 2) Complex structure: Physical gold plating usually requires multiple treatments of the molybdenum wire, involving multiple steps and links, and the entire process is relatively complicated. Before gold plating, the molybdenum wire needs to be cleaned, degreased, and rusted to ensure that the coating can be evenly and firmly attached to the surface of the molybdenum wire. Not only that, it is also necessary to accurately control the operating parameters of the equipment, such as vacuum, temperature, pressure, current, etc., to ensure the quality and uniformity of the coating. At the same time, the coating also needs to be post-processed, such as heat treatment, cooling and other steps, to improve the performance of the coating. After the gold plating is completed, the molybdenum wire needs to be cut, polished, tested and other post-processing steps to ensure that it meets the requirements for use.

[0007] 3) Low efficiency: Since physical gold plating involves multiple steps and each step requires precise control, the overall efficiency is low and it is difficult to meet the needs of large-scale production. It usually takes a long time to start and shut down, which affects the utilization and production efficiency of the equipment. And because the transmission speed of metal atoms in a vacuum is slow, the growth rate of the coating is also relatively slow. This limits the production capacity and output of the production line. Although physical gold plating equipment has achieved a certain degree of automation, it is still low compared to other modern manufacturing technologies. This increases the dependence and uncertainty of manual operation, further reducing production efficiency.

[0008] Chemical gold plating:

[0009] 1) Uneven coating: During the chemical gold plating process, due to the influence of factors such as the composition, concentration, and temperature of the plating solution, uneven coating is easily caused, thus affecting the performance of the molybdenum wire. The proportion and type of metal ions, complexing agents, reducing agents and other components in the plating solution directly affect the formation and uniformity of the coating. If the composition of the plating solution is inappropriate or the proportion is unbalanced, the coating will be unevenly distributed on the surface of the molybdenum wire, and the phenomenon of being too thick or too thin will appear locally. Secondly, too high or too low concentration of the plating solution will affect the uniformity of the coating. Too high a concentration may cause the coating to be too thick, while too low a concentration may cause the coating to be too thin or unable to form a complete coating. The temperature of the plating solution also has an important influence on the uniformity of the coating. Too high or too low a temperature will affect the speed and uniformity of coating formation, resulting in unstable coating quality.

[0010] 2) Uncontrollable thickness: The thickness of chemical gold plating is difficult to accurately control. Too thick or too thin a coating may affect the performance of the molybdenum wire. There are too many influencing factors. In addition to factors such as plating solution composition, concentration, and temperature, current density is also one of the key factors affecting coating thickness. The size of the current density directly affects the speed and thickness of the coating.

[0011] 3) Poor corrosion resistance: The coating prepared by the traditional chemical gold plating process has poor corrosion resistance and is prone to oxidation or corrosion in complex environments. The coating formed by chemical gold plating often has defects such as pores and microcracks, which will destroy the density and continuity of the coating and reduce its corrosion resistance. The metal composition and impurity content in the coating will also affect its corrosion resistance. If the metal composition in the coating is impure or contains too many impurities, its corrosion resistance will be reduced.

[0012] Therefore, the traditional molybdenum wire gold plating technology has certain defects and shortcomings in terms of cost, efficiency, coating quality, environmental protection, etc. Therefore, it is of great significance to develop a new, efficient and environmentally friendly molybdenum wire gold plating technology.

[0013] In order to solve the above problems, this application is proposed. Utility Model Content

[0014] The present application provides a chemical method circulating molybdenum wire gold plating device, the molybdenum wire gold plating device comprises: a gold plating liquid storage tank 1, a circulation pipeline 3, a sealed chemical plating liquid box 5, an anode 6, a molybdenum wire cathode 7, and a power supply 8;

[0015] The liquid outlet of the gold plating liquid storage tank 1 is connected to the liquid inlet of the sealed chemical plating liquid tank 5 through the circulation pipeline 3, and the liquid outlet of the sealed chemical plating liquid tank 5 is connected to the liquid inlet of the gold plating liquid storage tank 1 through the circulation pipeline 3;

[0016] The filtering device 2 and the circulating pump 4 are arranged on the circulating pipeline 3;

[0017] An anode 6 and a molybdenum wire cathode 7 are arranged in the sealed chemical plating liquid box 5 , and the anode 6 and the molybdenum wire cathode 7 are connected to the power supply 8 respectively.

[0018] Preferably, a magnetic stirrer 14 is provided inside the gold plating solution storage tank 1 , and is configured to stir the gold plating solution in the gold plating solution storage tank 1 .

[0019] Preferably, a heater 15 and a temperature controller 16 are provided inside the gold plating liquid storage tank 1 ; the heater 15 is configured to heat the gold plating liquid in the gold plating liquid storage tank 1 , and the temperature controller 16 is configured to control the heating temperature of the heater 15 .

[0020] Preferably, a filtering device 2 is provided on the circulation pipeline 3; or a filtering device 2 is provided between the gold plating liquid storage tank 1 and the circulation pipeline 3; and the filtering device 2 is configured to filter the gold plating liquid.

[0021] Preferably, a circulation pump 4 is provided on the circulation pipeline 3 .

[0022] Preferably, the molybdenum wire gold plating device further comprises: a valve 13 arranged at the liquid inlet of the sealed chemical plating liquid tank 5,

[0023] Preferably, the molybdenum wire gold plating device further comprises a control system, and the control system comprises: a current / voltage sensor 10;

[0024] The current / voltage sensor 10 is configured to monitor the current and voltage during the gold plating process, and the power supply 8 is configured to regulate the output current and / or output voltage according to the output signal of the current / voltage sensor 10 .

[0025] Preferably, the control system of the molybdenum wire gold plating device further comprises: a temperature sensor and a temperature controller 16;

[0026] The temperature sensor is configured to monitor the temperature of the molybdenum wire in real time during the gold plating process;

[0027] The temperature controller 16 is configured to control the heating temperature in the gold plating solution storage tank 1 according to the output signal of the temperature sensor.

[0028] Preferably, the control system of the molybdenum wire gold plating device further includes: a magnetic sensor 17 and a magnetic controller 19;

[0029] The magnetic sensor 17 is configured to monitor the magnetic field of the molybdenum wire during the gold plating process in real time;

[0030] The magnetic controller 19 is configured to control the stirring speed in the gold plating solution storage tank 1 according to the output signal of the magnetic sensor 17 . BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the structure of the chemical cyclic molybdenum wire gold plating device of the present application.

[0032] 1. Gold plating liquid storage tank, 2. Filter device, 3. Circulation pipeline, 4. Circulation pump, 5. Sealed chemical plating liquid tank, 6. Anode, 7. Molybdenum wire cathode, 8. Power supply, 9. Ammeter, 10. Current / voltage sensor, 11. Signal processor, 12. Display, 13. Valve, 14. Magnetic stirrer, 15. Heater, 16. Temperature controller, 17. Magnetic sensor, 18. Glue brush, 19. Magnetic controller. DETAILED DESCRIPTION

[0033] The present application is further described in detail below in conjunction with embodiments.

[0034] Those skilled in the art will appreciate that the following examples are only used to illustrate the present application and should not be considered to limit the scope of the present application. If no specific techniques or conditions are specified in the examples, the techniques or conditions described in the literature in the art or the product specifications are used. If the manufacturer of the materials or equipment used is not specified, they are all conventional products that can be purchased.

[0035] Those skilled in the art will appreciate that, unless expressly stated otherwise, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present application refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that when we refer to an element as being "connected" to another element, it may be directly connected to the other element, or there may be intermediate elements. In addition, the "connection" used herein may include wireless connections.

[0036] In the description of this application, unless otherwise specified, "plurality" means two or more. The terms "inside", "upper", "lower", etc. indicate positions or state relationships based on the positions or state relationships shown in the drawings, which are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operate in a specific position, and therefore cannot be understood as limiting this application.

[0037] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "provided with" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application are understood according to specific circumstances.

[0038] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as those generally understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless defined as herein.

[0039] The "range" disclosed in the present application is defined in the form of a lower limit and an upper limit, and a given range is defined by selecting a lower limit and an upper limit, and the selected lower limit and upper limit define the boundaries of the particular range. The range defined in this way can be inclusive or exclusive of the end values, and can be arbitrarily combined, that is, any lower limit can be combined with any upper limit to form a range. For example, if a range of 60 to 120 and 80 to 110 is listed for a particular parameter, it is understood that a range of 60 to 110 and 80 to 120 is also expected. In addition, if the minimum range values ​​1 and 2 are listed, and if the maximum range values ​​3, 4 and 5 are listed, the following ranges can all be expected: 1 to 3, 1 to 4, 1 to 5, 2 to 3, 2 to 4 and 2 to 5. In the present application, unless otherwise specified, the numerical range "a to b" represents an abbreviation of any real number combination between a and b, where a and b are both real numbers. For example, the numerical range "0-5" means that all real numbers between "0-5" are listed in this document, and "0-5" is just an abbreviation of these numerical combinations. In addition, when a parameter is expressed as an integer ≥ 2, it is equivalent to disclosing that the parameter is, for example, an integer of 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0040] If not otherwise specified, all embodiments and optional embodiments of the present application can be combined with each other to form a new technical solution. If not otherwise specified, all technical features and optional technical features of the present application can be combined with each other to form a new technical solution. If not otherwise specified, all steps of the present application can be performed sequentially or randomly, preferably sequentially. For example, the method includes steps (a) and (b), indicating that the method may include steps (a) and (b) performed sequentially, or may include steps (b) and (a) performed sequentially. For example, the method may further include step (c), indicating that step (c) may be added to the method in any order, for example, the method may include steps (a), (b) and (c), or may include steps (a), (c) and (b), or may include steps (c), (a) and (b), etc.

[0041] If there is no special explanation, the "include" and "comprising" mentioned in this application are open-ended or closed-ended. For example, the "include" and "comprising" may mean that other components not listed may also be included or only the listed components may be included or only the listed components may be included.

[0042] If not specifically stated, in this application, the term "or" is inclusive. For example, the phrase "A or B" means "A, B, or both A and B".

[0043] like Figure 1The chemical circulating molybdenum wire gold plating device of the present application includes: a gold plating liquid circulation filtration system, a chemical plating liquid electrode system, and a visual control system.

[0044] 1. Gold plating liquid circulation filtration system

[0045] The gold plating liquid circulation and filtration system is the key to ensure the purity, uniformity and continuous supply of the gold plating liquid. The system mainly includes a gold plating liquid storage tank 1, a filtration device 2, a circulation pump 4, and a circulation pipeline 3.

[0046] Gold plating liquid storage tank 1: The gold plating liquid storage tank 1 is mainly used to store and supply the gold plating liquid. It is made of corrosion-resistant materials, such as polypropylene PP or polytetrafluoroethylene PTFE, to ensure that the gold plating liquid will not produce chemical reactions due to long-term storage, resulting in changes in composition. The gold plating liquid storage tank 1 is usually designed with large capacity and excellent sealing to ensure that the gold plating liquid will not be lost due to evaporation or leakage. The gold plating liquid storage tank 1 is equipped with a heater 15 and a magnetic stirrer 14, which can adjust the temperature of the gold plating liquid as needed, and ensure that the composition of the gold plating liquid is uniform by stirring to avoid uneven coating quality due to precipitation. In addition, the gold plating liquid storage tank 1 is also equipped with a temperature controller 16 and a liquid level sensor, which can monitor the temperature and liquid level of the gold plating liquid in real time to ensure the safety and stability of the gold plating process. During the operation, the staff needs to regularly check the sealing of the gold plating liquid storage tank 1 and the operating status of the heating and stirring equipment to ensure the quality and stable supply of the gold plating liquid.

[0047] Filter device 3: Filter device 3 is used to remove impurities and particulate matter in the gold plating liquid to ensure the purity of the gold plating liquid. Filter device 3 is usually composed of a high-precision filter screen or filter element, and the appropriate filtration accuracy can be selected according to the characteristics of the gold plating liquid and the filtration requirements. During the gold plating process, the gold plating liquid enters the filtration system through a pipeline, and the impurities and particulate matter therein are removed by the filtration of the filter screen. The filtered gold plating liquid then returns to the liquid storage tank through a pipeline or directly enters the gold plating tank to form a cycle. To ensure the filtering effect, the staff needs to regularly clean and replace the filter screen or filter element to prevent clogging and wear from affecting the filtering effect.

[0048] ③ Circulation pump 4: Circulation pump 4 is an electric pump, which pumps the gold plating liquid from the gold plating liquid storage tank 1 into the sealed chemical plating liquid tank 5 through the circulation pipeline 3, and then flows back to the gold plating liquid storage tank 1 from the sealed chemical plating liquid tank 5, forming a cycle to ensure the continuous supply and uniform distribution of the gold plating liquid. The electric pump is made of corrosion-resistant materials, and the appropriate pump type and power can be selected according to the capacity of the gold plating tank and the flow rate of the gold plating liquid. The introduction of the electric pump circulation system has greatly improved the automation and efficiency of the gold plating process.

[0049] In summary, the technical means of this system is to achieve constant temperature, uniformity and cleanliness of the gold plating solution through precise heating and stirring control, as well as an efficient filtration system. The introduction of the electric pump circulation system further improves the circulation efficiency and utilization rate of the gold plating solution, ensuring the stability and repeatability of the gold plating process.

[0050] 2. Chemical plating solution electrode system

[0051] Anode 6: During the electroplating process, anode 6 is usually made of an inert metal such as titanium or platinum and coated with a precious metal oxide coating. This design allows anode 6 to remain stable during the electroplating process and is not easily corroded by the plating solution, thereby ensuring the continuation of the electroplating process. The main function of anode 6 is to release metal ions into the plating solution through an oxidation reaction to maintain the concentration of metal ions in the plating solution. During the electroplating process, the metal on anode 6 will continue to dissolve to replenish the metal ions consumed in the plating solution. The material and shape of anode 6 can be selected according to specific electroplating requirements to ensure the smooth progress of the electroplating process.

[0052] Molybdenum wire cathode 7: The cathode is the place where metal ions are received during the electroplating process, and the molybdenum wire connected to the negative electrode is the carrier of this receiving process. Molybdenum wire has good conductivity and corrosion resistance, so it is very suitable as a cathode material. During the electroplating process, the molybdenum wire cathode 7 will be negatively charged, attracting metal ions in the plating solution and forming a metal coating on its surface. The shape and size of the molybdenum wire cathode 7 can be customized according to the electroplating requirements. Generally speaking, the molybdenum wire cathode 7 will be made into a strip structure to increase its contact area with the plating solution, thereby improving the electroplating efficiency.

[0053] Rubber brush 18: Since the molybdenum wire itself is slender and has a certain elasticity, it is easy to get entangled with each other during transportation or storage. The rubber brush 18 can effectively separate the entangled molybdenum wires through the contact between its bristles and the molybdenum wires, making them independent. In addition to the separation function, the rubber brush 18 can also perform preliminary sorting of the molybdenum wires. Through the brushing of the bristles, the molybdenum wires can be combed neatly to avoid affecting the electroplating effect due to the disorder when entering the electroplating box. During the brushing process, the rubber brush 18 can also remove dust, oil and other impurities on the surface of the molybdenum wire. If these impurities enter the electroplating box with the molybdenum wire, it will not only affect the quality of electroplating, but also may pollute the electroplating box. Through the separation and sorting effect of the rubber brush 18, the molybdenum wire can enter the electroplating box in a more uniform and orderly state. This helps to ensure that the molybdenum wire can evenly receive the coating during the electroplating process, thereby obtaining a more uniform and consistent coating effect.

[0054] Molybdenum wire circulator: Molybdenum wire circulator is a device used to process gold-plated molybdenum wire in the chemical plating solution electrode system. During the electroplating process, the molybdenum wire cathode will continuously receive metal ions and form a metal coating on its surface. When the gold plating of the molybdenum wire is completed, the molybdenum wire circulator will take it out of the sealed chemical plating solution tank 5 and automatically wind it into a metal mesh. Molybdenum wire circulators usually have the characteristics of high degree of automation and easy operation. It can automatically adjust the winding speed and density according to the set parameters to adapt to different specifications of molybdenum wire and coating requirements. Through the processing of the circulator, the gold-plated molybdenum wire can be easily processed and applied in the future.

[0055] In summary, the chemical plating liquid electrode system is a highly integrated electroplating equipment, which is mainly composed of an anode 6, a molybdenum wire cathode 7, a rubber brush 18 and a molybdenum wire circulator. The anode 6 is responsible for stably releasing metal ions into the plating solution, while the molybdenum wire cathode 7 serves as a carrier for receiving metal ions to form a uniform coating. Before electroplating, the rubber brush 18 plays a key role. It effectively separates and organizes the molybdenum wires to ensure that they enter the sealed chemical plating liquid tank 5 neatly, thereby improving the quality of the coating. After the electroplating is completed, the molybdenum wire circulator automatically winds the gold-plated molybdenum wire into a net for subsequent processing. The various parts of the entire system work closely together to ensure the efficient operation of the electroplating process and provide stable, high-quality coating products for industrial production.

[0056] 3. Visual control system

[0057] The visual control system includes: a temperature sensor, a magnetic sensor 17, a current / voltage sensor 10, a display 12, a signal processor 11, a temperature controller 16, a magnetic controller 19, a power supply 8, etc. The signal processor 11 is used to process the signals output by the temperature sensor, the magnetic sensor 17, and the current / voltage sensor 10 and transmit them to the display 12.

[0058] Temperature sensor: In the visual control system of the molybdenum wire gold plating device, the temperature sensor plays a vital role. The sensor can monitor the temperature of the molybdenum wire in real time during the gold plating process to ensure that it is gold plated within a suitable temperature range, thereby ensuring the quality and uniformity of the coating. The temperature sensor is usually made of thermistor or thermocouple and has the characteristics of high precision, fast response, stability and reliability. It can accurately sense the temperature change on the surface of the molybdenum wire and convert it into a processable electrical signal and output it to the temperature controller 16. The temperature controller 16 can adjust the gold plating parameters such as current and voltage in real time according to the received temperature signal to achieve precise control of the temperature of the molybdenum wire. In the process of molybdenum wire gold plating, the application of temperature sensors is crucial. It can help operators understand the temperature status of the molybdenum wire in real time, detect abnormal conditions in time and take corresponding measures to deal with them. At the same time, the temperature sensor can also be linked with other sensors and actuators in the control system to achieve optimization and automatic control of the entire gold plating process.

[0059] Magnetic sensor 17: In the visual control system of the molybdenum wire gold plating device, the magnetic sensor 17 is mainly used to control the stirring speed in the gold plating liquid storage tank 1 to ensure the uniformity of the circulating plating liquid. This is because in the gold plating process, the uniformity of the plating liquid directly affects the quality and uniformity of the coating. The working principle of the magnetic sensor 17 is based on magnetic field induction technology. It contains a magnetic sensitive element that can sense the changes in the surrounding magnetic field and convert it into an electrical signal output. In the gold plating liquid storage tank 1, the magnetic sensor 17 is usually installed near the magnetic stirrer 14 to monitor the changes in the magnetic field generated by the magnetic stirrer 14 in real time. When the magnetic stirrer 14 starts working, it generates a rotating magnetic field. The magnetic sensor 17 can sense the changes in this magnetic field and convert it into an electrical signal and output it to the magnetic controller 19. The magnetic controller 19 can understand the operating status of the magnetic stirrer 14 in real time based on the received electrical signal, and adjust the stirring speed accordingly. During the gold plating process, the control system will monitor the actual stirring speed of the magnetic stirrer 14 in real time through the magnetic sensor 17 according to the preset stirring speed requirements. If the actual stirring speed is too fast or too slow, the control system will issue a command in time to adjust the speed of the magnetic stirrer 14 to achieve the preset stirring speed requirement. Through the application of the magnetic sensor 17, the molybdenum wire gold plating device can achieve accurate control of the stirring speed in the gold plating liquid storage tank 1. This can not only ensure the uniformity of the circulating plating solution, improve the quality and uniformity of the plating layer, but also reduce the waste of plating solution and environmental pollution.

[0060] Current / voltage sensor 10: In the visual control system of the molybdenum wire gold plating device, the current / voltage sensor 10 is used to monitor the voltage and current parameters in the gold plating process in real time. These parameters are crucial to controlling the quality and efficiency of gold plating. The current / voltage sensor 10 includes: a voltage sensor and a current sensor. The voltage sensor ensures that the voltage is stable within a set range by measuring the output voltage of the gold plating power supply 8. It can convert the voltage signal into a processable electrical signal and output it to the power supply 8 through the output power supply 8 to the control system. The power supply 8 adjusts the power output according to the voltage signal to maintain a stable gold plating voltage. The ammeter 9 is used to test the output current of the gold plating power supply 8. The current sensor monitors the current changes in the gold plating process in real time. It is usually installed at the output end of the gold plating power supply or the position where the molybdenum wire contacts the plating solution, and can sense the magnitude and direction of the current in real time. By measuring the current, the control system can understand the current consumption during the gold plating process and adjust the current size as needed to optimize the gold plating effect and efficiency. The current / voltage sensor 10 can reflect the electrical parameters in the gold plating process in real time, providing a reliable basis for the decision-making of the control system. At the same time, they can also be linked with other sensors and actuators in the control system to achieve precise control and optimization of the entire gold plating process.

[0061] The controllable chemical circulating molybdenum wire gold plating device of the present application solves the technical problems existing in the traditional molybdenum wire gold plating by means of the gold plating liquid circulation filtration system, the chemical plating liquid electrode system and the visual control system, and achieves the following effects:

[0062] 1. Improve the quality of plating solution: The gold plating solution circulation filtration system can remove impurities and particulate matter in the plating solution by circulating and filtering the plating solution, keeping the plating solution clean and stable. This helps to reduce plating defects and improve plating quality. At the same time, the circulation filtration system can also reduce the consumption and waste of plating solution, thereby reducing production costs. By recycling the plating solution, the waste of plating solution is reduced and the production cost is reduced.

[0063] 2. The system can accurately control the thickness and uniformity of the coating, reducing the problems of uneven coating and uncontrollable thickness. In addition, the chemical plating solution electrode system can also improve the corrosion resistance of the coating and extend the service life of the product.

[0064] 3. Automatic sensing and adjustment function: The visual control system realizes precise control of the electroplating process by real-time monitoring and controlling various parameters in the electroplating process. The system can reduce the difficulty and complexity of operation and improve production efficiency. At the same time, the visual control system can also detect and handle abnormal situations in time to ensure the safety and stability of the electroplating process.

Claims

1. A chemical method circulating molybdenum wire gold plating device, characterized in that: The molybdenum wire gold plating device comprises: a gold plating liquid storage tank (1), a circulation pipeline (3), a sealed chemical plating liquid box (5), an anode (6), a molybdenum wire cathode (7), and a power supply (8); The liquid outlet of the gold plating solution storage tank (1) is connected to the liquid inlet of the sealed chemical plating solution tank (5) through the circulation pipeline (3), and the liquid outlet of the sealed chemical plating solution tank (5) is connected to the liquid inlet of the gold plating solution storage tank (1) through the circulation pipeline (3); The circulation pipeline (3) is provided with a filtering device (2) and a circulation pump (4); An anode (6) and a molybdenum wire cathode (7) are arranged in the sealed chemical plating liquid box (5), and the anode (6) and the molybdenum wire cathode (7) are respectively connected to the power supply (8).

2. The chemical method circulating molybdenum wire gold plating device according to claim 1 is characterized in that: A magnetic stirrer (14) is arranged inside the gold plating liquid storage tank (1) and is configured to stir the gold plating liquid in the gold plating liquid storage tank (1).

3. The chemical method circulating molybdenum wire gold plating device according to claim 1 is characterized in that: The gold plating liquid storage tank (1) is provided with a heater (15) and a temperature controller (16); The heater (15) is configured to heat the gold plating liquid in the gold plating liquid storage tank (1), and the temperature controller (16) is configured to control the heating temperature of the heater (15).

4. The chemical circulating molybdenum wire gold plating device according to claim 1 is characterized in that: A filtering device (2) is provided on the circulation pipeline (3); or a filtering device (2) is provided between the gold plating liquid storage tank (1) and the circulation pipeline (3); the filtering device (2) is configured to filter the gold plating liquid.

5. The chemical circulating molybdenum wire gold plating device according to claim 1, characterized in that: The circulation pipeline (3) is provided with a circulation pump (4).

6. The chemical method circulating molybdenum wire gold plating device according to claim 1 is characterized in that: The molybdenum wire gold plating device further comprises: a valve (13) arranged at the liquid inlet of the sealed chemical plating liquid box (5).

7. The chemical cycle molybdenum wire gold plating device according to claim 1 is characterized in that: The molybdenum wire gold plating device further comprises a control system, and the control system comprises: a current / voltage sensor (10); The current / voltage sensor (10) is configured to monitor the current and voltage during the gold plating process, and the power supply (8) is configured to regulate the output current and / or output voltage according to the output signal of the current / voltage sensor (10).

8. The chemical cycle molybdenum wire gold plating device according to claim 3 is characterized in that: The control system of the molybdenum wire gold plating device also includes: a temperature sensor and a temperature controller (16); The temperature sensor is configured to monitor the temperature of the molybdenum wire in real time during the gold plating process; The temperature controller (16) is configured to control the heating temperature in the gold plating solution storage tank (1) according to the output signal of the temperature sensor.

9. The chemical cycle molybdenum wire gold plating device according to claim 2, characterized in that: The control system of the molybdenum wire gold plating device also includes: a magnetic sensor (17) and a magnetic controller (19); The magnetic sensor (17) is configured to monitor the magnetic field of the molybdenum wire in real time during the gold plating process; The magnetic force controller (19) is configured to control the stirring speed in the gold plating solution storage tank (1) according to the output signal of the magnetic force sensor (17).

10. The chemical cycle molybdenum wire gold plating device according to claim 1, characterized in that: The molybdenum wire gold plating device also includes a glue brush (18), which is configured to separate and sort the molybdenum wire to be gold plated.

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