High-performance embedded compact host

Abstract

The utility model relates to the technical field of industrial personal computer hosts, and discloses a high-performance embedded compact host, which comprises a host body and a metal plate base, a heat dissipation back plate is fixedly arranged outside the host body, the metal plate base is fixedly arranged at the bottom end of the heat dissipation back plate, a shell is arranged outside the heat dissipation back plate, and the metal plate base is fixedly arranged at the bottom end of the heat dissipation back plate. First reserved grooves are formed in the front ends of the heat dissipation back plate and the shell. According to the high-performance embedded compact host, the heat dissipation backboard, the shell and the mainboard are fixed to the all-aluminum metal heat dissipation backboard, heat dissipation is carried out through the good heat conduction performance of aluminum alloy, the all-aluminum metal heat dissipation backboard is designed to be free of a fan, the stability and leakproofness of the host are improved, the protection grade of the host is greatly improved, and the reliability of the host is improved. The four sides of the industrial mainboard are surrounded by the two U-shaped all-aluminum metal plate shells so as to protect a circuit board of the industrial mainboard and enhance overall heat dissipation, and the problems that the cost is increased in a heat dissipation mode of a fan structure and heat is easily generated in a driving mode are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of industrial control computer hosts, in particular to a high-performance embedded compact host. Background Art

[0002] An industrial computer is a computer device designed for industrial applications. It is a modification based on a personal computer so that its system structure and functional module division are more suitable for the requirements of industrial process control. Industrial computers are generally used in data acquisition, industrial control and other fields. The main host of an industrial computer can be used to control automated production lines, mechanical equipment control and other scenarios. In data processing, it can not only complete automatic control, but also be used to process large amounts of data generated by sensors and other equipment, and to collect, transmit and other operations.

[0003] According to the design of existing high-performance embedded compact hosts, a certain amount of heat will be generated when the internal components are running. Usually, a fan structure is used externally to dissipate the internal heat. This heat dissipation method is costly, and the fan driving method also generates heat, which makes it not suitable for use. Therefore, its structure needs to be improved.

[0004] Now, a new high-performance embedded compact host is proposed to solve the above solution. Utility Model Content

[0005] The utility model aims to provide a cleaning device for sewage treatment pipes to solve the problem that the heat dissipation method of the fan structure proposed in the above background technology increases the cost and the driving method is also prone to generate heat.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-performance embedded compact host, comprising a host body and a sheet metal base, the host body is fixedly installed on the top of the sheet metal base, a double-layer mainboard is arranged inside the host body, a heat dissipation backplate is fixedly installed outside the double-layer mainboard, an outer shell is arranged outside the host body, a first reserved groove is arranged at the front end of the heat dissipation backplate and the outer shell, a second reserved groove is arranged on one side of the first reserved groove, a third reserved groove is arranged on one side of the second reserved groove, a fourth reserved groove is arranged on one side of the third reserved groove, assembly grooves are arranged at the front and rear ends of the outer shell, and positioning screws are movably connected inside the assembly grooves.

[0007] Preferably, the shell is detachable from the host body by means of positioning screws, and the heat dissipation back plate is made of all-aluminum metal.

[0008] Preferably, the host body is high-performance and compact, and a GPIO interface is provided on one side of the front end of the host body.

[0009] Preferably, the shell is in a "U" shape, and is made of all-aluminum sheet metal. The shell is distributed at the front end, the rear end and both sides of the host body.

[0010] Preferably, first mounting holes are arranged at four corners of the bottom end of the sheet metal base, and a second mounting hole is arranged at the bottom end of the sheet metal base.

[0011] Preferably, the second mounting holes are provided in two groups, with four holes in each group.

[0012] Compared with the prior art, the utility model has the following beneficial effects: the high-performance embedded compact host not only realizes fanless heat dissipation, increases the stability and airtightness of the device, realizes rich interfaces, satisfies the self-definition of interfaces in different fields, but also facilitates multiple installation modes and various scenarios of the host body;

[0013] (1) A heat dissipation back plate and a shell are provided, and the shell is detachable from the host body by means of positioning screws. The heat dissipation back plate is made of all-aluminum metal, and the shell is "U"-shaped. The shell is made of all-aluminum sheet metal. The shell is distributed at the front end, the rear end and both sides of the host body. The mainboard is fixed on an all-aluminum metal heat dissipation back plate, and the heat is dissipated by the good thermal conductivity of aluminum alloy. The all-aluminum metal heat dissipation back plate adopts a fanless design, which increases the stability and airtightness of the device and greatly enhances its protection level. The industrial mainboard is surrounded by two U-shaped all-aluminum sheet metal shells on all four sides to protect its circuit board and enhance the overall heat dissipation;

[0014] (2) The host body adopts a compact design by providing a motherboard and GPIO interface. The size of the whole machine is very compact, which greatly reduces the required space. The host performance can meet industrial needs, and the interface is rich and equipped with a GPIO interface to meet the self-definition of interfaces in different fields;

[0015] (3) A first mounting hole and a second mounting hole are provided. The first mounting hole is provided at the four corners of the bottom of the sheet metal base. The second mounting hole is provided at the bottom of the sheet metal base. The second mounting hole is provided in two groups, each with four holes. The host body is fixed to the sheet metal base through two U-shaped all-aluminum sheet metal shells. The sheet metal base has fixed mounting holes, which can allow the host body to support various scenarios such as shelf installation and rail installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front view cross-sectional structural schematic diagram of the utility model;

[0017] Figure 2 This is a front view structural diagram of the connection method between the housing and the heat dissipation back plate of the utility model;

[0018] Figure 3This is a schematic diagram of the sheet metal base structure when viewed from above of the present utility model;

[0019] Figure 4 It is a front view structural schematic diagram of the heat dissipation back plate of the utility model.

[0020] In the figure: 1. Host body; 2. Heat dissipation back plate; 3. Outer shell; 4. First reserved slot; 5. Second reserved slot; 6. Third reserved slot; 7. Fourth reserved slot; 8. Sheet metal base; 9. GPIO interface; 10. Assembly slot; 11. Positioning screw; 12. First mounting hole; 13. Second mounting hole; 14. Double-layer motherboard. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Example 1: Please refer to Figure 1-4 A high-performance embedded compact host comprises a host body 1 and a sheet metal base 8, the host body 1 is fixedly installed on the top of the sheet metal base 8, a double-layer mainboard 14 is arranged inside the host body 1, a heat dissipation back plate 2 is fixedly installed outside the double-layer mainboard 14, a shell 3 is arranged outside the host body 1, a first reserved groove 4 is arranged at the front end of the heat dissipation back plate 2 and the shell 3, a second reserved groove 5 is arranged at one side of the first reserved groove 4, a third reserved groove 6 is arranged at one side of the second reserved groove 5, a fourth reserved groove 7 is arranged at one side of the third reserved groove 6, an assembly groove 10 is arranged at the front end and the rear end of the shell 3, and a positioning screw 11 is movably connected inside the assembly groove 10;

[0023] The housing 3 is detachable from the main body 1 by means of positioning screws 11, and the heat dissipation back plate 2 is made of all-aluminum metal;

[0024] The housing 3 is in a "U" shape and is made of all-aluminum sheet metal. The housing 3 is distributed at the front end, the rear end and both sides of the host body 1;

[0025] Specifically, Figure 1 and Figure 2As shown, the shell 3 is detachable from the host body 1 by means of positioning screws 11, the heat dissipation back plate 2 is made of all-aluminum metal, the shell 3 is "U"-shaped, the shell 3 is made of all-aluminum sheet metal, and the shell 3 is distributed at the front end, the rear end and both sides of the host body 1. The mainboard is fixed on an all-aluminum metal heat dissipation back plate 2, and the heat is dissipated by the good thermal conductivity of aluminum alloy. The all-aluminum metal heat dissipation back plate 2 adopts a fanless design, which increases the stability and airtightness of the equipment and greatly enhances its protection level. The industrial mainboard is surrounded by two U-shaped all-aluminum sheet metal shells 3 on all four sides to protect its circuit board and enhance the overall heat dissipation.

[0026] Embodiment 2: The host body 1 is a high-performance compact type, and a GPIO interface 9 is provided on one side of the front end of the host body 1;

[0027] Specifically, Figure 1 and Figure 4 As shown, the host adopts a compact design, and the size of the whole machine is very compact, which greatly reduces the required space. The performance of the host body 1 can meet industrial needs, and it has rich interfaces and is equipped with a GPIO interface 9 to meet the self-definition of interfaces in different fields.

[0028] Embodiment 3: The four corners of the bottom end of the sheet metal base 8 are provided with first mounting holes 12, and the bottom end of the sheet metal base 8 is provided with a second mounting hole 13;

[0029] The second mounting holes 13 are provided in two groups, each group having four holes;

[0030] Specifically, Figure 1 and Figure 3 As shown, first mounting holes 12 are provided at the four corners at the bottom of the sheet metal base 8, and second mounting holes 13 are provided at the bottom of the sheet metal base 8. The second mounting holes 13 are provided in two groups, with four holes in each group. The host body 1 is fixed to the sheet metal base 8 through two U-shaped all-aluminum sheet metal shells 3. The sheet metal base 8 has fixed mounting holes, so that the host body 1 can support various scenarios such as shelf installation and guide rail installation.

[0031] Working principle: When the utility model is in use, first of all, the host adopts a compact design, and the size of the whole machine is very compact, which greatly reduces the required space. The performance of the host body 1 can meet industrial needs, and it has rich interfaces and is equipped with a GPIO interface 9 to meet the self-definition of interfaces in different fields. The motherboard is fixed on an all-aluminum metal heat dissipation backplane 2, and heat is dissipated through the good thermal conductivity of aluminum alloy. The all-aluminum metal heat dissipation backplane 2 adopts a fanless design to increase the stability and airtightness of the equipment and greatly enhance its protection level. The industrial motherboard is surrounded by two U-shaped all-aluminum sheet metal shells 3 on all four sides to protect its circuit board and enhance the overall heat dissipation. The host body 1 is fixed to the sheet metal base 8 through two U-shaped all-aluminum sheet metal shells 3. The sheet metal base 8 has fixed mounting holes, which can allow the host body 1 to support various scenarios such as shelf installation and rail installation.

[0032] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A high-performance embedded compact host, comprising a host body (1) and a sheet metal base (8), characterized in that: A host body (1) is fixedly mounted on the top of the sheet metal base (8); a double-layer mainboard (14) is arranged inside the host body (1); a heat dissipation back plate (2) is fixedly mounted outside the double-layer mainboard (14); a shell (3) is arranged outside the host body (1); a first reserved groove (4) is arranged at the front end of the heat dissipation back plate (2) and the shell (3); a second reserved groove (5) is arranged at one side of the first reserved groove (4); a third reserved groove (6) is arranged at one side of the second reserved groove (5); a fourth reserved groove (7) is arranged at one side of the third reserved groove (6); an assembly groove (10) is arranged at the front end and the rear end of the shell (3); and a positioning screw (11) is movably connected inside the assembly groove (10).

2. A high-performance embedded compact host according to claim 1, characterized in that: The housing (3) is detachable from the host body (1) via positioning screws (11), and the heat dissipation back plate (2) is made of all-aluminum metal.

3. A high performance embedded compact host according to claim 1, characterized in that: The host body (1) is of high-performance and compact type, and a GPIO interface (9) is provided on one side of the front end of the host body (1).

4. A high-performance embedded compact host according to claim 1, characterized in that: The shell (3) is in a "U" shape and is made of all-aluminum sheet metal. The shell (3) is distributed at the front end, the rear end and both sides of the host body (1).

5. A high-performance embedded compact host according to claim 1, characterized in that: The four corners of the bottom end of the sheet metal base (8) are provided with first mounting holes (12), and the bottom end of the sheet metal base (8) is provided with a second mounting hole (13).

6. A high-performance embedded compact host according to claim 5, characterized in that: The second mounting holes (13) are provided in two groups, with four holes in each group.

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