Server board card and electronic equipment

Abstract

The utility model provides a server board card and electronic equipment. The server board card comprises a PCB mainboard, a closed shell, a chip unit and a heat dissipation unit, the closed shell is arranged on the PCB mainboard, and a local immersion cavity is formed between the closed shell and the PCB mainboard; the chip unit and the heat dissipation unit are arranged in the local immersion cavity, the chip unit is arranged on the PCB mainboard, and the heat dissipation unit is in heat conduction contact with the chip unit; a liquid inlet and a liquid outlet are formed in the closed shell. The chip unit and the heat dissipation unit are locally closed, and the closed cavity formed by local closing is immersed by the liquid cooling medium, so that circulating heat dissipation is performed, and the cost of equipment and the liquid cooling medium can be reduced. Compared with overall immersion liquid cooling, the local immersion liquid cooling needs less circulating power, and the energy efficiency ratio of the equipment can be obviously reduced.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a server board and an electronic device. Background Art

[0002] With the continuous development of modern electronic devices, high-density integration has led to an increasing amount of heat generated by electronic devices, especially for high-power chips such as central processing units (CPUs), where the heat flux density problem is becoming increasingly prominent.

[0003] Although traditional air cooling can dissipate heat to a certain extent, it can no longer meet the increasingly prominent heat dissipation needs in many cases. Although overall immersion liquid cooling can achieve efficient heat dissipation, it requires the entire device to be immersed in liquid cooling medium, which undoubtedly increases the cost of the equipment and liquid cooling medium. Utility Model Content

[0004] The purpose of the present application is to provide a server board and an electronic device to at least partially improve the above-mentioned problems.

[0005] In order to achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0006] In a first aspect, an embodiment of the present application provides a server board, which includes: a PCB mainboard, a sealed shell, a chip unit and a heat dissipation unit; the sealed shell is deployed on the PCB mainboard to form a local immersion cavity between the two; the chip unit and the heat dissipation unit are deployed in the local immersion cavity, the chip unit is arranged on the PCB mainboard, and the heat dissipation unit is in thermal contact with the chip unit; a liquid inlet and a liquid outlet are provided on the sealed shell.

[0007] The chip unit and the heat dissipation unit are partially sealed, and the closed cavity formed by the partial sealing is immersed in the liquid cooling medium to perform circulating heat dissipation, which can reduce the cost of equipment and liquid cooling medium. Compared with the overall immersion liquid cooling, the circulation power required for partial immersion liquid cooling is smaller, which can significantly reduce the energy efficiency ratio of the equipment.

[0008] Optionally, the sealed shell is fixed on the PCB mainboard by a sealing adhesive.

[0009] Optionally, when heat dissipation is performed, an insulating liquid-cooling medium flows into the local immersion cavity through the liquid inlet, and after the liquid-cooling medium exchanges heat with the heat dissipation unit and the chip unit, it flows out through the liquid outlet, and the closed cavity formed by the local closure is immersed in the liquid-cooling medium, thereby performing cyclic heat dissipation.

[0010] Optionally, the liquid cooling medium is a fluorinated liquid.

[0011] Optionally, the liquid inlet and the liquid outlet are provided on a side of the sealed housing away from the PCB mainboard, and the liquid inlet and the liquid outlet are located at two diagonal corners of the sealed housing, so as to fully ensure that the liquid cooling medium can flow in the local immersion cavity, thereby ensuring the heat dissipation effect.

[0012] Optionally, the chip unit includes a CPU core, a CPU substrate and a packaging metal shell, and the heat dissipation unit includes a radiator substrate and a radiator; the CPU substrate is deployed on the PCB mainboard; the packaging metal shell is deployed on the CPU substrate, and a packaging cavity is formed between the two; the CPU core is deployed in the packaging cavity; the radiator substrate is in thermal contact with the packaging metal shell, and the radiator is deployed on the radiator substrate.

[0013] Optionally, the heat sink substrate and the packaging metal shell achieve thermal contact through a thermally conductive interface material.

[0014] Optionally, the chip unit includes a CPU core, a CPU substrate and a package metal shell, the heat dissipation unit includes a radiator; the CPU substrate is disposed on the PCB mainboard; the package metal shell is disposed on the CPU substrate, and a package cavity is formed between the two; the CPU core is disposed in the package cavity; the radiator is disposed on the package metal shell. The thermal resistance generated by the heat transfer between the general independent radiator and the CPU metal shell through the thermal interface material is eliminated.

[0015] Optionally, the CPU substrate is fixed to the PCB mainboard by soldering.

[0016] In a second aspect, an embodiment of the present application provides an electronic device, comprising the above-mentioned server board.

[0017] In order to make the above-mentioned objects, features and advantages of the present application more obvious and understandable, embodiments are given below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 One of the structural diagrams of the server board provided for this application;

[0020] Figure 2 The second structural diagram of the server board provided for this application;

[0021] Figure 3 Top view of local immersion liquid cooling provided for this application;

[0022] Figure 4a Provided for this application Figure 1 The corresponding temperature cloud diagram of the heating chip;

[0023] Figure 4b Provided for this application Figure 1 Corresponding temperature cloud diagram and particle trajectory diagram;

[0024] Figure 5a Provided for this application Figure 2 The corresponding temperature cloud diagram of the heating chip;

[0025] Figure 5b Provided for this application Figure 2 Corresponding temperature cloud diagram and particle trajectory diagram.

[0026] In the figure: 10-PCB main board; 20-sealed shell; 30-chip unit; 40-heat dissipation unit; 201-liquid inlet; 202-liquid outlet; 301-CPU substrate; 302-CPU core; 303-package metal shell; 401-radiator; 402-radiator substrate. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0029] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0031] In the description of the present application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0034] In order to cope with the problem of increased cost of equipment and liquid cooling medium caused by immersing the entire device in a liquid cooling medium, the present application provides a server board. The server board can achieve local immersion liquid cooling, without the need for the entire device to be immersed in a liquid cooling medium, and can achieve the same high heat dissipation effect as overall immersion liquid cooling, and at a lower cost. Compared with overall immersion liquid cooling, local immersion liquid cooling requires less circulating power, which can significantly reduce the energy consumption of the heat dissipation equipment, thereby reducing the PUE value (power usage efficiency value). In the server board provided in the present application, the chip unit and the heat dissipation unit are partially enclosed, and the enclosed cavity formed by the local closure is immersed in the liquid cooling medium to perform circulating heat dissipation, which can reduce the cost of equipment and liquid cooling medium. For details, please refer to Figure 1 , Figure 1 This is one of the structural schematic diagrams of the server board provided in this application.

[0035] The server board includes: a PCB mainboard 10 , a sealed housing 20 , a chip unit 30 and a heat dissipation unit 40 .

[0036] The sealed housing 20 is disposed on the PCB mainboard 10 to form a local immersion cavity therebetween.

[0037] Optionally, the sealed housing 20 is fixed on the PCB main board 10 by a sealing adhesive, or the sealed housing 20 is fixed on the PCB main board 10 by welding.

[0038] The chip unit 30 and the heat dissipation unit 40 are disposed in the local immersion cavity. The chip unit 30 is disposed on the PCB main board 10 , and the heat dissipation unit 40 is in thermal contact with the chip unit 30 .

[0039] The sealed shell 20 is provided with a liquid inlet 201 and a liquid outlet 202 .

[0040] Optionally, when heat dissipation is performed, an insulating liquid cooling medium flows into the local immersion cavity through the liquid inlet 201, and the liquid cooling medium (also called immersion cooling liquid) flows out through the liquid outlet 202 after exchanging heat with the heat dissipation unit 40 and the chip unit 30, thereby achieving immersion cooling.

[0041] Optionally, the liquid cooling medium is a fluorinated liquid.

[0042] Optionally, the liquid inlet 201 and the liquid outlet 202 are opened on a side of the sealed housing 20 away from the PCB mainboard 10 , and the liquid inlet 201 and the liquid outlet 202 are located at two diagonal corners of the sealed housing 20 .

[0043] It should be noted that the liquid inlet 201 and the liquid outlet 202 are opened above the sealed shell 20. On the one hand, it is beneficial to the pipeline layout of the whole machine and does not interfere with the mainboard components; on the other hand, the diagonal deployment can make the flow field distribution uniform, and the flow rate and pressure drop through each cooling fin are basically consistent, which is conducive to uniform heat dissipation, thereby improving the heat dissipation efficiency.

[0044] For example Figure 1 As shown, the liquid inlet 201 is opened on the left side of the top panel of the sealed shell 20 (the panel on the side away from the PCB main board 10), and the liquid outlet 202 is opened on the right side of the top panel of the sealed shell 20 (the panel on the side away from the PCB main board 10). Figure 1The structure shown only shows that the two are located on both sides of the top panel, but fails to show the diagonal relationship. It should be noted that in order to ensure that the liquid cooling medium is fully circulated in the local immersion cavity, the liquid inlet 201 and the liquid outlet 202 can be respectively set at the two diagonals of the top panel of the closed shell 20.

[0045] In some optional implementations, the liquid inlet 201 and the liquid outlet 202 may be respectively disposed on the left and right panels of the sealed shell 20 , or both may be opened on one side panel of the sealed shell 20 .

[0046] The chip unit 30 in the present application may be, but is not limited to, a CPU unit, and may also be other chip units with high heat flux density.

[0047] Please continue to refer to Figure 1 When the chip unit 30 is a CPU unit, the chip unit 30 includes a CPU core 302 , a CPU substrate 301 and a packaging metal shell 303 , and the heat dissipation unit 40 includes a heat sink substrate 402 and a heat sink 401 .

[0048] The CPU substrate 301 is disposed on the PCB mainboard 10; the packaging metal shell 303 is disposed on the CPU substrate 301, and a packaging cavity is formed between the two; and the CPU core 302 is disposed in the packaging cavity.

[0049] The heat sink substrate 402 is in thermal contact with the package metal shell 303 , and the heat sink 401 is disposed on the heat sink substrate 402 .

[0050] Optionally, the heat sink substrate 402 and the package metal shell 303 are in thermal contact via a thermal interface material, which may be, but is not limited to, a thermally conductive silicone pad and a carbon fiber thermally conductive pad.

[0051] Please refer to Figure 2 , Figure 2 The second structural diagram of the server board provided in the present application is as follows: the chip unit 30 includes a CPU core 302 , a CPU substrate 301 and a packaging metal shell 303 , and the heat dissipation unit 40 includes a heat sink 401 .

[0052] The CPU substrate 301 is disposed on the PCB mainboard 10; the packaging metal shell 303 is disposed on the CPU substrate 301, and a packaging cavity is formed between the two; and the CPU core 302 is disposed in the packaging cavity.

[0053] The heat sink 401 is disposed on the packaging metal shell 303 .

[0054] Optionally, the CPU substrate 301 is fixed on the PCB mainboard 10 by soldering.

[0055] Optionally, the liquid inlet 201 uses a liquid inlet cold plate joint, and the liquid outlet 202 uses a liquid outlet cold plate joint. The liquid cold plate joint and the liquid outlet cold plate joint are welded and fixed to the closed shell 20 by brazing, so that the liquid inlet 201 and the liquid outlet 202 are connected to the local immersion cavity. Please refer to Figure 3 , Figure 3 Top view of the local immersion liquid cooling provided for this application.

[0056] Optionally, the chip unit 30 and the heat dissipation unit 40 are packaged in an integrated structure and fixed to the PCB mainboard 10 by soldering. Figure 2 In the structure shown, the heat sink 401 is directly formed by cutting teeth on the basis of the package metal shell 303, thereby eliminating the thermal resistance generated by the heat transfer between the general independent heat sink and the CPU metal shell through the thermal interface material.

[0057] It should be noted that the CPU core 302 serves as a heat source, and the heat generated by the CPU core 302 is conducted to the radiator 401, the CPU substrate 301, and the solder balls (generated by solder) between the CPU substrate 301 and the PCB mainboard 10 by heat conduction. The liquid cooling medium enters the local immersion cavity through the liquid inlet 201 and fills the entire immersion cavity. The liquid cooling medium flows through the fins of the heat sink 401, the CPU substrate 301, and the solder balls between the CPU substrate 301 and the PCB mainboard 10, and takes away the heat generated by the CPU core 302 by convection heat exchange. The immersion coolant flows out of the local immersion cavity through the liquid outlet 202 to achieve immersion cooling.

[0058] In order to further illustrate the heat dissipation effect of the server board provided in this application, the following is provided Figure 4a , Figure 4b , Figure 5a as well as Figure 5b , Figure 4a Provided for this application Figure 1 The corresponding temperature cloud diagram of the heating chip, Figure 4b Provided for this application Figure 1 Corresponding to the temperature cloud diagram and particle trajectory diagram, Figure 5a Provided for this application Figure 2 The corresponding temperature cloud diagram of the heating chip, Figure 5b Provided for this application Figure 2 Corresponding temperature cloud diagram and particle trajectory diagram.

[0059] Figure 2 The server boards shown are relative to Figure 1 The server card shown in the figure eliminates the thermal resistance generated by a layer of structure and a layer of thermal interface material, reducing the overall system thermal resistance and thus improving the heat dissipation efficiency. The comparison results show that Figure 1 The maximum CPU temperature shown is 74.5℃. Figure 2The maximum CPU temperature shown is 72.8°C, with a cooling gain of 1.7°C, which provides more sufficient safety margin value for high power density CPU critical applications.

[0060] The embodiment of the present application further provides an electronic device, which includes the server board as described above. The electronic device can be, but is not limited to, a server device.

[0061] In summary, the embodiments of the present application provide a server board and an electronic device, wherein the server board includes: a PCB mainboard, a sealed shell, a chip unit and a heat dissipation unit; the sealed shell is disposed on the PCB mainboard to form a local immersion cavity between the two; the chip unit and the heat dissipation unit are disposed in the local immersion cavity, the chip unit is disposed on the PCB mainboard, and the heat dissipation unit is in thermal contact with the chip unit; a liquid inlet and a liquid outlet are provided on the sealed shell. The chip unit and the heat dissipation unit are partially sealed, and the closed cavity formed by the partial sealing is immersed in a liquid cooling medium, thereby performing circulating heat dissipation, which can reduce the cost of the equipment and the liquid cooling medium. Compared with overall immersion liquid cooling, the circulation power required for partial immersion liquid cooling is smaller, which can significantly reduce the energy efficiency ratio of the equipment.

[0062] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0063] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A server card, characterized in that: The server board includes: a PCB mainboard, a sealed housing, a chip unit and a heat dissipation unit; The sealed housing is disposed on the PCB mainboard to form a local immersion cavity between the two; The chip unit and the heat dissipation unit are disposed in the local immersion cavity, the chip unit is arranged on the PCB mainboard, and the heat dissipation unit is in thermal contact with the chip unit; The sealed shell is provided with a liquid inlet and a liquid outlet.

2. The server board according to claim 1, wherein: The sealed shell is fixed on the PCB mainboard through a sealing adhesive.

3. The server board according to claim 1, wherein: When heat is dissipated, the insulating liquid cooling medium flows into the local immersion cavity through the liquid inlet, and the liquid cooling medium flows out through the liquid outlet after exchanging heat with the heat dissipation unit and the chip unit.

4. The server board as claimed in claim 3, characterized in that: The liquid cooling medium is fluorinated liquid.

5. The server board as claimed in claim 1, characterized in that: The liquid inlet and the liquid outlet are arranged on a side of the sealed shell away from the PCB mainboard, and the liquid inlet and the liquid outlet are located at two opposite corners of the sealed shell.

6. The server board as claimed in claim 1, characterized in that: The chip unit includes a CPU core, a CPU substrate and a packaging metal shell, and the heat dissipation unit includes a heat sink substrate and a heat sink; The CPU substrate is disposed on the PCB mainboard; the package metal shell is disposed on the CPU substrate, and a package cavity is formed between the two; the CPU core is disposed in the package cavity; The heat sink substrate is in thermal contact with the packaging metal shell, and the heat sink is disposed on the heat sink substrate.

7. The server board as claimed in claim 6, characterized in that: The heat sink substrate and the packaging metal shell are in thermal contact via a thermally conductive interface material.

8. The server board as claimed in claim 1, characterized in that: The chip unit includes a CPU core, a CPU substrate and a packaging metal shell, and the heat dissipation unit includes a heat sink; The CPU substrate is disposed on the PCB mainboard; the package metal shell is disposed on the CPU substrate, and a package cavity is formed between the two; the CPU core is disposed in the package cavity; The heat sink is arranged on the packaging metal shell.

9. The server board according to claim 6 or 8, characterized in that: The CPU substrate is fixed on the PCB mainboard by soldering.

10. An electronic device, characterized in that: It comprises a server board as described in any one of claims 1-9.

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