Surface-mounted field effect transistor semiconductor packaging equipment

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to surface-mounted field effect transistor semiconductor packaging equipment. According to the technical scheme, the device comprises an adjusting mechanism, a mechanical arm assembly and clamping mechanisms, a base is arranged on the upper side of a mounting base, a mounting groove is formed in one side of the base, the adjusting mechanism is arranged in the mounting groove, a conveying belt assembly is arranged in the middle of the adjusting mechanism in the mounting groove, and the clamping mechanisms are symmetrically arranged on the upper side of the adjusting mechanism; according to the device, a field-effect tube semiconductor is placed on a conveying belt assembly, a pushing plate is driven to move horizontally through a front sensor and a telescopic air cylinder, a mechanical arm is assisted to take out a proper packaging frame from a feeding box, and when the field-effect tube semiconductor makes contact with a rear sensor, the rear sensor sends out a signal; the driving motor is started to enable the rotating frame to turn over, when the rotating frame is turned over to a proper position, the front side clamping block positions the semiconductor to be packaged, the mechanical arm assembly packages the field effect transistor semiconductor, and efficient packaging is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a mountable field effect tube semiconductor packaging device. Background Art

[0002] The surface mount field effect tube is a surface mount field effect tube semiconductor device, which is widely used in various circuits in electronic equipment, and the surface mount field effect tube semiconductor packaging equipment is a device used for automatic packaging of surface mount field effect tubes;

[0003] However, in traditional surface-mount field effect transistor semiconductor packaging equipment, if there are problems such as uneven technical levels of operators, large operating errors, and the production process is easily disturbed by external factors, human operation may easily cause quality problems such as packaging position deviation and uneven packaging pressure, affecting the stability and reliability of the product. Manual operation is prone to operational negligence and uneven speed, resulting in the inability to effectively improve production efficiency. In view of this, we propose a surface-mount field effect transistor semiconductor packaging equipment to solve the existing problems. Utility Model Content

[0004] The utility model aims to provide a surface mounted field effect transistor semiconductor packaging device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a surface mount field effect tube semiconductor packaging device, comprising a mounting seat, an adjustment mechanism, a conveyor belt assembly, a mechanical arm assembly, a clamping mechanism and a base, wherein a base is arranged on the upper side of the mounting seat, a mounting groove is opened on one side of the base, an adjustment mechanism is arranged in the mounting groove, and a conveyor belt assembly is arranged in the middle of the adjustment mechanism in the mounting groove, and a clamping mechanism is symmetrically arranged on the upper side of the adjustment mechanism;

[0006] The adjusting mechanism includes a telescopic cylinder, a pushing plate, a guide rod, a sliding frame and a support plate. The guide rods are symmetrically arranged in the installation groove, the guide rods are slidably connected to the sliding frame, and a telescopic cylinder is arranged on one side of the base. The output end of the telescopic cylinder is fixedly connected to the pushing plate in the installation groove, the side of the pushing plate away from the telescopic cylinder is fixedly connected to the sliding frame, and a support plate is arranged between the sliding frames, and a mechanical arm assembly is arranged on the sliding frame.

[0007] Preferably, the clamping mechanism includes a fixed frame, a rotating groove, a rotating rod, an adjusting block, a driving motor, a fixed plate, a rotating frame, a threaded rod, a clamping block and a threaded sleeve. A fixed frame is provided in the middle of the sliding frames on both sides. A rotating groove is opened on the upper side of the fixed frame. The rotating groove is movably connected with a rotating rod. The rotating rod is fixedly connected with an adjusting block, and a fixed plate is provided on one side of the adjusting block. The driving motor is placed on the fixed plate, and the output end of the driving motor is fixedly connected with a threaded rod.

[0008] Preferably, a rotating shaft is provided on the adjusting block, and the threaded rod is located on the rotating shaft, and a rotating frame is movably connected to one side below the fixed frame, a threaded sleeve is provided on the rotating frame, the threads of the threaded sleeve and the threaded rod cooperate with each other, and a clamping block is provided on one side of the rotating frame.

[0009] Preferably, the support plate is located in the middle of the conveyor belt assembly, and sensors are provided on both sides of the sliding frame close to the fixed frame. The sensors are infrared sensors, and the model of the infrared sensors is: EE-SX1041.

[0010] Preferably, a loading box is provided on one side of the base, and the output end of the robot arm assembly cooperates with the loading box, and a material unloading inclined plate is provided on one side of the base close to the conveyor belt assembly.

[0011] Preferably, the conveyor belt assembly, the robotic arm assembly, the drive motor and the sensor are all electrically connected to an external power supply and an external single-chip microcomputer, and the model of the external single-chip microcomputer is: STM32.

[0012] Compared with the prior art, the utility model has the following beneficial effects: when it is necessary to package the field effect tube semiconductor, first the field effect tube semiconductor is placed on the conveyor belt assembly, when the field effect tube semiconductor contacts the front sensor, the push plate can be driven to move by controlling the start of the telescopic cylinder, thereby driving the sliding frame to move horizontally along the guide rod, and the auxiliary mechanical arm assembly takes out a suitable packaging frame from the loading box to prepare for subsequent packaging work, when the field effect tube semiconductor contacts the rear sensor, the rear sensor sends a signal to control the clamping mechanism to work, the function of the clamping mechanism is to firmly clamp the semiconductor for subsequent packaging work, the field effect tube semiconductor can be efficiently packaged, and the quality and efficiency of the packaging can be ensured, and the threaded rod can be driven to rotate along the rotating shaft of the adjustment block by starting the drive motor, and the threads between the threaded rod and the threaded sleeve cooperate with each other, so that when the drive motor rotates, the rotating frame can be flipped, and when the rotating frame flips to a suitable position, the semiconductor to be packaged can be positioned by the clamping block on the front side, and then the mechanical arm assembly packages the field effect tube semiconductor, which can achieve efficient packaging of the field effect tube semiconductor, improve production efficiency and ensure packaging quality.

[0013] 1. Efficient packaging: Through automated processes, field effect transistor semiconductors can be packaged quickly and accurately, improving production efficiency.

[0014] 2. Packaging quality assurance: Through automated control and positioning, the stability and consistency of packaging quality can be ensured.

[0015] 3. Reduce labor costs: Automated equipment can reduce manual intervention, reduce labor costs, and improve production efficiency and quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2 It is a three-dimensional side view of the utility model;

[0018] Figure 3 Based Figure 2 Schematic diagram of the cross-sectional structure of AA;

[0019] Figure 4 It is a structural schematic diagram of the clamping mechanism in the utility model.

[0020] In the figure: 1. mounting base; 2. adjusting mechanism; 201. telescopic cylinder; 202. pushing plate; 203. guide rod; 204. sliding frame; 205. supporting plate; 3. unloading inclined plate; 4. conveyor belt assembly; 5. mechanical arm assembly; 6. clamping mechanism; 601. fixed frame; 602. rotating groove; 603. rotating rod; 604. adjusting block; 605. driving motor; 606. fixed plate; 607. rotating frame; 608. threaded rod; 609. clamping block; 610. threaded sleeve; 7. base; 8. feeding box; 9. mounting groove; 10. sensor. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the utility model. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the utility model.

[0022] like Figure 1-Figure 4 As shown, a surface mount field effect tube semiconductor packaging device proposed by the utility model comprises a mounting seat 1, an adjustment mechanism 2, a conveyor belt assembly 4, a mechanical arm assembly 5, a clamping mechanism 6 and a base 7, wherein the mounting seat 1 is provided with a base 7 on the upper side, a mounting groove 9 is provided on one side of the base 7, the adjustment mechanism 2 is provided in the mounting groove 9, and the conveyor belt assembly 4 is provided in the middle of the adjustment mechanism 2 in the mounting groove 9, and the clamping mechanism 6 is symmetrically provided on the upper side of the adjustment mechanism 2;

[0023] The adjusting mechanism 2 includes a telescopic cylinder 201, a push plate 202, a guide rod 203, a sliding frame 204 and a support plate 205. The guide rods 203 are symmetrically arranged in the installation groove 9, and the guide rods 203 are slidably connected to the sliding frame 204. The telescopic cylinder 201 is arranged on one side of the base 7. The output end of the telescopic cylinder 201 is fixedly connected to the push plate 202 in the installation groove 9. The side of the push plate 202 away from the telescopic cylinder 201 is fixedly connected to the sliding frame 204, and the support plate 205 is arranged between the sliding frames 204. The mechanical arm assembly 5 is arranged on the sliding frame 204;

[0024] When the field effect transistor semiconductor needs to be packaged, the field effect transistor semiconductor is first placed on the conveyor belt assembly 4. When the field effect transistor semiconductor contacts the front sensor 10, the telescopic cylinder 201 is controlled to start, which can drive the push plate 202 to move, thereby driving the sliding frame 204 to move horizontally along the guide rod 203, and assisting the robotic arm assembly 5 to take out a suitable packaging frame from the loading box 8. When the field effect transistor semiconductor contacts the rear sensor 10, the rear sensor 10 sends a signal, and the field effect transistor semiconductor is positioned by controlling the positioning mechanism 6.

[0025] In an optional embodiment, the clamping mechanism 6 includes a fixed frame 601, a rotating groove 602, a rotating rod 603, an adjusting block 604, a driving motor 605, a fixed plate 606, a rotating frame 607, a threaded rod 608, a clamping block 609 and a threaded sleeve 610. A fixed frame 601 is provided in the middle of the sliding frame 204 on both sides. A rotating groove 602 is opened on the upper side of the fixed frame 601. The rotating groove 602 is movably connected with a rotating rod 603. The rotating rod 603 is fixedly connected with an adjusting block 604, and a fixed plate 606 is provided on one side of the adjusting block 604. A driving motor 605 is placed on the fixed plate 606, and a threaded rod 608 is fixedly connected to the output end of the driving motor 605.

[0026] In an optional embodiment, a rotating shaft is provided on the adjusting block 604, and the threaded rod 608 is located on the rotating shaft, and a rotating frame 607 is movably connected to one side below the fixed frame 601, and a threaded sleeve 610 is provided on the rotating frame 607, and the threads of the threaded sleeve 610 and the threaded rod 608 are matched with each other, and a clamping block 609 is provided on one side of the rotating frame 607;

[0027] By starting the driving motor 605, the threaded rod 608 can be driven to rotate along the rotating shaft of the adjusting block 604, and the threads of the threaded rod 608 and the threaded sleeve 610 cooperate with each other, so that when the driving motor 605 rotates, the rotating frame 607 can be flipped. When the rotating frame 607 is flipped to a suitable position, the semiconductor to be packaged can be positioned by the clamping block 609 on the front side.

[0028] In an optional embodiment, the support plate 205 is located in the middle of the conveyor belt assembly 4, and sensors 10 are provided on both sides of the sliding frame 204 close to the fixed frame 601. The sensor 10 is an infrared sensor, and the model of the infrared sensor is: EE-SX1041.

[0029] In an optional embodiment, a loading box 8 is provided on one side of the base 7, and the output end of the robot arm assembly 5 cooperates with the loading box 8, and a material unloading inclined plate 3 is provided on one side of the base 7 close to the conveyor belt assembly 4.

[0030] In an optional embodiment, the conveyor belt assembly 4, the robotic arm assembly 5, the drive motor 605 and the sensor 10 are all electrically connected to an external power supply and an external single-chip microcomputer, and the model of the external single-chip microcomputer is: STM32.

[0031] The working principle of the utility model is as follows: when it is necessary to package the field effect transistor semiconductor, first the field effect transistor semiconductor is placed on the conveyor belt assembly 4. When the field effect transistor semiconductor contacts the front sensor 10, the telescopic cylinder 201 is controlled to start, so that the push plate 202 can be driven to move, thereby driving the sliding frame 204 to move horizontally along the guide rod 203, and the auxiliary mechanical arm assembly 5 takes out a suitable packaging frame from the loading box 8. When the field effect transistor semiconductor contacts the rear sensor 10, the rear sensor 10 sends a signal, and the threaded rod 608 can be driven to rotate along the rotating shaft of the adjustment block 604 by starting the drive motor 605, and the threads between the threaded rod 608 and the threaded sleeve 610 cooperate with each other, so that when the drive motor 605 rotates, the rotating frame 607 can be turned over. When the rotating frame 607 is turned over to a suitable position, the semiconductor to be packaged can be positioned by the clamping block 609 on the front side, and then the mechanical arm assembly 5 packages the field effect transistor semiconductor, which can achieve efficient packaging of the field effect transistor semiconductor, improve production efficiency and ensure packaging quality.

[0032] It should be understood that the above specific embodiments of the present invention are used to illustrate or explain the principles of the present invention, and do not constitute a limitation on the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the claims attached to the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the attached claims, or the equivalent forms of such scope and boundaries.

Claims

1. A surface mount field effect transistor semiconductor packaging device, characterized in that: The invention comprises a mounting seat (1), an adjustment mechanism (2), a conveyor belt assembly (4), a mechanical arm assembly (5), a clamping mechanism (6) and a base (7), wherein the mounting seat (1) is provided with a base (7) on the upper side, a mounting groove (9) is provided on one side of the base (7), the adjustment mechanism (2) is provided in the mounting groove (9), and a conveyor belt assembly (4) is provided in the middle of the adjustment mechanism (2) in the mounting groove (9), and the clamping mechanism (6) is symmetrically provided on the upper side of the adjustment mechanism (2); The adjusting mechanism (2) comprises a telescopic cylinder (201), a pushing plate (202), a guide rod (203), a sliding frame (204) and a support plate (205); the guide rods (203) are symmetrically arranged in the installation groove (9); the guide rods (203) are slidably connected to the sliding frame (204); a telescopic cylinder (201) is arranged on one side of the base (7); an output end of the telescopic cylinder (201) is fixedly connected to the pushing plate (202) in the installation groove (9); a side of the pushing plate (202) away from the telescopic cylinder (201) is fixedly connected to the sliding frame (204); a support plate (205) is arranged between the sliding frames (204); and a mechanical arm assembly (5) is arranged on the sliding frame (204).

2. The surface mount field effect transistor semiconductor packaging device according to claim 1, characterized in that: The clamping mechanism (6) comprises a fixed frame (601), a rotating groove (602), a rotating rod (603), an adjusting block (604), a driving motor (605), a fixed plate (606), a rotating frame (607), a threaded rod (608), a clamping block (609) and a threaded sleeve (610). The sliding frames (204) on both sides are provided with a fixed frame (601) at the middle part of the upper part. The upper side of the fixed frame (601) is provided with a rotating groove (602). The rotating groove (602) is movably connected with a rotating rod (603). The rotating rod (603) is fixedly connected with the adjusting block (604). A fixed plate (606) is provided on one side of the adjusting block (604). The driving motor (605) is placed on the fixed plate (606). The output end of the driving motor (605) is fixedly connected with the threaded rod (608).

3. The surface mount field effect transistor semiconductor packaging device according to claim 2, characterized in that: The adjusting block (604) is provided with a rotating shaft, and the threaded rod (608) is located on the rotating shaft. A rotating frame (607) is movably connected to one side below the fixed frame (601). A threaded sleeve (610) is provided on the rotating frame (607). The threads of the threaded sleeve (610) and the threaded rod (608) are matched with each other. A clamping block (609) is provided on one side of the rotating frame (607).

4. The surface mount field effect transistor semiconductor packaging device according to claim 1, characterized in that: The support plate (205) is located in the middle of the conveyor belt assembly (4), and sensors (10) are arranged on both sides of the sliding frame (204) close to the fixed frame (601). The sensor (10) is an infrared sensor, and the model of the infrared sensor is: EE-SX1041.

5. The surface mount field effect transistor semiconductor packaging device according to claim 1, characterized in that: A loading box (8) is provided on one side of the base (7), and the output end of the mechanical arm assembly (5) cooperates with the loading box (8), and a material unloading inclined plate (3) is provided on one side of the base (7) close to the conveyor belt assembly (4).

6. The surface mount field effect transistor semiconductor packaging device according to claim 1, characterized in that: The conveyor belt assembly (4), the mechanical arm assembly (5), the drive motor (605) and the sensor (10) are all electrically connected to an external power supply and an external single-chip microcomputer, and the model of the external single-chip microcomputer is STM32.

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