One-way analog-to-digital conversion circuit integrated acquisition module
By using voltage-dividing resistors and temperature resistors in a single-channel analog conversion digital circuit, combining time-sharing sampling and external voltage-dividing circuits, the time-sharing acquisition of system voltage, button switch status and temperature sensing voltage is achieved, and the traditional 3-way The high cost and large area occupancy of ADC circuits have achieved cost savings and area optimization.
Patent Information
- Application Number
- CN202420953157.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-25
- Filing Date
- 2024-05-05
- Publication Date
- 2025-02-14
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Traditional sampling multi-channel analog voltage signals require 3 ADC circuits, which leads to expensive costs and occupies a large area of the microcontroller chip.
Through a single-channel analog conversion digital circuit integrated acquisition module, the voltage-dividing resistor and temperature resistance are used, combined with time-sharing sampling and external voltage-dividing circuit, the time-sharing acquisition of system voltage, button switching state and temperature sensing voltage is realized, and integrated into a single-channel ADC.
It simplifies the traditional 3-channel ADC circuit, saves costs, and reduces the area of the microcontroller chip.
Smart Images

Figure CN222484690U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an integrated acquisition module for analog signals, in particular to an integrated acquisition module for a single-channel analog-to-digital conversion circuit. Background Art
[0002] Due to fierce cost competition, the control of the number of package pins and chip area of MCU is becoming more and more strict. Different fields use the most streamlined package pins to reduce waste. On the chip, the analog-to-digital converter (ADC) occupies a large area of the MCU chip. Each additional ADC means an additional cost. The ability to use the most streamlined pins and the least ADC is more cost-effective. Traditional sampling of multiple analog voltage signals (system voltage, temperature sensing voltage, key switch) requires 3 ADC circuits, which is expensive. Summary of the invention
[0003] The utility model aims to provide a single-channel analog-to-digital circuit integrated acquisition module to realize single-channel acquisition of three-channel signals.
[0004] The utility model adopts a technical solution to achieve the above-mentioned purpose: a single-channel analog conversion digital circuit integrated acquisition module, including a single-chip microcomputer MCU, a voltage-dividing resistor, a temperature resistor R3, and a switch K1. The voltage-dividing resistor includes a voltage-dividing resistor R1 and a voltage-dividing resistor R2. The voltage-dividing resistor R1 and the voltage-dividing resistor R2 are connected in series. The voltage-dividing resistor is arranged between the contact point of the system voltage and the contact point of the ground wire. The contact point of the system voltage is connected to an ADC port of the single-chip microcomputer MCU. The contact point of the voltage-dividing resistor R1 and the voltage-dividing resistor R2 is connected to an ADC port of the single-chip microcomputer MCU. The switch K1 is arranged between an ADC port of the single-chip microcomputer MCU and the ground wire.
[0005] One end of the temperature resistor R3 is connected to the chip output pin I / O, and the other end of the temperature resistor R3 is connected to the junction of the voltage divider resistor R1 and the voltage divider resistor R2.
[0006] Furthermore, a resistor R p , resistor R p Connected in series with temperature resistor R3.
[0007] Furthermore, a capacitor C1 is provided, and the capacitor C1 is connected in parallel with the voltage dividing resistor R2.
[0008] Furthermore, the switch K1 is a push button switch.
[0009] Furthermore, a resistor R p and capacitor C1, resistor R p It is connected in series with the temperature resistor R3, and the capacitor C1 is connected in parallel with the voltage dividing resistor R2.
[0010] Furthermore, the voltage divider resistor R1 is 15k, the voltage divider resistor R2 is 2k, the temperature resistor R3 is 10k, and the resistor R p The resistor is 1k and the capacitor C1 is 0.1uF.
[0011] The utility model integrates the sampling of system voltage, key switch status, and temperature sensing voltage into a single ADC through time-sharing sampling and an external voltage divider circuit, thereby simplifying the traditional 3-channel ADC circuit required by the traditional circuit and saving costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a schematic diagram of a preferred embodiment of the utility model;
[0013] Figure 2 It is a schematic diagram of one of the preferred embodiments of the utility model. DETAILED DESCRIPTION
[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0015] like Figure 1 , Figure 2 As shown, a single-channel analog-to-digital circuit integrated acquisition module includes a single-chip microcomputer MCU, a voltage-dividing resistor, a temperature resistor R3, and a switch K1. The voltage-dividing resistor includes a voltage-dividing resistor R1 and a voltage-dividing resistor R2. The voltage-dividing resistor R1 and the voltage-dividing resistor R2 are connected in series. The voltage-dividing resistor is arranged between a contact of a system voltage and a contact of a ground line. The contact of the system voltage is connected to an ADC port of the single-chip microcomputer MCU. The contact of the voltage-dividing resistor R1 and the voltage-dividing resistor R2 is connected to an ADC port of the single-chip microcomputer MCU. The switch K1 is arranged between an ADC port of the single-chip microcomputer MCU and the ground line.
[0016] One end of the temperature resistor R3 is connected to the chip output pin I / O, and the other end of the temperature resistor R3 is connected to the junction of the voltage divider resistor R1 and the voltage divider resistor R2.
[0017] With resistance R p , resistor R p Connected in series with temperature resistor R3.
[0018] The utility model adopts time-sharing control, collecting one channel each time. The temperature-sensing voltage that is not collected is controlled through a simple chip output pin I / O; there is no need to control the key switch voltage signal that is usually triggered by high level and low level. When the system is running, the voltage division level of the system voltage (VBUS) is collected at ordinary times; when the key switch is pressed, the ADC port is pulled to zero level, and the zero level can be collected to know the state of the key switch being pressed; when the temperature-sensing voltage needs to be known, Rp can be pulled to the ground through an output port to form another voltage division to obtain the temperature-sensing voltage result.
[0019] like Figure 2 As shown, a capacitor C1 is provided, and the capacitor C1 is connected in parallel with the voltage dividing resistor R2.
[0020] like Figure 2 As shown, in a specific embodiment, the system voltage (VBUS) is 24V, the voltage divider resistor R1 is 15k, the voltage divider resistor R2 is 2k, the temperature resistor R3 is 10k, and the resistor R p The resistor is 1k and the capacitor C1 is 0.1uF.
[0021] The utility model performs time-sharing sampling on the system voltage, key switch status, and temperature sensing voltage through time-sharing sampling and an external voltage divider circuit. Through the selection of the voltage divider circuit I / O port, it integrates a single-channel ADC sampling, simplifies the traditional 3-channel ADC circuit required by the traditional circuit, replaces the traditional three-channel sampling, and greatly saves costs.
Claims
1. A single-channel analog-to-digital circuit integrated acquisition module, characterized in that: It includes a single-chip microcomputer MCU, a voltage-dividing resistor, a temperature resistor R3, and a switch K1. The voltage-dividing resistor includes a voltage-dividing resistor R1 and a voltage-dividing resistor R2. The voltage-dividing resistor R1 and the voltage-dividing resistor R2 are connected in series. The voltage-dividing resistor is arranged between a contact point of a system voltage and a contact point of a ground line. The contact point of the system voltage is connected to an ADC port of the single-chip microcomputer MCU. The contact point of the voltage-dividing resistor R1 and the voltage-dividing resistor R2 is connected to an ADC port of the single-chip microcomputer MCU. The switch K1 is arranged between an ADC port of the single-chip microcomputer MCU and the ground line. One end of the temperature resistor R3 is connected to the chip output pin I / O, and the other end of the temperature resistor R3 is connected to the junction of the voltage divider resistor R1 and the voltage divider resistor R2.
2. The single-channel analog-to-digital circuit integrated acquisition module according to claim 1, characterized in that: With resistance R p , resistor R p Connected in series with temperature resistor R3.
3. The single-channel analog-to-digital circuit integrated acquisition module according to claim 1, characterized in that: A capacitor C1 is provided, and the capacitor C1 is connected in parallel with a voltage dividing resistor R2.
4. The single-channel analog-to-digital circuit integrated acquisition module according to claim 1, characterized in that: Switch K1 is a push button switch.
5. The single-channel analog-to-digital circuit integrated acquisition module according to claim 1, characterized in that: With resistance R p and capacitor C1, resistor R p It is connected in series with the temperature resistor R3, and the capacitor C1 is connected in parallel with the voltage dividing resistor R2.
6. The single-channel analog-to-digital circuit integrated acquisition module according to claim 1 or 5, characterized in that: The voltage divider resistor R1 is 15k, the voltage divider resistor R2 is 2k, the temperature resistor R3 is 10k, and the resistor R p The resistor is 1k and the capacitor C1 is 0.1uF.