PCB structure compatible with various Ethernet interfaces and mainboard

Abstract

The utility model discloses a PCB structure and mainboard compatible with a plurality of Ethernet interfaces, the PCB structure comprises a first packaging area, a second packaging area and a third packaging area, the first packaging area comprises welding terminals used for connecting cells of a first type Ethernet interface and a second type Ethernet interface, and the third packaging area comprises welding terminals used for connecting cells of a first type Ethernet interface and a second type Ethernet interface. The welding terminals connected with different types of Ethernet interfaces are the same; the second packaging area comprises a first fixing terminal used for being connected with a first fixing end of the first-type Ethernet interface. The third packaging area comprises a second fixing terminal used for being connected with a second fixing end of a second-type Ethernet interface.

Description

Technical Field

[0001] The embodiments of the utility model relate to PCB technology, and in particular to a PCB structure and a mainboard for being compatible with multiple Ethernet interfaces. Background Art

[0002] PCB packaging refers to the graphical representation of various parameters of actual electronic components, chips, etc. (such as component size, length and width, direct insertion, patch, pad size, pin length and width, pin spacing, etc.).

[0003] When there are multiple different requirements for the Ethernet interface configured on the motherboard, it is difficult to design a PCB packaging structure that is compatible with multiple Ethernet interface packages. At present, if compatibility with multiple Ethernet interfaces is considered, the only way is to modify the board or occupy more PCB board space, which increases the design cost and is inconvenient for the factory to prepare materials. Utility Model Content

[0004] The utility model provides a PCB structure and a mainboard for being compatible with a variety of Ethernet interfaces, so as to achieve the purpose of one PCB board being compatible with a variety of designated Ethernet interfaces.

[0005] In a first aspect, an embodiment of the utility model provides a PCB structure for being compatible with a variety of Ethernet interfaces, comprising: a first packaging area, a second packaging area, and a third packaging area;

[0006] The first packaging area includes welding terminals for connecting the battery cells of the first type Ethernet interface and the second type Ethernet interface, which are the same as the welding terminals connected to the Ethernet interfaces of different types;

[0007] The second encapsulation area includes a first fixed terminal for connecting to a first fixed end of the first type Ethernet interface;

[0008] The third packaging area includes a second fixed terminal for connecting to a second fixed end of the second type Ethernet interface.

[0009] Optionally, each of the welding terminals has the same shape, and the welding terminals are arranged in parallel;

[0010] The distance between the central axes of two adjacent welding terminals is 1.01 mm, the width of each welding terminal is 0.7 mm, and the height of each welding terminal is 2.39 mm.

[0011] Optionally, the first fixed terminal includes a first fixed portion and a second fixed portion;

[0012] The first fixing portion and the second fixing portion have the same shape;

[0013] The first fixing portion and the second fixing portion are symmetrically arranged in the second packaging area, and the second packaging area is symmetrically arranged relative to the first packaging area.

[0014] Optionally, the second fixed terminal includes a third fixed portion and a fourth fixed portion;

[0015] The third fixing portion has the same shape as the fourth fixing portion;

[0016] The third fixing portion and the fourth fixing portion are symmetrically arranged in the third packaging area, and the third packaging area is symmetrically arranged relative to the first packaging area.

[0017] Optionally, the distance between the central axis of the first fixing portion and the central axis of the welding terminal adjacent thereto is 2.02 mm;

[0018] The distance between the first side of the first fixing portion and the first side of the second fixing portion is 12.35 mm.

[0019] Optionally, the height of the third fixing portion is 4.3 mm;

[0020] The distance between the first side of the third fixing portion and the first side of the fourth fixing portion is 19.44 mm, and the distance between the second side of the third fixing portion and the second side of the fourth fixing portion is 14.2 mm;

[0021] The distance between the third side of the third fixing portion and the fourth side of the welding terminal is 4.21 mm.

[0022] Optionally, the third fixing portion further includes a first positioning hole, and the fourth fixing portion further includes a second positioning hole;

[0023] In the third packaging area, the first positioning hole and the second positioning hole are symmetrical in position;

[0024] The distance between the center of the first positioning hole and the center of the second positioning hole is 17.24 mm.

[0025] Optionally, the first type Ethernet interface includes an 8-pin SMD socket.

[0026] Optionally, the second type of Ethernet interface includes an RJ45 interface.

[0027] In a second aspect, an embodiment of the utility model further provides a mainboard, comprising any one of the PCB structures described in the embodiments for being compatible with multiple Ethernet interfaces.

[0028] Compared with the prior art, the beneficial effect of the utility model is that: the utility model proposes a PCB structure, which includes a first packaging area including multiple welding terminals, a second packaging area including a first fixed terminal and a third packaging area including a second fixed terminal, wherein, based on a reasonable parameter design of the welding terminals, when different types of Ethernet interfaces are set on the PCB, they all occupy the same welding pin, and at the same time, based on a reasonable parameter design of the second packaging area and the third packaging area, when different types of Ethernet interfaces are set on the PCB, they all have available fixed ends, based on this, a PCB board can be made compatible with Ethernet interfaces of different packages, and there is no need to occupy additional board space or modify the board for different Ethernet interface designs, avoiding the inconvenience of increasing the types of boards in factory material preparation and avoiding increased costs on the design end. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic diagram of a PCB packaging structure in an embodiment;

[0030] Figure 2 It is another schematic diagram of PCB packaging structure in the embodiment. DETAILED DESCRIPTION

[0031] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0032] Embodiment 1

[0033] Figure 1 is a schematic diagram of the PCB packaging structure in the embodiment, refer to Figure 1 , the PCB structure includes: a first packaging area 100, a second packaging area 200 and a third packaging area 300;

[0034] The first packaging area 100 includes welding terminals for connecting the battery cells of the first type Ethernet interface and the second type Ethernet interface, which are the same as the welding terminals connected to different types of Ethernet interfaces;

[0035] The second packaging area 200 includes a first fixed terminal for connecting to a first fixed end of the first type Ethernet interface;

[0036] The third packaging area 300 includes a second fixed terminal for connecting to a second fixed end of the second type Ethernet interface.

[0037] In this solution, the number of cells of the first type Ethernet interface and the second type Ethernet interface is set to be the same. For example, the first type Ethernet interface and the second type Ethernet interface can both be RJ45 interfaces, optical fiber interfaces, etc.;

[0038] In this solution, the number of welding terminals configured in the first packaging area 100 is set to be the same as the number of battery cells of the first or second Ethernet interface. For example, if the RJ45 interface includes 8 battery cells, then the first packaging area 100 is correspondingly provided with 8 welding terminals.

[0039] In this solution, the first type of Ethernet interface and the second type of Ethernet interface are set to have the same soldering method. For example, both types of Ethernet interfaces can be surface mount devices or plug-in devices.

[0040] In this solution, setting the difference between the first type Ethernet interface and the second type Ethernet interface at least includes setting the first type Ethernet interface as a socket and setting the second type Ethernet interface as a network card interface.

[0041] In this solution, the encapsulation of different first-class Ethernet interfaces may be different. For example, the pin spacing of different first-class Ethernet interfaces may be different.

[0042] The packages of different second-type Ethernet interfaces may be different. For example, the cell pin spacings of different second-type Ethernet interfaces may be different.

[0043] In this scheme, Figure 1 For example only, the second packaging area 200 may be as follows Figure 1 The bilateral symmetrical setting shown, or the unilateral asymmetrical setting can also be used as required;

[0044] The third packaging area 300 may be Figure 1 The bilateral symmetrical setting shown is also possible, or the unilateral asymmetrical setting can be used as required.

[0045] In this solution, it is defined that the PCB (package) structure is used to be compatible with several specified first-class Ethernet interfaces and second-class Ethernet interfaces.

[0046] Exemplarily, in this solution, the PCB package can be designed in the following ways:

[0047] Obtain the PCB footprint of each specified Ethernet interface, determine the spacing between the pins of different Ethernet interfaces, and the position and size of the fixed end configured for each Ethernet interface;

[0048] Determine the spacing between the soldering terminals in the first packaging area 100 and the size of each soldering terminal (length and width if for SMD devices, and aperture if for plug-in devices);

[0049] Based on the above pin design, when different Ethernet interfaces are set on the PCB, the cells at the same position can share the corresponding welding terminals;

[0050] Based on the above design for the fixed end, when different Ethernet interfaces are set on the PCB, there are available fixed ends.

[0051] The present embodiment proposes a PCB structure, which includes a first packaging area including multiple welding terminals, a second packaging area including a first fixed terminal, and a third packaging area including a second fixed terminal, wherein based on reasonable parameter design of the welding terminals, when different types of Ethernet interfaces are set on the PCB, they all occupy the same welding pin, and based on reasonable parameter design of the second packaging area and the third packaging area, when different types of Ethernet interfaces are set on the PCB, they all have available fixed terminals. Based on this, a PCB board can be compatible with Ethernet interfaces of different packages, and there is no need to occupy additional board space or modify the board for different Ethernet interface designs, avoiding the inconvenience of factory material preparation caused by increasing the types of boards and avoiding increased costs on the design end.

[0052] Figure 2 is another schematic diagram of a PCB packaging structure in the embodiment, refer to Figure 2 ,exist Figure 1 Based on the scheme shown, in one possible implementation scheme, the shape of each welding terminal is set to be the same, and the welding terminals are arranged in parallel;

[0053] The distance between the central axes of two adjacent welding terminals is 1.016 mm, the width of each welding terminal is 0.7 mm, and the height of each welding terminal is 2.39 mm.

[0054] In this solution, the first type of Ethernet interface is set to an 8-pin SMD socket with a pin spacing of 1.0 mm, and the second type of Ethernet interface is set to an RJ45 interface, wherein the second type of Ethernet interface may include several RJ45 interfaces of specified models or specified packages.

[0055] Exemplarily, in this solution, it is assumed that both the first type Ethernet interface and the second type Ethernet interface are surface mount devices.

[0056] In this solution, for the first type Ethernet interface and the second type Ethernet interface of the selected model, according to the package of the above Ethernet interface, the PCB package is set to include 8 welding terminals, the spacing between the central axes of two adjacent welding terminals is set to 1.01mm, the width of each welding terminal is 0.7mm, and the height of each welding terminal is 2.39mm;

[0057] The distance between each soldering terminal and the PCB board is set to 0.4 mm.

[0058] refer to Figure 2 On the basis of any of the foregoing solutions, in one possible implementation scheme, the first fixed terminal is designed to include a first fixed portion 201 and a second fixed portion 202 .

[0059] In this solution, the first fixing portion and the second fixing portion are set to have the same shape, and the first fixing portion and the second fixing portion are set to be symmetrically arranged in the second packaging area, and the second packaging area is symmetrically arranged relative to the first packaging area.

[0060] refer to Figure 2 In this solution, the welding terminals are symmetrically arranged in the first packaging area, with the symmetry axis of the first packaging area in the vertical direction as the boundary, and the first fixing portion 201 and the second fixing portion 202 are symmetrically arranged on the left and right sides of the symmetry axis.

[0061] refer to Figure 2 , further, for the selected model of the first type Ethernet interface, the distance between the central axis (in the vertical direction) of the first fixing portion 201 and the central axis of the adjacent welding terminal (PIN8) is set to 2.02 mm, and the width of the first fixing portion 201 is set to 2.396 mm;

[0062] The distance between the first side of the first fixing portion 201 and the first side of the second fixing portion 202 is set to 12.35 mm;

[0063] The distance between the symmetry axis of the first fixing portion 201 in the horizontal direction and the fourth side of the welding terminal (in the vertical direction, the bottom end of the welding terminal) is set to 0.44 mm.

[0064] In this solution, the first fixing portion 201 and the second fixing portion 202 are configured to fix the 8-pin SMD socket.

[0065] refer to Figure 2 Based on any of the foregoing solutions, in one possible implementation, the second fixed terminal includes a third fixed portion and a fourth fixed portion.

[0066] In this solution, the third fixing portion and the fourth fixing portion are set to have the same shape, and the third fixing portion and the fourth fixing portion are set to be symmetrically arranged in the third packaging area, and the third packaging area is symmetrically arranged relative to the first packaging area.

[0067] refer to Figure 2 In this solution, the welding terminals are symmetrically arranged in the first packaging area, with the symmetry axis of the first packaging area in the vertical direction as the boundary, and the third fixing portion 301 and the fourth fixing portion 302 are symmetrically arranged on the left and right sides of the symmetry axis.

[0068] In this solution, the third fixing portion 301 and the fourth fixing portion 302 are configured to fix the RJ45 interface.

[0069] refer to Figure 2 , further, for the selected RJ45 interface of the specified model, the height of the third fixing portion 301 is set to 4.3 mm, and the width of the third fixing portion 301 is set to 2.62 mm;

[0070] The distance between the first side (the left side in the horizontal direction) of the third fixing portion 301 and the first side (the right side in the horizontal direction) of the fourth fixing portion 302 is 19.44 mm, and the distance between the second side (the right side in the horizontal direction) of the third fixing portion 301 and the second side (the left side in the horizontal direction) of the fourth fixing portion 302 is 14.2 mm;

[0071] The distance between the third side (upper side in the vertical direction) of the third fixing portion 301 and the fourth side of the welding terminal is 4.21 mm.

[0072] refer to Figure 2 Further, when the third packaging area includes a third fixing portion and a fourth fixing portion, the third fixing portion also includes a first positioning hole, and the fourth fixing portion also includes a second positioning hole.

[0073] In this solution, in the third packaging area, the positions of the first positioning hole and the second positioning hole are symmetrical, the distance between the center of the first positioning hole and the center of the second positioning hole is set to 17.24 mm, and the diameter of the first positioning hole is set to 1.00±0.05 mm.

[0074] refer to Figure 2 Based on any of the above solutions, in one possible implementation scheme, the PCB structure is set for the welding of a specified type of 8-pin SMD socket and a specified type of (SMD) RJ45 interface (including two types of RJ45 interfaces with the socket facing up and the socket facing down);

[0075] The PCB (package) structure includes a first package area, a second package area and a third package area which are arranged in sequence up and down in the vertical direction, wherein in the horizontal direction, the first package area, the second package area and the third package area are symmetrically located;

[0076] The first packaging area includes 8 welding terminals arranged side by side, and the second packaging area includes a first fixed end 201 and a second fixed end 202 arranged symmetrically in the vertical direction;

[0077] The third packaging area includes a third fixed end 301 and a fourth fixed end 302 which are symmetrically arranged in the vertical direction, the third fixed end 301 includes a first positioning hole, and the fourth fixed end 302 includes a second positioning hole;

[0078] In this solution, the PCB structure design parameters are as follows: Figure 2 As shown, including:

[0079] The distance between the central axes of two adjacent welding terminals is 1.016 mm, the width of each welding terminal is 0.7 mm, and the height of each welding terminal is 2.39 mm;

[0080] Set the distance between (each) solder terminal and the first side of the PCB board in the vertical direction to 0.4mm;

[0081] The distance between the first side of the first fixing portion 201 and the first side of the second fixing portion 202 is set to 12.35 mm;

[0082] The distance between the symmetric axis of the first fixing portion 201 in the horizontal direction and the first edge of the PCB plate in the vertical direction is 0.84 mm;

[0083] The height of the third fixing portion 301 is set to 4.3 mm;

[0084] The distance between the first side (the left side in the horizontal direction) of the third fixing portion 301 and the first side (the right side in the horizontal direction) of the fourth fixing portion 302 is 19.44 mm, and the distance between the second side (the right side in the horizontal direction) of the third fixing portion 301 and the second side (the left side in the horizontal direction) of the fourth fixing portion 302 is 14.2 mm;

[0085] The distance between the symmetry axis of the second fixed end 202 in the horizontal direction and the symmetry axis of the fourth fixed end 302 in the horizontal direction is 6.80 mm;

[0086] The distance between the second and third sides of the PCB board in the horizontal direction is 13.59mm;

[0087] The distance between the fourth side and the fifth side of the PCB board in the vertical direction is 8.10 mm;

[0088] The distance between the symmetry axis of the second fixing end 202 in the horizontal direction and the fifth side of the PCB board in the vertical direction is 9.80 mm.

[0089] The distance between the center of the first positioning hole and the center of the second positioning hole is set to 17.24 mm, and the diameter of the first positioning hole is set to 1.00±0.05 mm.

[0090] Embodiment 2

[0091] This embodiment proposes a mainboard, including any one of the PCB structures recorded in Embodiment 1 for being compatible with multiple Ethernet interfaces. The implementation method and beneficial effects of the PCB structure are the same as the corresponding contents recorded in Embodiment 1, and the specific contents will not be described in detail.

[0092] In this embodiment, there is no limitation on the usage scenario of the mainboard. For example, the mainboard may be an industrial computer mainboard, an Android system mainboard, etc.

[0093] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A PCB structure for being compatible with multiple Ethernet interfaces, characterized in that: include: a first packaging area, a second packaging area, and a third packaging area; The first packaging area includes welding terminals for connecting the battery cells of the first type Ethernet interface and the second type Ethernet interface, which are the same as the welding terminals connected to the Ethernet interfaces of different types; The second encapsulation area includes a first fixed terminal for connecting to a first fixed end of the first type Ethernet interface; The third packaging area includes a second fixed terminal for connecting to a second fixed end of the second type Ethernet interface.

2. The PCB structure for being compatible with multiple Ethernet interfaces as claimed in claim 1, characterized in that: Each of the welding terminals has the same shape, and the welding terminals are arranged in parallel; The distance between the central axes of two adjacent welding terminals is 1.01 mm, the width of each welding terminal is 0.7 mm, and the height of each welding terminal is 2.39 mm.

3. The PCB structure for being compatible with multiple Ethernet interfaces as claimed in claim 2, characterized in that: The first fixed terminal includes a first fixed portion and a second fixed portion; The first fixing portion and the second fixing portion have the same shape; The first fixing portion and the second fixing portion are symmetrically arranged in the second packaging area, and the second packaging area is symmetrically arranged relative to the first packaging area.

4. The PCB structure for being compatible with multiple Ethernet interfaces as claimed in claim 2, characterized in that: The second fixed terminal includes a third fixed portion and a fourth fixed portion; The third fixing portion has the same shape as the fourth fixing portion; The third fixing portion and the fourth fixing portion are symmetrically arranged in the third packaging area, and the third packaging area is symmetrically arranged relative to the first packaging area.

5. The PCB structure for being compatible with multiple Ethernet interfaces as claimed in claim 3, characterized in that: The distance between the central axis of the first fixing portion and the central axis of the adjacent welding terminal is 2.02 mm; The distance between the first side of the first fixing portion and the first side of the second fixing portion is 12.35 mm.

6. The PCB structure for being compatible with multiple Ethernet interfaces as claimed in claim 4, characterized in that: The height of the third fixing portion is 4.3 mm; The distance between the first side of the third fixing portion and the first side of the fourth fixing portion is 19.44 mm, and the distance between the second side of the third fixing portion and the second side of the fourth fixing portion is 14.2 mm; The distance between the third side of the third fixing portion and the fourth side of the welding terminal is 4.21 mm.

7. The PCB structure for being compatible with multiple Ethernet interfaces as claimed in claim 6, characterized in that: The third fixing portion further includes a first positioning hole, and the fourth fixing portion further includes a second positioning hole; In the third packaging area, the first positioning hole and the second positioning hole are symmetrical in position; The distance between the center of the first positioning hole and the center of the second positioning hole is 17.24 mm.

8. The PCB structure for being compatible with multiple Ethernet interfaces as claimed in claim 1, characterized in that: The first type of Ethernet interface includes an 8-pin SMD connector.

9. The PCB structure for compatibility with multiple Ethernet interfaces as claimed in claim 1, characterized in that: The second type of Ethernet interface includes an RJ45 interface.

10. A motherboard, characterized in that: A PCB structure for being compatible with multiple Ethernet interfaces comprising any one of claims 1 to 9.

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