Light source device and projection device

Abstract

The embodiment of the utility model provides a light source device and a projection device, the light source device comprises a substrate, a light-emitting chip, a wavelength conversion layer, an enclosure layer, a supporting structure and a conical rod, and the light-emitting chip is arranged on the substrate; the wavelength conversion layer is disposed on a surface of the light-emitting chip away from the substrate. The enclosure layer is arranged on the surface of the substrate and surrounds the light-emitting chip and the wavelength conversion layer, the supporting structure is arranged on the enclosure layer, the conical rod is provided with a light inlet end, the light inlet end is fixed to the supporting structure, the end face of the light inlet end corresponds to the wavelength conversion layer, and a gap is formed between the end face of the light inlet end and the wavelength conversion layer. The supporting structure is arranged, and the conical rod is supported and fixed on the supporting structure, so that a gap is formed between the end face of the conical rod and the surface of the wavelength conversion layer, the phenomenon of light leakage caused by similar refractive indexes of light rays between the end face of the conical rod and the surface of the wavelength conversion layer is prevented, the light efficiency is improved, and good color uniformity is kept. And meanwhile, the supporting structure can play a role in fixing the cone rod, and the installation stability of the cone rod is improved.

Description

Technical Field

[0001] The present application relates to the technical field of light source equipment, and in particular to a light source device and a projection device. Background Art

[0002] As a new type of energy-saving light source, LED has been widely used in the fields of lighting and projection. SMD ceramic packaged LED lamp beads that meet the projection market have good light source color uniformity, high brightness, good heat dissipation performance, high reliability, and can withstand high operating temperatures. When used as an LCD backlight source, the overall consistency is high.

[0003] In backlight projection applications, blue light will leak when the light-emitting surface of the SMD ceramic package LED fluorescent film is attached to the silicone cone rod. During bonding, due to the similar refractive index of the fluorescent film on the LED surface and the silicone cone rod, the total reflection of light at the interface between the two will be reduced. More blue light will be emitted from the surface of the fluorescent film and enter the cone rod and escape from the cone rod, causing the light efficiency to decrease and making it difficult to ensure the normal color of the light. Utility Model Content

[0004] The embodiments of the present application provide a light source device and a projection device to at least partially improve the above technical problems.

[0005] In a first aspect, an embodiment of the present application provides a light source device, including a substrate, a light-emitting chip, a wavelength conversion layer, a protective layer, a support structure, and a tapered rod, wherein the light-emitting chip is disposed on the substrate and is used to emit excitation light; the wavelength conversion layer is disposed on a surface of the light-emitting chip away from the substrate and is used to convert the excitation light into converted light. The protective layer is disposed on the surface of the substrate and surrounds the light-emitting chip and the wavelength conversion layer, the support structure is disposed on the protective layer, and the tapered rod has a light input end, the light input end is fixed to the support structure, and the end face of the light input end corresponds to the wavelength conversion layer and has a gap with the wavelength conversion layer.

[0006] In one embodiment, the support structure is bonded to the enclosure.

[0007] In one embodiment, the supporting structure includes a positioning plate, which is arranged on the enclosure layer and has a through hole corresponding to the wavelength conversion layer, and the light incident end is embedded in the through hole and fixed to the positioning plate.

[0008] In one embodiment, a step is provided in the through hole, and the light incident end abuts against the step.

[0009] In one embodiment, the positioning sheet is a ceramic sheet or a metal sheet.

[0010] In one embodiment, the supporting structure includes a positioning plate and a gasket. The gasket is arranged on the protective layer and has a first through hole corresponding to the wavelength conversion layer. The positioning plate is arranged on the surface of the gasket away from the protective layer and has a second through hole corresponding to the first through hole. The aperture of the second through hole is larger than the aperture of the first through hole. The light incident end is embedded in the second through hole and abuts against the gasket.

[0011] In one embodiment, the inner wall surrounding the second through hole is in contact with the outer wall of the light incident end.

[0012] In one embodiment, the positioning plate is a ceramic plate or a metal plate.

[0013] In one embodiment, the positioning plate and the spacer are bonded.

[0014] In a second aspect, an embodiment of the present application further provides a projection device, comprising the above-mentioned light source device.

[0015] The light source device and the projection device provided by the embodiment of the present application are provided with a support structure on the protective layer on the base, and the cone rod is supported and fixed on the support structure, so that a gap is formed between the end face of the cone rod and the surface of the wavelength conversion layer, thereby preventing light from leaking between the end face of the cone rod and the surface of the wavelength conversion layer due to similar refractive index, improving light efficiency, and maintaining good color uniformity of the light source device. At the same time, the support structure can fix the cone rod and improve the installation stability of the cone rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the description of the implementation modes will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A schematic structural diagram of a light source device in a related technology shown in an embodiment of the present application.

[0018] Figure 2 A schematic diagram of the structure of a light source device proposed in an embodiment of the present application.

[0019] Figure 3 for Figure 2 A schematic cross-sectional structure diagram of a light source device is shown.

[0020] Figure 4 for Figure 2 A structural schematic diagram of a supporting structure in a light source device is shown.

[0021] Figure 5This is a schematic cross-sectional structure diagram of another light source device proposed in an embodiment of the present application.

[0022] Figure 6 for Figure 5 A structural schematic diagram of a supporting structure in a light source device is shown.

[0023] Figure 7 It is a working principle diagram of the light source device proposed in the embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the implementation mode of the present application. Obviously, the described implementation mode is only a part of the implementation mode of the present application, not all the implementation modes. Based on the implementation mode in the present application, all other implementation modes obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0025] In this application, unless otherwise clearly specified or limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be internal communication between two elements, or it can be only surface contact, or surface contact connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] In addition, the terms "first", "second", etc. are only used to distinguish descriptions and cannot be understood as specific or special structures. The descriptions of the terms "some embodiments", "other embodiments", etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0027] In backlight projection applications, blue light will leak when the light-emitting surface of the SMD ceramic package LED fluorescent film is attached to the silicone cone rod. During bonding, due to the similar refractive index of the fluorescent film on the LED surface and the silicone cone rod, the total reflection of light at the interface between the two will be reduced. More blue light will be emitted from the surface of the fluorescent film and enter the cone rod and escape from the cone rod, causing the light efficiency to decrease and making it difficult to ensure the normal color of the light.

[0028] like Figure 1 As shown, Figure 1 A conical rod installation structure in the related art is shown, wherein a light-emitting chip 2 is arranged on a substrate 1, a wavelength conversion layer 3 is arranged on a surface of the light-emitting chip 2 away from the substrate 1, a protective layer 5 is arranged around the light-emitting chip 2 and the wavelength conversion layer 3 to protect the light-emitting chip 2 and the wavelength conversion layer 3, the end face size of the conical rod 4 is larger than the size of the wavelength conversion layer 3, the end face of the conical rod 4 is arranged on the surface of the protective layer 5 and the wavelength conversion layer 3, and the end face of the conical rod 4 is bonded to the surface of the protective layer 5 and the wavelength conversion layer 3.

[0029] Since the end face of the cone rod 4 and the surface of the wavelength conversion layer 3 are directly bonded, and the refractive index of the wavelength conversion layer 3 is similar to that of the cone rod 4, when the excitation light is emitted from the wavelength conversion layer 3, part of the excitation light does not undergo total reflection at the interface between the end face of the cone rod 4 and the surface of the wavelength conversion layer 3, but directly enters the cone rod 4 and then escapes from the cone rod 4, and cannot be fully converted into converted light, resulting in light leakage. This not only reduces the light efficiency, but also the excitation light may be mixed with the converted light after leaking out, resulting in poor uniformity of the emitted light.

[0030] Based on this, the inventor of the present application proposed a light source device and a projection device to overcome the above technical defects. The light source device and the projection device of the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0031] Example

[0032] Please also read Figure 2 and Figure 3 This embodiment provides a light source device 10, including a substrate 1, a light-emitting chip 2, a wavelength conversion layer 3, a protective layer 5, a cone rod 4 and a supporting structure 6, wherein the light-emitting chip 2 and the wavelength conversion layer 3 are used to form an output light, the protective layer 5 is arranged on the substrate 1 and is used to protect the light-emitting chip 2 and the wavelength conversion layer 3, and the supporting structure 6 is arranged on the protective layer 5 and is used to fix the cone rod 4.

[0033] Specifically, the substrate 1 is a roughly flat plate-shaped result. In this embodiment, the substrate 1 is a ceramic substrate. The substrate 1 is sintered with a high thermal conductivity ceramic material. The high thermal conductivity ceramic material can be at least one of aluminum oxide, aluminum nitride and silicon carbide, which is not limited in this embodiment. In some other embodiments, the substrate 1 can also be made of a metal material, such as copper. In this embodiment, the light source device 10 also includes a base 7, and the base is fixed on the base 7, and the base 7 can be one or more, which is not limited in this embodiment.

[0034] The light-emitting chip 2 may be a blue light LED chip for emitting blue light as excitation light. The light-emitting chip 2 is disposed on the surface of the substrate 1. As a more specific embodiment, the light-emitting chip 2 may be a gallium nitride-based light-emitting diode flip chip. Of course, in some other embodiments, the light-emitting chip 2 may also be a chip that emits excitation light of other colors. The light-emitting chip 2 may be bonded to the surface of the substrate 1. The wavelength conversion layer 3 is disposed on the surface of the light-emitting chip 2 away from the substrate 1 and completely covers the surface of the light-emitting chip 2 away from the substrate 1. The wavelength conversion layer 3 may be used to convert the excitation light into the stimulated light. For example, the wavelength conversion layer 3 may convert the blue excitation light into yellow fluorescence. The wavelength conversion layer 3 may be formed on the surface of the light-emitting chip 2 by bonding.

[0035] The wavelength conversion layer 3 can be a silica gel fluorescent film, fluorescent ceramics, etc., including fluorescent powder, which is not limited in this embodiment. Among them, the fluorescent powder in the wavelength conversion layer 3 can be a monochrome fluorescent powder, or a mixture of fluorescent powders of multiple different colors or the same color. The fluorescent powder is selected from at least one of YAG fluorescent powder, nitride fluorescent powder, oxide fluorescent powder, aluminate fluorescent powder, and silicate fluorescent powder. The thickness of the wavelength conversion layer 3 can be 40μm to 200μm. When the light-emitting chip 2 emits excitation light, the excitation light enters the wavelength conversion layer 3 and is converted into converted light by the wavelength conversion layer 3. The converted converted light is emitted from the wavelength conversion layer 3.

[0036] The protective layer 5 is arranged on the surface of the substrate 1 and surrounds the light-emitting chip 2 and the wavelength conversion layer 3. The protective layer 5 can be composed of resin silicone and reflective powder. The resin silicone is methyl silicone or phenyl silicone, and the reflective powder is oxide, and the appearance is white. During preparation, a piezoelectric valve is used to dispense glue, and the points are connected into lines, so that the resin silicone filled with reflective powder can be quickly diffused for filling. After dispensing, it is placed on a vacuum hot plate platform to remove the overflow glue, and then cured and baked to form the protective layer 5. The protective layer 5 can limit the light output area of ​​the light-emitting chip 2, and at the same time protect the light-emitting chip 2 and the wavelength conversion layer 3.

[0037] When forming the protective layer 5, the protective layer 5 can completely fill the surface of the substrate 1 where the light-emitting chip 2 is not arranged, and in a more specific embodiment, the surface of the protective layer 5 away from the substrate 1 can be flush with the surface of the wavelength conversion layer 3 away from the light-emitting chip 2. This arrangement can make the formation process of the protective layer 5 simpler and facilitate the positioning of the support structure 6 when the support structure 6 is subsequently arranged. Of course, in some other embodiments, the surface of the protective layer 5 away from the substrate 1 may not be flush with the surface of the wavelength conversion layer 3 away from the light-emitting chip 2, for example: the surface of the protective layer 5 away from the substrate 1 may be higher than the surface of the wavelength conversion layer 3 away from the light-emitting chip 2, or the surface of the protective layer 5 away from the substrate 1 may be lower than the surface of the wavelength conversion layer 3 away from the light-emitting chip 2.

[0038] The cone rod 4 is a light-guiding device, which is roughly cone-shaped. The cone rod 4 includes a light input end 41 and a light output end. Light can enter the cone rod 4 from the light input end 41, and be emitted from the light output end after being conducted by the cone rod 4. The cross-sectional area of ​​the light input end 41 is smaller than the cross-sectional area of ​​the light output end, and the cross-sectional area of ​​the cone rod 4 gradually decreases in the direction from the light output end to the light input end 41. In this embodiment, the cross-sectional area of ​​the cone rod 4 is rectangular. It can be understood that in some other embodiments, the cross-sectional area of ​​the cone rod 4 can also be other shapes, which is not limited in this embodiment.

[0039] The support structure 6 is disposed on the enclosure 5, specifically, on the surface of the enclosure 5 away from the substrate 1, and is used to fix the cone rod 4. The support structure 6 can be fixed to the enclosure 5 by bonding, and in some other embodiments, the support structure 6 can also be fixed to the enclosure 5 by other means, such as by screws, etc., which is not limited in this embodiment.

[0040] In this embodiment, refer to Figure 4 The support structure 6 includes a positioning sheet 61, which is a roughly plate-shaped structure. The positioning sheet 61 is arranged on the enclosure layer 5, and the positioning sheet 61 is provided with a through hole 612 corresponding to the wavelength conversion layer 3. The cross-sectional area of ​​the through hole 612 is greater than or equal to the cross-sectional area of ​​the wavelength conversion layer 3, and the orthographic projection of the wavelength conversion layer 3 on the substrate 1 is completely within the range of the orthographic projection of the through hole 612 on the substrate 1, so that the wavelength conversion layer 3 can be completely exposed from the through hole 612, so that the converted light formed after the wavelength conversion layer 3 is converted will not be blocked by the positioning sheet 61. The light input end 41 is embedded in the through hole 612 and fixed to the positioning sheet 61. Among them, the positioning sheet 61 can be a ceramic sheet or a metal sheet, which is not limited in this embodiment. Both the ceramic sheet and the metal sheet have high structural strength, so they can fix the cone rod 4 more stably. In some other embodiments, the positioning sheet 61 can also be made of other materials, such as graphite.

[0041] The light input end 41 can be fixed to the support structure 6 by interference fit, bonding, etc. In this embodiment, a step 611 is provided in the through hole 612, and the light input end 41 abuts against the step 611, and an adhesive can be provided on the step 611 so that the light input end 41 is bonded to the positioning sheet 61. Since the step 611 is provided, when the light input end 41 abuts against the step 611, a gap 8 is formed between the surface of the wavelength conversion layer 3 away from the substrate 1. In some other embodiments, the step 611 may not be provided, and an adhesive may be provided on the side wall of the light input end 41 and bonded to the inner wall surrounding the through hole 612. At this time, the depth of the light input end 41 embedded in the through hole 612 can be controlled, so that a gap 8 is formed between the end face of the light input end 41 of the patch plate and the wavelength conversion layer 3.

[0042] The width of the gap 8 between the end face of the light incident end 41 and the wavelength conversion layer 3 can be, for example, 1μm to 200μm. Of course, in some other embodiments, the width of the gap 8 between the end face of the light incident end 41 and the wavelength conversion layer 3 can be, for example, other values, which is not limited in this embodiment.

[0043] In order to better fix the cone rod 4, the inner wall of the through hole 612 can be set to a structure that matches the outer wall of the cone rod 4. For example, in this embodiment, the cross section of the through hole 612 can be set to a rectangle that matches the cross section of the cone rod 4. At the same time, the aperture of the through hole 612 gradually decreases from the end away from the base 1 to the step 611, and the inner wall of the through hole 612 is completely in contact with the outer wall of the cone rod 4.

[0044] In another embodiment, please refer to Figure 5 and Figure 6 The support structure 6 may include a positioning plate 62 and a gasket 63, the gasket 63 is arranged on the protective layer 5 and is provided with a first through hole 631 corresponding to the wavelength conversion layer 3, the cross-sectional area of ​​the first through hole 631 is greater than or equal to the cross-sectional area of ​​the wavelength conversion layer 3, and the orthographic projection of the wavelength conversion layer 3 on the substrate 1 is completely within the range of the orthographic projection of the first through hole 631 on the substrate 1, so that the wavelength conversion layer 3 can be completely exposed from the first through hole 631, so that the converted light formed after the wavelength conversion layer 3 is not blocked by the gasket 63.

[0045] The positioning plate 62 is arranged on the surface of the gasket 63 away from the enclosure layer 5. For example, the positioning plate 62 can be connected to the gasket 63 by bonding. The positioning plate 62 is provided with a second through hole 621 corresponding to the first through hole 631. The first through hole 631 can be coaxially arranged with the second through hole 621. The aperture of the second through hole 621 is larger than the aperture of the first through hole 631. The light-incoming end 41 is embedded in the second through hole 621 and abuts against the gasket 63. At this time, the gasket 63 supports the cone rod 4, and a gap 8 is formed between the end face of the light-incoming end 41 of the cone rod 4 and the wavelength conversion layer 3. The width of the gap 8 is equal to the thickness of the gasket 63. In order to better fix the cone rod 4, the inner wall surrounding the second through hole 621 can be set to a structure that is compatible with the outer wall of the cone rod 4. For example, in this embodiment, the cross section of the second through hole 621 can be set to a rectangle that matches the cross section of the second cone rod 4. At the same time, the aperture of the second through hole 621 gradually decreases from the end away from the substrate 1 to the step 611 , and the inner wall surrounding the second through hole 621 is completely in contact with the outer wall of the cone rod 4 .

[0046] The positioning plate 62 may be a ceramic plate or a metal plate, both of which have high structural strength, and thus can more stably fix the cone rod 4. This embodiment is not limited to this, and in some other embodiments, the positioning plate 62 may also be made of other materials, such as graphite. At the same time, the gasket 63 may also be made of materials such as ceramics or metals.

[0047] See also Figure 7 In the light source device 10 provided in this embodiment, when the light emitting chip 2 emits excitation light, the excitation light enters the wavelength conversion layer 3, and the wavelength conversion layer 3 converts the excitation light. In the conversion process, due to the influence of conversion efficiency, the excitation light cannot be completely converted at the first time, and part of the excitation light will reach the surface of the wavelength conversion layer 3 away from the light emitting chip 2. Since there is a gap 8 between the wavelength conversion layer 3 and the end face of the light incident end 41 of the cone rod 4, and there is air in the gap 8, since the refractive index of the material of the wavelength conversion layer 3 is significantly greater than the refractive index of air, the excitation light reaching the surface of the wavelength conversion layer 3 away from the light emitting chip 2 will be totally reflected back to the wavelength conversion layer 3 at the interface between the wavelength conversion layer 3 and the space, and will continue to be converted by the wavelength conversion layer 3. The excitation light will not directly enter the air and the cone rod 4 to cause light leakage, and the converted converted light will enter the cone rod 4 through the air in the gap 8 and be emitted. In this way, the light conversion efficiency of the wavelength conversion layer 3 is significantly improved, and at the same time, it is also avoided that the excitation light leaks into the converted light and causes the color of the converted light to be uneven.

[0048] The present embodiment further provides a projection device (not shown), which includes the above-mentioned light source device 10. The projection device may include an image display unit (not shown), and the image display unit includes the above-mentioned light source device 1010. The image display unit may also selectively include a spatial light modulator, a lens group and other devices, which is not limited to the present embodiment. The projection device can be configured as a HUD device, for example, for use in application scenarios such as in a car, or the projection device can also be configured in other forms, which is not limited to the present embodiment.

[0049] The above implementation modes are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned implementation modes, a person skilled in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various implementation modes of the present application, and should all be included in the protection scope of the present application.

Claims

1. A light source device, characterized in that: include: substrate; A light-emitting chip, which is disposed on the substrate and is used to emit excitation light; A wavelength conversion layer, which is disposed on a surface of the light-emitting chip away from the substrate and is used to convert the excitation light into the converted light; A protective layer, the protective layer is arranged on the surface of the substrate and surrounds the light-emitting chip and the wavelength conversion layer; A supporting structure, wherein the supporting structure is arranged on the enclosure layer; as well as A tapered rod, wherein the tapered rod has a light incident end, the light incident end is fixed to the supporting structure, an end face of the light incident end corresponds to the wavelength conversion layer and there is a gap between the light incident end and the wavelength conversion layer.

2. The light source device according to claim 1, characterized in that: The supporting structure is bonded to the enclosure layer.

3. The light source device according to claim 1 or 2, characterized in that: The supporting structure comprises a positioning plate, which is arranged on the enclosure layer and has a through hole corresponding to the wavelength conversion layer, and the light incident end is embedded in the through hole and fixed to the positioning plate.

4. The light source device according to claim 3, characterized in that: A step is arranged in the through hole, and the light incident end abuts against the step.

5. The light source device according to claim 3, characterized in that: The positioning sheet is a ceramic sheet or a metal sheet.

6. The light source device according to claim 1 or 2, characterized in that: The supporting structure includes a positioning plate and a gasket, wherein the gasket is arranged on the protective layer and is provided with a first through hole corresponding to the wavelength conversion layer, the positioning plate is arranged on a surface of the gasket away from the protective layer and is provided with a second through hole corresponding to the first through hole, the aperture of the second through hole is larger than the aperture of the first through hole, and the light incident end is embedded in the second through hole and abuts against the gasket.

7. The light source device according to claim 6, characterized in that: The inner wall surrounding the second through hole is in contact with the outer wall of the light incident end.

8. The light source device according to claim 6, characterized in that: The positioning plate is a ceramic plate or a metal plate.

9. The light source device according to claim 6, characterized in that: The positioning plate and the gasket are bonded.

10. A projection device, characterized in that: Comprising the light source device as described in any one of claims 1-9.

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