Display panel and display device

Abstract

The embodiment of the utility model provides a display panel, and belongs to the technical field of display. The display panel comprises a driving backboard, a pixel definition layer and a light-emitting function layer. The pixel definition layer and the light-emitting function layer are located on the first surface of the driving backboard. The pixel definition layer comprises a plurality of first openings distributed in an array mode, the light-emitting function layer comprises a plurality of light-emitting units distributed in an array mode, and at least parts of the light-emitting units are located in the corresponding first openings. Each light-emitting unit comprises a first electrode, a light-emitting layer and a second electrode which are sequentially stacked on the first surface, and the light-emitting layer comprises a first sub-layer, a light-emitting material layer and a second sub-layer which are sequentially stacked on the first surface. A first groove is formed in the side wall of the first opening, one end, far away from the driving back plate, of the first groove breaks the first sub-layers of the light emitting units, and the broken positions of the first sub-layers are connected with the side wall of the first opening. According to the embodiment of the invention, the problem of abnormal display caused by electric leakage due to too short distance between the first sub-layer and the second electrode is solved.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Display devices have a wide range of application scenarios in life, such as mobile phones, tablet computers and other electronic devices. Display panels are an important component of display devices.

[0003] In the related art, the display panel includes a driving backplane, a pixel definition layer and a light-emitting function layer, wherein the pixel definition layer and the light-emitting function layer are located on the first surface of the driving backplane. The pixel definition layer has a plurality of openings distributed in an array, and the light-emitting function layer includes a plurality of light-emitting units distributed in an array. A light-emitting unit is provided in each opening. Each light-emitting unit includes a first electrode, a light-emitting layer and a second electrode stacked in sequence on the first surface.

[0004] However, some sublayers in the light-emitting layer of some light-emitting units (such as the hole injection layer and the hole transport layer) may climb up along the side walls of the opening, causing the distance between some sublayers in the light-emitting layer electrically connected to the first electrode and the second electrode to be too close, resulting in leakage, and further causing display abnormalities. Utility Model Content

[0005] The embodiments of the present disclosure provide a display panel and a display device, which can improve the problem that the distance between the sub-layers in the light-emitting layer electrically connected to the first electrode and the second electrode is too close, causing leakage and thus causing display abnormality. The technical solution is as follows:

[0006] On the one hand, a display panel is provided, which includes a driving backplane, a pixel definition layer and a light-emitting function layer, wherein the pixel definition layer and the light-emitting function layer are located on the first surface of the driving backplane; the pixel definition layer includes a plurality of first openings distributed in an array, and the light-emitting function layer includes a plurality of light-emitting units distributed in an array, wherein the plurality of light-emitting units correspond one-to-one to the plurality of first openings and at least part of the light-emitting units are located in the corresponding first openings; each of the light-emitting units includes a first electrode, a light-emitting layer, and a second electrode stacked in sequence on the first surface, and the light-emitting layer includes a first sublayer, a light-emitting material layer, and a second sublayer stacked in sequence on the first surface; the sidewall of the first opening has a first groove, and the first sublayer is connected to the sidewall of the first opening.

[0007] Optionally, the pixel definition layer includes a first pixel definition sublayer, a second pixel definition sublayer and a third pixel definition sublayer stacked in sequence on the first surface; the surface of the second pixel definition sublayer close to any of the light-emitting units is recessed in the surface of the third pixel definition sublayer close to the same light-emitting unit to form the first groove.

[0008] Optionally, the distance between the edge of the orthographic projection of the second pixel definition sublayer on the first surface and the edge of the orthographic projection of the third pixel definition sublayer on the first surface is greater than 0.1 μm and less than one third of the dimension of the third pixel definition sublayer located between two adjacent light-emitting units 20 in a direction parallel to the first surface.

[0009] Optionally, the thickness of the second pixel definition sublayer is greater than half of the thickness of the first sublayer.

[0010] Optionally, the first pixel definition sublayer and the third pixel definition sublayer are silicon oxide layers, and the second pixel definition sublayer is a silicon nitride layer.

[0011] Optionally, the display panel also includes an isolation layer, which is located on a side of the pixel definition layer away from the driving backplane, and the isolation layer includes a plurality of second openings distributed in an array, the plurality of light-emitting units correspond one-to-one to the second openings, and a portion of the light-emitting units is located in the corresponding second openings; the side wall of the second opening has a second groove, and the second electrode is connected to the side wall of the second opening.

[0012] Optionally, the isolation layer includes a first isolation sublayer and a second isolation sublayer stacked sequentially on the first surface; the surface of the first isolation sublayer close to any of the light-emitting units is recessed into the surface of the second isolation sublayer close to the same light-emitting unit to form the second groove.

[0013] Optionally, the first partition sublayer is an insulating layer, a semiconductor layer or a conductive layer, and the second partition sublayer is an insulating layer.

[0014] Optionally, the display panel also includes an encapsulation layer and an auxiliary connection layer stacked in sequence on a side of the light-emitting functional layer away from the driving backplane, the encapsulation layer has a plurality of vias, the plurality of vias correspond one-to-one to the plurality of light-emitting units, the auxiliary connection layer is connected to the second electrodes of the plurality of light-emitting units through the plurality of vias; the auxiliary connection layer is a conductive layer.

[0015] Optionally, the driving backplane is a silicon-based driving backplane.

[0016] Optionally, the first electrode is a metal structure, and the second electrode is a semi-transmissive and semi-reflective structure.

[0017] Optionally, the plurality of light emitting units include a first light emitting unit, a second light emitting unit and a third light emitting unit, and the first light emitting unit, the second light emitting unit and the third light emitting unit emit different colors.

[0018] Optionally, the display panel further includes a plurality of microlens structures, and the plurality of microlens structures are located on a side of the light-emitting functional layer away from the driving backplane.

[0019] On the other hand, a display device is provided. The display device includes a power supply circuit and any one of the above-mentioned display panels, wherein the power supply circuit supplies power to the display panel.

[0020] The beneficial effects brought about by the technical solution provided by the present disclosure include at least: by setting a first groove on the side wall of the first opening in the pixel definition layer, partial sub-layers of the light-emitting layer electrically connected to the first electrode of different light-emitting units are fully isolated, and partial sub-layers electrically connected to the first electrode are prevented from climbing up along the side wall of the first opening, thereby improving the problem of leakage caused by the close distance between the partial sub-layer electrically connected to the first electrode and the second electrode, which in turn causes display abnormality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 is a schematic diagram of a cross-sectional structure of a display panel provided by an embodiment of the present disclosure;

[0023] Figure 2 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure;

[0024] Figure 3 is a schematic diagram of a cross-sectional structure of a silicon-based driving backplane provided in an embodiment of the present disclosure;

[0025] Figure 4 is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present disclosure;

[0026] Figures 5 to 8 It is the first part to the fourth part of the flowchart of another method for manufacturing a display panel provided by an embodiment of the present disclosure.

[0027] Legend:

[0028] 100, driving backplane A, first surface x, first direction 10, wiring

[0029] 101, substrate 102, source-drain electrode layer 1021, source electrode 1022, drain electrode 103, gate insulating layer 104, gate layer 1040, gate electrode 105, first insulating layer 106, second insulating layer 107, planarization layer 108, isolation groove

[0030] 200, light-emitting functional layer 20, light-emitting unit 201, first light-emitting unit 202, second light-emitting unit 203, third light-emitting unit

[0031] 21, first electrode 21a, first sublayer 21b of first electrode, second sublayer 21c of first electrode, third sublayer 21d of first electrode, fourth sublayer 21e of first electrode, fifth sublayer 22 of first electrode, light-emitting layer 22a, first sublayer 22b, light-emitting material layer 22c, second sublayer 23, second electrode

[0032] 300, pixel definition layer 30, first opening 30a, first groove

[0033] 301, first pixel definition sublayer 302, second pixel definition sublayer 303, third pixel definition sublayer

[0034] 400, isolation layer 40, second opening 40a, second groove

[0035] 401, first partition sublayer 402, second partition sublayer

[0036] 500, encapsulation layer 50, through hole 600, auxiliary connection layer 700, microlens structure 800, filling layer 900, bonding layer DETAILED DESCRIPTION

[0037] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0038] The terms used in the embodiments of the present disclosure are only used to explain the embodiments of the present disclosure, and are not intended to limit the present disclosure. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be the usual meanings understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second", "third" and similar words used in the patent application specification and claims of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "one" do not indicate quantitative restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing in front of "include" or "comprise" cover the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. The directional terms mentioned in the present disclosure, such as "top", "bottom", "up", "down", "left" or "right", etc., are only referenced to the directions of the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present disclosure, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present disclosure.

[0039] Figure 1 is a schematic diagram of a cross-sectional structure of a display panel provided by an embodiment of the present disclosure, Figure 2 Schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure. Figure 1 and Figure 2As shown, the display panel includes a driving backplane 100, a pixel definition layer 300 and a light-emitting function layer 200, and the pixel definition layer 300 and the light-emitting function layer 200 are located on the first surface A of the driving backplane 100. The pixel definition layer 300 includes a plurality of first openings 30 distributed in an array, and the light-emitting function layer 200 includes a plurality of light-emitting units 20 distributed in an array, and the plurality of light-emitting units 20 correspond to the plurality of first openings 30 one by one, and at least part of the light-emitting unit 20 is located in the corresponding first opening 30. Each light-emitting unit 20 includes a first electrode 21, a light-emitting layer 22, and a second electrode 23 sequentially stacked on the first surface A, and the light-emitting layer 22 includes a first sublayer 22a, a light-emitting material layer 22b, and a second sublayer 22c sequentially stacked on the first surface A. The sidewall of the first opening 30 has a first groove 30a, and the first sublayer 22a is connected to the sidewall of the first opening 30. That is, the first sublayer 22a of the plurality of light-emitting units 20 is disconnected at one end of the first groove 30a away from the driving backplane 100, and the disconnected portion of the first sublayer 22a is connected to the side wall of the first opening 30. By providing the first groove 30a on the side wall of the first opening 30 in the pixel definition layer 300, part of the sublayer of the light-emitting layer 22 electrically connected to the first electrode 21 of different light-emitting units 20, namely, the first sublayer 22a, is fully isolated, and the first sublayer 22a electrically connected to the first electrode 21 is prevented from climbing up along the side wall of the first opening 30, thereby improving the problem of leakage caused by the close distance between the first sublayer 22a electrically connected to the first electrode 21 and the second electrode 23, thereby improving the problem of display abnormality.

[0040] Optionally, the first electrode 21 is an anode, and the second electrode 22 is a cathode.

[0041] Optionally, the first electrode 21 is made of metal. Optionally, the first electrode 21 is made of one metal; or the first electrode 21 includes a plurality of stacked metal layers. Figure 1 As shown, the first electrode 21 may include a first sublayer 21a of the first electrode, a second sublayer 21b of the first electrode, a third sublayer 21c of the first electrode, a fourth sublayer 21d of the first electrode and a fifth sublayer 21e of the first electrode stacked in sequence on the first surface A. The first sublayer 21a of the first electrode may be made of a titanium layer, the second sublayer 21b of the first electrode may be made of a titanium nitride layer, the third sublayer 21c of the first electrode may be made of aluminum, the fourth sublayer 21d of the first electrode may be made of titanium nitride, and the fifth sublayer 21e of the first electrode may be made of indium tin oxide.

[0042] Optionally, the display panel further includes a filling structure 1000, and the filling structure 1000 is located between two adjacent first electrodes 21 and is used to separate the plurality of first electrodes 21. Optionally, the filling structure 1000 is made of an inorganic material, such as silicon oxide.

[0043] Optionally, in the light-emitting layer 22, the first sublayer 22a includes at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron blocking layer (EBL) sequentially stacked on the first surface A, for example, the first sublayer 22a only includes the hole transport layer. The second sublayer 22c includes at least one of a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL) sequentially stacked on the first surface A.

[0044] For example, Figure 1 As shown, the pixel definition layer 300 includes a first pixel definition sublayer 301, a second pixel definition sublayer 302, and a third pixel definition sublayer 303 stacked in sequence on the first surface A. The surface of the second pixel definition sublayer 302 close to any light-emitting unit 20 is recessed in the surface of the third pixel definition sublayer 303 close to the same light-emitting unit 20, forming a first groove 30a. That is, along the direction parallel to the first surface A (for example, the first direction x), the edge of the second pixel definition sublayer 302 close to any light-emitting unit 20 is recessed in the edge of the third pixel definition sublayer 303 close to the same light-emitting unit 20, forming the first groove 30a. In the process of forming the first sublayer 22a, the first groove 20a can naturally disconnect the first sublayers 22a of different light-emitting units 20, thereby simplifying the preparation process.

[0045] For example, Figure 1 As shown, the distance a between the edge of the orthographic projection of the second pixel definition sublayer 302 on the first surface A and the edge of the orthographic projection of the third pixel definition sublayer 303 on the first surface A is greater than 0.1 μm, and is less than one third of the dimension b of the third pixel definition sublayer 303 located between two adjacent light-emitting units 20 in a direction parallel to the first surface A. That is, 0.1 μm<a<b / 3. 0.1 μm<a ensures that the plurality of first sublayers 22a can be sufficiently separated. a<b / 3 ensures that the pixel definition layer 300 has good stability.

[0046] For example, Figure 1 As shown, the thickness c of the second pixel definition sublayer 302 is greater than half of the thickness d of the first sublayer 22a, that is, c>d / 2, ensuring that the multiple first sublayers 22a can be fully separated.

[0047] Optionally, the thickness of the pixel definition layer 300 is comparable to the thickness of the light emitting layer 22. If the pixel definition layer 300 is too thick, the display panel will be too thick, which is not conducive to product miniaturization. If the pixel definition layer 300 is too thin, the plurality of first sub-layers 22a may not be sufficiently separated.

[0048] Optionally, the thickness of the pixel definition layer 300 is equal to the thickness of the light emitting layer 22 , and the difference between the two is half of the thickness of the second electrode 23 .

[0049] Exemplarily, under the same etching conditions, the etching rate of the materials of the first pixel definition sublayer 301 and the third pixel definition sublayer 303 is lower than the etching rate of the materials of the second pixel definition sublayer 302. This facilitates the natural formation of the first groove 30a under the same etching conditions, saving process.

[0050] Exemplarily, the first pixel definition sublayer 301 and the third pixel definition sublayer 303 are silicon oxide layers, and the second pixel definition sublayer 302 is a silicon nitride layer. The first pixel definition sublayer 301 and the third pixel definition sublayer 303 are made of the same material, and the second pixel definition sublayer 302 is made of another material with different etching rates, which facilitates the production of the first groove 30a.

[0051] For example, Figure 1 and Figure 2 As shown, the display panel further includes a partition layer 400, which is located on the side of the pixel definition layer 300 away from the driving backplane 100, and the partition layer 400 includes a plurality of second openings 40 distributed in an array, and a plurality of light-emitting units 20 correspond to and are connected to the second openings 40 one by one. A portion of the light-emitting unit 20 is located in the corresponding second opening 40. The side wall of the second opening 40 has a second groove 40a, and the second electrode 23 is connected to the side wall of the first partition sublayer 401. The provision of the partition layer 400 facilitates further separation of the plurality of first sublayers 22a, and separation of the plurality of light-emitting material layers 22b and the second sublayer 22c, that is, separation of the plurality of light-emitting layers 22, and the provision of the partition layer 400 facilitates separation of the plurality of second electrodes 23, thereby separating the plurality of different light-emitting units 20.

[0052] For example, Figure 1As shown, the isolation layer 400 includes a first isolation sublayer 401 and a second isolation sublayer 402 sequentially stacked on the first surface A. Along a direction parallel to the driving backplane 100, for example, the first direction x, the edge of the first isolation sublayer 401 close to any light-emitting unit 20 is recessed into the edge of the second isolation sublayer 402 close to the same light-emitting unit 20, forming a second groove 40a. In the process of forming the light-emitting layer 22 and the second electrode 23, since the surface of the first isolation sublayer 401 close to any light-emitting unit 20 is recessed into the surface of the second isolation sublayer 402 close to the same light-emitting unit 20, forming the second groove 40a, the end of the second groove 40a away from the driving backplane 100 can naturally disconnect the first sublayers 22a of different light-emitting units 20, thereby simplifying the preparation process.

[0053] Exemplarily, the first partitioning sublayer 401 is an insulating layer, a semiconductor layer or a conductive layer, and the second partitioning sublayer 402 is an insulating layer. The etching rate of the insulating material is lower than that of the semiconductor material or the conductive material, and the second partitioning sublayer 402 and the pixel definition layer 22 are both made of insulating materials, so it is convenient to naturally form the second groove 40a during the etching process.

[0054] When the first blocking sublayer 401 is made of a conductive material, such as aluminum, it can also assist in connecting the second electrode 23. Optionally, the thickness of the first blocking sublayer 401 is greater than the thickness of the second electrode 23. When the first blocking sublayer 401 is made of a conductive material, the resistance of the first blocking sublayer 401 is less than the resistance of the second electrode 23, which facilitates the flow of current on the second electrode 23.

[0055] Optionally, the first barrier sublayer 401 may be made of an insulating material, and the etching rate of the first barrier sublayer 401 is greater than the etching rate of the second barrier sublayer 402. Optionally, the first barrier sublayer 401 is made of silicon nitride, and the second barrier sublayer 402 is made of silicon oxide.

[0056] Optionally, the first blocking sublayer 401 is greater than twice the thickness of the second electrode 23 .

[0057] Optionally, the thickness of the second partition sublayer 402 is greater than 500 angstroms and less than 2000 angstroms. Optionally, the thickness of the second partition sublayer 402 is greater than 1000 angstroms and less than 1500 angstroms. Optionally, the thickness of the second partition sublayer 402 can be 1000 angstroms, 1100 angstroms, 1200 angstroms, 1300 angstroms, 1400 angstroms, or 1500 angstroms.

[0058] Optionally, the partition layer 400 may also be a single-layer structure. One end of the partition layer 400 close to the driving backplane 100 and close to any light-emitting unit 20 is recessed in the surface of the partition layer 400 away from the driving backplane 100 and close to the same light-emitting unit 20 .

[0059] Exemplarily, the display panel further includes an encapsulation layer 500 and an auxiliary connection layer 600 stacked in sequence on a side of the light-emitting functional layer 200 away from the driving backplane 100. The encapsulation layer 500 has a plurality of through holes 50, and the plurality of through holes 50 correspond to the plurality of light-emitting units 20 one by one. The auxiliary connection layer 600 is connected to the second electrodes 23 of the plurality of light-emitting units through the plurality of through holes 50. The auxiliary connection layer 600 is a conductive layer. The provision of the auxiliary connection layer 600 facilitates the connection of the auxiliary second electrode 23. Since the material of the auxiliary connection layer 600 is a conductive material, and the auxiliary connection layer 600 is connected to the plurality of second electrodes 23, it is equivalent to the auxiliary connection layer 600 being connected in parallel with the plurality of second electrodes 23, and the overall resistance of the auxiliary connection layer 600 electrically connected to the second electrode 23 is less than the resistance of the second electrode 23.

[0060] Optionally, the auxiliary connection layer 600 is a whole layer structure. Alternatively, the auxiliary connection layer 600 is a mesh structure, as long as it can electrically connect the second electrodes 23 of all light-emitting units.

[0061] Optionally, the auxiliary connection layer 600 is made of a transparent conductive material, such as indium tin oxide or indium zinc oxide.

[0062] Optionally, the encapsulation layer 500 includes at least one of an organic encapsulation sublayer and an inorganic encapsulation sublayer. The organic encapsulation sublayer can be made of organic materials such as polyimide, polyamide, acrylic resin, phenolic resin, etc. The inorganic encapsulation sublayer can be made of inorganic materials such as silicon nitride, silicon oxide, silicon oxynitride, etc.

[0063] Exemplarily, the first electrode 21 is a metal structure, and the second electrode 23 is a semi-transmissive and semi-reflective structure. When the light emitted by the luminescent material layer 22b reaches the second electrode 23, part of the light is reflected by the second electrode 23 to the first electrode 21, and is reflected again by the first electrode 21 to the second electrode 23. This part of the light interferes with the light originally emitted by the luminescent material layer 22b. When the optical path difference is an even multiple of half the wavelength, the half-wave width of the wavelength light is narrowed, thereby increasing the brightness of the light emitted by the display panel, increasing the color gamut, and reducing pixel crosstalk. Optionally, the second electrode 23 is made of magnesium-silver alloy.

[0064] In other embodiments, the second electrode 23 may also be made of a transparent conductive material, such as indium tin oxide or indium zinc oxide.

[0065] Alternatively, if Figure 1 As shown, the display panel further includes a plurality of microlens structures 700, and the plurality of microlens structures 700 are located on a side of the light-emitting functional layer 200 away from the driving backplane 100. Figure 1 and Figure 2The plurality of microlens structures 700 correspond to the plurality of light emitting units 20 one by one, and the orthographic projection of the light emitting unit 20 on the first surface A is located within the orthographic projection of the corresponding microlens structure 700 on the first surface A, and the microlens structure 700 has a surface convex in a direction away from the driving backplane 100. The arrangement of the microlens structure 700 can further improve the light extraction of the display panel.

[0066] Optionally, the shape of the microlens structure 700 is hemispherical, semi-elliptical, or a shape similar to a hemispherical or semi-elliptical surface with a smooth arc.

[0067] Optionally, the shape of the orthographic projection of the microlens structure 700 on the first surface A is circular or elliptical, and correspondingly, the shape of the orthographic projection of the light emitting unit 20 on the first surface A is square or circular and is located within the orthographic projection of the microlens structure 700 on the first surface A. Optionally, the center of the orthographic projection of the microlens structure 700 on the first surface A coincides with the center of the orthographic projection of the light emitting unit 20 on the first surface A.

[0068] Optionally, the microlens structure 700 is made of an organic material, such as resin.

[0069] Alternatively, if Figure 1 As shown, the display panel further includes a filling layer 800 , and the filling layer 800 is used to fill the surface of the plurality of micro-lens structures 700 away from the driving backplane 100 .

[0070] Optionally, the refractive index of the filling layer 800 is smaller than the refractive index of the microlens structure 700 , so as to further improve light extraction.

[0071] Optionally, the filling layer 800 is made of an organic material, such as OCA (Optically Clear Adhesive). OCA is colorless and transparent, with a light transmittance of more than 99%. OCA has good strength and stability, and is resistant to high temperatures and ultraviolet rays.

[0072] Optionally, the display panel further includes a protective layer, which is located on a side of the filling layer 800 away from the display back plate 10. The protective layer can protect the display panel. Optionally, the protective layer is made of glass or plastic.

[0073] Optionally, the display panel further includes an adhesive layer 900, and the adhesive layer 900 is located between the auxiliary connection layer 600 and the plurality of micro lens structures 700. The adhesive layer 900 is used to adhere the plurality of micro lens structures 700 to the display panel. Optionally, the adhesive layer 900 is made of a transparent adhesive material.

[0074] For example, Figure 2As shown, the plurality of light-emitting units 20 include a first light-emitting unit 201, a second light-emitting unit 202 and a third light-emitting unit 203. The first light-emitting unit 201, the second light-emitting unit 202 and the third light-emitting unit 203 emit different colors to realize the display function. In the related art, the color of the light emitted by the light-emitting layer is white, and a color filter layer is arranged on the side of the light-emitting function layer away from the driving backplane. The color filter layer includes a plurality of color blocks that can convert white light into light of different colors. However, the arrangement of the color filter layer will reduce the brightness by about 70%. In the embodiment of the present disclosure, the structure of not setting a color filter layer can improve the problem of reducing the brightness due to the low transmittance of the color filter layer, which is conducive to improving the brightness of the display panel.

[0075] Exemplarily, the driving backplane 100 is a silicon-based driving backplane. The display panel including the silicon-based driving backplane has smaller pixels and lower brightness. However, the display panel in the embodiment of the present disclosure is conducive to improving the brightness of the display panel, so the embodiment of the present disclosure is particularly suitable for the display panel including the silicon-based driving backplane.

[0076] Alternatively, if Figure 1 As shown, the driving backplane 100 includes a wiring 10 , and the wiring 10 is used to transmit the electrical signal in the driving backplane 100 to the first electrode 21 .

[0077] Optionally, the wiring 10 is made of a metal material, such as copper, aluminum, or tungsten. The wiring 10 may be made of a single metal material, or may include a plurality of stacked metal films made of different materials.

[0078] The structure of the silicon-based driving backplane is exemplified below. Figure 3 Schematic diagram of the cross-sectional structure of a silicon-based driving backplane provided by an embodiment of the present disclosure. Figure 3 As shown, the silicon-based driving backplane includes a plurality of transistors, and the transistors may be metal oxide semiconductor field effect transistors (metal oxide semiconductor, MOS).

[0079] like Figure 3 As shown, the silicon-based driving backplane includes a substrate 101, a source-drain electrode layer 102, a gate insulating layer 103, a gate layer 104, a first insulating layer 105, a first wiring layer (not shown in the figure), a second insulating layer 106, a second wiring layer (not shown in the figure) and a planarization layer 107 which are stacked in sequence. Among them, a plurality of vias are included between the gate insulating layer 103, the first insulating layer 105, the second insulating layer 106 and the planarization layer 107, so that the wiring 10 can be electrically connected to the first electrode 21 and the transistor in the driving backplane through the vias.

[0080] Exemplarily, the gate layer 104 includes a gate 1040 , the source-drain layer 102 includes a source 1021 and a drain 1022 , and the gate 1040 , the source 1021 , and the drain 1022 form a MOS transistor.

[0081] Optionally, the transistor may be an N-type MOS transistor or a P-type MOS transistor. For an N-type MOS transistor, the substrate 101 located below the N-type MOS transistor may be a P-type semiconductor, and the source 1021 and the drain 1022 may be N-type semiconductors; for a P-type MOS transistor, the substrate 101 located below the P-type MOS transistor may be an N-type semiconductor, and the source 1021 and the drain 1022 may be P-type semiconductors.

[0082] Optionally, the silicon-based driving backplane 10 further includes a plurality of isolation trenches 109, and the isolation trenches 109 are located between two adjacent transistors. Optionally, the isolation trenches 109 are made using a shallow trench isolation (STI) process. Optionally, the isolation trenches 109 are filled with deposited oxide.

[0083] Optionally, the driving backplane 100 includes a plurality of pixel driving circuits, and the plurality of pixel driving circuits are connected to the plurality of light-emitting units in a one-to-one correspondence. The first routing layer includes a plurality of gate lines, and the first routing layer is electrically connected to the gate layer 104. The second routing layer includes a plurality of data lines, and the second routing layer is electrically connected to the source-drain electrode layer 102. The extension directions of the gate lines and the data lines can be a first direction x and a second direction y, respectively, and the second direction y intersects with the first direction x. Each gate line is electrically connected to a plurality of pixel driving circuits, and each data line is electrically connected to a plurality of pixel driving circuits. A display function is realized.

[0084] Exemplarily, the gate insulating layer 103 may be made of silicon oxide, silicon nitride, silicon oxynitride, or the like.

[0085] Exemplarily, the material of the first insulating layer 105 may be silicon oxide, silicon nitride, silicon oxynitride, or the like.

[0086] Exemplarily, the material of the second insulating layer 107 may be silicon oxide, silicon nitride, silicon oxynitride, or the like.

[0087] Exemplarily, the planarization layer 109 is made of an organic insulating material, such as resin.

[0088] Optionally, the driving backplane 100 may also be a driving backplane including a plurality of TFTs (Thin Film Transistors), such as an LTPO (Low-temperature Polycrystalline oxide) backplane, or an LTPS (Low-Temperature Poly-Silicon) backplane. Optionally, the display backplane includes a gate layer, an active layer, and a source-drain layer. The active layer is made of a metal oxide semiconductor material such as a low-temperature polycrystalline silicon material and IGZO (IndiumGallium Zinc Oxide), or the active layer is made of a low-temperature polycrystalline silicon material.

[0089] Figure 4 is a flow chart of a method for manufacturing a display panel provided by an embodiment of the present disclosure, such as Figure 4 As shown, the method includes:

[0090] In step S1 , a driving backplane is provided.

[0091] In step S2, a pixel definition layer and a light-emitting function layer are manufactured on the first surface of the driving backplane.

[0092] The pixel definition layer includes a plurality of first openings distributed in an array, the light-emitting function layer includes a plurality of light-emitting units distributed in an array, the plurality of light-emitting units correspond to the plurality of first openings one by one and at least part of the light-emitting units are located in the corresponding first openings, each light-emitting unit includes a first electrode, a light-emitting layer and a second electrode sequentially stacked on the first surface, and the light-emitting layer includes a first sublayer, a light-emitting material layer and a second sublayer sequentially stacked on the first surface. The sidewall of the first opening has a first groove, and the first sublayer is connected to the sidewall of the first opening.

[0093] Figures 5 to 8 The first to fourth parts are the flow chart of another method for manufacturing a display panel provided by the embodiment of the present disclosure, which can be used to manufacture Figure 1 The display panel shown.

[0094] The first step, such as Figure 5As shown in part (a), a driving backplane 100 is provided, and a first electrode material layer is formed on the driving backplane by, for example, deposition, and the first electrode material layer is patterned to form a plurality of first electrodes 21. A filling structure is formed between the plurality of first electrodes 21 by, for example, deposition. Optionally, a lateral height coverage (LHC) process is used to reduce the step difference between the surface of the first electrode and the upper surface of the adjacent filling structure. Then, by, for example, deposition, an initial first pixel definition sublayer 3010, an initial second pixel definition sublayer 3020, an initial third pixel definition sublayer 3030, an initial first isolation sublayer 4010, and an initial second isolation sublayer 4020 are sequentially formed.

[0095] The second step is, Figure 5 As shown in part (b), a photoresist structure is formed on the surface of the initial second partition sub-layer 4020 by processes such as photoresist coating, exposure, and development.

[0096] The third step is Figure 5 As shown in part (c), the initial first partitioning sublayer 4010 and the initial second partitioning sublayer 4020 are etched to form the first partitioning sublayer 401 and the second partitioning sublayer 402. The etching rates of the initial first partitioning sublayer 4010 and the initial second partitioning sublayer 4020 are different. Optionally, different gases are used to etch the initial first partitioning sublayer 4010 and the initial second partitioning sublayer 4020. Optionally, the etching conditions of the initial first partitioning sublayer 4010 and the initial second partitioning sublayer 4020 are the same, for example, the same gas is used for etching.

[0097] The fourth step is Figure 5 As shown in part (d), a photoresist structure is formed on the surface of the initial third pixel definition sublayer 3030 and the second partition sublayer 402 by processes such as photoresist coating, exposure, and development.

[0098] Step 5: Figure 6As shown in part (a) of the embodiment, the initial first pixel definition sublayer 3010, the initial second pixel definition sublayer 3020 and the initial third pixel definition sublayer 3030 are etched to form the first pixel definition sublayer 301, the second pixel definition sublayer 302 and the third pixel definition sublayer 303. The etching rates of the initial first pixel definition sublayer 3010, the initial second pixel definition sublayer 3020 and the initial third pixel definition sublayer 3030 are different. Optionally, different gases are used to etch the initial first pixel definition sublayer 3010, the initial second pixel definition sublayer 3020 and the initial third pixel definition sublayer 3030. Optionally, the same gas is used to etch the initial first pixel definition sublayer 3010, the initial second pixel definition sublayer 3020 and the initial third pixel definition sublayer 3030.

[0099] Step 6: Figure 6 As shown in part (b), the light-emitting layer material 2210 of the first light-emitting unit, the second electrode material layer 230 and the encapsulation layer 500 are obtained in sequence by, for example, evaporation.

[0100] Step 7: Figure 6 As shown in part (c), a photoresist structure is formed at a position corresponding to the first light-emitting unit by processes such as photoresist coating, exposure, and development.

[0101] Step 8: Figure 6 As shown in part (d), the light-emitting layer 221 and the second electrode 23 of the first light-emitting unit, as well as a portion of the encapsulation layer 500 located above the first light-emitting unit are formed by, for example, etching.

[0102] Step 9: Figure 7 As shown in part (a), the light-emitting layer material 2220 of the second light-emitting unit, the second electrode material layer 230 and the encapsulation layer 500 are obtained in sequence by, for example, evaporation.

[0103] Step 10: Figure 7 As shown in part (b), a photoresist structure is formed at a position corresponding to the second light-emitting unit by processes such as photoresist coating, exposure, and development.

[0104] Step 11: Figure 7 As shown in part (c), the light-emitting layer 222 and the second electrode 23 of the second light-emitting unit, as well as a portion of the encapsulation layer 500 located above the second light-emitting unit are formed by, for example, etching.

[0105] Step 12: Figure 7As shown in part (d), the light-emitting layer material, the third electrode material layer and the encapsulation layer 500 of the third light-emitting unit are obtained in sequence by, for example, evaporation, and the light-emitting layer material of the third light-emitting unit is patterned to remove the light-emitting layer material, the third electrode material layer and part of the encapsulation layer of the third light-emitting unit above the first light-emitting unit and the second light-emitting unit. Finally, the encapsulation layer 500 is formed on the surface of the second partitioning sublayer 402 by, for example, deposition, and the encapsulation layers 500 on the surfaces of the first light-emitting unit, the second light-emitting unit, the third light-emitting unit and the second partitioning sublayer 402 are connected to form a whole.

[0106] Step 13: Figure 8 As shown in part (a), a photoresist structure is formed at positions corresponding to the plurality of light-emitting units by processes such as photoresist coating, exposure, and development.

[0107] Step 14: Figure 8 As shown in part (b), the encapsulation layer 500 is etched to form a plurality of through holes 50, the plurality of through holes 50 correspond to the plurality of light emitting units one by one, and the through holes 50 of the encapsulation layer 500 are located above the light emitting units.

[0108] Step 15: Figure 8 As shown in part (c) of the drawing, an auxiliary connection layer 600 is formed on the surface of the encapsulation layer 500 by, for example, deposition.

[0109] Step 16: Figure 8 As shown in part (d) of the embodiment, an adhesive layer 900 is formed on the surface of the auxiliary connection layer by, for example, coating. A plurality of microlens structures 700 are made on the surface of the adhesive layer 900. Optionally, a microlens structure material layer is formed by coating, and the microlens structure material layer is patterned to form a plurality of dot structures distributed in an array, and then baked to make the upper surface of the microlens structure material layer bulge to form a plurality of microlens structures distributed in an array. Optionally, a filling layer 800 is formed by, for example, coating. Figure 1 The display panel shown.

[0110] Optionally, the patterning process includes processes such as photoresist coating, exposure, development, etching, and stripping.

[0111] Optionally, in the embodiment of the present disclosure, etching is performed by photolithography instead of using a silicon mask for evaporation. Since the development of silicon mask technology is difficult, the corresponding evaporation equipment has high alignment accuracy and high cost, and the service life of the silicon mask needs to be considered. In addition, PT (particle) control needs to be considered when using a silicon mask for evaporation, that is, preventing impurity particles (such as organic materials attached to the silicon mask) from falling on the silicon drive substrate during the evaporation process. The use of photolithography in the embodiment of the present disclosure can avoid the above problems.

[0112] An embodiment of the present disclosure further provides a display device, which includes any one of the aforementioned display panels and a power supply circuit, wherein the power supply circuit is used to supply power to the display panel.

[0113] Illustratively, the display device provided in the embodiments of the present disclosure may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or the like.

[0114] The display device has the same effect as the above-mentioned display panel, which will not be described in detail here.

[0115] The above are only optional embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. A display panel, characterized in that: The display panel comprises a driving backplane, a pixel definition layer and a light-emitting functional layer, wherein the pixel definition layer and the light-emitting functional layer are located on a first surface of the driving backplane; The pixel definition layer includes a plurality of first openings distributed in an array, the light-emitting function layer includes a plurality of light-emitting units distributed in an array, the plurality of light-emitting units correspond to the plurality of first openings one by one, and at least a portion of the light-emitting units is located in the corresponding first openings; Each of the light-emitting units includes a first electrode, a light-emitting layer, and a second electrode sequentially stacked on the first surface, and the light-emitting layer includes a first sublayer, a light-emitting material layer, and a second sublayer sequentially stacked on the first surface; The sidewall of the first opening has a first groove, and the first sub-layer is connected to the sidewall of the first opening.

2. The display panel according to claim 1, characterized in that: The pixel definition layer includes a first pixel definition sublayer, a second pixel definition sublayer and a third pixel definition sublayer sequentially stacked on the first surface; A surface of the second pixel definition sublayer close to any of the light emitting units is recessed into a surface of the third pixel definition sublayer close to the same light emitting unit to form the first groove.

3. The display panel according to claim 2, characterized in that: The distance between the edge of the orthographic projection of the second pixel definition sublayer on the first surface and the edge of the orthographic projection of the third pixel definition sublayer on the first surface is greater than 0.1 μm and less than one third of the size of the third pixel definition sublayer located between two adjacent light-emitting units in a direction parallel to the first surface.

4. The display panel according to claim 2, characterized in that: The thickness of the second pixel definition sublayer is greater than half of the thickness of the first sublayer.

5. The display panel according to any one of claims 2 to 4, characterized in that: The first pixel definition sublayer and the third pixel definition sublayer are silicon oxide layers, and the second pixel definition sublayer is a silicon nitride layer.

6. The display panel according to any one of claims 1 to 4, characterized in that: The display panel further comprises a partition layer, the partition layer being located on a side of the pixel definition layer away from the driving backplane, the partition layer comprising a plurality of second openings distributed in an array, the plurality of light emitting units corresponding to the second openings one by one, and a portion of the light emitting units being located in the corresponding second openings; The sidewall of the second opening has a second groove, and the second electrode is connected to the sidewall of the second opening.

7. The display panel according to claim 6, characterized in that: The barrier layer includes a first barrier sublayer and a second barrier sublayer sequentially stacked on the first surface; The surface of the first partitioning sublayer close to any of the light-emitting units is recessed into the surface of the second partitioning sublayer close to the same light-emitting unit to form the second groove.

8. The display panel according to claim 7, characterized in that: The first partition sublayer is an insulating layer, a semiconductor layer or a conductive layer, and the second partition sublayer is an insulating layer.

9. The display panel according to claim 7 or 8, characterized in that: The display panel further comprises an encapsulation layer and an auxiliary connection layer which are sequentially stacked on a side of the light-emitting functional layer away from the driving backplane, the encapsulation layer has a plurality of via holes, the plurality of via holes correspond to the plurality of light-emitting units one by one, and the auxiliary connection layer is connected to the second electrodes of the plurality of light-emitting units through the plurality of via holes; The auxiliary connection layer is a conductive layer.

10. The display panel according to any one of claims 1 to 4 and claims 7 to 8, characterized in that: The driving backplane is a silicon-based driving backplane.

11. The display panel according to any one of claims 1 to 4 and claims 7 to 8, characterized in that: The first electrode is a metal structure, and the second electrode is a semi-transmissive and semi-reflective structure.

12. The display panel according to any one of claims 1 to 4 and claims 7 to 8, characterized in that: The plurality of light emitting units include a first light emitting unit, a second light emitting unit and a third light emitting unit, and the first light emitting unit, the second light emitting unit and the third light emitting unit emit different colors.

13. The display panel according to any one of claims 1 to 4 and claims 7 to 8, characterized in that: The display panel further comprises a plurality of microlens structures, and the plurality of microlens structures are located on a side of the light-emitting functional layer away from the driving backplane.

14. A display device, characterized in that: The display device comprises a power supply circuit and a display panel according to any one of claims 1 to 13, wherein the power supply circuit supplies power to the display panel.

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