First chip, chip assembly and consumable box

By designing a chip assembly with a thickness smaller than the sum of the original chip thickness, the problem of chip easily damaged when the consumable box is installed is solved, ensuring the normal use of the printing equipment.

CN222512088UActive Publication Date: 2025-02-21APEX MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202421460695.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Priority Date
2024-01-26
Filing Date
2024-06-24
Publication Date
2025-02-21
Estimated Expiration
2034-06-24

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Abstract

The embodiment of the utility model provides a first chip, a chip assembly and a consumable box, and relates to the technical field of printing imaging. The first chip comprises a circuit board, an integrated circuit package and a contact; the integrated circuit package and the contacts are arranged on the circuit board, and the integrated circuit package can be accommodated in one hollow part of the box cover. In the direction perpendicular to the circuit board, the projection of the circuit board of the first chip and the projection of the old integrated circuit package of the second chip are staggered, so that when the first chip is welded to the second chip, the thickness of the chip assembly is smaller than the sum of the thickness of the first chip and the thickness of the second chip, and therefore when the consumable box is installed in the printing equipment, the consumable box is not prone to falling off. The first chip on the second chip is not extruded by the contact pin component of the printer, so that the first chip is not easy to damage, and normal use of the printer is ensured.
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Description

Technical Field

[0001] The utility model relates to the technical field of printing and imaging, in particular to a first chip, a chip component and a consumable box. Background Art

[0002] Printing devices are generally equipped with replaceable consumables boxes, which contain coloring materials used to form images and text, such as toner and ink. In order to record the usage of the consumable box and authenticate the source of the consumable box, a consumable chip is often provided on the consumable box. The consumable chip includes a memory that stores and accesses the usage information of the consumable box and the authentication information of the consumable box. The printing device can be an inkjet printer, a laser printer, a copier, a multifunction machine, etc.

[0003] Due to the huge amount of consumables used, the use of discarded consumables will cause huge environmental pollution, but in fact many used consumables are still worth recycling. Recycled consumables cannot work properly by simply refilling toner. The consumables chip data needs to be updated to achieve the regeneration of consumables. In one case, a new consumable chip can be adapted for the consumables; in another case, a repair chip can be used to weld the old chip on the consumable box to repair the data in the old chip.

[0004] The existing repair chip is similar in shape to the old chip, and both have an integrated circuit (IC) package and long strip contacts. When the existing repair chip is welded to the old chip, the contacts of the two overlap, and the positions of the integrated circuit packages also overlap.

[0005] However, when the consumables box is installed in the printing device, the repair chip on the old chip will be squeezed by the contact pin component of the printer, causing the repair chip to be easily damaged, affecting the normal use of the printing device. Utility Model Content

[0006] The embodiment of the utility model provides a first chip, a chip assembly and a consumable box to solve the problem that when the consumable box is installed in a printing device, the repair chip on the old chip will be squeezed by the contact pin component of the printer, causing the repair chip to be easily damaged and affecting the normal use of the printer.

[0007] In a first aspect, an embodiment of the utility model provides a first chip that can be welded to a second chip to form a chip assembly, and the chip assembly can be installed on a box body of a consumable box, and the box cover of the consumable box has a plurality of hollow parts;

[0008] The first chip includes a circuit board, an integrated circuit package and contacts;

[0009] The integrated circuit package and the contacts are arranged on the circuit board, and the integrated circuit package can be accommodated in one of the hollow parts of the box cover. In the direction perpendicular to the circuit board, the projection of the circuit board is misaligned with the projection of the old integrated circuit package of the second chip, and the thickness of the chip component is less than the sum of the thicknesses of the first chip and the second chip.

[0010] In a possible implementation manner, the circuit board includes a main body section and an extension section connected to each other, the contact is arranged on the main body section, and the integrated circuit package is arranged on the extension section;

[0011] The projection of the main section in a direction perpendicular to the circuit board is misaligned with the projection of the old integrated circuit package, and the projection of the extension section in a direction perpendicular to the circuit board is misaligned with the projection of the second chip.

[0012] In a possible implementation manner, a plurality of the contacts are disposed on the main body segment, and the plurality of the contacts are spaced apart along the first direction;

[0013] The first direction is the width direction of the contact, and the first direction is perpendicular to the extending direction of the extending section.

[0014] In a possible implementation manner, in the second direction, the projection of the contact is misaligned with the projection of the integrated circuit package;

[0015] The second direction is the length direction of the contact.

[0016] In a possible implementation manner, the integrated circuit package is disposed on a side of the extension section away from the main body section.

[0017] In a possible implementation, the circuit board is a flexible circuit board.

[0018] In a possible implementation, the box body has a toner outlet, and the integrated circuit package, the second chip and the toner outlet are respectively arranged in one of the hollow portions of the box cover.

[0019] In a possible implementation, the circuit board has a first surface and a second surface, the first surface is provided with a first contact, and the second surface is provided with a second contact.

[0020] In a second aspect, an embodiment of the utility model provides a chip assembly, comprising a second chip and the first chip as described above, wherein the first chip is soldered on the second chip.

[0021] In a third aspect, an embodiment of the utility model provides a consumable box, comprising a box body and a chip assembly as described above, wherein the chip assembly is mounted on the box body.

[0022] The embodiment of the utility model provides a first chip, a chip assembly and a consumables box, including a circuit board, an integrated circuit package and contacts; the integrated circuit package and the contacts are arranged on the circuit board, the integrated circuit package can be accommodated in a hollow part of the box cover, in the direction perpendicular to the circuit board, the projection of the circuit board is misaligned with the projection of the old integrated circuit package of the second chip, and the thickness of the chip assembly is less than the sum of the thicknesses of the first chip and the second chip. In the direction perpendicular to the circuit board, by misaligning the projection of the circuit board of the first chip with the projection of the old integrated circuit package of the second chip, when the first chip is welded to the second chip, the thickness of the chip assembly is less than the sum of the thicknesses of the first chip and the second chip, and the thickness of the chip assembly is reduced, so that when the consumables box is installed in the printing device, the first chip on the second chip will not be squeezed by the contact pin component of the printer, and then the first chip is not easily damaged, ensuring the normal use of the printing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 It is a structural schematic diagram of an old consumables box in the prior art;

[0025] Figure 2 for Figure 1 Schematic diagram of the box body of the old consumables box on the chip installation side;

[0026] Figure 3 for Figure 1 A schematic diagram of the structure of an old box cover of an old consumable box;

[0027] Figure 4 A schematic diagram of the structure of a box cover provided by an embodiment of the utility model;

[0028] Figure 5 A schematic diagram of the structure of a first chip provided in an embodiment of the utility model;

[0029] Figure 6 A schematic diagram of a first chip being welded to a second chip provided in an embodiment of the utility model.

[0030] Description of reference numerals:

[0031] 10-box body; 11-positioning column;

[0032] 12-toner outlet; 20a-old box cover;

[0033] 20-box cover; 21-first hollow portion;

[0034] 22- second hollow portion; 23- third hollow portion;

[0035] 24- fourth hollow portion; 25- fifth hollow portion;

[0036] 26-sixth hollow portion; 30-second chip;

[0037] 31-Old circuit boards; 32-Old integrated circuit packages;

[0038] 33-old contact; 40-first chip;

[0039] 41-circuit board; 411-first side;

[0040] 41a-main section; 41b-extension section;

[0041] 42-integrated circuit package; 43-first contact. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0043] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] In the above description, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0047] As described in the background technology, when the consumables box is installed in the printing device, the repair chip on the old chip will be squeezed by the stylus component of the printer, causing the repair chip to be easily damaged. The inventor has found that the reason for this problem is that since the integrated circuit package of the old chip protrudes from the chip surface, after the repair chip is welded to the old chip, the repair chip is located on the integrated circuit package of the old chip, and the thickness of the repair chip and the old chip welded together is equal to the sum of the thickness of the repair chip and the old chip, resulting in the thickness of the entire component being greatly thickened relative to the old chip. With such a structure, when the recycled consumables box is installed in the printing device, the long strip contacts of the repair chip will be squeezed by the stylus component of the printer, causing the repair chip to be easily damaged.

[0048] In order to solve the above problems, the embodiments of the utility model provide a first chip, a chip assembly and a consumable box. The first chip and the second chip have different shapes. When the first chip is welded to the second chip, in the direction perpendicular to the circuit board, the projection of the circuit board of the first chip is misaligned with the projection of the old integrated circuit package of the second chip. That is, the projection of the circuit board of the first chip on the direction perpendicular to the circuit board avoids the projection of the old integrated circuit package of the second chip. The thickness of the chip assembly can be made smaller than the sum of the thicknesses of the first chip and the second chip, and the thickness of the chip assembly is reduced. Therefore, when the consumable box is installed in a printing device, the first chip on the second chip will not be squeezed by the contact pin component of the printer, and the first chip is not easily damaged, thereby ensuring the normal use of the printing device.

[0049] The first chip, chip assembly and consumable box provided in the embodiment of the utility model are described in detail below in conjunction with specific embodiments.

[0050] like Figure 1 As shown, the consumable box obtained by recycling (i.e., the old consumable box) includes a box body 10, an old box cover 20a, and a second chip 30. When the old consumable box needs to be repaired and reused, the first chip 40 (see Figure 5 as shown) is soldered to the second chip 30.

[0051] Figure 2 FIG. 1 is a view of the box body 10 of the old consumables box at the chip mounting end. Figure 2 As shown, the box body 10 has a positioning column 11 and two circular colorant outlets 12 at this end, and the second chip 30 (i.e., the old chip) is installed next to the positioning column 11. The second chip 30 includes an old integrated circuit package 32 protruding from the surface of the square old circuit board 31 and a plurality of long strip-shaped old contacts 33.

[0052] Figure 3 It is a view of the side where the old box cover 20a of the old consumable box is installed and combined with the box body 10, and there are two hollow parts in the middle, namely the first hollow part 21 and the second hollow part 22. The first hollow part 21 is used to accommodate the second chip 30 and the positioning column 11 when the old box cover 20a is installed on the box body 10, and the second hollow part 22 is used to accommodate the two toner outlets 12 when the old box cover 20a is installed on the box body 10.

[0053] The embodiment of the utility model provides a consumable box suitable for a printing device. The consumable box comprises a box body 10 , a box cover 20 , a second chip 30 and a first chip 40 .

[0054] The structure of the box body 10 of the consumable box provided in this embodiment is the same as the structure of the box body 10 of the old consumable box, and the details can refer to the box body 10 of the old consumable box.

[0055] The structure of the second chip 30 of the consumable box provided in this embodiment is the same as the structure of the second chip 30 of the old consumable box, and the details may refer to the second chip 30 of the old consumable box.

[0056] Figure 4 A box cover 20 provided in an embodiment of the utility model has a plurality of hollow parts, the number of the plurality of hollow parts is greater than 2, and the hollow parts are cavity structures. Exemplarily, the box cover 20 has a first hollow part 21, a second hollow part 22, a third hollow part 23, a fourth hollow part 24, a fifth hollow part 25, and a sixth hollow part 26 that are not connected to each other.

[0057] The first hollow portion 21 and the second hollow portion 22 are arranged in sequence along the X-axis direction; the third hollow portion 23 and the fourth hollow portion 24 are located on one side of the first hollow portion 21 and the second hollow portion 22 in the -Y-axis direction, and the fifth hollow portion 25 and the sixth hollow portion 26 are located on one side of the first hollow portion 21 and the second hollow portion 22 in the +Y-axis direction.

[0058] Figure 5 The first chip 40 provided in the embodiment of the utility model can be welded to the second chip 30 to form a chip assembly, and the chip assembly can be installed on the box body 10 of the consumable box.

[0059] The first chip 40 includes a circuit board 41 , an integrated circuit package 42 and contacts; the integrated circuit package 42 and the contacts are arranged on the circuit board 41 , and the integrated circuit package 42 can be accommodated in a hollow portion of the box cover 20 .

[0060] like Figure 6 As shown, in the direction perpendicular to the circuit board 41 (that is, Figure 5 In the direction perpendicular to the X-axis and the Y-axis in the circuit board 41, the projection of the circuit board 41 is misaligned with the projection of the old integrated circuit package 32 of the second chip 30, that is, the projection of the circuit board 41 in the direction perpendicular to the circuit board 41 does not overlap with the projection of the old integrated circuit package 32. When the first chip 40 is soldered to the second chip 30, the contacts of the first chip 40 are electrically connected to the old contacts 33 of the second chip 30, and the contacts of the first chip 40 and the old contacts 33 of the second chip 30 are sandwiched between the circuit board 41 and the old circuit board 31. Almost only the contacts of the first chip 40 and the old contacts 33 intersect and overlap between the circuit board 41 and the old circuit board 31. Since the contacts of the first chip 40 and the old contacts 33 are relatively thin relative to the old integrated circuit package 32, the thickness of this overlapped part is still relatively thin. The old integrated circuit package 32 is not between the circuit board 41 and the old circuit board 31, so that the thickness of the chip assembly can be less than the sum of the thicknesses of the first chip 40 and the second chip 30.

[0061] The thickness of the first chip 40 can be equal to the sum of the thickness of the circuit board 41 and the integrated circuit package 42, and the thickness of the integrated circuit package 42 is greater than the thickness of the contacts of the first chip 40; the thickness of the second chip 30 can be equal to the sum of the thickness of the old circuit board 31 and the old integrated circuit package 32, and the thickness of the old integrated circuit package 32 is greater than the thickness of the old contacts 33.

[0062] It should be noted that the distance between the circuit board 41 and the old circuit board 31 is smaller than the thickness of the old integrated circuit package 32 .

[0063] In the direction perpendicular to the circuit board 41 , the circuit board 41 has a first surface 411 and a second surface. The first surface 411 is located on the side of the circuit board 41 away from the second chip 30 , and the second surface is located on the side of the circuit board 41 facing the second chip 30 .

[0064] The first surface 411 may be a plane, and the first contact 43 is disposed on the first surface 411. Other components may also be disposed on the first surface 411.

[0065] The first contacts 43 may be long strip contacts. The number of the first contacts 43 is equal to the number of the old contacts 33. When the consumables box is installed in the printing device, the first contacts 43 of the first chip 40 of the chip assembly are electrically connected to the contact pin component of the printing device.

[0066] The second surface may be a plane, and a second contact is disposed on the second surface. The shape of the second contact may be the same as that of the old contact 33, and the number of the second contact is equal to the number of the old contact 33. In this embodiment, the number of the old contact 33, the first contact 43, and the second contact are all 4. When the first chip 40 is welded to the second chip 30, the 4 second contacts are welded and connected with the 4 old contacts 33 in a one-to-one correspondence, so that the second contacts are electrically connected with the old contacts 33.

[0067] It should be noted that when the first contact 43 of the first chip 40 communicates with the contact pin component of the printing device, the communication signal sent to the first contact 43 will be processed by the integrated circuit package 42 of the first chip 40 and then sent to the second chip 30 through the second contact.

[0068] The circuit board 41 may be a flexible circuit board. Since the gap between the box cover 20 and the box body 10 is small when they are installed together, the flexible substrate can prevent the first chip 40 from being squeezed and damaged when it is welded to the second chip 30 by the box cover 20.

[0069] The storage part in the first chip 40 can adopt common non-volatile memory, such as Erasable Programmable Read Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Flash Memory, Ferroelectric Memory, Phase Change Memory, etc., or a volatile memory plus a power supply solution can be adopted, such as Static Random-Access Memory (SRAM) plus a battery or a capacitor, Dynamic Random Access Memory (DRAM) plus a battery or a capacitor.

[0070] The first chip 40 provided in the embodiment of the utility model can be misaligned with the projection of the circuit board 41 of the first chip 40 and the projection of the old integrated circuit package 32 of the second chip 30 in a direction perpendicular to the circuit board 41. When the first chip 40 is soldered to the second chip 30, the thickness of the chip assembly can be made less than the sum of the thickness of the first chip 40 and the second chip 30. The thickness of the chip assembly is reduced, so that when the consumable box is installed in the printing device, the first chip 40 on the second chip 30 will not be squeezed by the contact pin component of the printer, and the first chip 40 is not easily damaged, thereby ensuring the normal use of the printing device.

[0071] In a possible implementation, Figure 5 As shown, the circuit board 41 includes a main body section 41a and an extension section 41b connected to each other, the contacts are arranged on the main body section 41a, and the integrated circuit package 42 is arranged on the extension section 41b.

[0072] The main body section 41a may be in a square shape. The first contact 43 and the second contact are arranged on the main body section 41a.

[0073] See also Figure 5 As shown, the length direction of the first contact 43 is the X-axis direction, that is, the second direction; the width direction of the first contact 43 is the Y-axis direction, that is, the first direction; the X-axis and the Y-axis are perpendicular to each other. The direction perpendicular to the X-axis and the Y-axis is the thickness direction of the first contact 43, that is, the direction perpendicular to the circuit board 41. It should be noted that the length direction, width direction and thickness direction of the second contact are respectively the same as the length direction, width direction and thickness direction of the first contact 43.

[0074] In the direction perpendicular to the circuit board 41, the projection of the main body segment 41a is misaligned with the projection of the old integrated circuit package 32, that is, in the direction perpendicular to the circuit board 41, the projection of the main body segment 41a does not overlap with the projection of the old integrated circuit package 32. Figure 6 As shown, when the first chip 40 is soldered to the second chip 30, the main body segment 41a is entirely located on one side of the old integrated circuit package 32 in the -X-axis direction, and the main body segment 41a does not contact the old integrated circuit package 32, so that in the direction perpendicular to the circuit board 41, the projection of the main body segment 41a is misaligned with the projection of the old integrated circuit package 32.

[0075] Between the main body segment 41a and the old circuit board 31, almost only the second contact and the old contact 33 intersect and overlap each other. The second contact and the old contact 33 are relatively thin relative to the old integrated circuit package 32, so the thickness of this stacked part is still relatively thin. There is no old integrated circuit package 32 between the main body segment 41a and the old circuit board 31, so the distance between the main body segment 41a and the old circuit board 31 can be smaller than the thickness of the old integrated circuit package 32.

[0076] The extension section 41 b extends in a direction away from the old integrated circuit package 32 .

[0077] In the direction perpendicular to the circuit board 41, the projection of the extension section 41b is misaligned with the projection of the second chip 30, that is, in the direction perpendicular to the circuit board 41, the projection of the extension section 41b does not overlap with the projection of the second chip 30. With this arrangement, the integrated circuit package 42 can be kept away from the old integrated circuit package 32, and in the direction perpendicular to the circuit board 41, the integrated circuit package 42 and the old integrated circuit package 32 do not overlap.

[0078] For example, Figure 6 As shown, when the first chip 40 is soldered to the second chip 30 , the extension sections 41 b are all located on one side of the -Y axis direction of the second chip 30 , so that in the direction perpendicular to the circuit board 41 , the projection of the extension section 41 b is misaligned with the projection of the second chip 30 .

[0079] In one possible implementation, see Figure 5 As shown, a plurality of contacts are disposed on the main body segment 41 a , and the plurality of contacts are spaced apart along the first direction.

[0080] The main body segment 41 a extends along a first direction.

[0081] A plurality of second contacts are disposed on a side of the main body section 41 a facing the second chip 30 , and a plurality of first contacts 43 are disposed on a side of the main body section 41 a facing away from the second chip 30 .

[0082] The plurality of second contacts and the plurality of first contacts 43 are arranged at intervals along the first direction, that is, the plurality of second contacts and the plurality of first contacts 43 are arranged at intervals along the Y-axis direction.

[0083] The first direction is perpendicular to the extension direction of the extension section 41b. Specifically, the extension section 41b may be located on the -Y axis side of the main section 41a, the extension section 41b extends along the X axis direction, the extension direction of the extension section 41b is perpendicular to the arrangement direction of the first contacts 43, and the arrangement direction of the first contacts 43 is the Y axis direction. In other embodiments, the extension section 41b may also be located on the +Y axis side of the main section 41a.

[0084] The integrated circuit package 42 is arranged on the side of the extension section 41b away from the main section 41a. Specifically, the side of the extension section 41b in the +X axis direction is close to the main section 41a and connected to the main section 41a; the side of the extension section 41b in the -X axis direction is away from the main section 41a and is not connected to the main section 41a, and the integrated circuit package 42 is arranged on the side of the extension section 41b in the -X axis direction. In this way, the integrated circuit package 42 is arranged at a position away from the second chip 30.

[0085] Further, in the second direction, the projection of the contacts of the first chip 40 is misaligned with the projection of the integrated circuit package 42 , that is, in the second direction, the projection of the contacts of the first chip 40 is not overlapped with the projection of the integrated circuit package 42 .

[0086] The main body section 41a is provided with four second contacts and four first contacts 43. In the Y-axis direction, two sides of the four second contacts are aligned with two sides of the four first contacts 43 respectively.

[0087] In the Y-axis direction, the extension lines of the two sides of the four first contacts 43 are as follows: Figure 6 The integrated circuit package 42 does not intersect the two extension lines and is not located between the two extension lines. In this way, when the chip assembly is installed on the box body 10 of the consumable box, since there is a toner outlet 12 in the space between the two extension lines, the integrated circuit package 42 is not located in the space between the two extension lines, which can avoid interference between the integrated circuit package 42 and the toner outlet 12.

[0088] In a possible implementation, the integrated circuit package 42 , the second chip 30 , and the toner outlet 12 are respectively disposed in a hollow portion of the box cover 20 .

[0089] Among them, the first hollow portion 21 is used to accommodate the second chip 30, the part where the main section 41a of the first chip 40 is located and the positioning column 11 when the box cover 20 is installed to the box body 10, and the second hollow portion 22 is used to accommodate two colorant outlets 12 when the box cover 20 is installed to the box body 10.

[0090] The integrated circuit package 42 can be accommodated in one of the third hollow portion 23 , the fourth hollow portion 24 , the fifth hollow portion 25 and the sixth hollow portion 26 through the extension section 41 b .

[0091] It should be noted that there is no hollow portion on the old box cover 20a that can accommodate the integrated circuit package 42 in the embodiment of the present application. Therefore, the box cover 20 in the embodiment of the present application adds a third hollow portion 23, a fourth hollow portion 24, a fifth hollow portion 25 and a sixth hollow portion 26 on the basis of the old box cover 20a.

[0092] An embodiment of the utility model provides a chip assembly, comprising a second chip and a first chip, wherein the first chip is welded on the second chip.

[0093] Among them, the first chip in this embodiment has the same structure as the first chip provided in any of the above embodiments, and can bring the same or similar technical effects, which will not be described one by one here, and the details can be referred to the description of the above embodiments.

[0094] The utility model provides a consumables box, comprising a shell and a chip assembly; the chip assembly is detachably mounted on a chip mounting portion of the shell.

[0095] Among them, the chip component in this embodiment has the same structure as the chip component provided in any of the above embodiments, and can bring the same or similar technical effects, which will not be described one by one here, and the details can be referred to the description of the above embodiments.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A first chip, characterized in that: It can be welded to the second chip to form a chip assembly, and the chip assembly can be installed on the box body of the consumable box, and the box cover of the consumable box has a plurality of hollow parts; The first chip includes a circuit board, an integrated circuit package and contacts; The integrated circuit package and the contacts are arranged on the circuit board, and the integrated circuit package can be accommodated in one of the hollow parts of the box cover. In the direction perpendicular to the circuit board, the projection of the circuit board is misaligned with the projection of the old integrated circuit package of the second chip, and the thickness of the chip component is less than the sum of the thicknesses of the first chip and the second chip.

2. The first chip according to claim 1, characterized in that: The circuit board comprises a main body section and an extension section connected to each other, the contact is arranged on the main body section, and the integrated circuit package is arranged on the extension section; The projection of the main section in a direction perpendicular to the circuit board is misaligned with the projection of the old integrated circuit package, and the projection of the extension section in a direction perpendicular to the circuit board is misaligned with the projection of the second chip.

3. The first chip according to claim 2, characterized in that: A plurality of the contacts are arranged on the main body segment, and the plurality of the contacts are arranged at intervals along the first direction; The first direction is the width direction of the contact, and the first direction is perpendicular to the extending direction of the extending section.

4. The first chip according to claim 3, characterized in that: In a second direction, a projection of the contact is misaligned with a projection of the integrated circuit package; The second direction is the length direction of the contact.

5. The first chip according to claim 4, characterized in that: The integrated circuit package is arranged on a side of the extension section away from the main body section.

6. The first chip according to any one of claims 1 to 5, characterized in that: The circuit board is a flexible circuit board.

7. The first chip according to any one of claims 1 to 5, characterized in that: The box body has a toner outlet, and the integrated circuit package, the second chip and the toner outlet are respectively arranged in one of the hollow parts of the box cover.

8. The first chip according to any one of claims 1 to 5, characterized in that: The circuit board has a first surface and a second surface, wherein a first contact is disposed on the first surface, and a second contact is disposed on the second surface.

9. A chip assembly, characterized in that: The method comprises a second chip and the first chip as claimed in any one of claims 1 to 8, wherein the first chip is welded on the second chip.

10. A consumables box, characterized in that: It comprises a box body and the chip assembly as claimed in claim 9, wherein the chip assembly is mounted on the box body.