Heat dissipation structure and vehicle-mounted display screen
By designing a heat dissipation structure including a thermal conductive layer and a metal support frame, the problem of poor temperature resistance of the vehicle display screen is solved, and the effect of effectively deriving heat and avoiding screen failure is achieved.
Patent Information
- Application Number
- CN202323624179.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2025-02-21
- Estimated Expiration
- 2033-12-27
AI Technical Summary
The poor temperature resistance of the vehicle display screen leads to uneven temperatures in different locations, which may lead to abnormal or failure of the screen display.
A heat dissipation structure is designed, including a back cover module, a screen module, a support frame and a thermal conduction part. The thermal conduction part is attached to the circuit main board through the first thermal conduction layer and connected to the metal support frame to derive heat. Meanwhile, the second thermal conductive layer can be arranged between the screen module and the support frame to further derive the heat of the screen module.
Effectively export the heat from the circuit motherboard and screen module, avoiding the screen from failing due to high heat, and improving the temperature resistance and reliability of the on-board display screen.
Smart Images
Figure CN222515453U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of automobile interior decoration, in particular to a heat dissipation structure and a vehicle-mounted display screen. Background Art
[0002] As consumer demands continue to increase, in-vehicle displays are increasingly being used in automotive displays, but in-vehicle displays have certain defects, and their temperature resistance is poor. Because there are components with different heat and power consumption on the circuit board, this will cause uneven temperatures at different locations on the display. The screen in contact with the heat-generating components will overheat, causing abnormal display and even screen failure. Utility Model Content
[0003] The main purpose of the utility model is to provide a heat dissipation structure and a vehicle-mounted display screen, aiming to provide a heat dissipation structure and a vehicle-mounted display screen with good thermal conductivity and preventing the screen from failing due to high heat generated by a circuit mainboard.
[0004] In order to achieve the above-mentioned purpose, the utility model proposes a heat dissipation structure, which is characterized by comprising:
[0005] The rear cover module is concavely provided with a receiving groove;
[0006] A screen module is covered on the rear cover module and forms a receiving cavity with the receiving groove, wherein the receiving cavity is used to install a receiving circuit mainboard;
[0007] A support frame is disposed between the rear cover module and the screen module; the support frame material includes metal; and,
[0008] The heat conducting part includes a first heat conducting layer, which is attached to the circuit main board and connected to the support frame, so as to conduct heat from the circuit main board to the support frame.
[0009] Optionally, the heat-conducting portion further includes a second heat-conducting layer, which is disposed between the screen module and the support frame and is used for conducting heat from the screen module to the support frame.
[0010] Optionally, the heat dissipation structure further includes a bonding portion for bonding the rear cover module and the screen module; the bonding portion includes:
[0011] The first adhesive layer comprises a thermally conductive material; and / or
[0012] The second adhesive layer is made of a heat dissipation material.
[0013] Optionally, a plurality of heat dissipation holes are formed on the outer end surface of the rear cover module so that convection air can be formed in the accommodating cavity.
[0014] Optionally, a copper foil layer is laid on the end surface of the screen module facing the accommodating cavity to dissipate heat from the screen module.
[0015] Optionally, the accommodating cavity is densely formed with honeycomb grooves on the end surface relative to the screen module to increase the heat dissipation area.
[0016] Optionally, the heat dissipation structure further includes a heat dissipation portion, and the heat dissipation portion includes a heat dissipation layer, which is laid in the accommodating cavity to transfer heat from high to low.
[0017] Optionally, the heat dissipation structure further includes an isolation portion, which is disposed between the screen module and the circuit main board to isolate the heat of the circuit main board from the screen module.
[0018] Optionally, the isolation portion includes a spacer rubber strip, and a plurality of the spacer rubber strips are provided and evenly distributed between the screen module and the circuit main board.
[0019] The utility model also provides a vehicle-mounted display screen, the vehicle-mounted display screen includes a heat dissipation structure, the heat dissipation structure includes:
[0020] The rear cover module is concavely provided with a receiving groove;
[0021] A screen module is covered on the rear cover module and forms a receiving cavity with the receiving groove, wherein the receiving cavity is used to install a receiving circuit mainboard;
[0022] A support frame is disposed between the rear cover module and the screen module; the support frame material includes metal; and,
[0023] The heat conducting part includes a first heat conducting layer, which is attached to the circuit main board and connected to the support frame, so as to conduct heat from the circuit main board to the support frame.
[0024] In the technical solution of the utility model, the material of the support frame is metal with high thermal conductivity; the first thermal conductive layer is attached to the circuit main board and connected to the support frame, so as to guide the heat generated by the electronic components on the circuit main board to the support frame, and then the support frame dissipates the heat into the air, thereby avoiding the screen module being affected by the high heat generated by the circuit main board and causing the screen module to fail. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0026] Figure 1 A side cross-sectional schematic diagram of an embodiment of a heat dissipation structure provided by the utility model;
[0027] Figure 2 for Figure 1 A partial enlarged view of
[0028] Figure 3 is a structural schematic diagram of the bonding portion;
[0029] Figure 4 This is the bottom view of the vehicle display;
[0030] Figure 5 It is a structural schematic diagram of the inner end surface of the screen module;
[0031] Figure 6 It is a schematic diagram of the structure of the inner end surface of the rear cover module;
[0032] Figure 7 The present invention is a schematic side cross-sectional view of another embodiment of a heat dissipation structure provided by the present invention.
[0033] Description of Figure Numbers:
[0034] Label name Label name 1000 Heat dissipation structure 4 Heat transfer part 100 Car display 41 First thermal conductive layer 1 Back cover module 42 Second thermal conductive layer 11 Storage tank 5 Bonding 111 Accommodation cavity 51 First bonding layer 1111 Honeycomb slot 52 Second adhesive layer 12 Cooling holes 6 Heat dissipation 2 Screen module 61 Heat dissipation layer 21 Copper foil layer 7 Isolation Department 3 Support frame 71 Spacer Strip
[0035] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0037] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0038] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0039] As consumer demands continue to increase, in-vehicle displays are increasingly being used in automotive displays, but in-vehicle displays have certain defects, and their temperature resistance is poor. Because there are components with different heat and power consumption on the circuit board, this will cause uneven temperatures at different locations on the display. The screen in contact with the heat-generating components will overheat, causing abnormal display and even screen failure.
[0040] In order to solve the above problems, the utility model proposes a heat dissipation structure, which aims to provide a heat dissipation structure and a vehicle-mounted display screen with good heat conduction effect and prevent the screen from failing due to high heat generated by the circuit mainboard. Figures 1 to 7 The present invention is a schematic structural diagram of a heat dissipation structure and a vehicle-mounted display screen according to an embodiment of the present invention.
[0041] Please refer to Figure 1 The utility model proposes a heat dissipation structure 1000, including a back cover module 1, a screen module 2, a support frame 3 and a heat conducting part 4; the back cover module 1 is recessed with a receiving groove 11; the screen module 2 is covered on the back cover module 1, and forms a receiving cavity 111 with the receiving groove 11, and the receiving cavity 111 is used to install and receive a circuit main board; the support frame 3 is arranged between the back cover module 1 and the screen module 2; the material of the support frame 3 includes metal; the heat conducting part 4 includes a first heat conducting layer 41, which is attached to the circuit main board and connected to the support frame 3, so that the circuit main board can conduct heat to the support frame 3.
[0042] In the technical solution of the present utility model, the material of the support frame 3 is metal with high thermal conductivity; the first thermal conductive layer 41 is attached to the circuit main board and connected to the support frame 3, so as to guide the heat generated by the electronic components on the circuit main board to the support frame 3, and then the support frame 3 dissipates the heat into the air, thereby preventing the screen module 2 from being affected by the high heat generated by the circuit main board and causing the screen module 2 to fail.
[0043] For further information, please refer to Figure 1 The heat conducting part 4 also includes a second heat conducting layer 42, which is arranged between the screen module 2 and the support frame 3, and is used for the screen module 2 to conduct heat to the support frame 3. It can be understood that the screen module 2 will also generate heat when it emits light. In order to enable the heat emitted by the screen module 2 to be conducted away in time and prevent the screen module 2 from failing, the heat conducting part 4 is also provided with the second heat conducting layer 42, which is arranged between the screen module 2 and the support frame 3, and is used for the screen module 2 to conduct heat to the support frame 3, and then the support frame 3 conducts the absorbed heat into the air, thereby dissipating the heat of the screen module 2.
[0044] In addition, please refer to Figure 2 and Figure 3 The heat dissipation structure 1000 also includes a bonding portion 5 for bonding the back cover module 1 and the screen module 2; the bonding portion 5 includes: a first bonding layer 51, the material of which includes a thermal conductive material; and / or a second bonding layer 52, the material of which includes a heat dissipation material. It can be understood that the back cover module 1 and the screen module 2 are directly connected together by the adhesive portion 5. In some embodiments, the adhesive portion 5 includes a double-sided tape, but the double-sided tape does not have the ability to insulate and dissipate heat, resulting in poor heat dissipation effect of the screen module 2. Therefore, in another embodiment, the adhesive portion 5 includes the first adhesive layer 51, the material of the first adhesive layer 51 includes a thermal conductive material, and is arranged between the back cover module 1 and the screen module 2; the adhesive portion 5 also includes the second adhesive layer 52, the material of the second adhesive layer 52 includes a heat dissipation material, and is arranged between the back cover module 1 and the screen module 2; wherein, the first adhesive layer 51 and the second adhesive layer 52 can be arranged in combination or can be arranged alone, which is not limited here; by limiting the material of the adhesive portion 5, the temperature of the screen module 2 is further reduced, so that the screen module 2 does not fail due to excessive temperature.
[0045] In addition, please refer to Figure 4, a plurality of heat dissipation holes 12 are provided on the outer end surface of the rear cover module 1, so that convection air is formed in the accommodating cavity 111. It can be understood that the circuit main board is arranged in the accommodating cavity 111, and a plurality of electronic components are arranged on the circuit main board, which generates a large amount of heat when working. If it is not drained away, it will affect the screen module 2; therefore, a plurality of heat dissipation holes 12 are provided on the outer end surface of the rear cover module 1, so that convection air is formed in the accommodating cavity 111, thereby taking away the heat generated by the circuit main board in the accommodating cavity 111.
[0046] In addition, please refer to Figure 5 The end surface of the screen module 2 facing the accommodating cavity 111 is paved with a copper foil layer 21 to dissipate heat from the screen module 2. It can be understood that the screen module 2 is a heating element. In order to better dissipate heat and conduct electricity, a whole copper foil layer 21 is added to the back of the luminous material of the screen module 2. The copper foil layer 21 has high thermal conductivity, which can improve the heat dissipation efficiency of the screen module 2.
[0047] In addition, please refer to Figure 6 The end surface of the accommodating cavity 111 relative to the screen module 2 is densely formed with honeycomb grooves 1111 to increase the heat dissipation area. In order to increase the heat dissipation area within the limited space of the accommodating cavity 111, the end surface of the accommodating cavity 111 relative to the screen module 2 is densely formed with the honeycomb grooves 1111. A large number of the honeycomb grooves 1111 can greatly increase the area of heat conduction, thereby playing a role in reducing temperature rise.
[0048] In addition, please refer to Figure 6 , the heat dissipation structure 1000 also includes a heat dissipation portion 6, and the heat dissipation portion 6 includes a heat dissipation layer 61, which is laid in the accommodating cavity 111 to transfer heat from high to low. It can be understood that since there are components with different heat and power consumption on the circuit main board, this will cause uneven temperatures at different positions in the accommodating cavity 111, so that the temperature is evenly distributed in time, or the difference between the highest temperature and the lowest temperature is as small as possible, which is beneficial to protecting the screen module 2 from failure due to overheating; therefore, the heat dissipation structure 1000 also includes the heat dissipation portion 6, and the heat dissipation portion 6 includes the heat dissipation layer 61, which is laid in the accommodating cavity 111 to transfer heat from high to low, so that the temperature inside the accommodating cavity 111 is evenly distributed.
[0049] In addition, please refer to Figure 7, the heat dissipation structure 1000 also includes an isolation part 7, which is arranged between the screen module 2 and the circuit main board to isolate the heat of the circuit main board from the screen module 2. It can be understood that the circuit main board is the main part that generates heat, and its distance from the screen module 2 will also affect the operating state of the screen module 2; therefore, the heat dissipation structure 1000 is also provided with the isolation part 7, which is arranged between the screen module 2 and the circuit main board to isolate the heat of the circuit main board from the screen module 2, thereby protecting the screen module 2 from the high temperature of the circuit main board.
[0050] Furthermore, the isolation part 7 includes a spacer rubber strip 71, and a plurality of the spacer rubber strips 71 are provided and evenly distributed between the screen module 2 and the circuit main board. Considering the economic efficiency, the isolation part 7 is configured as the spacer rubber strip 71, and a plurality of the spacer rubber strips 71 are provided and evenly distributed between the screen module 2 and the circuit main board, so that there is a certain distance between the screen module 2 and the back cover module 1, because air is a poor conductor of heat, thereby protecting the screen module 2 from the heat generated by the circuit main board as much as possible, and the material is simple, which is more economical.
[0051] The utility model also proposes a vehicle-mounted display screen 100, which includes a heat dissipation structure 1000. The specific structure of the heat dissipation structure 1000 refers to the above-mentioned embodiment. Since the vehicle-mounted display screen 100 adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.
[0052] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A heat dissipation structure, characterized in that: include: The rear cover module is concavely provided with a receiving groove; A screen module is covered on the rear cover module and forms a receiving cavity with the receiving groove, wherein the receiving cavity is used to install a receiving circuit mainboard; A support frame is disposed between the rear cover module and the screen module; the support frame material includes metal; and, The heat conducting part includes a first heat conducting layer, which is attached to the circuit main board and connected to the support frame, so as to conduct heat from the circuit main board to the support frame.
2. The heat dissipation structure according to claim 1, characterized in that: The heat-conducting part also includes a second heat-conducting layer, which is arranged between the screen module and the support frame and is used for conducting heat from the screen module to the support frame.
3. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further includes a bonding portion for bonding the rear cover module and the screen module; the bonding portion includes: The first adhesive layer comprises a thermally conductive material; and / or The second adhesive layer is made of a heat dissipation material.
4. The heat dissipation structure according to claim 1, characterized in that: A plurality of heat dissipation holes are formed on the outer end surface of the rear cover module so that convection air can be formed in the accommodating cavity.
5. The heat dissipation structure according to claim 1, characterized in that: A copper foil layer is laid on the end surface of the screen module facing the accommodating cavity to dissipate heat from the screen module.
6. The heat dissipation structure according to claim 1, characterized in that: The end surface of the accommodating cavity relative to the screen module is densely formed with honeycomb grooves to increase the heat dissipation area.
7. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further includes a heat dissipation portion, and the heat dissipation portion includes a heat dissipation layer, which is laid in the accommodating cavity to transfer heat from high to low.
8. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further includes an isolation portion, which is disposed between the screen module and the circuit main board to isolate the heat of the screen module from the circuit main board.
9. The heat dissipation structure according to claim 8, characterized in that: The isolation portion includes a spacer rubber strip, and a plurality of the spacer rubber strips are provided and evenly distributed between the screen module and the circuit main board.
10. A vehicle-mounted display screen, characterized in that: The vehicle-mounted display screen includes the heat dissipation structure according to any one of claims 1-9.