Edge computing protocol conversion equipment for intelligent heating

Abstract

The utility model provides an edge computing protocol conversion device for intelligent heating, and belongs to the field of protocol conversion devices. The problems of redundancy of high configuration functions and insufficient low configuration computing power of the existing protocol conversion equipment in actual use are solved; comprising a shell, a main control circuit board is fixed in the shell, an RJ45 interface used for being connected with an RS485 communication line, a power line and a serial port is formed in the shell, a power module, an RS485 communication interface chip and an MCU module are integrated on the main control circuit board, the MCU module is connected with the RS485 communication interface chip, and the MCU module comprises a WIFI module, a Bluetooth module, a built-in storage module and a logic module. The built-in storage module stores device types of power supply devices and protocols corresponding to cross-manufacturer devices, the MCU module exchanges data with the RS485 communication chip through a UART serial port, the MCU module sends the recognized device types and corresponding protocol data to the WIFI module through the serial port, and the WIFI module sends the data to an upper layer device; the protocol converter is applied to equipment protocol conversion in the heating and ventilation field.

Description

Technical Field

[0001] The utility model relates to the application of the Internet of Things (IoT) and edge computing technology in an intelligent heating system, and specifically to an edge computing protocol conversion device for smart heating. Background Art

[0002] With the vigorous development of the Internet of Things industry, the HVAC industry has to some extent realized data transmission and processing by utilizing technologies such as the Internet of Things and big data. However, most systems are generally built using single-function DTU-type related equipment. The data processing function only focuses on data transmission and a certain level of offline storage capability. In terms of data calculation and data storage, it is still stored upstream in the form of metadata. This type of method will greatly increase the computing pressure of the central node service. There is an urgent need for a conversion device that can sink the cloud computing capabilities to the edge side and the sensor side, and at the same time has protocol conversion, alarm calculation, data aggregation, and flexible combination to complete the unified delivery, operation, maintenance, and control of upper-level data.

[0003] In the prior art, there are two main types of devices that can perform the above functions. One type is the edge gateway type, such as a new type of distributed DTU disclosed in Chinese patent CN110112698A, whose structure is as follows: Figure 1 As shown, the device hardware and software are rich in functions and have strong computing power. However, this type of device generally has slightly higher requirements for hardware configuration, the device size is slightly larger, and not all functions of the device must be used in actual usage scenarios. This will lead to redundant device functions and difficulty in disassembly, and the cost of further sinking the edge computing power will become higher.

[0004] One type is DTU equipment, such as a multifunctional data acquisition controller based on 4G-DTU wireless network transmission disclosed in Chinese patent CN111464968A, whose structure is as follows: Figure 2 As shown, this type of equipment has relatively low hardware configuration requirements and is relatively small in size, but its main function is data transmission, and most of the data calculation and processing is still placed in the upper central node device unit. Although it has certain edge computing functions, most of them are general functions, and the functional completion in the heating segment is not enough. Utility Model Content

[0005] In order to solve the problems of redundant functions in high-configuration protocol conversion devices and insufficient computing power in low-configuration protocol conversion devices in actual use, the utility model proposes an edge computing protocol conversion device for smart heating, aiming to realize a protocol conversion device with edge computing power and the ability to flexibly adapt to various heating equipment through hardware improvements or improvements to the combined connection of hardware modules and / or circuits.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is: an edge computing protocol conversion device for smart heating, comprising a shell, a main control circuit board is fixed inside the shell, an RJ45 interface for connecting an RS485 communication line, a power line and a serial port is opened on the shell, and the RJ45 interface is pluggable to connect an RJ45 network port to a 6-pin terminal wiring RJ45 network port, and the 6-pin port of the RJ45 network port to the 6-pin terminal wiring is connected to the heating equipment;

[0007] The main control circuit board is integrated with a power module, an RS485 communication interface chip and an MCU module. The MCU module is connected to the RS485 communication interface chip. The power module supplies power to the main control circuit board. The MCU module includes a WIFI module, a Bluetooth module, a built-in storage module and a logic module. The logic module is connected to the WIFI module, the Bluetooth module and the built-in storage module through a wire. The built-in storage module stores the device type of each power supply device and the corresponding protocol of the cross-manufacturer device. The MCU module exchanges data with the RS485 communication chip through a UART serial port. The MCU module stores the received data in the built-in storage module. The logic module can also read the data in the built-in storage module. The MCU module sends the identified device type and the corresponding protocol data to the WIFI module through the serial port, and the WIFI module sends the data to the upper layer device.

[0008] The RJ45 interface has 8 terminals, and terminals 1-8 of the RJ45 interface are respectively used for serial port configuration, power supply and 485 bus communication of the device. The parameters are written into the built-in storage module of the MCU module through the RJ45 interface according to the T568A line sequence as the data input line to complete the initialization configuration; the heating equipment at the lower end is connected to the RS485 communication interface chip as the RS485 data bus input and output interface according to the T568A line sequence.

[0009] The MCU module uses the ESP32C3N4 module as the main control chip, the RS485 communication interface chip uses the MAX485ESA as the communication chip, the pin 1 of the ESP32C3N4 module is connected in parallel to one end of the resistor R7, one end of the capacitor C25, and one end of the capacitor C24, the other end of the resistor R7 is connected in parallel to the pin 2 of the ESP32C3N4 module and one end of the capacitor C26, the other ends of the capacitors C24, C25, and C26 are grounded respectively, the pin 5 of the ESP32C3N4 module is connected to the pin 9 of the RJ45 interface to connect LED2, the pin 10 of the RJ45 interface is connected in series with the resistor R13 and then grounded, the pin 12 of the RJ45 interface is connected in series with the resistor R12 and then grounded, and the pin 11 of the RJ45 interface is connected to a +3.3V power supply;

[0010] Pins 7 and 8 of the ESP32C3N4 module are connected to GPIO8 and GPIO9 respectively, wherein GPIO8 is connected in series with a resistor R8 and then connected to a +3.3V power supply, GPIO9 is connected in parallel to one end of a button SW4 and one end of a capacitor C27, the other end of the button SW4 is connected in parallel to the other end of the capacitor C27 and then grounded, and pin 2 of the ESP32C3N4 module is also connected in parallel to one end of a button SW5 and one end of a capacitor C28, the other end of the button SW5 is connected in parallel to the other end of the capacitor C28 and then grounded;

[0011] Pin 9 of the ESP32C3N4 module is grounded, pin 10 of the ESP32C3N4 module is connected to pin 2 of the RS485 communication interface chip, pins 11 and 12 of the ESP32C3N4 module are connected to pins 4 and 5 of the RJ45 interface respectively, pins 13 and 14 of the ESP32C3N4 module are connected to pins 1 and 2 of the RS485 communication interface chip respectively, wherein pins 2 and 3 of the RS485 communication interface chip are connected, pin 5 of the RS485 communication interface chip is grounded, pins 6 and 7 of the RS485 communication interface chip are connected to pins 3 and pin 6 of the RJ45 interface respectively, pin 8 of the RS485 communication interface chip is connected in parallel to one end of capacitor C29, one end of capacitor C30 and then to a +3.3V power supply, the other end of capacitor C29 is connected in parallel to the other end of capacitor C30 and then to ground, pin 6 of the RS485 communication interface chip is connected in parallel to one end of resistor R42, one end of resistor R11 and one end of discharge diode D3, The other end of the resistor R42 is connected to +3.3V, the other end of the resistor R11 is connected in parallel to pin 7 of the RS485 communication interface chip, one end of the resistor R43, and one end of the discharge diode D4, the other end of the resistor R43 is grounded, the other end of the discharge diode D4 is connected in parallel to the other end of the discharge diode D3 and then grounded, the pin 6 of the RS485 communication interface chip is also connected in parallel to one end of the transient suppression diode D12 and one end of the transient suppression diode D10, the other end of the transient suppression diode D12 is grounded, the other end of the transient suppression diode D10 is connected in parallel to pin 7 of the RS485 communication interface chip and one end of the transient suppression diode D11, and the other end of the transient suppression diode D11 is grounded; the pin 5 of the RJ45 interface is also connected in parallel to one end of the transient suppression diode D13, the other end of the transient suppression diode D13 is grounded, the pin 4 of the RJ45 interface is also connected in parallel to one end of the transient suppression diode D14, and the other end of the transient suppression diode D14 is grounded.

[0012] The power module includes a voltage-step-down circuit and a voltage-stabilizing circuit.

[0013] The step-down circuit uses TPS54302 as a power chip, and the voltage stabilizing circuit uses AMS1117-3.3 as a voltage stabilizing chip.

[0014] Pin 1 of the power chip is grounded, pin 2 of the power chip is connected in parallel to one end of capacitor C3 and one end of inductor L1, the other end of capacitor C3 is connected to pin 6 of the power chip, the other end of inductor L1 is connected in parallel to one end of capacitor C4, one end of capacitor C5, one end of resistor R1 and then connected to +5V power supply, capacitor C4 The other end of the resistor R1 and the other end of the capacitor C5 are both grounded, the other end of the resistor R1 is connected in parallel to one end of the capacitor C6 and one end of the resistor R2, the other end of the capacitor C6 is connected in parallel to the other end of the resistor R2 and one end of the resistor R3, and then to pin 4 of the power supply chip, the other end of the resistor R3 is grounded, pin 3 of the power supply chip is connected in parallel to one end of the resistor R4, one end of the capacitor C2, one end of the capacitor C1, the positive electrode of the Schottky diode D2, and one end of the transient suppression diode D1, and then to the +12V power supply, the other end of the resistor R4 is connected in parallel to one end of the resistor R5 and pin 5 of the power supply chip, the other end of the resistor R5 is grounded, the other end of the capacitor C2 is connected in parallel to the other end of the capacitor C1, the negative electrode of the Schottky diode D2, and the other end of the transient suppression diode D1, and then to ground.

[0015] Pin 1 of the voltage stabilizing chip is grounded, pins 2 and 4 of the voltage stabilizing chip are connected and connected in parallel to one end of capacitor C10 and one end of capacitor C9 to output a 3.3V power supply, the other end of capacitor C9 is connected in parallel to the other end of capacitor C10 and then grounded, pin 3 of the voltage stabilizing chip is connected in parallel to one end of capacitor C7 and one end of capacitor C23 and then connected to a +5V power supply, the other end of capacitor C7 is connected in parallel to the other end of capacitor C23 and then grounded.

[0016] The beneficial effects of the present invention compared to the prior art are as follows: the edge computing protocol conversion device proposed by the present invention can more flexibly adapt to the communication protocols used by different heating equipment through a chip with edge computing capabilities. It has more flexible protocol adaptation, which solves the problem of high-end function redundancy and low-frequency function insufficiency. At the same time, users do not need to worry about the mismatch of communication protocols between devices, which greatly simplifies the process of system integration and deployment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings:

[0018] Figure 1 It is a structural diagram of the existing edge gateway class;

[0019] Figure 2 It is a structural diagram of the existing DTU equipment;

[0020] Figure 3 This is a main control circuit structure diagram of the protocol conversion device of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the protocol conversion device used in the embodiment of the utility model;

[0022] Figure 5 This is a schematic diagram of the structure of voltage conversion of the protocol conversion device of the utility model;

[0023] Figure 6 This is the circuit schematic diagram of the MCU module of the utility model;

[0024] Figure 7 This is a circuit schematic diagram of the signal conversion of the utility model;

[0025] Figure 8 This is a circuit schematic diagram of the voltage-reducing circuit of the utility model;

[0026] Fig. 9 This is a circuit schematic diagram of the voltage stabilizing circuit of the utility model;

[0027] Fig.10 This is a circuit schematic diagram of the peripheral interface of the utility model. DETAILED DESCRIPTION

[0028] like Figures 3 to 10 As shown, the utility model provides an edge computing protocol conversion device for smart heating, including a shell and a main control circuit board fixed in the shell, and the shell is also provided with an RJ45 interface for accessing RS485 communication lines, power lines and serial ports. The RJ45 interface can be plugged into an RJ45 network port to 6-pin terminal wiring, thereby connecting the protocol conversion device to heating equipment such as water meters, electric meters, pressure gauges, etc.; Figure 3 As shown, the main control circuit board integrates a power module, an RS485 communication interface chip and an MCU module. The MCU module is coupled to the RS485 communication interface chip. The MCU module includes a WIFI module, a Bluetooth module, a built-in storage module and a logic module. The RJ45 interface has 8 wiring terminals. The 8-wire system is used to hide the uncommon wiring configuration extension function under the premise of completing the core function to further reduce the size of the device. The 1-8 lines of the RJ45 interface are used for the serial port configuration, power supply, and 485 bus communication of the device respectively. The parameters are written into the built-in storage of the MCU module through the RJ45 interface through the serial port according to the T568A line sequence so that the 7th and 8th pins of the RJ45 network port are used as data input lines. The initialization configuration is completed in the module for subsequent logic modules to perform storage, calculation, and network configuration; the lower-end device uses the 3rd and 6th pins of the 6-pin terminal as the RS485 data bus input and output (RX, TX) interface according to the T568A line sequence, and connects to the RS485 communication interface chip. The MCU module exchanges data with the RS485 communication chip through the UART serial port. The MCU module stores the received data in the built-in storage module (internal EEPROM). The logic module reads the data stored in the EEPROM and combines it with the input data, then integrates the data through the logic module, converts it into the data format required by the user, and then sends it to the WIFI module through the serial port and sends the data to the upper-level device.

[0029] like Figure 4 As shown, each protocol conversion device installed during use of the utility model only processes the downstream device to which it is connected. The number of devices is installed as required based on the actual situation of the scene, which solves the problem of high-end functional redundancy and increases the possibility of further edge computing devices.

[0030] like Figure 6-10 As shown, the MCU module of the utility model uses the ESP32C3N4 module as the first main control chip to process the full-process control logic, without the need for an additional MCU chip, reducing the size of the device and saving costs, and encapsulating and opening the user's autonomous protocol analysis secondary development function under the hardware architecture. The RS485 communication interface chip uses the MAX485ESA half-duplex RS-485 transceiver to meet long-distance, high-speed, and reliable data communication, and is coupled to the ESP32C3N4 module UART serial port to process terminal devices within the baud rate range of 1200 to 115200. In addition, the RJ45 network port socket uses the 8-wire system to hide the uncommon wiring configuration extension function under the premise of completing the core function to further reduce the size of the device. After power-on, the DC5V-DC28V voltage is converted to 5VDC through the power chip TPS54302DDCR, and then the 5V voltage is reduced to 3.3V through the AMS1117-3.3. The specific implementation circuit is as follows.

[0031] Pin 1 of the ESP32C3N4 module is connected in parallel to one end of the resistor R7, one end of the capacitor C25, and one end of the capacitor C24. The other end of the resistor R7 is connected in parallel to pin 2 of the ESP32C3N4 module and one end of the capacitor C26. The other ends of the capacitors C24, C25, and C26 are grounded respectively. Pin 5 of the ESP32C3N4 module is connected to pin 9 of the RJ45 interface to connect LED2. Pin 10 of the RJ45 interface is connected in series with resistor R13 and then to ground. Pin 12 of the RJ45 interface is connected in series with resistor R12 and then to ground. Pin 11 of the RJ45 interface is connected to a +3.3V power supply. Pins 11 and 12 of the RJ45 interface are green lights that come with the network port to indicate the power-on status.

[0032] Pins 7 and 8 of the ESP32C3N4 module are connected to GPIO8 and GPIO9 respectively. GPIO8 is connected in series with resistor R8 and then to a +3.3V power supply. GPIO9 is connected in parallel to one end of button SW4 and one end of capacitor C27. The other end of button SW4 is connected in parallel to the other end of capacitor C27 and then to ground. Pin 2 of the ESP32C3N4 module is also connected in parallel to one end of button SW5 and one end of capacitor C28. The other end of button SW5 is connected in parallel to the other end of capacitor C28 and then to ground. Pin 9 of the ESP32C3N4 module is grounded. Pin 10 of the ESP32C3N4 module is connected to Connect the pin 2 of the RS485 communication interface chip, the pins 11 and 12 of the ESP32C3N4 module are connected to the pins 4 and 5 of the RJ45 interface respectively, the pins 13 and 14 of the ESP32C3N4 module are connected to the pins 1 and 2 of the RS485 communication interface chip respectively, wherein the pins 2 and 3 of the RS485 communication interface chip are connected, the pin 5 of the RS485 communication interface chip is grounded, the pins 6 and 7 of the RS485 communication interface chip are connected to the pins 3 and pin 6 of the RJ45 interface respectively, and the pin 8 of the RS485 communication interface chip is connected in parallel to one end of the capacitor C29 and one end of the capacitor C30. The other end of capacitor C29 is connected to the other end of capacitor C30 and then to ground. Pin 6 of the RS485 communication interface chip is connected to one end of resistor R42, one end of resistor R11, and one end of discharge diode D3. The other end of resistor R42 is connected to +3.3V. The other end of resistor R11 is connected to pin 7 of the RS485 communication interface chip, one end of resistor R43, and one end of discharge diode D4. The other end of resistor R43 is grounded. The other end of discharge diode D4 is connected to the other end of discharge diode D3 and then to ground. Pin 6 of the RS485 communication interface chip is connected to one end of resistor R42, one end of resistor R11, and one end of discharge diode D3. The other end of resistor R43 is grounded. The other end of discharge diode D4 is connected to the other end of discharge diode D3 and then to ground. 6 is also connected in parallel to one end of a transient suppression diode D12 and one end of a transient suppression diode D10, the other end of the transient suppression diode D12 is grounded, the other end of the transient suppression diode D10 is connected in parallel to pin 7 of the RS485 communication interface chip and one end of a transient suppression diode D11, the other end of the transient suppression diode D11 is grounded; pin 5 of the RJ45 interface is also connected in parallel to one end of a transient suppression diode D13, the other end of the transient suppression diode D13 is grounded, pin 4 of the RJ45 interface is also connected in parallel to one end of a transient suppression diode D14, the other end of the transient suppression diode D14 is grounded.

[0033] In the above circuit, the ESP32C3N4 module is used to execute the business functions of the entire circuit board. It is the CPU of the entire board and all logics are handled by this module. C24 and C25 are decoupling capacitors that provide a stable voltage to the chip. Resistor R7 pulls up the chip pin 2 to enable the chip. C26 is a decoupling capacitor, and in conjunction with resistor R7, the level signal of the enable pin is met at the moment of power-on. Resistor R8 can pull down the IO8 pin of the chip so that the chip can print information normally when powered on. SW4 controls the BOOT pin of the chip, allowing the chip to enter the program burning mode. SW5 is the reset control button of the chip.

[0034] The MAX485ESA chip converts the serial port signal into a differential signal for converting the level signal. C29 and C30 are used to decouple the 3.3V power supply voltage so that the MAX3485 can be powered stably. R42 is a pull-up resistor that allows the device to have a certain level in the idle state. R43 is a pull-down resistor that allows the device to have a certain level in the idle state. R11 is used to match the impedance of the communication network when connecting to the cluster device, which requires about 60 ohms. D3 and D4 are discharge diodes to prevent static electricity from damaging the device. D12, D10, and D11 are transient suppression diodes used to prevent the bus voltage from being too high and damaging the device.

[0035] The RJ45 interface connects the external signal to the board through the R-RJ45RO8P-C000 terminal block. D13 and D14 are used to protect the program download port. R12 and R13 are the current-limiting resistors for the indicator lights on the terminal blocks.

[0036] like Figure 8 As shown, the step-down circuit of the utility model adopts TPS54302 as the power chip, the pin 1 of the power chip is grounded, the pin 2 of the power chip is connected in parallel to one end of the capacitor C3 and one end of the inductor L1, the other end of the capacitor C3 is connected to the pin 6 of the power chip, the other end of the inductor L1 is connected in parallel to one end of the capacitor C4, one end of the capacitor C5, one end of the resistor R1 and then connected to a +5V power supply, the other end of the capacitor C4 and the other end of the capacitor C5 are both grounded, the other end of the resistor R1 is connected in parallel to one end of the capacitor C6 and one end of the resistor R2, the other end of the capacitor C6 is connected in parallel to the resistor R2 The other end of the resistor R3 is connected to pin 4 of the power chip, the other end of the resistor R3 is grounded, pin 3 of the power chip is connected in parallel to one end of the resistor R4, one end of the capacitor C2, one end of the capacitor C1, the positive electrode of the Schottky diode D2, and one end of the transient suppression diode D1, and then connected to a +12V power supply, the other end of the resistor R4 is connected in parallel to pin 5 of the power chip at one end of the resistor R5, the other end of the resistor R5 is grounded, the other end of the capacitor C2 is connected in parallel to the other end of the capacitor C1, the negative electrode of the Schottky diode D2, and the other end of the transient suppression diode D1, and then grounded.

[0037] The buck circuit can convert the input 6-18V DC voltage into 5V DC voltage. The TPS54302 device is a 3A synchronous buck converter with an input voltage range of 4.5V to 28V and an output voltage of 596mV~28V. It has an advanced Eco-mode to maximize light load efficiency and reduce power loss. The output voltage is controlled to 5V by adjusting the resistance values ​​of R2 and R3. Among them, D1 is a transient suppression diode, which is used to prevent surge static electricity protection and overvoltage protection. D2 is a Schottky diode, which has a large power and is used to prevent power reverse connection protection. C1 and C2 are power filter capacitors, which provide a smoother voltage for the power chip. R4 and R5 provide enable voltage for the chip. C3 is a bootstrap capacitor. L1 is an output power inductor. C4 and C5 are output capacitors. R1 indicates a convenient location for disconnecting the control loop for stability testing. R2 and R3 are proportional resistors used to control the output voltage.

[0038] The voltage stabilizing circuit of the utility model adopts the AMS1117-3.3 chip to stabilize the voltage of 5V input to 3.3V, and provide a power supply environment with smaller ripple for the chip. Pin 1 of the AMS1117-3.3 chip is grounded, and pins 2 and 4 of the AMS1117-3.3 chip are connected and connected to one end of capacitor C10 and one end of capacitor C9 to output 3.3V power supply, and the other end of capacitor C9 is connected to the other end of capacitor C10 and then grounded, and pin 3 of the AMS1117-3.3 chip is connected to one end of capacitor C7 and one end of capacitor C23 and then connected to +5V power supply, and the other end of capacitor C7 is connected to the other end of capacitor C23 and then grounded. The voltage stabilizing circuit uses LDO, i.e., low voltage difference linear regulator, to stabilize the voltage to 3.3V, and the latter circuit can obtain a voltage with lower ripple through the filtering of capacitors C10 and C9. C23 and C7 are used to decouple the input 5V voltage to obtain a relatively stable 5V voltage. C10 and C9 are used to decouple the output voltage.

[0039] By utilizing the device of the utility model, it is possible to achieve refined management and monitoring of the underlying sensing nodes, including functions such as remote configuration, fault diagnosis, and status monitoring, thereby improving the stability and reliability of the system and reducing the cost of maintenance and operation.

[0040] Regarding the specific structure of the utility model, it should be explained that the connection relationship between the various component modules adopted in the utility model is definite and feasible. Except for special instructions in the embodiments, the specific connection relationship can bring corresponding technical effects and solve the technical problems raised by the utility model without relying on the execution of corresponding software programs. The components, modules, models of specific components and the connection methods between each other appearing in the utility model, as well as the conventional use methods and expected technical effects brought about by the above-mentioned technical features, except for specific instructions, all belong to the disclosed contents in patents, journal articles, technical manuals, technical dictionaries, and textbooks that can be obtained by technical personnel in this field before the application date, or belong to the existing technologies such as conventional technologies and common knowledge in this field, and there is no need to elaborate, so that the technical solution provided in this case is clear, complete and feasible, and the corresponding physical products can be reproduced or obtained according to the technical means.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. An edge computing protocol conversion device for smart heating, comprising a housing, characterized in that: A main control circuit board is fixed inside the shell, and an RJ45 interface for connecting an RS485 communication line, a power line and a serial port is provided on the shell. The RJ45 interface is pluggable to connect an RJ45 network port to a 6-pin terminal wiring RJ45 network port, and the 6-pin port of the RJ45 network port to a 6-pin terminal wiring is connected to the heating equipment; The main control circuit board is integrated with a power module, an RS485 communication interface chip and an MCU module. The MCU module is connected to the RS485 communication interface chip. The power module supplies power to the main control circuit board. The MCU module includes a WIFI module, a Bluetooth module, a built-in storage module and a logic module. The logic module is connected to the WIFI module, the Bluetooth module and the built-in storage module through a wire. The built-in storage module stores the device type of each power supply device and the corresponding protocol of the cross-manufacturer device. The MCU module exchanges data with the RS485 communication chip through a UART serial port. The MCU module stores the received data in the built-in storage module. The logic module can also read the data in the built-in storage module. The MCU module sends the identified device type and the corresponding protocol data to the WIFI module through the serial port, and the WIFI module sends the data to the upper layer device.

2. According to claim 1, an edge computing protocol conversion device for smart heating is characterized in that: The RJ45 interface has 8 terminals, and terminals 1-8 of the RJ45 interface are respectively used for serial port configuration, power supply and 485 bus communication of the device. The parameters are written into the built-in storage module of the MCU module through the RJ45 interface according to the T568A line sequence as the data input line to complete the initialization configuration; the heating equipment at the lower end is connected to the RS485 communication interface chip as the RS485 data bus input and output interface according to the T568A line sequence.

3. The edge computing protocol conversion device for smart heating according to claim 2 is characterized in that: The MCU module uses the ESP32C3N4 module as the main control chip, the RS485 communication interface chip uses the MAX485ESA as the communication chip, the pin 1 of the ESP32C3N4 module is connected in parallel to one end of the resistor R7, one end of the capacitor C25, and one end of the capacitor C24, the other end of the resistor R7 is connected in parallel to the pin 2 of the ESP32C3N4 module and one end of the capacitor C26, the other ends of the capacitors C24, C25, and C26 are grounded respectively, the pin 5 of the ESP32C3N4 module is connected to the pin 9 of the RJ45 interface to connect LED2, the pin 10 of the RJ45 interface is connected in series with the resistor R13 and then grounded, the pin 12 of the RJ45 interface is connected in series with the resistor R12 and then grounded, and the pin 11 of the RJ45 interface is connected to a +3.3V power supply; Pins 7 and 8 of the ESP32C3N4 module are connected to GPIO8 and GPIO9 respectively, wherein GPIO8 is connected in series with a resistor R8 and then connected to a +3.3V power supply, GPIO9 is connected in parallel to one end of a button SW4 and one end of a capacitor C27, the other end of the button SW4 is connected in parallel to the other end of the capacitor C27 and then grounded, and pin 2 of the ESP32C3N4 module is also connected in parallel to one end of a button SW5 and one end of a capacitor C28, the other end of the button SW5 is connected in parallel to the other end of the capacitor C28 and then grounded; Pin 9 of the ESP32C3N4 module is grounded, pin 10 of the ESP32C3N4 module is connected to pin 2 of the RS485 communication interface chip, pins 11 and 12 of the ESP32C3N4 module are connected to pins 4 and 5 of the RJ45 interface respectively, pins 13 and 14 of the ESP32C3N4 module are connected to pins 1 and 2 of the RS485 communication interface chip respectively, wherein pins 2 and 3 of the RS485 communication interface chip are connected, pin 5 of the RS485 communication interface chip is grounded, pins 6 and 7 of the RS485 communication interface chip are connected to pins 3 and pin 6 of the RJ45 interface respectively, pin 8 of the RS485 communication interface chip is connected in parallel to one end of capacitor C29, one end of capacitor C30 and then to a +3.3V power supply, the other end of capacitor C29 is connected in parallel to the other end of capacitor C30 and then to ground, pin 6 of the RS485 communication interface chip is connected in parallel to one end of resistor R42, one end of resistor R11 and one end of discharge diode D3, The other end of the resistor R42 is connected to +3.3V, the other end of the resistor R11 is connected in parallel to pin 7 of the RS485 communication interface chip, one end of the resistor R43, and one end of the discharge diode D4, the other end of the resistor R43 is grounded, the other end of the discharge diode D4 is connected in parallel to the other end of the discharge diode D3 and then grounded, the pin 6 of the RS485 communication interface chip is also connected in parallel to one end of the transient suppression diode D12 and one end of the transient suppression diode D10, the other end of the transient suppression diode D12 is grounded, the other end of the transient suppression diode D10 is connected in parallel to pin 7 of the RS485 communication interface chip and one end of the transient suppression diode D11, and the other end of the transient suppression diode D11 is grounded; the pin 5 of the RJ45 interface is also connected in parallel to one end of the transient suppression diode D13, the other end of the transient suppression diode D13 is grounded, the pin 4 of the RJ45 interface is also connected in parallel to one end of the transient suppression diode D14, and the other end of the transient suppression diode D14 is grounded.

4. The edge computing protocol conversion device for smart heating according to claim 2 is characterized in that: The power module includes a voltage-step-down circuit and a voltage-stabilizing circuit.

5. The edge computing protocol conversion device for smart heating according to claim 4 is characterized in that: The step-down circuit uses TPS54302 as a power chip, and the voltage stabilizing circuit uses AMS1117-3.3 as a voltage stabilizing chip.

6. The edge computing protocol conversion device for smart heating according to claim 5, characterized in that: Pin 1 of the power chip is grounded, pin 2 of the power chip is connected in parallel to one end of capacitor C3 and one end of inductor L1, the other end of capacitor C3 is connected to pin 6 of the power chip, and the other end of inductor L1 is connected in parallel to capacitor C4 One end of the resistor R1, one end of the capacitor C5, and one end of the resistor R1 are connected to a +5V power supply, the other end of the capacitor C4 and the other end of the capacitor C5 are grounded, the other end of the resistor R1 is connected in parallel to one end of the capacitor C6 and one end of the resistor R2, the other end of the capacitor C6 is connected in parallel to the other end of the resistor R2 and one end of the resistor R3, and then to pin 4 of the power supply chip, the other end of the resistor R3 is grounded, pin 3 of the power supply chip is connected in parallel to one end of the resistor R4, one end of the capacitor C2, one end of the capacitor C1, the positive electrode of the Schottky diode D2, and one end of the transient suppression diode D1, and then to the +12V power supply, the other end of the resistor R4 is connected in parallel to pin 5 of the power supply chip at one end of the resistor R5, the other end of the resistor R5 is grounded, the other end of the capacitor C2 is connected in parallel to the other end of the capacitor C1, the negative electrode of the Schottky diode D2, and the other end of the transient suppression diode D1, and then to ground.

7. The edge computing protocol conversion device for smart heating according to claim 5 is characterized in that: Pin 1 of the voltage stabilizing chip is grounded, pins 2 and 4 of the voltage stabilizing chip are connected and connected in parallel to one end of capacitor C10 and one end of capacitor C9 to output a 3.3V power supply, the other end of capacitor C9 is connected in parallel to the other end of capacitor C10 and then grounded, pin 3 of the voltage stabilizing chip is connected in parallel to one end of capacitor C7 and one end of capacitor C23 and then connected to a +5V power supply, the other end of capacitor C7 is connected in parallel to the other end of capacitor C23 and then grounded.

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