Thermal imaging equipment

Abstract

The embodiment of the utility model discloses thermal imaging equipment, relates to the technical field of surveying and mapping equipment, and aims to improve the thermal imaging quality. The thermal imaging equipment comprises a lens assembly, a separation blade assembly and a photosensitive assembly, wherein the separation blade assembly is arranged between the lens assembly and the photosensitive assembly; a soaking piece and a first heat conduction pad are arranged between the lens assembly and the separation blade assembly, the first surface of the soaking piece is in contact with the separation blade assembly, the second surface of the soaking piece is in contact with the first surface of the first heat conduction pad, and the second surface of the first heat conduction pad faces the lens assembly.

Description

Technical Field

[0001] The present application relates to the technical field of surveying and mapping equipment, and in particular to a thermal imaging device. Background Art

[0002] Thermal imaging equipment is widely used in surveying and mapping and other fields. Currently, thermal imaging equipment includes a lens and a baffle assembly. The infrared radiation light of the external object passes through the lens and the baffle assembly, and is received and imaged by the sensing assembly. Since the lens and the baffle assembly cannot directly contact each other, there is a gap between the two, which further leads to a temperature difference between the lens and the baffle assembly. When the temperature difference is large, the pitting noise index will be large, which will further make the thermal imaging quality poor. In addition, the large temperature difference of the baffle assembly will also lead to poor thermal imaging quality. Utility Model Content

[0003] In view of this, an embodiment of the present application provides a thermal imaging device to improve the quality of thermal imaging.

[0004] An embodiment of the present application provides a thermal imaging device, comprising: a lens assembly, a baffle assembly and a photosensitive assembly; wherein the baffle assembly is arranged between the lens assembly and the photosensitive assembly; a heat spreader and a first thermal pad are arranged between the lens assembly and the baffle assembly, a first surface of the heat spreader is in contact with the baffle assembly, a second surface of the heat spreader is in contact with a first surface of the first thermal pad, and a second surface of the first thermal pad faces the lens assembly.

[0005] According to a specific implementation of the embodiment of the present application, the first thermally conductive pad and the heat spreader are prefabricated integrated composite parts.

[0006] According to a specific implementation of the embodiment of the present application, the first thermally conductive pad and the heat spreader are an integrated composite part that are pre-pressed together, and a bonding layer for bonding the first thermally conductive pad and the heat spreader is provided between the first thermally conductive pad and the heat spreader.

[0007] According to a specific implementation of the embodiment of the present application, the heat spreader is a graphite sheet, gold, silver or copper; and the first thermally conductive pad is a thermally conductive silicone pad.

[0008] According to a specific implementation of the embodiment of the present application, a bonding layer for bonding the heat spreader and the baffle assembly is provided between the heat spreader and the baffle assembly.

[0009] According to a specific implementation method of the embodiment of the present application, the first thermal pad and the heat spreader are both sheet structures, the first thermal pad is provided with a first light-transmitting hole, the heat spreader is provided with a second light-transmitting hole, and the first light-transmitting hole and the second light-transmitting hole at least partially overlap.

[0010] According to a specific implementation method of the embodiment of the present application, a second thermally conductive pad is provided between the first thermally conductive pad and the lens assembly; the second surface of the first thermally conductive pad is in contact with the first surface of the second thermally conductive pad; a third light-transmitting hole is provided on the second thermally conductive pad, and the third light-transmitting hole at least partially overlaps with the first light-transmitting hole and the second light-transmitting hole.

[0011] According to a specific implementation of the embodiment of the present application, the lens assembly includes a lens and a lens mount for mounting the lens; the second surface of the second thermal pad is in contact with the lens mount.

[0012] According to a specific implementation of the embodiment of the present application, the thickness of the first thermal conductive pad is 0.3-0.8 mm.

[0013] According to a specific implementation of the embodiment of the present application, an installation orientation identification hole of the first thermal pad is provided on the first thermal pad at a preset edge position of the first light-transmitting hole.

[0014] In the thermal imaging device of this embodiment, the baffle assembly is arranged between the lens assembly and the photosensitive assembly, a heat spreader and a first thermal pad are arranged between the lens assembly and the baffle assembly, a first surface of the heat spreader contacts with the baffle assembly, a second surface of the heat spreader contacts with a first surface of the first thermal pad, and a second surface of the first thermal pad faces the lens assembly. In this way, the heat spreader can reduce the temperature difference between various parts in the baffle assembly, and the heat of the baffle assembly can be transferred to the lens assembly through the heat spreader and the first thermal pad, thereby reducing the temperature difference between the baffle assembly and the lens assembly, thereby improving the quality of thermal imaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 An exploded diagram of a thermal imaging device provided in one embodiment of the present application;

[0017] Figure 2 A schematic diagram of the positional relationship of a first thermal pad, a heat spreader, and a baffle assembly provided in a specific embodiment of the present application;

[0018] Figure 3 An exploded diagram of a thermal imaging device provided in yet another embodiment of the present application;

[0019] Figure 4This is an external schematic diagram of a thermal imaging device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0020] The embodiments of the present application are described in detail below in conjunction with the accompanying drawings. It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] As mentioned in the background technology, when there is a large temperature difference between the lens and the baffle assembly, the thermal imaging quality will be poor. During the research process, the inventor found that the process of the thermal imaging photosensitive assembly (sensor) can be optimized to reduce the impact caused by the excessive temperature difference between the lens and the baffle assembly, but this method has high requirements on the sensor process and high uncertainty. To this end, a heat-conducting member can be filled at the lens seat and the baffle to reduce the temperature difference between the lens seat (lens) and the baffle, such as filling with thermal conductive foam. However, the thermal conductive foam has poor thermal conductivity and cannot be made into a special shape, which is inconvenient to operate and has the risk of dust introduction. Therefore, further, a thermal conductive pad with a dustproof structure can be provided in the gap between the lens and the baffle assembly. In order to increase the contact area between the thermal conductive pad and the lens seat, a thermal conductive sheet is provided on the lens seat. When the temperature difference in the baffle assembly is large, the image quality is affected by the bright and dark corners and the pot cover phenomenon around the image. To solve this problem, a heat spreader such as a graphite plate is provided on the baffle assembly. In order to facilitate tearing and sticking, the thermal conductive pad can be bonded to the heat spreader.

[0022] In order to enable those skilled in the art to better understand the technical concept, implementation plan and beneficial effects of the embodiments of the present application, specific embodiments are described in detail below.

[0023] A thermal imaging device provided by an embodiment of the present application is convenient for improving the quality of thermal imaging.

[0024] Figure 1 A schematic diagram of the structure of a thermal imaging device provided in an embodiment of the present application. Figure 2 A schematic diagram of the positional relationship of a first thermal pad, a heat spreader, and a baffle assembly provided in a specific embodiment of the present application is shown in FIG. Figure 1 and Figure 2 As shown, the thermal imaging device of this embodiment may include: a lens assembly 1, a baffle assembly 2 and a photosensitive assembly 3.

[0025] In this embodiment, the baffle assembly 2 is arranged between the lens assembly 1 and the photosensitive assembly 3 ; a heat spreader 4 and a first thermal pad 5 are provided between the lens assembly 1 and the baffle assembly 2 .

[0026] Thermal imaging equipment is a detection device that detects infrared energy (heat) non-contactly and converts it into electrical signals, thereby generating thermal images and temperature values ​​on the display and calculating the temperature values.

[0027] The infrared radiation light of the external object is projected onto the photosensitive component 3 through the lens component 1 and the baffle component 2 to further obtain an image.

[0028] The lens assembly 1 may include a lens housing, a lens mount and a lens; the lens is mounted on the lens mount, and the lens mount is mounted in the lens housing.

[0029] The baffle assembly 2 may include blades and a blade support frame. The blades can be opened and closed. When in an open state, a light guide hole is formed. The infrared radiation light of an external object can be projected onto the photosensitive assembly 3 through the lens and the light guide hole.

[0030] In this embodiment, the heat spreader 4 and the first thermal pad 5 disposed between the lens assembly 1 and the baffle assembly 2 can be of any shape.

[0031] It can be understood that the positions and shapes of the heat spreader 4 and the first thermal pad 5 between the lens assembly 1 and the baffle assembly 2 of this embodiment do not affect the projection of infrared radiation light from external objects onto the sensing assembly.

[0032] In this embodiment, the first surface of the heat spreader 4 contacts the baffle assembly 2 , the second surface of the heat spreader 4 contacts the first surface of the first thermal pad 5 , and the second surface of the first thermal pad 5 faces the lens assembly 1 .

[0033] The first surface of the heat spreader 4 is in contact with the baffle assembly 2 , and the temperature of each part in the baffle assembly 2 can be conducted through the heat spreader 4 , thereby reducing the temperature difference of each part in the baffle assembly 2 and improving the thermal imaging quality.

[0034] In addition, in the present embodiment, the second surface of the heat spreader 4 is in contact with the first surface of the first thermal pad 5, and the second surface of the first thermal pad 5 faces the lens assembly 1. Thus, when the temperature of the baffle assembly 2 is higher than that of the lens assembly 1, it is convenient to transfer the heat of the baffle assembly 2 to the lens assembly 1 through the heat spreader 4 and the first thermal pad 5, thereby reducing the temperature difference between the baffle assembly 2 and the lens assembly 1.

[0035] In some examples, the area of ​​the first thermal pad 5 is larger than the area of ​​the heat spreader 4 .

[0036] The materials of the heat spreader 4 and the first thermal pad 5 can be any heat-conducting material. In some examples, the heat spreader 4 can be a graphite sheet, graphene, gold, silver or copper; the first thermal pad 5 can be a thermally conductive silicone pad.

[0037] In some embodiments, the thermal imaging device also includes a display or an eyepiece for viewing the image.

[0038] The thermal imaging device of this embodiment may further include a rear shell, which is connected to a shell body on the lens assembly to form a cavity, and the baffle assembly and the photosensitive assembly are arranged in the cavity.

[0039] In this embodiment, the baffle assembly 2 is arranged between the lens assembly 1 and the photosensitive assembly 3, and a heat spreader 4 and a first thermal pad 5 are arranged between the lens assembly 1 and the baffle assembly 2. The first surface of the heat spreader 4 is in contact with the baffle assembly 2, and the second surface of the heat spreader 4 is in contact with the first surface of the first thermal pad 5. The second surface of the first thermal pad 5 faces the lens assembly 1. In this way, the heat spreader 4 can reduce the temperature difference of each part in the baffle assembly 2, and the heat of the baffle assembly 2 can be transferred to the lens assembly 1 through the heat spreader 4 and the first thermal pad 5, thereby reducing the temperature difference between the baffle assembly 2 and the lens assembly 1, thereby improving the thermal imaging quality.

[0040] To facilitate installation, in some examples, the first thermal pad 5 and the heat spreader 4 are prefabricated integrated composite parts. In this way, during the installation of the thermal imaging device of this embodiment, the prefabricated integrated composite parts can be directly used, thereby reducing the installation process.

[0041] In some examples, the first thermal pad 5 and the heat spreader 4 are integrated composite parts that are pre-pressed together, and an adhesive layer for bonding the first thermal pad 5 and the heat spreader 4 is provided between the first thermal pad 5 and the heat spreader 4 .

[0042] In this embodiment, the first thermal pad 5 can be adhered to the heat spreader 4, and then the two can be pressed together through a stamping process to form an integrated composite component.

[0043] In order to make the first surface of the heat spreader 4 and the baffle assembly 2 contact more firmly, in some examples, a bonding layer for bonding the heat spreader 4 and the baffle assembly 2 is provided between the heat spreader 4 and the baffle assembly 2 .

[0044] A colloid may be disposed on the second surface of the heat spreader 4 , and the heat spreader 4 and the baffle assembly 2 are bonded together by the colloid, so that the heat spreader 4 and the baffle assembly 2 are in firm contact.

[0045] In some examples, the first thermal pad 5 and the heat spreader 4 are both sheet structures, the first thermal pad 5 is provided with a first light-transmitting hole, the heat spreader 4 is provided with a second light-transmitting hole, and the first light-transmitting hole and the second light-transmitting hole at least partially overlap.

[0046] The first thermal pad 5 of this embodiment can be a circular annular structure or a rectangular annular structure. The annular structure can be formed by drilling a hole in the rectangular first thermal pad 5, and the hole can be circular or rectangular, or other regular or irregular shapes; it can also be formed by connecting multiple long strip thermal conductive structures end to end in sequence.

[0047] The first light-transmitting hole can be opened at the edge of the first thermal pad 5 , or can be opened in the middle of the first thermal pad 5 .

[0048] The second light-transmitting hole can be opened at the edge of the heat spreader 4 , or can be opened in the middle of the heat spreader 4 .

[0049] The first light-transmitting hole and the second light-transmitting hole at least partially overlap, so that the infrared reflected light of the external object can be projected onto the photosensitive component 3.

[0050] In some examples, the first light transmission hole and the second light transmission hole are located between the lens and the barrier assembly 2 in the lens assembly 1 .

[0051] See also Figure 1 and Figure 3 In order to improve the heat conduction effect between the baffle assembly 2 and the lens assembly 1, in some examples, a second thermal pad 6 is provided between the first thermal pad 5 and the lens assembly 1; the second surface of the first thermal pad 5 is in contact with the first surface of the second thermal pad 6; a third light-transmitting hole is provided on the second thermal pad 6, and the third light-transmitting hole at least partially overlaps with the first light-transmitting hole and the second light-transmitting hole.

[0052] The material of the second thermally conductive pad 6 can be any material that can conduct heat. In some specific embodiments, the material of the second thermally conductive pad 6 is copper foil, and the shape can be ring-shaped.

[0053] The third light-transmitting hole at least partially overlaps with the first light-transmitting hole and the second light-transmitting hole, so that the infrared reflected light of the external object can be projected onto the photosensitive component 3.

[0054] In some examples, the lens assembly 1 includes a lens and a lens mount for mounting the lens; the second surface of the second thermal pad 6 is in contact with the lens mount.

[0055] The lens is arranged on the lens mount, and the lens can receive or release heat through the lens mount.

[0056] The second surface of the second thermal pad 6 is in contact with the lens mount, so that the contact area between the first thermal pad 5 and the lens mount can be increased. Further, the temperature difference between the lens mount and the baffle assembly 2 can be quickly reduced, thereby facilitating the improvement of thermal imaging quality.

[0057] In some examples, the thickness of the first thermal pad 5 is 0.3-0.8 mm. In a specific example, the thickness of the first thermal pad 5 is 0.5 mm, which is very thin and not convenient for tearing and sticking on the production line. By combining the first thermal pad 5 with the heat spreader 4 as an integrated material, the thermal conductivity and heat spread capability are improved and the production line process operation is also convenient.

[0058] To facilitate installation, in some examples, an installation orientation identification hole for the first thermal pad 5 is provided on the first thermal pad 5 at a preset edge position of the first light-transmitting hole.

[0059] The installation orientation identification hole can be installed at the orientation of the shaft on the baffle assembly.

[0060] See also Figure 3 and Figure 4 The following is a specific embodiment to illustrate the installation process of the various components of the present application: fix the second thermal pad 6 such as copper foil on the lens assembly 1 through the positioning hole, adhere the special-shaped thermal pad (first thermal pad 5) and the heat spreader 4 such as a graphite sheet composite material to the baffle assembly (baffle) 2, fix the special-shaped thermal pad graphite sheet and the baffle assembly to the photosensitive assembly 3 (movement module) and the mainboard module, and then lock them on the lens seat of the lens assembly with screws, and then lock them on the rear shell and the eyepiece assembly with screws.

[0061] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0062] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0063] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A thermal imaging device, characterized in that: include: A lens assembly, a baffle assembly and a photosensitive assembly; wherein the baffle assembly is arranged between the lens assembly and the photosensitive assembly; A heat spreader and a first thermal pad are provided between the lens assembly and the baffle assembly, the first surface of the heat spreader contacts the baffle assembly, the second surface of the heat spreader contacts the first surface of the first thermal pad, and the second surface of the first thermal pad faces the lens assembly; wherein the heat spreader is a graphite sheet; the first thermal pad is a thermally conductive silicone pad; the first thermal pad and the heat spreader are prefabricated integrated composite parts; The first thermal pad is provided with a first light-transmitting hole; and an installation orientation identification hole of the first thermal pad is provided on the first thermal pad at a preset edge position of the first light-transmitting hole.

2. The thermal imaging device according to claim 1, characterized in that: The first thermally conductive pad and the heat spreader are integrated composite parts that are pre-pressed together, and a bonding layer for bonding the first thermally conductive pad and the heat spreader is provided between the first thermally conductive pad and the heat spreader.

3. The thermal imaging device according to any one of claims 1 to 2, characterized in that: A bonding layer for bonding the heat spreader and the baffle assembly is provided between the heat spreader and the baffle assembly.

4. The thermal imaging device according to claim 1, characterized in that: The first thermal pad and the heat spreader are both sheet-like structures. The heat spreader is provided with a second light-transmitting hole. The first light-transmitting hole and the second light-transmitting hole at least partially overlap.

5. The thermal imaging device according to claim 4, characterized in that: A second thermally conductive pad is provided between the first thermally conductive pad and the lens assembly; The second surface of the first thermally conductive pad is in contact with the first surface of the second thermally conductive pad; A third light-transmitting hole is disposed on the second thermal pad, and the third light-transmitting hole at least partially overlaps with the first light-transmitting hole and the second light-transmitting hole.

6. The thermal imaging device according to claim 5, characterized in that: The lens assembly comprises a lens and a lens mount for mounting the lens; The second surface of the second thermal conductive pad is in contact with the lens mount.

7. The thermal imaging device according to claim 1, characterized in that: The thickness of the first thermal conductive pad is 0.3-0.8 mm.

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