Circuit board capable of improving isolation between signal welding spots

Abstract

The utility model provides a circuit board capable of improving isolation between signal welding spots, which comprises a circuit board body, the signal welding spots are arranged on the circuit board body, and signal lines connected with the signal welding spots are arranged on the circuit board body, and is characterized in that an isolation body is arranged on the circuit board body, and the isolation body is connected with the signal welding spots. The isolator is made of a metal material, and the isolator is arranged between the two signal welding spots which are in crosstalk with each other. In the prior art, no isolation cavity exists between two signal welding spots, and under the condition of high-frequency communication, signals between two different networks are mutually interfered through the short-distance signal welding spots, so that the mutual isolation degree is influenced. According to the invention, signals are isolated by adding the metal isolators between the signal through holes, so that mutual signal crosstalk is reduced, and the isolation degree is optimized.

Description

Technical Field

[0001] The utility model belongs to the technical field of mobile communications, and in particular relates to a circuit board for improving the isolation between signal solder joints. Background Art

[0002] With the rapid development of mobile communication technology, PCB circuit boards are increasingly used in radio frequency and microwave systems. As an important cornerstone of electronic circuit systems, they play a very important role in the field of signal communication.

[0003] As the frequency bands of circuit board applications are becoming wider and higher, the signal crosstalk between high frequencies in the same environment will be more serious and the isolation will be worse. While ensuring the performance requirements of the product, we have to consider the cost advantage of mass production, which is also one of the core competitiveness of the product. Therefore, while solving the problem, choosing the lowest cost solution has a very important impact on the product. Utility Model Content

[0004] The technical purpose of the utility model is to provide a circuit board with improved isolation between signal solder joints, to isolate the signals of two mutually crosstalking signal solder joints, thereby reducing mutual signal crosstalk, optimizing isolation, and having low cost.

[0005] In order to solve the above technical problems, the utility model is implemented as follows: a circuit board with improved isolation between signal solder joints, comprising: a circuit board body, on which the signal solder joints are arranged, and on which signal lines connecting the signal solder joints are arranged; and characterized in that an isolator is arranged on the circuit board body, the isolator is made of metal, and the isolator is arranged between two signal solder joints that crosstalk with each other.

[0006] Furthermore, the isolating body is arranged along a direction perpendicular to the circuit board body.

[0007] Furthermore, the isolating body is a stud, the circuit board body is provided with a screw hole, and the stud passes through the screw hole and is fixed to the circuit board body.

[0008] Furthermore, the diameter of the upper end of the stud is larger than the diameter of the lower end, and the lower end of the stud is connected to the screw hole.

[0009] Furthermore, the upper end of the stud is cylindrical.

[0010] Furthermore, the isolator and the signal line are arranged on the same side of the circuit board body.

[0011] Furthermore, there is one and only one isolating body, and the isolating body is arranged at the center point of the line connecting the two signal welding points.

[0012] Furthermore, the diameter of the isolating body is larger than the diameter of the signal solder joint.

[0013] Furthermore, there are a plurality of the isolating bodies, and the plurality of isolating bodies are arranged side by side along a direction perpendicular to a connection line between the two signal solder joints.

[0014] Compared with the prior art, the circuit board of the utility model which improves the isolation between signal solder joints has the following beneficial effects:

[0015] In the past, there was no isolation cavity between two signal solder joints. Under high-frequency communication conditions, the signals between two different networks crosstalked each other through the close-range signal solder joints, affecting the isolation between them. By adding a metal isolator between the signal through holes, the signals are isolated, thereby reducing the mutual signal crosstalk and optimizing the isolation. The use of metal isolators improves isolation and has low processing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of a circuit board for improving the isolation between signal solder joints in Example 1 of the utility model.

[0017] Figure 2 It is a cross-sectional view of a circuit board for improving the isolation between signal solder joints in Example 1 of the utility model.

[0018] Figure 3 It is a cross-sectional view of the stud and the circuit board body in Example 1 of the utility model being separated.

[0019] Figure 4 It is a schematic diagram of the overall structure of a circuit board for improving the isolation between signal solder joints in Example 2 of the utility model.

[0020] In the accompanying drawings, each reference numeral represents:

[0021] 1. Circuit board body 2. First signal solder joint 3. First signal line 4. Second signal solder joint 5. Second signal line 6. Stud 7. Screw hole. DETAILED DESCRIPTION

[0022] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0025] Example 1

[0026] See also Figure 1-3 In this embodiment, the circuit board for improving the isolation between signal solder joints includes: a circuit board body 1, a signal solder joint is arranged on the circuit board body 1, and a signal line connecting the signal solder joint is arranged on the circuit board body 1. The signal solder joints include at least a first signal solder joint 2 and a second signal solder joint 4, the signal line includes a first signal line 3 connecting the first signal solder joint 2 and a second signal line 5 connecting the second signal solder joint 4, the first signal solder joint 2 and the first signal line 3 have a common signal network, the second signal solder joint 4 and the second signal line 5 have a common signal network, and the first signal solder joint 2 and the second signal solder joint 4 belong to different signal networks.

[0027] There is no isolation cavity between the first signal solder joint 2 and the second signal solder joint 4. Under high-frequency communication conditions, the signals between the two different networks are crosstalked through the close-range signal solder joints, affecting the isolation between them. In this embodiment, an isolator is arranged between the first signal solder joint 2 and the second signal solder joint 4. The isolator is arranged on the circuit board body 1. The isolator is made of metal. By adding an isolator made of metal between the signal through holes, the signals are isolated, thereby reducing the mutual signal crosstalk and optimizing the isolation.

[0028] The isolator is arranged in a direction perpendicular to the circuit board body 1. Specifically, the isolator in this embodiment is a stud 6, and a screw hole 7 is provided on the circuit board body 1. The end of the stud 6 passes through the screw hole 7 and is fixed on the mounting surface of the circuit board body 1. In order to limit the stud 6, the upper end diameter of the stud 6 is larger than the lower end diameter, and the lower end of the stud 6 is connected to the screw hole 7.

[0029] The upper end of the stud 6 is preferably cylindrical, and may also be other special shapes. The diameter of the isolator is larger than the diameter of the signal solder joint. In this embodiment, there is only one isolator, and the isolator is arranged at the center point of the line connecting the two signal solder joints.

[0030] The circuit board body 1 in this embodiment can be a single-layer board, and the signal line is arranged on the surface of the circuit board body 1 . The circuit board body 1 can also be a multi-layer board. The isolator and the signal line are arranged on the same side of the circuit board body 1 .

[0031] The stud 6 is used to improve the poor isolation between the first signal solder joint 2 and the second signal solder joint 4 due to the close distance, thereby reducing the mutual signal crosstalk.

[0032] Embodiment 2:

[0033] See also Figure 4 In this embodiment, there are multiple isolators, and the multiple isolators are arranged side by side in a direction perpendicular to the line connecting the first signal solder joint 2 and the second signal solder joint 4. The multiple isolators can further improve the isolation between the two signal solder joints.

[0034] The isolator in this embodiment is preferably a stud 6, but the isolator may also be of other shapes, such as a metal plate, which is perpendicular to the line connecting the first signal solder point 2 and the second signal solder point 4, and which may also improve the isolation between the first signal solder point 2 and the second signal solder point 4.

[0035] Example 3

[0036] Different from the embodiment, in this embodiment, the isolator is fixed on the circuit board body 1 by bonding.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board for improving the isolation between signal solder joints, comprising a circuit board body, on which the signal solder joints are arranged, and on which signal lines connecting the signal solder joints are arranged, characterized in that: An isolator is provided on the circuit board body. The isolator is made of metal and is arranged between two signal solder joints that crosstalk with each other.

2. The circuit board for improving isolation between signal solder joints according to claim 1, characterized in that: The isolating body is arranged along a direction perpendicular to the circuit board body.

3. The circuit board for improving isolation between signal solder joints according to claim 2, characterized in that: The isolating body is a stud, and a screw hole is provided on the circuit board body. The stud passes through the screw hole and is fixed on the circuit board body.

4. The circuit board for improving isolation between signal solder joints according to claim 3, characterized in that: The diameter of the upper end of the stud is greater than the diameter of the lower end, and the lower end of the stud is connected to the screw hole.

5. The circuit board for improving isolation between signal solder joints according to claim 3 or 4, characterized in that: The upper end of the stud is cylindrical.

6. The circuit board for improving isolation between signal solder joints according to claim 1, characterized in that: The isolator and the signal line are arranged on the same side of the circuit board body.

7. The circuit board for improving isolation between signal solder joints according to claim 1, characterized in that: There is only one isolating body, and the isolating body is arranged at the center point of the line connecting the two signal welding points.

8. The circuit board for improving isolation between signal solder joints according to claim 1 or 7, characterized in that: The diameter of the isolating body is greater than the diameter of the signal pad.

9. The circuit board for improving isolation between signal solder joints according to claim 1, characterized in that: There are a plurality of the isolating bodies, and the plurality of isolating bodies are arranged side by side along a direction perpendicular to the connection line between the two signal solder joints.

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