Display module and display device

Abstract

The utility model provides a display module and a display device, belongs to the technical field of display, and can solve the problem that a resistance test is unqualified due to the fact that an existing display module is prone to insufficient grounding. The display module disclosed by the utility model comprises a display panel; the display panel includes: a main body portion; the main body part is provided with a display side and a non-display side which are oppositely arranged; the display module further comprises a circuit board located on the non-display side of the main body part and a reinforcing supporting layer located on the side, close to the main body part, of the circuit board. The reinforcing supporting layer comprises a first metal layer, a conductive adhesive layer and a second metal layer which are sequentially arranged in the direction away from the main body part; the second metal layer is provided with a slot; the groove exposes part of the conductive adhesive layer; the circuit board is located in the open groove and is connected with the first metal layer and the second metal layer through the conductive adhesive layer.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a display module and a display device. Background Art

[0002] With the development of flexible display panel technology, foldable display modules are being used more and more widely. Due to the characteristics of flexibility and easy bending, foldable display modules have become the current design mainstream and have great room for development.

[0003] In folding display modules, resistance tests often fail due to insufficient copper leakage area on the circuit board and insufficient grounding. When the grounding terminal cannot be conducted, the electrostatic discharge (ESD) of the folding display module will be affected. In severe cases, the display quality of the folding display module will be affected, reducing the user experience. Utility Model Content

[0004] The present disclosure aims to solve at least one of the technical problems existing in the prior art, and provides a display module and a display device.

[0005] In a first aspect, an embodiment of the present disclosure provides a display module, the display module comprising: a display panel; the display panel comprising: a main body; the main body having a display side and a non-display side arranged opposite to each other; the display module further comprising: a circuit board located on the non-display side of the main body, and a reinforcing support layer located on a side of the circuit board close to the main body;

[0006] The reinforcing support layer comprises: a first metal layer, a conductive adhesive layer and a second metal layer arranged in sequence in a direction away from the main body;

[0007] The second metal layer has a groove; the groove exposes a portion of the conductive adhesive layer;

[0008] The circuit board is located in the slot and is connected to the first metal layer and the second metal layer through the conductive adhesive layer.

[0009] In some embodiments, the circuit board includes: a bottom plate, components located on a side of the bottom plate away from the main body, and a ground terminal located on a side of the bottom plate close to the main body and connected to the components;

[0010] The ground terminal is connected to the first metal layer and the second metal layer through the conductive adhesive layer.

[0011] In some embodiments, the display panel further includes: a binding portion, and a bending portion connecting the main body portion and the binding portion;

[0012] The binding portion is located on the non-display side of the main body;

[0013] The bent portion is bent toward the non-display side of the main body.

[0014] In some embodiments, the orthographic projections of the first metal layer, the conductive adhesive layer, and the second metal layer on the main body portion at least partially overlap with the orthographic projection of the binding portion on the main body portion.

[0015] In some embodiments, the circuit board further comprises: a binding terminal located at one end of the base plate and connected to the component;

[0016] The component is connected to the binding portion through the binding terminal.

[0017] In some embodiments, the display module further includes: a first panel support layer;

[0018] The first panel supporting layer is located on a side of the main body close to the first metal layer.

[0019] In some embodiments, an orthographic projection of the first panel supporting layer on the main body portion at least partially overlaps with an orthographic projection of the binding portion on the main body portion.

[0020] In some embodiments, the reinforcing support layer further includes: a first bonding layer located on a side of the first metal layer close to the main body;

[0021] The first metal layer is bonded to the first panel supporting layer through the first adhesive layer.

[0022] In some embodiments, the display module further includes: a second panel support layer;

[0023] The second panel supporting layer is located at a side of the binding portion close to the main body portion.

[0024] In some embodiments, the display module further comprises: a second adhesive layer located between the second panel supporting layer and the binding portion;

[0025] The second panel supporting layer is bonded to the second metal layer via the second adhesive layer.

[0026] In some embodiments, the display module further includes: a third metal layer;

[0027] The third metal layer is located between the conductive adhesive layer and the ground terminal.

[0028] In some embodiments, the display module further includes: an electromagnetic shielding layer located on a side of the bottom plate close to the second metal layer; the electromagnetic shielding layer is provided with a first opening;

[0029] An orthographic projection of the first opening on the main body at least partially overlaps with an orthographic projection of the ground terminal on the main body.

[0030] In some embodiments, the display module further includes: a third bonding layer located between the electromagnetic shielding layer and the conductive adhesive layer; the third bonding layer is provided with a second opening;

[0031] An orthographic projection of the second opening on the main body at least partially overlaps with an orthographic projection of the ground terminal on the main body.

[0032] In some embodiments, the display module further includes: a cover plate;

[0033] The cover plate covers the display side of the main body.

[0034] In a second aspect, an embodiment of the present disclosure provides a display device, which includes the display module provided above. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the planar structure of an exemplary display module.

[0036] Figure 2 FIG. 4 is a schematic diagram of a planar structure of another exemplary display module.

[0037] Figure 3 for Figure 1 The cross-sectional structure diagram of the display module along the AA' direction is shown.

[0038] Figure 4 for Figure 3 A schematic structural diagram of a reinforcing support layer in a display module is shown.

[0039] Figure 5 A schematic diagram of a planar structure of a display module provided by an embodiment of the present disclosure.

[0040] Figure 6 A schematic diagram of the planar structure of another display module provided in an embodiment of the present disclosure.

[0041] Figure 7 for Figure 5 The display module shown is a schematic diagram of a cross-sectional structure along the BB' direction.

[0042] Figure 8 for Figure 7 A schematic structural diagram of a reinforcing support layer in a display module is shown.

[0043] Fig. 9 for Figure 5Another schematic diagram of the cross-sectional structure of the display module along the BB' direction is shown. DETAILED DESCRIPTION

[0044] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0045] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0046] Terms such as "first" and "second" are used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one component from other components. For example, an element referred to as a first element in one embodiment can be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless otherwise mentioned, terms in the singular may include plural forms.

[0047] When describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0048] “At least one of A, B and C” has the same meaning as “at least one of A, B or C”, and both include the following combinations of A, B and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B and C. “A and / or B” includes the following three combinations: only A, only B, and a combination of A and B.

[0049] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0050] As used herein, "about" or "approximately" includes the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0051] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0052] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0053] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0054] In this specification, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as those commonly understood by ordinary technicians in the field to which this application belongs. It will be further understood that, unless explicitly defined herein, terms (such as terms defined in a general dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted as an ideal or overly formal meaning.

[0055] In the present disclosure, terms such as "lower", "below", "above" and "upper" and the like are used to explain the relationship association of components shown in the drawings. The terms may be relative concepts and described based on the directions shown in the drawings, but are not limited thereto.

[0056] The term "overlap" or "overlapping" means that a first object may be above or below a second object or to the side of the second object, and vice versa. Additionally, the term "overlap" may include stacking, stacking, facing or facing, extending over, covering or partially covering, or any other suitable term that will be appreciated and understood by a person of ordinary skill in the art.

[0057] Figure 1 is a schematic diagram of a planar structure of an exemplary display module, Figure 2 is a schematic diagram of a planar structure of another exemplary display module, such as Figure 1 and Figure 2 As shown, the display module has a display area A and a peripheral area B arranged on at least one side of the display area A. Figure 1 and Figure 2 In the figure, the peripheral area B is arranged around the display area A for illustration.

[0058] like Figure 1 and Figure 2 As shown, the display area A is the area for displaying images and is configured to set a plurality of pixel units P, and the peripheral area B is the area for not displaying images and is configured to set a display driving circuit, for example, a gate driving circuit and a source driving circuit.

[0059] The display area A in the display module includes at least one bending area A1 and at least two non-bending areas A2. Figure 1 and Figure 2 As shown, the display panel module may include a bending area A1 and two non-bending areas A2.

[0060] For example, Figure 1 As shown, the bending area A1 extends along the first direction (X direction), and the two non-bending areas A2 are respectively arranged on both sides of the bending area A1 along the second direction (Y direction), and two adjacent non-bending areas A2 are connected through the bending area A1.

[0061] Or, if Figure 2 As shown, the bending area A1 extends along the second direction (Y direction), and two non-bending areas A2 are respectively arranged on both sides of the bending area A1 along the first direction (X direction), and two adjacent non-bending areas A2 are connected through the bending area A1.

[0062] The following is a schematic explanation using the above-mentioned display module having one bending area A1 and two non-bending areas A2 as an example, but the embodiments of the present disclosure are not limited to this, and display modules with multiple bending areas A1 and multiple non-bending areas A2 can also be considered as long as the same technical concept is applied.

[0063] For example, Figure 1 and Figure 2 As shown, the two non-bending regions A2 can be symmetrically arranged with respect to the bending region A1, so that after the display module is bent, the ends of the two non-bending regions A2 away from the bending region A1 are flush.

[0064] In addition, when the display module is an inward folding display module, after the display module is folded, the two non-bending areas A2 of the display module are stacked face to face. When the display module is an outward folding display module, the two non-bending areas A2 of the display module are stacked back to back.

[0065] Figure 3 for Figure 1 The cross-sectional structure diagram of the display module along the AA' direction is shown in FIG. Figure 3 As shown, the display module includes: a display panel 101, a circuit board 102 and a reinforcing support layer 103. It can be understood that, Figure 2 The cross-sectional structure at the corresponding position in Figure 3 The structures shown are the same and will not be described again.

[0066] The display panel 101 includes: a main body 1011 , a binding portion 1012 , and a bending portion 1013 connecting the main body 1011 and the binding portion 1012 ; the bending portion 1013 is located between the main body 1011 and the binding portion 1012 .

[0067] The main body 1011 may be a portion of the display panel 101 for displaying images, that is, the display area A (eg, Figure 1 and Figure 2 ) is located in the main body 1011, that is, the main body 1011 has a display area A (as shown Figure 1 and Figure 2 shown).

[0068] The main body 1011 has a display side and a non-display side that are arranged opposite to each other. The display side refers to the side of the main body 1011 that displays an image ( Figure 3 The non-display side refers to the other side opposite to the display side ( Figure 3 The upper side of the middle main body 1011).

[0069] The binding portion 1012 is a portion for binding and connecting the display panel 101 and the circuit board 102. Through a bending process, the bending portion 1013 can be bent along a bending axis extending in a first direction (X direction) toward the non-display side of the main body 1011 of the display panel 101, so that the binding portion 1012 is bent to the non-display side of the main body 1011, thereby reducing the frame of the display module. The bending axis is not an actual structure existing in the display panel 101, but is only a concept proposed to illustrate the bending process of the display panel 101.

[0070] like Figure 3 As shown, after the binding portion 1012 is bent, the circuit board 102 can be bent along with the binding portion 1012 to the non-display side of the main body 1011 to achieve the purpose of reducing the frame of the display module.

[0071] like Figure 3 As shown, the circuit board 102 is located on the main body 1011 and is bound and connected with the binding part 1012. The circuit board 102 includes: a bottom plate 1021 and a component 1022 located on the side of the bottom plate 1021 away from the main body 1011, and a grounding terminal 1023 located on the side of the bottom plate 1021 close to the main body 1011 and connected to the component 1022. The grounding terminal 1023 is generally made of metal materials such as copper, and the area where the grounding terminal 1023 is located can be called a copper leakage area.

[0072] like Figure 3 As shown, the reinforcing support layer 103 is located on a side of the circuit board 102 close to the main body 1011 . Figure 4 for Figure 3 The structural diagram of the reinforcing support layer in the display module shown in FIG. Figure 3 and Figure 4As shown, the reinforcing support layer 103 generally adopts a four-layer structure, including: a first bonding layer 1031, a substrate layer 1032, an auxiliary bonding layer 1033, and a metal layer 1034, which are sequentially arranged in a direction away from the main body 1011. Among them, the first bonding layer 1031 and the auxiliary bonding layer 1033 can be made of pressure-sensitive adhesive materials, the substrate layer 1032 can be made of polyimide (PI), and the metal layer 1034 can be made of metal materials such as stainless steel.

[0073] The metal layer 1034 in the reinforcing support layer 103 is connected to the ground terminal 1023 of the circuit board 102 through conductive glue. On the one hand, it can support the circuit board 102, and on the other hand, it can be used as a ground signal terminal to release static electricity in the circuit board 102 to prevent static electricity from breaking down the components 1022 therein.

[0074] However, due to the insufficient copper leakage area in the circuit board 102 and the weak bonding performance between the conductive glue and the metal layer 1034, insufficient grounding may occur, resulting in failure of the resistance test. When the ground terminal 1023 cannot be conducted, the electrostatic discharge (ESD) of the display module may be affected. In severe cases, the display quality of the display module may be affected, reducing the user experience.

[0075] In order to solve at least one of the above-mentioned technical problems, the embodiments of the present disclosure provide a display module and a display device. The display module and the display device provided by the embodiments of the present disclosure will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0076] In a first aspect, an embodiment of the present disclosure provides a display module, Figure 5 A schematic diagram of a planar structure of a display module provided by an embodiment of the present disclosure, Figure 6 A schematic diagram of a planar structure of another display module provided in an embodiment of the present disclosure, Figure 5 The display module shown is Figure 1 The display modules shown have similar structures, with the bending area A1 extending along the first direction (X direction), two non-bending areas A2 respectively arranged on both sides of the bending area A1 along the second direction (Y direction), and two adjacent non-bending areas A2 connected through the bending area A1. Figure 6 The display module shown is Figure 2 The display modules shown have similar structures, with the bending area A1 extending along the second direction (Y direction), two non-bending areas A2 respectively arranged on both sides of the bending area A1 along the first direction (X direction), and two adjacent non-bending areas A2 connected via the bending area A1.

[0077] Figure 7 for Figure 5A schematic diagram of a cross-sectional structure of a display module along the BB' direction is shown in FIG. Figure 7 As shown, the display module includes: a display panel 101; the display panel 101 includes: a main body 1011; the main body 1011 has a display side and a non-display side that are relatively arranged; the display module also includes: a circuit board 102 located on the non-display side of the main body 1011, and a reinforcing support layer 103 located on the side of the circuit board 102 close to the main body 1011. Figure 8 Figure 7 The structural diagram of the reinforcing support layer in the display module shown in FIG. Figure 7 and Figure 8 As shown, the reinforcing support layer 103 includes: a first adhesive layer 1031, a first metal layer 1035, a conductive adhesive layer 1036 and a second metal layer 1037 arranged in sequence in a direction away from the main body; the second metal layer 1037 has a slot M; the slot M exposes a portion of the conductive adhesive layer 1036; the circuit board 102 is located in the slot M and is connected to the first metal layer 1035 and the second metal layer 1037 through the conductive adhesive layer 1036. It can be understood that Figure 6 The cross-sectional structure at the corresponding position in Figure 7 The structures shown are the same and will not be described again.

[0078] The display panel 101 can be any one of the foldable display panels such as an organic electroluminescent diode display panel, a quantum dot light-emitting diode display panel, a micro light-emitting diode display panel, a plasma display panel, a field emission display panel, an electrowetting display panel or an electrophoretic display panel, and is not limited in the present disclosed embodiments.

[0079] The main body 1011 may be a portion of the display panel 101 for displaying images, that is, the display area A (eg, Figure 5 and Figure 6 ) is located in the main body 1011, that is, the main body 1011 has a display area A (as shown Figure 5 and Figure 6 shown).

[0080] The main body 1011 has a display side and a non-display side that are arranged opposite to each other. The display side refers to the side of the main body 1011 that displays an image ( Figure 7 The non-display side refers to the other side opposite to the display side ( Figure 7 The upper side of the middle main body 1011).

[0081] The circuit board 102 may specifically be a flexible printed circuit (FPC), which is provided with structures such as signal lines, and can transmit signals to the display panel 101 so that the display panel 101 can achieve a display function.

[0082] The reinforcing support layer 103 can support the circuit board 102 , and it also adopts a four-layer structure, namely a first adhesive layer 1031 , a first metal layer 1035 , a conductive adhesive layer 1036 and a second metal layer 1037 arranged in sequence in a direction away from the main body 1011 .

[0083] The first adhesive layer 1031 can be made of a pressure-sensitive adhesive material, and the first metal layer 1035 thereon can be bonded to other film layers. The first metal layer 1035 and the second metal layer 1037 can be made of metal materials such as stainless steel, and the double-layer metal structure can further improve the support performance of the reinforcing support layer 103. The conductive adhesive layer 1036 can bond the first metal layer 1035 and the second metal layer 10357. At the same time, the second metal layer 1037 on the conductive adhesive layer 1036 is provided with a groove M, and the groove M can expose a portion of the conductive adhesive layer 1036.

[0084] The circuit board 102 is located in the slot 24 and is directly connected to the conductive adhesive layer 1036. The circuit board 102 does not need to be provided with conductive adhesive, which can reduce the thickness of the circuit board 102. At the same time, the circuit board 102 can be sunken to reduce the space occupied by the circuit board 102, providing space for structures such as batteries in the display module, thereby increasing the capacity of the battery and improving the endurance of the display module.

[0085] The conductive adhesive layer 1036 is bonded to the upper and lower metal layers, namely the first metal layer 1035 and the second metal layer 1037. The first metal layer 1035 and the second metal layer 1037 can be used as ground signal terminals, which can increase the contact area between the conductive adhesive layer 1036 and the ground signal terminal, avoid insufficient grounding, resulting in failure of the resistance test, and avoid affecting the electrostatic discharge (ESD) of the display module, thereby improving the display quality of the display module and enhancing the user experience.

[0086] The first metal layer 1035 and the second metal layer 1037 can be made of metal materials such as stainless steel, wherein the second metal layer 1037 is generally thicker, and its thickness is usually 100 microns to 150 microns, for example, 100 microns, so that the depth of the slot M is 100 microns, which can make the circuit board 102 sink 100 microns, providing more space for structures such as batteries in the display module. The thickness of the first metal layer 1035 is generally thinner, and its thickness is usually 30 microns to 50 microns, for example, 30 microns, that is, the original substrate layer 1032 (polyimide film layer) is replaced with a 30-micron thick first metal layer 1035 (stainless steel layer), while increasing the contact area between the conductive adhesive layer 1036 and the ground signal terminal, it can also optimize the pen-dropping and ball-dropping performance of the display module to a certain extent, improve the impact resistance of the display module, thereby increasing the service life of the display module and increasing the competitiveness of the display module.

[0087] In some embodiments, Figure 7 As shown, the circuit board 102 includes: a base plate 1021, a component 1022 located on the side of the base plate 1021 away from the main body 1011, and a grounding terminal 1023 located on the side of the base plate 1021 close to the main body 1011 and connected to the component 1022; the grounding terminal 1023 is connected to the first metal layer 1035 and the second metal layer 1037 through a conductive adhesive layer 1036.

[0088] The bottom plate 1021 can be made of a flexible material such as polyimide (PI) to form a flexible bottom plate, which can support the components 1022 thereon. The components 1022 can be resistors, capacitors, inductors, etc., which are connected according to a predetermined design to transmit electrical signals. The ground terminal 1023 can be made of a metal material with strong conductive properties such as copper.

[0089] The ground terminal 1023 is connected to the first metal layer 1035 and the second metal layer 1035 through the conductive adhesive layer 1036. The first metal layer 1035 and the second metal layer 1037 can be used as ground signal terminals, which can increase the contact area between the conductive adhesive layer 1036 and the ground signal terminal, avoid insufficient grounding, and cause failure of the resistance test. At the same time, avoid affecting the electrostatic discharge (ESD) of the display module, thereby improving the display quality of the display module and enhancing the user experience.

[0090] In some embodiments, the display panel further includes: a binding portion 1012 and a bending portion 1013 connecting the main body 1011 and the binding portion 1012 ; the binding portion 1012 is located on the non-display side of the main body 1011 ; and the bending portion 1013 is bent toward the non-display side of the main body 1011 .

[0091] The binding portion 1012 is a portion for binding and connecting the display panel 101 and the circuit board 102. Through a bending process, the bending portion 1013 can be bent along a bending axis extending in a first direction (X direction) toward the non-display side of the main body 1011 of the display panel 101, so that the binding portion 1012 is bent to the non-display side of the main body 1011, thereby reducing the frame of the display module. The bending axis is not an actual structure existing in the display panel 101, but is only a concept proposed to illustrate the bending process of the display panel 101.

[0092] like Figure 7 As shown, after the binding portion 1012 is bent, the circuit board 102 can be bent along with the binding portion 1012 to the non-display side of the main body 1011 to achieve the purpose of reducing the frame of the display module.

[0093] In some embodiments, Figure 7 As shown, the orthographic projections of the first metal layer 1035 , the conductive adhesive layer 1036 , and the second metal layer 1037 on the main body 1011 at least partially overlap with the orthographic projection of the binding portion 1012 on the main body 1011 .

[0094] The first metal layer 1035 , the conductive adhesive layer 1036 , and the second metal layer 1037 can continue to extend to the overlapping position of the binding portion 1012 of the display panel 101 while supporting the circuit board 102 , so as to effectively support the main body 1011 of the display panel 101 and improve the strength of the main body 1011 of the display panel 101 .

[0095] In some embodiments, Figure 7 As shown, the circuit board 102 further includes: a binding terminal 1024 located at one end of the bottom plate 1021 and connected to the component 1022 ; the component 1022 is connected to the binding portion 1012 via the binding terminal 1024 .

[0096] The binding terminal 1024 may be made of a metal material with strong electrical conductivity such as copper. The component 1022 may be connected to the binding portion 1012 via the binding terminal 1024 to provide an electrical signal to the display panel 101 .

[0097] In some embodiments, Figure 7 As shown, the display module further includes: a first panel supporting layer 104 ; the first panel supporting layer 104 is located on a side of the main body 1011 close to the first metal layer 1035 .

[0098] The first panel support layer 104 can effectively support the main body 1011 of the display panel 101, and can be made of metal material or absorbing material. Among them, the metal material has better supporting performance. The absorbing material is a type of material that can absorb or greatly weaken the electromagnetic wave energy received on its surface and reduce the interference of electromagnetic waves, thereby realizing electromagnetic shielding.

[0099] In some embodiments, Figure 7 As shown, the orthographic projection of the first panel support layer 104 on the main body 1011 at least partially overlaps with the orthographic projection of the binding part 1012 on the main body 1011. The display module also includes: a second panel support layer 105; the second panel support layer 105 is located on the side of the binding part 1012 close to the main body 1011.

[0100] The first panel support layer 104 extends to the position where the binding part 1012 overlaps, and can effectively support the entire main body 1011. The first support layer 104 also extends to the position where the binding part 1012 is located. At the same time, a second panel support layer 105 is also provided on one side of the binding part 1011 close to the main body 1011. The first panel support layer 104 and the second panel support layer 105 can jointly effectively support the binding part 1012 thereon to improve the strength of the binding part 1012.

[0101] The second panel support layer 105 can be made of metal material or absorbing material, wherein metal material has better supporting performance. Absorbing material is a type of material that can absorb or greatly weaken the electromagnetic wave energy received on its surface and reduce the interference of electromagnetic waves, thereby achieving electromagnetic shielding.

[0102] In some embodiments, Figure 7 As shown, the display module further includes: a second adhesive layer 106 located between the second panel supporting layer 105 and the binding portion 1012 ; the second panel supporting layer 105 is bonded to the second metal layer 1037 via the second adhesive layer 106 .

[0103] The second adhesive layer 106 can be made of materials such as pressure-sensitive adhesive, and can adhere the second panel support layer 105 to the second metal layer 1037, so that the first metal layer 1037 and the first metal layer 1035 can also effectively support the binding part 1012, thereby further improving the strength of the binding part 1012 of the display panel 101.

[0104] Fig. 9 for Figure 5 Another schematic diagram of the cross-sectional structure of the display module along the BB' direction is shown. Fig. 9 The display module shown is Figure 7 The display modules shown differ in that Figure 7The circuit board 102 in the display module shown in the figure can be a six-layer board, and the thickness of the bottom plate 1021 thereof is relatively thick and has a strong supporting capacity. Fig. 9 The circuit board 102 shown in the figure is a two-layer board, and the thickness of the bottom plate 1021 thereof is relatively thin, and its supporting capacity is relatively weak. In order to further improve the overall strength of the circuit board 102, as shown in the figure, Fig. 9 As shown, the display module further includes: a third metal layer 107 ; the third metal layer 107 is located between the conductive adhesive layer 1036 and the ground terminal 1023 .

[0105] The third metal layer 107 can be made of metal materials such as stainless steel. The third metal layer 107 is located between the conductive adhesive layer 1036 and the ground terminal 1023 . It can support the circuit board 102 thereon and further improve the overall strength of the circuit board 102 .

[0106] It should be noted that the second adhesive layer 106 and the third metal layer 107 can both effectively support the circuit board 102 thereon. Since the strength of the second adhesive layer 106 is much smaller than that of the third metal layer 107, the second adhesive layer 106 can be added or removed according to actual conditions. For example, when a circuit board 102 with a smaller thickness is required, the second adhesive layer 106 can be removed to meet the requirement of a smaller overall thickness of the display module. Alternatively, the number of layers or thickness of the second adhesive layer 106 can be increased to provide a higher strength support for the circuit board 102 to prevent the circuit board 102 from being deformed or dislocated during preparation, transportation, and application.

[0107] In some embodiments, Figure 7 and Fig. 9 As shown, the display module also includes: an electromagnetic shielding layer 108 located on the side of the bottom plate 1021 close to the second metal layer 1037; the electromagnetic shielding layer 108 is provided with a first opening; the orthographic projection of the first opening on the main body 1011 at least partially overlaps with the orthographic projection of the ground terminal 1023 on the main body 1011.

[0108] The electromagnetic shielding layer 108 can be made of metal materials, such as copper, stainless steel, etc. The thickness of the electromagnetic shielding layer 108 is determined according to the specific process. For example, the thickness of the electromagnetic shielding layer 108 can be 15 microns. The electromagnetic shielding layer 108 can protect the circuit board 102 thereon to prevent external electromagnetic waves from interfering with the electrical signals transmitted in the circuit board 102.

[0109] The electromagnetic shielding layer 108 is provided with a first opening, which can expose the ground terminal 1023 so that the ground terminal 1023 is connected to the conductive adhesive layer 1036 .

[0110] Fig. 9The circuit board in the display module shown is a two-layer board. In order to further improve the overall strength of the circuit board 102, as shown in FIG. Fig. 9 As shown, the display module also includes: a third adhesive layer 109 located between the electromagnetic shielding layer 108 and the conductive adhesive layer 1036; the third adhesive layer 109 is provided with a second opening; the orthographic projection of the second opening on the main body 1011 at least partially overlaps with the orthographic projection of the ground terminal 1023 on the main body 1011.

[0111] The third adhesive layer 109 may be a double-sided adhesive, which can adhere the electromagnetic shielding layer 105 to the conductive adhesive layer 1036 , and can also effectively support the circuit board 102 thereon, thereby further improving the strength of the circuit board 102 .

[0112] In some implementations, such as Figure 7 and Fig. 9 As shown, the display module further includes: a cover plate 110 ; the cover plate 110 covers the display side of the main body 1011 .

[0113] The cover plate 110 can cover the display side of the main body 1011 and at least cover the display area A of the display panel, and can protect the main body 1011 of the display panel 101 to prevent external forces from damaging the main body 1011 of the display panel 101 during preparation, transportation, and application, thereby affecting the display effect of the display panel 101. The material of the cover plate 110 can be flexible glass, such as thinned glass.

[0114] It is understandable that other structures such as a touch layer, a polarizer, and optical adhesive are also provided between the cover plate 110 and the main body 1011 , which can be provided with reference to the structures in the related art and will not be described in detail here.

[0115] In a second aspect, an embodiment of the present disclosure provides a display device, which includes a display module of any one of the above embodiments. The display device can be, for example, a mobile phone, a tablet computer, a display, a laptop computer, a digital photo frame, or any other product with a display function. Other essential components of the display device should be understood by a person of ordinary skill in the art, and will not be described in detail here, nor should they be used as a limitation to the present disclosure.

[0116] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display module, characterized in that: The display module comprises: a display panel; the display panel comprises: a main body; the main body has a display side and a non-display side arranged opposite to each other; the display module further comprises: a circuit board located on the non-display side of the main body, and a reinforcing support layer located on a side of the circuit board close to the main body; The reinforcing support layer comprises: a first metal layer, a conductive adhesive layer and a second metal layer arranged in sequence in a direction away from the main body; The second metal layer has a groove; the groove exposes a portion of the conductive adhesive layer; The circuit board is located in the slot and is connected to the first metal layer and the second metal layer through the conductive adhesive layer.

2. The display module according to claim 1, characterized in that: The circuit board comprises: a bottom plate, components located on a side of the bottom plate away from the main body, and a ground terminal located on a side of the bottom plate close to the main body and connected to the components; The ground terminal is connected to the first metal layer and the second metal layer through the conductive adhesive layer.

3. The display module according to claim 2, characterized in that: The display panel further includes: a binding portion, and a bending portion connecting the main body portion and the binding portion; The binding portion is located on the non-display side of the main body; The bent portion is bent toward the non-display side of the main body.

4. The display module according to claim 3, characterized in that: The orthographic projections of the first metal layer, the conductive adhesive layer, and the second metal layer on the main body portion at least partially overlap with the orthographic projection of the binding portion on the main body portion.

5. The display module according to claim 4, characterized in that: The circuit board further comprises: a binding terminal located at one end of the bottom plate and connected to the component; The component is connected to the binding portion through the binding terminal.

6. The display module according to claim 5, characterized in that: The display module further includes: a first panel supporting layer; The first panel supporting layer is located on a side of the main body close to the first metal layer.

7. The display module according to claim 6, characterized in that: An orthographic projection of the first panel supporting layer on the main body portion at least partially overlaps with an orthographic projection of the binding portion on the main body portion.

8. The display module according to claim 7, characterized in that: The reinforcing support layer further includes: a first bonding layer located on a side of the first metal layer close to the main body; The first metal layer is bonded to the first panel supporting layer through the first adhesive layer.

9. The display module according to claim 5, characterized in that: The display module further includes: a second panel supporting layer; The second panel supporting layer is located on a side of the binding portion close to the main body portion.

10. The display module according to claim 9, characterized in that: The display module further includes: a second adhesive layer located between the second panel supporting layer and the binding portion; The second panel supporting layer is bonded to the second metal layer via the second adhesive layer.

11. The display module according to claim 2, characterized in that: The display module further includes: a third metal layer; The third metal layer is located between the conductive adhesive layer and the ground terminal.

12. The display module according to claim 2, characterized in that: The display module further includes: an electromagnetic shielding layer located on a side of the bottom plate close to the second metal layer; the electromagnetic shielding layer is provided with a first opening; An orthographic projection of the first opening on the main body at least partially overlaps with an orthographic projection of the ground terminal on the main body.

13. The display module according to claim 12, characterized in that: The display module further includes: a third bonding layer located between the electromagnetic shielding layer and the conductive adhesive layer; the third bonding layer is provided with a second opening; An orthographic projection of the second opening on the main body at least partially overlaps with an orthographic projection of the ground terminal on the main body.

14. The display module according to claim 2, characterized in that: The display module further includes: a cover plate; The cover plate covers the display side of the main body.

15. A display device, characterized in that: The display device comprises the display module according to any one of claims 1 to 14.

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