Image acquisition equipment

Abstract

The utility model discloses image acquisition equipment, which comprises a shell and a cover plate arranged outside the shell, a functional part capable of generating heat in a working process is arranged in the shell, the image acquisition equipment further comprises a heat dissipation assembly arranged in the shell, and the heat dissipation assembly comprises a heat conduction plate; the shell is provided with an opening, one side surface of the heat-conducting plate is connected with the functional part to generate heat conduction therebetween, and the other side surface of the heat-conducting plate is connected with the cover plate through the opening to generate heat conduction therebetween. The opening is formed in the shell, and the heat conducting plate is connected with the cover plate arranged outside the shell through the opening, so that the heat conducting plate can conduct heat generated by the functional component to the cover plate and then dissipate heat to the outside through the cover plate, and the heat does not necessarily dissipate heat to the outside through the shell; a heat dissipation fin structure arranged on the shell in the related technology can be omitted.

Description

Technical Field

[0001] The present application relates to the field of image acquisition technology, and in particular to an image acquisition device. Background Art

[0002] With the rapid development of machine vision, the market demand for laser 3D cameras has grown rapidly. Laser 3D cameras emit lasers to target objects through the lasers set inside them, and reflect light is formed by reflection. Then, the reflected light is collected by the optical camera set inside the laser 3D camera, and the three-dimensional image data of the object can be collected. Since the laser 3D camera has many functional components that can generate heat, such as lasers and control circuit boards, the heat dissipation performance of the product needs to be fully considered when designing the product, otherwise it will affect its working performance. In the related art, heat dissipation fins are generally set on the shell of the laser 3D camera to increase the heat dissipation area, and then the heat emitted by the functional components is conducted to the heat dissipation fins through the heat conduction structure for heat dissipation. On the one hand, this structural design will increase the overall size of the shell (the setting of heat dissipation fins will increase the overall thickness of the shell); on the other hand, due to reasons such as lightweight design and strength requirements, the shell material of the laser 3D camera is generally selected from carbon fiber, glass fiber, etc. It is difficult to make a shell with a heat dissipation fin structure with the above materials, and the thermal conductivity of the above materials is low, which makes the overall heat dissipation capacity of the product poor. Utility Model Content

[0003] The present application aims to solve one of the technical problems in the related art to a certain extent. To this end, the present application provides an image acquisition device.

[0004] In order to achieve the above-mentioned purpose, the present application adopts the following technical solution: an image acquisition device, comprising a shell and a cover plate arranged outside the shell, wherein a functional component capable of generating heat during operation is arranged inside the shell, and the image acquisition device also includes a heat dissipation component arranged inside the shell, and the heat dissipation component includes a heat conducting plate; the shell is provided with an opening, and one side surface of the heat conducting plate is connected to the functional component to generate heat conduction between the two, and the other side surface of the heat conducting plate is connected to the cover plate through the opening to generate heat conduction between the two.

[0005] The application of the present invention has the following beneficial effects: an opening is provided on the shell, and a heat conducting plate is connected to a cover plate provided outside the shell by utilizing the opening, so that the heat conducting plate can conduct the heat generated by the functional components to the cover plate, and then dissipate the heat to the outside through the cover plate, thereby making it possible for the heat to not necessarily be dissipated to the outside through the shell, and the heat dissipation fin structure provided on the shell in the related technology can be omitted.

[0006] Optionally, the thermal conductivity of the cover plate is greater than the thermal conductivity of the shell.

[0007] Optionally, the functional component is a laser, the shell includes a front side wall having a light emitting hole and a light collecting hole, the opening is arranged on the front side wall, the cover plate is arranged outside the front side wall, and the cover plate is provided with a light emitting through hole adapted to the light emitting hole and a light collecting through hole adapted to the light collecting hole.

[0008] Optionally, the image acquisition device further includes a driving board assembly and a connector, the driving board assembly and the laser are connected as a whole via the connector, and the driving board assembly and the laser are spaced apart from each other.

[0009] Optionally, the drive board assembly includes a drive board and a first mounting structure for mounting the drive board on the inner wall of the shell, and the image acquisition device also includes a second mounting structure for mounting the laser on the inner wall of the shell; one of the first mounting structure and the second mounting structure is fixedly connected to one end of the connecting member, and the other is fixedly connected to the other end of the connecting member, and the connecting member is an elastic and retractable structure.

[0010] Optionally, the heat conducting plate is formed with a first boss portion adapted to the opening, the first boss portion extends into the opening, and the heat conducting plate is connected to the cover plate via the first boss portion to generate heat conduction between the two.

[0011] Optionally, the image acquisition device further comprises a first elastic thermally conductive pad disposed in the opening, and two side surfaces of the first elastic thermally conductive pad are respectively tightly fitted to the heat conductive plate and the cover plate.

[0012] Optionally, the heat conducting plate is spaced apart from the functional component, and the heat dissipation assembly further comprises a refrigerator located between the heat conducting plate and the functional component, the cold end of the refrigerator is connected to the functional component to generate heat conduction between the two, and the hot end of the refrigerator is connected to the heat conducting plate to generate heat conduction between the two.

[0013] Optionally, the image acquisition device further comprises a mounting seat disposed on the heat conducting plate, the mounting seat forming a mounting groove, the functional component being mounted in the mounting groove, and the functional component being connected to the cold end of the refrigerator via the mounting seat to generate heat conduction between the three.

[0014] Optionally, the image acquisition device further includes a temperature sensor, and the temperature sensor is disposed on the mounting base.

[0015] Optionally, the refrigerator is arranged on a heat conductive plate, and the heat dissipation assembly also includes a heat insulation plate, which is arranged between the mounting seat and the heat conductive plate and separates the mounting seat from the heat conductive plate; the heat insulation plate is provided with an opening at a position corresponding to the refrigerator, and the mounting seat is connected to the cold end of the refrigerator through the opening to generate heat conduction between the two.

[0016] Optionally, the heat dissipation assembly further includes a sealing ring arranged around the opening, and the sealing ring is clamped between the heat insulation plate and the mounting seat.

[0017] Optionally, the heat conducting plate is provided with a groove matched with the opening, the groove cooperates with the opening to form a receiving groove, the refrigerator is arranged in the receiving groove, and the hot end of the refrigerator is in contact with the bottom wall of the groove.

[0018] Optionally, the heat conducting plate is provided with a wiring groove connected to the groove, a notch connecting the groove with the outside is formed between the wiring groove and the heat insulation plate, the cable of the refrigerator is arranged in the wiring groove, and the notch is sealed with glue.

[0019] Optionally, the mounting seat is formed with a second boss portion adapted to the opening, the second boss portion extends into the opening, and the mounting seat is connected to the cold end of the refrigerator via the second boss portion to generate heat conduction between the two.

[0020] Optionally, the heat dissipation assembly further includes a second elastic thermally conductive pad disposed in the opening, and two side surfaces of the second elastic thermally conductive pad are respectively tightly fitted to the cold end and the mounting seat of the refrigerator.

[0021] These features and advantages of the present application will be disclosed in detail in the following specific embodiments and drawings. The best embodiments or means of the present application will be described in detail in conjunction with the drawings, but they are not intended to limit the technical solutions of the present application. In addition, there are multiple features, elements, and components that appear in each of the following texts and drawings, and different symbols or numbers are marked for convenience, but they all represent components with the same or similar structures or functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present application is further described below in conjunction with the accompanying drawings:

[0023] Figure 1 An exploded diagram of an image acquisition device provided in an embodiment of the present application;

[0024] Figure 2 is a cross-sectional view of an image acquisition device;

[0025] Figure 3 for Figure 1 A magnified schematic diagram of part A;

[0026] Figure 4 for Figure 2 A magnified schematic diagram of part B;

[0027] Figure 5 It is a schematic diagram of the structure of the refrigeration component and the laser;

[0028] Figure 6 This is a schematic diagram of the structure of the cooling assembly and the laser from another perspective;

[0029] Figure 7 An exploded view of the refrigeration assembly and the laser;

[0030] Figure 8 is a cross-sectional view of the cooling assembly and the laser;

[0031] Fig. 9 for Figure 8 A magnified schematic diagram of part C;

[0032] Fig.10 is an internal schematic diagram of an image acquisition device;

[0033] Fig.11 for Fig.10 An enlarged schematic diagram of part D in the middle;

[0034] Fig.12 It is a connection diagram of the drive board assembly and the connecting parts.

[0035] Among them, 1. shell; 10. front side wall; 100. light outlet; 101. light collecting hole; 102. opening; 2. cover plate; 20. light outlet hole; 21. light collecting hole; 3. laser; 4. heat dissipation assembly; 40. heat conducting plate; 400. first boss portion; 401. groove; 402. wiring slot; 403. connection hole; 41. refrigerator; 410. cable; 42. heat insulation board; 420. opening; 43. sealing ring; 44. second elastic thermal pad; 45. temperature sensor; 5. mounting seat; 50. second boss portion; 6. first elastic thermal pad; 7. drive board assembly; 8. connector; 80. column; 81. spring pin structure. DETAILED DESCRIPTION

[0036] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments based on the embodiments are intended to be used to explain the present application and cannot be understood as limiting the present application.

[0037] References to "one embodiment" or "an example" or "an example" in this specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment itself may be included in at least one embodiment disclosed in the present application. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily refer to the same embodiment.

[0038] This embodiment provides an image acquisition device, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown in , the image acquisition device includes a housing 1 and a cover plate 2 arranged outside the housing 1, wherein a functional component that generates heat during operation is arranged in the housing 1. The image acquisition device also includes a heat dissipation component 4 arranged in the housing 1, and the heat dissipation component 4 includes a heat conducting plate 40, and one side surface of the heat conducting plate 40 is connected to the functional component, so that heat conduction can be generated between the functional component and the heat conducting plate 40. In this embodiment, an opening 102 is provided on the housing 1, and the other side surface of the heat conducting plate 40 is connected to the cover plate 2 through the opening 102, so that heat conduction can be generated between the heat conducting plate 40 and the cover plate 2. The "connection" described in the aforementioned "connecting one side surface of the heat conducting plate 40 to the functional component" and "connecting the other side surface of the heat conducting plate 40 to the cover plate 2 through the opening 102" refers to direct bonding or indirect bonding. That is, in different embodiments, one side surface of the heat conducting plate can be directly bonded to the functional component or indirectly bonded, and the other side surface of the heat conducting plate can be directly bonded to the cover plate or indirectly bonded.

[0039] An opening 102 is provided on the shell 1, and the heat conducting plate 40 is connected to the cover plate 2 provided outside the shell 1 by using the opening 102, so that the heat conducting plate 40 can conduct the heat generated by the functional components to the cover plate 2, and then dissipate the heat to the outside through the cover plate 2, so that the heat does not necessarily dissipate to the outside through the shell, and the heat dissipation fin structure provided on the shell in the related technology can be omitted.

[0040] Specifically in this embodiment, a 3D laser camera is used as an example of an image acquisition device for explanation. Accordingly, the 3D laser camera includes functional components such as lasers, optical devices, and drive boards that can generate heat during operation. In this embodiment, the laser is used as the functional component for explanation. In this embodiment, the housing 1 is made of carbon fiber material, and the cover plate 2 is made of aluminum alloy material. In this way, the thermal conductivity of the cover plate 2 is much greater than the thermal conductivity of the housing 1, so that the image acquisition device has a better heat dissipation capacity. It should be noted that most of the products of this type on the market currently use materials such as carbon fiber or glass fiber to make the housing in pursuit of lightweight design and high strength, and for the purpose of beauty, decoration, etc., aluminum alloy, magnesium aluminum alloy or stainless steel are generally used to make the cover plate. For such products, since the thermal conductivity of the cover plate is greater than the thermal conductivity of the housing, compared with the solution in the related art that the heat generated by the functional components is thermally conducted to the housing for heat dissipation, the solution of thermally conducting the heat generated by the functional components to the cover plate located outside the housing for heat dissipation in this application has a better heat dissipation effect.

[0041] The shell 1 in this embodiment is a square tube structure. The shell 1 includes four side walls and end caps at both ends. A light exit hole 100 and a light-collecting hole 101 are provided on one of the side walls. For ease of description, the side wall provided with the light exit hole 100 and the light-collecting hole 101 is referred to as the front side wall 10. In this embodiment, the opening 102 is provided on the front side wall 10, and the cover plate 2 is provided outside the front side wall 10, and the cover plate 2 is provided with a light exit hole 20 adapted to the light exit hole 100 and a light-collecting hole 21 adapted to the light-collecting hole 101. The laser 3 can emit laser light outward through the light exit hole 100, and the optical lens in the image acquisition device can collect laser light reflected by the object through the light-collecting hole 101. The working principle of the laser and the optical lens is prior art and will not be repeated here.

[0042] like Figure 4 As shown in , the heat conducting plate 40 in this embodiment is formed with a first boss portion 400 adapted to the opening 102, the first boss portion 400 extends into the opening 102, and the heat conducting plate 40 is connected to the cover plate 2 through the first boss portion 400, so that heat conduction can be generated between the heat conducting plate 40 and the cover plate 2. Further, the image acquisition device also includes a first elastic heat conducting pad 6 arranged in the opening 102, and the two side surfaces of the first elastic heat conducting pad 6 are respectively tightly fitted with the heat conducting plate 40 and the cover plate 2. By providing the first elastic heat conducting pad 6, the heat conducting plate 40 and the cover plate 2 can be made to fit tightly respectively by utilizing the heat conducting capacity and elastic deformation capacity of the first elastic heat conducting pad 6.

[0043] In this embodiment, the heat conducting plate 40 and the cover plate 2 are connected in an indirect fitting relationship, while in other optional embodiments, the first elastic thermal pad can be eliminated, and the first boss portion on the heat conducting plate can be directly fitted with the cover plate. In addition, in this embodiment, the first boss portion is set on the heat conducting plate, and in other embodiments, a boss structure extending into the opening can also be set on the cover plate. In addition, in another different embodiment, the first boss portion can be eliminated, and an elastic thermal pad is set in the opening, and the thickness of the elastic thermal pad is designed to be slightly larger than the depth of the opening. Then, the heat conducting plate and the cover plate are used to extrude the two side surfaces of the elastic thermal pad respectively. This scheme can also achieve indirect fitting of the heat conducting plate and the cover plate. It should be noted that the first boss portion set on the heat conducting plate in this embodiment not only plays a role in closely fitting with the elastic thermal pad to generate heat conduction, but also plays a role in positioning the heat conducting plate during the assembly of the heat conducting plate by cooperating with the opening.

[0044] Furthermore, in this embodiment, the heat conducting plate 40 is spaced apart from the laser 3, and the heat dissipation assembly 4 also includes a refrigerator 41 located between the heat conducting plate 40 and the laser 3. Specifically, the refrigerator 41 is a cooling element, and the cooling element has a cold end and a hot end. When it is powered on, a large temperature difference will be generated between the cold end and the hot end, so that the target object can be cooled and cooled through the cold end, and the heat is correspondingly dissipated through the hot end. In this embodiment, the cold end of the refrigerator 41 is connected to the laser 3, so that heat conduction can be generated between the cold end of the refrigerator 41 and the laser 3, thereby cooling and cooling the laser 3. Correspondingly, the hot end of the refrigerator 41 is connected to the heat conducting plate 40, so that heat conduction can be generated between the hot end of the refrigerator 41 and the heat conducting plate 40.

[0045] Similar to the above, the "connection" in "connecting the cold end of the refrigerator 41 to the laser 3" and "connecting the hot end of the refrigerator 41 to the heat conducting plate 40" in this embodiment refers to direct bonding or indirect bonding. That is, in different embodiments, one side surface of the heat conducting plate can be directly bonded to the hot end of the refrigerator or indirectly bonded, and the laser can be directly bonded to the cold end of the refrigerator or indirectly bonded.

[0046] Specifically in this embodiment, the laser 3 is indirectly bonded to the cold end of the refrigerator 41, while the heat conducting plate 40 is directly bonded to the hot end of the refrigerator 41. Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 As shown in , the image acquisition device also includes a mounting base 5 arranged on the heat conducting plate 40, the mounting base 5 is formed with a mounting groove, the laser 3 is installed in the mounting groove, and the laser 3 is connected to the cold end of the refrigerator 41 through the mounting base 5, that is, the laser 3 and the cold end of the refrigerator 41 are indirectly connected, so that heat conduction can be generated between the laser 3, the mounting base 5 and the cold end of the refrigerator 41.

[0047] like Figure 8 and Fig. 9 As shown in , in this embodiment, the refrigerator 41 is arranged on the heat conducting plate 40. Specifically, a groove 401 is arranged on the heat conducting plate 40, and the refrigerator 41 is installed in the groove 401, and the hot end of the refrigerator 41 is in contact with the bottom wall of the groove 401, that is, the heat conducting plate 40 is directly in contact with the hot end of the refrigerator 41. In addition, the heat dissipation assembly 4 in this embodiment also includes a heat insulation plate 42, which is arranged between the mounting seat 5 and the heat conducting plate 40 and separates the mounting seat 5 from the heat conducting plate 40. An opening 420 is arranged on the heat insulation plate 42 at a position corresponding to the refrigerator 41, and the mounting seat 5 is connected to the cold end of the refrigerator 41 through the opening 420, so that heat conduction can be generated between the mounting seat 5 and the cold end of the refrigerator 41.

[0048] Similar to the aforementioned arrangement of the first boss portion 400 and the first elastic thermal pad 6, the heat dissipation assembly 4 in this embodiment further includes a second elastic thermal pad 44 arranged in the opening 420, and the two side surfaces of the second elastic thermal pad 44 are respectively tightly fitted with the cold end of the refrigerator 41 and the mounting seat 5. At the same time, a second boss portion 50 adapted to the opening 420 is formed on the mounting seat 5, and the second boss portion 50 extends into the opening 420, that is, the second elastic thermal pad 44 is tightly fitted with the second boss portion 50 on the mounting seat 5. In this embodiment, the mounting seat 5 and the cold end of the refrigerator 41 are indirectly connected, and in other optional embodiments, the second elastic thermal pad can also be eliminated, and the second boss portion on the mounting seat is directly fitted with the cold end of the refrigerator. In addition, in another different embodiment, the second boss portion can be eliminated, and an elastic thermal pad is set in the opening, and the thickness of the elastic thermal pad is designed to be slightly larger than the depth of the opening, and then the mounting seat and the cold end of the refrigerator are used to extrude from the two side surfaces of the elastic thermal pad, respectively. This solution can also achieve indirect bonding between the mounting seat and the cold end of the refrigerator. It should be noted that the second boss portion 50 set on the mounting seat 5 in this embodiment not only plays a role in closely fitting with the second elastic thermal pad 44 to generate heat conduction, but also cooperates with the opening 420 to position the mounting seat 5 during the assembly process of the mounting seat 5.

[0049] The heat conducting plate 40 in this embodiment can be made of aluminum alloy or copper, the heat insulating plate 42 can be made of plastic materials such as PC or PP, and the first elastic heat conducting pad 6 and the second elastic heat conducting pad 44 can be made of heat conducting gel or heat conducting silicone grease or flexible graphite pad.

[0050] It should be noted that in this embodiment, the groove 401 provided on the heat conducting plate 40 is matched with the opening 420 provided on the heat insulating plate 42, and the matching means that the shapes and sizes of the two are roughly the same, so that the groove 401 and the opening 420 can cooperate to form a receiving groove. As mentioned above, the refrigerator 41 is arranged in the groove 401, but part of the structure on the refrigerator 41 protrudes from the groove 401 and enters the space of the opening 420, so it can also be said that the refrigerator 41 is arranged in the receiving groove.

[0051] In order to facilitate the disassembly and assembly of the laser 3, a detachable connection method is adopted between the mounting seat 5 and the heat insulation board 42 in this embodiment. Specifically, the mounting seat 5 is connected to the heat insulation board 42 by screw threads. The heat insulation board 42 and the heat conducting plate 40 are bonded and fixed by gluing. The heat dissipation component 4 in this embodiment includes a refrigerator 41. Since the temperature of the cold end of the refrigerator 41 is relatively low, when the gas with a temperature higher than the temperature of the cold end encounters the cold end, condensation will occur, causing the gas to become water, which will affect the refrigeration performance of the refrigerator 41, and may also affect the performance of the optical lens or the driving board in the image acquisition device. Therefore, the refrigerator 41 is also sealed in this embodiment. Specifically, in this embodiment, the mounting seat 5, the heat insulation board 42 and the heat conducting plate 40 are used to form a cavity for installing the refrigerator 41. At the same time, the heat dissipation component 4 also includes a sealing ring 43 arranged around the opening 420, and the sealing ring 43 is sandwiched between the heat insulation board 42 and the mounting seat 5. The heat insulating plate 42 and the heat conducting plate 40 are glued together to ensure good sealing between the two, and a sealing ring 43 is provided between the heat insulating plate 42 and the mounting seat 5 to ensure good sealing between the two, thereby preventing condensation problems from occurring at the cold end of the refrigerator 41.

[0052] As mentioned above, the refrigerator 41 will be powered when working, so the refrigerator 41 is provided with a cable 410. In this embodiment, a wiring groove 402 connected to the groove 401 is provided on the heat conducting plate 40, and a gap is formed between the wiring groove 402 and the heat insulating plate 42 to connect the groove 401 with the outside. The cable 410 of the refrigerator 41 is arranged in the wiring groove 402, and the gap is sealed by glue. The wiring groove 402 is provided to facilitate the wiring operation of the cable 410 of the refrigerator 41, and the gap is sealed by glue filling to ensure the sealing effect on the refrigerator 41.

[0053] like Figure 5 As shown in , in this embodiment, a temperature sensor 45 is also provided on the mounting base 5, and the temperature of the mounting base 5 can be monitored in real time by the temperature sensor 45, thereby clarifying the temperature rise of the laser 3. Specifically, in this embodiment, the temperature sensor 45 is directly fixed to the mounting base 5 by screws.

[0054] As mentioned above, the image acquisition device has many functional components that can generate heat, such as the drive board (circuit control board) used to control the operation of the laser 3. Since the drive board needs to be electrically connected to the laser 3 to achieve control, the drive board and the laser 3 are generally installed on the same installation structure (bottom plate or base, etc.), which results in a small distance between the two. Since both the laser 3 and the drive board generate heat when working, the heat generated by the two affects each other and significantly increases the heating rate. For this reason, combined with Figure 5 , Fig.10 , Fig.11 and Fig.12 As shown in , the image acquisition device provided in this embodiment further includes a driving board assembly 7 and a connecting member 8. The driving board assembly 7 and the laser 3 are connected as a whole through the connecting member 8, and the driving board assembly 7 and the laser 3 are spaced apart from each other.

[0055] Furthermore, the drive board assembly 7 in this embodiment includes a drive board and a first mounting structure (generally a bottom plate or a base structure) for mounting the drive board on the inner wall of the housing 1, and the image acquisition device also includes a second mounting structure (specifically in this embodiment, the second mounting structure is a heat conducting plate 40) for mounting the laser 3 on the inner wall of the housing 1. In this embodiment, one end of the connector 8 is fixedly connected to the first mounting structure, and at the same time, the other end of the connector 8 is fixedly connected to the heat conducting plate 40. The connector 8 itself is an elastically retractable mechanism. Specifically, the connector 8 includes a column 80 and a spring pin structure 81 fixedly plugged with the column 80. In this embodiment, the column is threadedly fastened to the first mounting structure, and the spring pin structure 81 is threadedly fastened to the heat conducting plate 40, and then the column 80 and the spring pin structure 81 are plugged and fixed together. The connector 8 can achieve elastic expansion and contraction using the spring pin structure 81. In this way, on the one hand, the drive plate assembly 7 and the laser 3 can be connected while being spaced apart, so as to facilitate the simultaneous assembly operation of the two relative to the housing 1; on the other hand, since the connector 8 itself is an elastic and retractable structure, the spacing between the first mounting structure and the second mounting structure can be adjusted within a certain range. In this way, when there are processing errors in the components, the drive plate assembly 7 and the laser 3 assembled as a whole can be smoothly loaded into the housing 1 through the above-mentioned spacing adjustment. In addition, after the drive plate assembly 7 and the laser are initially assembled into the housing 1, due to the elastic and retractable characteristics of the connector 8, a force can be applied to the drive plate assembly 7 and the laser synchronously, so that the two are pressed against the inner wall of the housing on the corresponding side, which is convenient for subsequent assembly and fixation. It should be noted that this type of spring pin structure is an existing commonly used connection structure and will not be described in detail here.

[0056] It is easy to understand that in other optional implementations, the column may be fixedly connected to the second mounting structure, and the spring pin structure may be fixedly connected to the first mounting structure accordingly.

[0057] The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Those skilled in the art should understand that the present application includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification that does not deviate from the functional and structural principles of the present application will be included in the scope of the claims.

Claims

1. An image acquisition device, comprising a housing (1) and a cover plate (2) arranged outside the housing (1), wherein a functional component capable of generating heat during operation is arranged inside the housing (1), characterized in that: The image acquisition device further comprises a heat dissipation component (4) arranged in the housing (1), and the heat dissipation component (4) comprises a heat conducting plate (40); The shell (1) is provided with an opening (102), one side surface of the heat conducting plate (40) is connected to the functional component to generate heat conduction between the two, and the other side surface of the heat conducting plate (40) is connected to the cover plate (2) through the opening (102) to generate heat conduction between the two.

2. The image acquisition device according to claim 1, characterized in that: The thermal conductivity of the cover plate (2) is greater than the thermal conductivity of the shell (1).

3. The image acquisition device according to claim 1 or 2, characterized in that: The functional component comprises a laser (3); the housing (1) comprises a front side wall (10) having a light emitting hole (100) and a light collecting hole (101); the opening (102) is arranged on the front side wall (10); the cover plate (2) is arranged outside the front side wall (10); and the cover plate (2) is provided with a light emitting through hole (20) matched with the light emitting hole (100) and a light collecting through hole (21) matched with the light collecting hole (101).

4. The image acquisition device according to claim 3, characterized in that: The image acquisition device further comprises a driving board assembly (7) and a connecting member (8); the driving board assembly (7) and the laser (3) are connected as a whole via the connecting member (8), and the driving board assembly (7) and the laser (3) are spaced apart from each other.

5. The image acquisition device according to claim 4, characterized in that: The drive board assembly (7) comprises a drive board and a first mounting structure for mounting the drive board on the inner wall of the housing (1); the image acquisition device further comprises a second mounting structure for mounting the laser (3) on the inner wall of the housing (1); One of the first mounting structure and the second mounting structure is fixedly connected to one end of the connecting member (8), and the other is fixedly connected to the other end of the connecting member (8), and the connecting member (8) is an elastic and retractable structure.

6. The image acquisition device according to claim 1, characterized in that: The heat conducting plate (40) is formed with a first boss portion (400) adapted to the opening (102), the first boss portion (400) extending into the opening (102), and the heat conducting plate (40) is connected to the cover plate (2) via the first boss portion (400) to generate heat conduction between the two.

7. The image acquisition device according to claim 1 or 6, characterized in that: The image acquisition device further comprises a first elastic thermally conductive pad (6) arranged in the opening (102), and two side surfaces of the first elastic thermally conductive pad (6) are respectively tightly fitted to the thermally conductive plate (40) and the cover plate (2).

8. The image acquisition device according to claim 1, characterized in that: The heat conducting plate (40) is spaced apart from the functional component, and the heat dissipation assembly (4) further comprises a refrigerator (41) located between the heat conducting plate (40) and the functional component, a cold end of the refrigerator (41) is connected to the functional component to generate heat conduction between the two, and a hot end of the refrigerator (41) is connected to the heat conducting plate (40) to generate heat conduction between the two.

9. The image acquisition device according to claim 8, characterized in that: The image acquisition device further comprises a mounting seat (5) arranged on the heat conducting plate (40), the mounting seat (5) being formed with a mounting groove, the functional component being mounted in the mounting groove, and the functional component being connected to the cold end of the refrigerator (41) via the mounting seat (5) to generate heat conduction between the three.

10. The image acquisition device according to claim 9, characterized in that: The image acquisition device further comprises a temperature sensor (45), wherein the temperature sensor (45) is arranged on the mounting seat (5).

11. The image acquisition device according to claim 9, characterized in that: The refrigerator (41) is arranged on the heat conducting plate (40), and the heat dissipation assembly (4) further comprises a heat insulating plate (42), wherein the heat insulating plate (42) is arranged between the mounting seat (5) and the heat conducting plate (40) and separates the mounting seat (5) from the heat conducting plate (40); The heat insulation board (42) is provided with an opening (420) at a position corresponding to the refrigerator (41), and the mounting seat (5) is connected to the cold end of the refrigerator (41) through the opening (420) to generate heat conduction between the two.

12. The image acquisition device according to claim 11, characterized in that: The heat dissipation assembly (4) further comprises a sealing ring (43) arranged around the opening (420), and the sealing ring (43) is sandwiched between the heat insulation board (42) and the mounting seat (5).

13. The image acquisition device according to claim 11, characterized in that: The heat conducting plate (40) is provided with a groove (401) adapted to the opening (420), and the groove (401) and the opening (420) cooperate to form a receiving groove, and the refrigerator (41) is arranged in the receiving groove, and the hot end of the refrigerator (41) is in contact with the bottom wall of the groove (401).

14. The image acquisition device according to claim 13, characterized in that: The heat conducting plate (40) is provided with a wiring groove (402) connected to the groove (401), and a gap is formed between the wiring groove (402) and the heat insulating plate (42) to connect the groove (401) with the outside. The cable (410) of the refrigerator (41) is arranged in the wiring groove (402), and the gap is sealed with glue.

15. The image acquisition device according to claim 11, characterized in that: The mounting seat (5) is formed with a second boss portion (50) adapted to the opening (420), the second boss portion (50) extending into the opening (420), and the mounting seat (5) is connected to the cold end of the refrigerator (41) via the second boss portion (50) to generate heat conduction between the two.

16. The image acquisition device according to claim 11 or 15, characterized in that: The heat dissipation component (4) also includes a second elastic thermal pad (44) disposed in the opening (420), and two side surfaces of the second elastic thermal pad (44) are respectively tightly fitted with the cold end of the refrigerator (41) and the mounting seat (5).

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