Optical modulation clock generator and integrated circuit
By using optical modulated clock generators and optical waveguides in integrated circuits, the rapid propagation characteristics of optical signals are used to solve the problems of clock signal transmission delay and deviation in integrated circuits, high-speed and low-bias clock signal transmission is achieved, and the performance and integration of integrated circuits are improved.
Patent Information
- Application Number
- CN202421469336.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-25
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-06-25
AI Technical Summary
In integrated circuits, as the chip size increases, the clock path length increases, resulting in an increase in signal delay and clock delay deviation, limiting the performance improvement and integration of the integrated circuit.
An optical modulation clock generator is used to transmit the optical clock signal in the waveguide core through the optical waveguide plate, and a waveguide window is set up where the clock signal is needed, so that the optical signal is transmitted to the photoelectric conversion module and converted into an electrical clock signal.
By leveraging the rapid propagation characteristics of the optical signal, the transmission delay and delay deviation of the clock signal are shortened, the clock synchronization capability of the integrated circuit is improved, and the overall size of the integrated circuit is not significantly increased.
Smart Images
Figure CN222599887U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit clock design, in particular to an optical modulation clock generator and an integrated circuit. Background Art
[0002] With the progress of the information age, people's requirements for information processing capabilities are getting higher and higher, making the scale of the microelectronic devices and integrated circuits they rely on larger and larger. The clock link that controls the circuit to keep pace in an orderly manner has become more and more complex, the key link has become longer and longer, and the transmission delay and clock delay deviation of different paths have become larger and larger, which limits the integration of circuits under the same process size. Therefore, it is necessary to continuously reduce the process node and reduce the transmission distance of the signal to support larger-scale system integration. However, the reduction of process nodes requires support from higher-end semiconductor equipment, more complex process technology and higher costs. In response to this problem, choosing a relatively large process node to make larger-scale integrated circuits is an effective way to reduce the difficulty and cost of integrated circuit manufacturing and increase the life cycle of the process node. To this end, it is necessary to provide a transmission scheme for high-speed, low-deviation synchronous clock signals on a relatively long signal path.
[0003] Figure 1 is a schematic diagram of an existing optoelectronic device, such as Figure 1 As shown in the figure, the traditional clock tree is mainly composed of clock source, clock tree branch, clock signal driving unit and other parts. At present, the industry mostly adopts symmetrical structure in layout design to improve the consistency of clock signal delay and reduce the deviation of clock tree, so as to ensure the working frequency of integrated circuit. Figure 2a In the method shown in FIG. 1 , the clock delay of load circuit n is greater than that of load circuit 1, resulting in asynchrony of logic operations and even possible logic errors. Figure 2b The method shown in the figure is obviously more conducive to the consistency of clock delay through symmetrical clock tree layout. However, the symmetrical layout structure is difficult to meet the current chip miniaturization requirements. Figure 2b It can be seen that even if the layout has been optimized, as the chip functions increase and the chip area increases, the length of the clock path 1 or n will also increase. In addition, the existence of resistance and capacitance on the path will cause signal delays.
[0004] Therefore, for integrated circuits with more complex structures or larger chip sizes, most of them currently model device delays, load capacitance, wiring impedance, etc., and optimize the clock tree path through algorithms, and constrain it during the layout and routing process, hoping to eventually form a high-speed, low-deviation clock tree in the layout. However, due to the complexity of the algorithm, the clock tree for ultra-high integration circuits such as multi-core processors is very complex, which limits the improvement of overall circuit performance. In particular, as the scale of integrated circuits increases, process fluctuations and other factors lead to a surge in design difficulty, and also cause a decrease in product yield. Utility Model Content
[0005] In view of the above problems, the purpose of the utility model is to provide an optical modulation clock generator and an integrated circuit, in which the modulated optical clock signal is transmitted in the entire waveguide core, and a waveguide window is set where the clock signal is needed to allow the optical clock signal to be transmitted to the optoelectronic conversion module. The fast transmission speed of the optical signal is utilized to reduce the clock signal transmission delay at different nodes and the clock signal delay deviation of different transmission paths.
[0006] According to one aspect of the utility model, there is provided an optical modulation clock generator, comprising: an optical clock source and an optical waveguide plate, wherein the optical waveguide plate comprises: a waveguide core and a reflective layer, the reflective layer covers the waveguide core, and an optical signal generated by the optical clock source is transmitted in the waveguide core; a plurality of waveguide windows are located in the reflective layer, the reflective layer is absent at the waveguide windows and the surface of the waveguide core is exposed, and the optical signal transmitted in the waveguide core is transmitted from the waveguide windows to the outside of the waveguide core.
[0007] Optionally, the optical waveguide plate further comprises: an optical signal inlet located at the edge of the waveguide core, the optical signal inlet being free of the reflective layer and exposing the surface of the waveguide core, and the optical signal generated by the optical clock source entering the waveguide core from the optical signal inlet.
[0008] Optionally, a plurality of said waveguide windows are located on at least one surface of said waveguide core.
[0009] According to another aspect of the present invention, there is provided an integrated circuit, comprising: an optical modulation clock generator, as described above; a semiconductor chip, located on at least one side of an optical waveguide plate, comprising a plurality of photoelectric conversion modules and a plurality of load circuits, wherein the position of the photoelectric conversion module in the semiconductor chip corresponds to the position of the waveguide window, so that the photoelectric conversion module receives the optical signal transmitted from the waveguide window and converts it into a clock signal, and the load circuit receives the clock signal.
[0010] Optionally, at least one of the photoelectric conversion modules is included adjacent to the load circuit.
[0011] Optionally, the semiconductor chip further includes: a metal wiring layer and an insulating dielectric layer, and the insulating dielectric layer is made of a light-transmitting material.
[0012] Optionally, the metal wiring layer includes multiple layers, and the multiple layers of metal wiring layers and the insulating medium layers are alternately arranged; in addition to the electrical connection function between the modules on the semiconductor chip, the multiple layers of metal wiring layers also have a light shielding function, and the multiple layers of metal wiring layers complement each other to shield the area outside the waveguide window between the optical waveguide plate and the semiconductor chip, so that the optical signal from the optical waveguide plate cannot pass through the area to reach the semiconductor chip; there is no metal wiring in the area of the metal wiring layer corresponding to the waveguide window to avoid shielding the optical signal.
[0013] Optionally, the semiconductor chips include two, the two semiconductor chips are arranged opposite to each other and the optical waveguide plate is located between the two semiconductor chips.
[0014] Optionally, the two semiconductor chips work independently or in cooperation with each other.
[0015] Optionally, positions of the photoelectric conversion modules in the two semiconductor chips correspond or do not correspond.
[0016] Optionally, the photoelectric conversion module includes: a photoelectric switch, which is turned on after receiving the optical signal and turned off when there is no optical signal; a resistor, which is connected in series with the photoelectric switch and is used to generate an initial clock signal when the photoelectric switch is periodically turned on or off; a clock signal driving unit, which is connected to the photoelectric switch and the resistor, and shapes and filters the initial clock signal to obtain a usable clock signal.
[0017] Optionally, the photoelectric switch includes a photoelectric two-dimensional modulation field emission device.
[0018] The utility model provides an optical modulation clock generator and an integrated circuit. The optical modulation clock generator includes an optical clock source and an optical waveguide plate. The waveguide core of the optical waveguide plate adopts a whole piece type, and a waveguide window is provided in the area corresponding to the photoelectric conversion module, so that the optical signal can be transmitted from the waveguide core to the photoelectric conversion module and converted into an electrical clock signal. Since the optical modulation clock generator utilizes the fast propagation speed of light, it can realize fast synchronization of the clock, shorten the transmission delay of the clock signal and the delay deviation of different clock signal transmission paths, and at the same time will not have a significant impact on the overall size of the integrated circuit.
[0019] Furthermore, in the optical modulation clock generator and integrated circuit provided by the utility model, the photoelectric conversion module uses a silicon-based photoelectric sensor or a photoelectric two-dimensional modulated field emission device as a photoelectric switch, which has the characteristics of fast switch response speed and can further shorten the clock signal transmission delay. In addition, in all places where clock signals are required in the integrated circuit, the clock signals can be obtained entirely through the optical modulation clock generator, or partially through the optical modulation clock generator and partially through the traditional clock tree, so as to improve the applicability and flexibility of the integrated circuit design. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The above and other purposes, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
[0021] Figure 1 A schematic diagram of a photoelectric device according to the prior art is shown;
[0022] Figure 2a and Figure 2b Two schematic diagrams of optoelectronic devices according to the prior art are shown;
[0023] Figure 3 A schematic diagram of the structure of an optical modulation clock generator and an optoelectronic conversion module according to an embodiment of the utility model is shown;
[0024] Figure 4 A schematic diagram of the structure of a photoelectric switch in a photoelectric conversion module according to an embodiment of the utility model is shown;
[0025] Figure 5 A schematic diagram showing the structure of an optical waveguide plate in an optical modulation clock generator according to an embodiment of the utility model is shown;
[0026] Figure 6 A schematic diagram of the structure of an integrated circuit (taking one of the photoelectric conversion modules as an example) according to an embodiment of the utility model is shown;
[0027] Figure 7 A specific structural schematic diagram of an integrated circuit (taking one of the photoelectric conversion modules as an example) according to an embodiment of the utility model is shown. DETAILED DESCRIPTION
[0028] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, the same elements are represented by the same or similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale.
[0029] The specific implementation of the utility model is further described in detail below in conjunction with the drawings and embodiments.
[0030] Figure 3 A schematic structural diagram of an optical modulation clock generator according to an embodiment of the utility model is shown.
[0031] Among them, reference Figure 3 The optical modulation clock generator 100 of the present application includes: an optical clock source 110 and an optical waveguide plate 120. The optical clock source 110 is used to emit light as an optical clock signal source, the optical waveguide plate 120 receives the optical clock signal generated by the optical clock source 110 and transmits it in the optical waveguide plate 120, and the optoelectronic conversion module 130 can convert the optical clock signal transmitted in the optical waveguide plate 120 into an electrical clock signal to facilitate the clock needs of other circuits. Therefore, the optical modulation clock generator 100 cooperates with the optoelectronic conversion module 130 to utilize the fast propagation speed of light to achieve fast clock synchronization, shorten the clock signal transmission delay and the delay deviation of different clock signal transmission paths,
[0032] Based on the optical modulation clock generator 100, the required integrated circuit can be designed and manufactured. Specifically, Figure 5 FIG. 1 shows a schematic top view of a window surface of an optical waveguide plate 120 (without a reflective layer), Figure 6 and Figure 7 A schematic cross-sectional view of the integrated circuit 10 is shown.
[0033] refer to Figure 5 and Figure 7 , in the optical waveguide plate 120, a waveguide core 121, a plurality of waveguide windows 122, a reflective layer 124 and an optical signal inlet 123 are included. The waveguide core 121 is, for example, a whole-piece plate-shaped structure matching the size of the semiconductor chip 200 in the integrated circuit, the reflective layer 124 covers the surface of the waveguide core 121, and the waveguide window 122 is formed by removing the reflective layer 124 at the corresponding position of the optical waveguide plate 120 to allow the optical signal transmitted in the waveguide core 121 to pass out of the waveguide core 121. In this embodiment, the plurality of waveguide windows 122 are located on at least one side of the optical waveguide plate 120, and the waveguide windows 122 correspond to the position of the photoelectric conversion module 130 arranged in the semiconductor chip 200, that is, the optical signal can be transmitted from the waveguide window 122 to the photoelectric conversion module 130.
[0034] Specifically, in the optical modulation clock generator 100, the optical clock signal generated by the optical clock source 110 enters the waveguide core 121 in the optical waveguide plate 120 from the optical signal inlet 123, and is transmitted in the entire waveguide core 121. At the waveguide window 122 of the optical waveguide plate 120, the optical clock signal is transmitted to the photoelectric conversion module 130 arranged at the corresponding position of the semiconductor chip 200. Therefore, based on the optical modulation clock generator 100, a photoelectric conversion module 130 can be correspondingly arranged at each waveguide window 122 of the optical waveguide plate 120, that is, the waveguide window 122 in the optical waveguide plate 120 is arranged according to the position of the photoelectric conversion module 130 in the semiconductor chip 200, so as to reduce the wiring distance between the photoelectric conversion module 130 and the chip in the integrated circuit or optimize the wiring design.
[0035] In this embodiment, in order to facilitate the transmission of the optical clock signal in the optical waveguide plate 120, a reflective layer 124 can be formed on the exposed surface of the optical waveguide plate 120, and the reflective layer 124 can be removed at the optical signal inlet 123 and the waveguide window 122, so that the optical clock signal can be transmitted quickly and effectively in the waveguide core 121, and can also be irradiated to the photoelectric conversion module 130 through the waveguide window 122.
[0036] Further, refer to Figure 6 , the integrated circuit 10 includes a semiconductor chip 200 and an optical modulation clock generator 100 .
[0037] Specifically, the semiconductor chip 200 includes a plurality of photoelectric conversion modules 130 and a plurality of load circuit modules 220. The adjacent area of each load circuit module 220 includes at least one photoelectric conversion module 130, so that after the photoelectric conversion module 130 converts the optical signal into a clock signal, it can be provided to the corresponding load circuit module 220 in a timely manner to reduce the delay of the clock signal.
[0038] The photoelectric conversion module 130 includes a photoelectric switch 131, a resistor 132 and a clock signal driving unit 133. Figure 3 As shown. Specifically, the photoelectric switch 131 is connected in series with the resistor 132, and the clock signal driving unit 133 is connected to both ends of the photoelectric switch 131 and both ends of the resistor 132. The photoelectric switch 131 will be turned on under light conditions, and will be turned off when there is no light. Controlled by the optical clock signal in the optical waveguide plate 120, the photoelectric switch 131 is turned on or off. At this time, the clock generating unit formed by the photoelectric switch 131 and the resistor 132 can generate a square wave signal composed of a combination of high and low levels. The square wave signal is the initial clock signal. The clock signal driving unit 133 shapes, filters and amplifies the initial clock signal to obtain a suitable clock signal for use by the load circuit module 220.
[0039] In this embodiment, the photoelectric switch 131 can be a conventional silicon-based photoelectric sensor or a novel photoelectric two-dimensional modulation field emission device. The structure of the photoelectric two-dimensional modulation field emission device is as follows: Figure 4 As shown, it includes a field emission cathode, an emission micro-tip, a cavity, a collector and an isolation medium. The photoelectric two-dimensional modulation field emission device can stimulate the emission micro-tip to emit electrons when there is light and the electrons are absorbed by the collector, thereby forming a current between the field emission cathode and the collector. When the current generated by the photoelectric two-dimensional modulation field emission device passes through the resistor 132, a voltage signal is generated at both ends of the resistor 132, and the voltage signal can be regarded as an initial clock signal.
[0040] In the manufacturing process of the integrated circuit, the manufacturing process of the optical modulation clock generator 100 and the semiconductor chip 200 is separated, that is, after the two are manufactured separately, the optical modulation clock generator 100 and the semiconductor chip 200 are integrated and packaged by bonding technology. In this embodiment, the optical clock source 110 in the optical modulation clock generator 100 can be provided outside the integrated circuit, or it can be bonded and packaged with the semiconductor chip 200 together with the optical waveguide plate 120. Optionally, a load circuit module 220 includes at least one photoelectric conversion module 130 around it, and above the photoelectric conversion module 130 is a waveguide window 122, and the waveguide window 122 allows the optical signal in the optical waveguide plate 120 to irradiate the photoelectric conversion module 130.
[0041] Further, refer to Figure 7 The semiconductor chip 200 includes a plurality of photoelectric conversion regions 131, a plurality of load circuit regions 221, and a plurality of metal wiring layers 231 and an insulating dielectric layer 232. The plurality of photoelectric conversion regions 131 are used to set the main part of the electronic components of the photoelectric conversion module 130 except the metal wiring, and the plurality of load circuit regions 221 are used to set the main part of the electronic components of the load circuit module 220 except the metal wiring layer 231. That is, the load circuit region 221, the metal wiring layer 231 and the insulating dielectric layer 232 together constitute the load circuit module 220. The load circuit region 221 is, for example, the main part of the electronic components in the load circuit module 220. Similarly, the photoelectric conversion region 131 is, for example, the main part of the electronic components in the photoelectric conversion module 130, and it, the metal wiring layer 231 and the insulating dielectric layer 232 together constitute the photoelectric conversion module 130. The multi-layer metal wiring layer 231 and the insulating dielectric layer 232 are located on one side of the semiconductor chip 200 close to the optical waveguide plate 120. The metal wiring layers 231 and the insulating dielectric layers 232 are alternately arranged, and the insulating dielectric layers 232 are made of a light-transmitting material.
[0042] In the present application, when the semiconductor chip 200 is designed and manufactured, its metal wiring layer 231 should not only have an electrical connection function, but also a light shielding function. That is, in order to make the optical signal in the optical waveguide plate 120 only reach the photoelectric conversion region 130 after passing through the waveguide window 122, and not be received by other regions on the semiconductor chip 200, thereby affecting other circuits, except for the portion corresponding to the waveguide window 122 on the semiconductor chip 200 that can receive the optical signal, the rest of the portions need to be complemented by the multi-layer metal wiring layer 231 to achieve the function of shielding the optical signal from the optical waveguide plate 120. That is, in the metal wiring layer 231, there is no metal wiring in the region corresponding to the photoelectric conversion region 130 or the waveguide window 122, and the metal wiring only exists in the region outside the region corresponding to the photoelectric conversion region 131 or the waveguide window 122.
[0043] In this embodiment, if the scale of the semiconductor chip 200 in the integrated circuit 10 is larger, the more load circuit modules 220 that require clock signals will be therein, and thus the clock link that controls the circuit to coordinate in an orderly manner will be more complex. By using the optical modulation clock generator 100, due to the fast propagation speed of light, fast clock synchronization can be achieved, and the clock signal transmission delay and the delay deviation of different clock signal transmission paths can be shortened, without having a significant impact on the overall size of the integrated circuit.
[0044] In other embodiments, the integrated circuit 10 may also use a technical solution combining the optical modulation clock generator 100 and a traditional clock circuit. For example, in an integrated circuit, a portion of relatively concentrated load circuits that require clock signals may use a traditional clock circuit. This is because the corresponding load circuits are relatively concentrated, so the delay of the clock signal generated by the traditional clock circuit can also be greatly shortened. For those load circuits that require clock signals but are relatively dispersed, the optical modulation clock generator 100 of the present application may be used, thereby shortening the delay of the clock signal required by the load circuits in the entire integrated circuit.
[0045] In another embodiment, the optical modulation clock generator 100 can also provide clock signals for two semiconductor chips 200 with the same input clock frequency at the same time. The two semiconductor chips 200 can work independently or cooperate with each other to form a functional module or system. Figure 6 and Figure 7Only an embodiment in which a semiconductor chip 200 is arranged on one side of the optical waveguide plate 120 is shown. Semiconductor chips 200 can also be arranged on both the upper and lower sides of the optical waveguide plate 120, that is, the optical waveguide plate 120 is located between two semiconductor chips 200 that are arranged oppositely. In the case of the opposite arrangement, the positions of the photoelectric conversion modules 130 in the two semiconductor chips 200 may correspond to each other or may not correspond to each other. By simply setting waveguide windows at corresponding positions of the upper and lower surfaces of the optical waveguide plate 120 corresponding to the photoelectric conversion modules 130 in the two semiconductor chips 200, clock sharing of the two semiconductor chips 200 can be achieved.
[0046] The utility model provides an optical modulation clock generator and an integrated circuit. The optical modulation clock generator includes an optical clock source and an optical waveguide plate. The waveguide core of the optical waveguide plate adopts a whole chip type, and a waveguide window is provided in the area corresponding to the photoelectric conversion module in the semiconductor chip, so that the optical signal can be transmitted from the waveguide core to the photoelectric conversion module and converted into an electrical clock signal. Since the optical modulation clock generator utilizes the fast propagation speed of light, it can realize fast synchronization of the clock, shorten the transmission delay of the clock signal and the delay deviation of different clock signal transmission paths, and at the same time will not have a significant impact on the overall size of the integrated circuit.
[0047] Furthermore, in the optical modulation clock generator and integrated circuit provided by the utility model, the photoelectric conversion module uses a silicon-based photoelectric sensor or a photoelectric two-dimensional modulated field emission device as a photoelectric switch, which has the characteristics of fast switch response speed and can further shorten the clock signal transmission delay. In addition, in all places where clock signals are required in the integrated circuit, the clock signals can be obtained entirely through the optical modulation clock generator, or partially through the optical modulation clock generator and partially through the traditional clock tree, so as to improve the applicability and flexibility of the integrated circuit design.
[0048] The embodiments of the present invention are described above, and these embodiments do not describe all the details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and the modifications based on the present invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims
1. An optical modulation clock generator, comprising: An optical clock source and an optical waveguide plate, wherein the optical waveguide plate comprises: A waveguide core and a reflective layer, wherein the reflective layer covers the waveguide core, and the optical signal generated by the optical clock source is transmitted in the waveguide core; A plurality of waveguide windows are located in the reflective layer, wherein the reflective layer is absent at the waveguide windows and the surface of the waveguide core is exposed, and the optical signal transmitted in the waveguide core is transmitted from the waveguide windows to the outside of the waveguide core.
2. The optical modulation clock generator according to claim 1, characterized in that: The optical waveguide plate further includes: an optical signal inlet located at the edge of the waveguide core, the optical signal inlet having no reflective layer and exposing the surface of the waveguide core, and the optical signal generated by the optical clock source enters the waveguide core from the optical signal inlet.
3. The optical modulation clock generator according to claim 2, characterized in that: A plurality of the waveguide windows are located on at least one surface of the waveguide core.
4. An integrated circuit comprising: An optical modulation clock generator as claimed in any one of claims 1 to 3; The semiconductor chip is located on at least one side of the optical waveguide plate and includes a plurality of photoelectric conversion modules and a plurality of load circuit modules. The position of the photoelectric conversion module in the semiconductor chip corresponds to the position of the waveguide window, so that the photoelectric conversion module receives the optical signal transmitted from the waveguide window and converts it into a clock signal, and the load circuit module receives the clock signal.
5. The integrated circuit according to claim 4, characterized in that Adjacent to the load circuit module, at least one of the photoelectric conversion modules is included.
6. The integrated circuit according to claim 4, characterized in that The semiconductor chip further comprises: a metal wiring layer and an insulating dielectric layer, and the insulating dielectric layer is made of a light-transmitting material.
7. The integrated circuit according to claim 6, characterized in that The metal wiring layer includes multiple layers, and the metal wiring layer and the insulating medium layer are alternately arranged; the multiple metal wiring layers not only have the function of electrically connecting the modules on the semiconductor chip, but also have the function of shielding light, and the multiple metal wiring layers complement each other to shield the area outside the waveguide window between the optical waveguide plate and the semiconductor chip, so that the optical signal from the optical waveguide plate cannot pass through the area and reach the semiconductor chip; There is no metal wiring in the area of the metal wiring layer corresponding to the waveguide window to avoid blocking the optical signal.
8. The integrated circuit according to claim 4, characterized in that The semiconductor chips include two, the two semiconductor chips are arranged opposite to each other and the optical waveguide plate is located between the two semiconductor chips.
9. The integrated circuit according to claim 8, characterized in that The two semiconductor chips work independently or in cooperation with each other.
10. The integrated circuit according to claim 9, characterized in that The positions of the photoelectric conversion modules in the two semiconductor chips correspond or do not correspond.
11. The integrated circuit according to claim 4, characterized in that The photoelectric conversion module comprises: A photoelectric switch, which turns on after receiving the light signal and turns off after the light signal is gone; A resistor connected in series with the photoelectric switch to generate an initial clock signal when the photoelectric switch is periodically turned on or off; The clock signal driving unit is connected to the photoelectric switch and the resistor, and shapes and filters the initial clock signal to obtain a usable clock signal.
12. The integrated circuit according to claim 11, characterized in that The photoelectric switch includes a photoelectric two-dimensional modulation field emission device.