Inverter and energy storage device
By using thermally conductive insulating glue to fix the inductor module in the box of the inverter and using the radiation to dissipate heat on the surface of the box, the problem of temperature rise of the inductor module is solved, and the electrical performance and heat dissipation efficiency of the inductor module are improved.
Patent Information
- Application Number
- CN202323578501.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2033-12-26
AI Technical Summary
The heat dissipation method of the inductor module in existing inverters cannot effectively reduce the temperature rise, resulting in the inability to guarantee electrical performance.
By using thermally conductive insulating glue to fix the inductor module in the box, the heat of the inductor module is transferred to the box through the thermally conductive insulating glue, and the temperature rise of the inductor module is reduced by radiating heat dissipation on the surface of the box.
It effectively reduces the temperature rise of the inductor module, improves the current load and electrical performance of the inductor module, and improves the heat dissipation efficiency by increasing the heat dissipation area.
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Figure CN222602830U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of energy storage technology, and in particular, to an inverter and an energy storage device. Background Art
[0002] In the related art, each inductor in the inductor module of the inverter is installed in an aluminum metal shell, and the heat is dissipated by blowing air from a radiator and a fan arranged on the outside of the inductor shell. However, this heat dissipation method still cannot solve the problem of temperature rise of the inductor module well, resulting in the electrical performance of the inductor module cannot be guaranteed. Utility Model Content
[0003] An object of the present disclosure is to provide an inverter and an energy storage device to at least partially solve the problems existing in the related art.
[0004] In order to achieve the above-mentioned object, the present disclosure provides an inverter, including an inductor module and a box accommodating the inductor module, the box including a first cavity, and the inductor module is fixed in the first cavity by a heat-conductive insulating adhesive.
[0005] Optionally, the inductor module is potted in the first cavity by means of a thermally conductive insulating adhesive, and at least a portion of the inductor module is immersed in the thermally conductive insulating adhesive.
[0006] Optionally, the side wall of the box body is used to form a partial cavity wall of the first cavity.
[0007] Optionally, the thermally conductive insulating adhesive fills the first cavity, the inductor module is sealed in the thermally conductive insulating adhesive, and lead wires of the inductor module are led out from a cured surface of the thermally conductive insulating adhesive.
[0008] Optionally, the box body is a die-cast box body.
[0009] Optionally, the wall thickness of the box body is 3-4 mm.
[0010] Optionally, the inverter includes a heat dissipation module, the box includes a second cavity, and the heat dissipation module is embedded in the second cavity.
[0011] Optionally, a surface of the heat dissipation module is arranged in contact with a cavity wall of the second cavity.
[0012] Optionally, the box has a first surface and a second surface that are opposite to each other, the opening of the first cavity faces the first surface, and the opening of the second cavity faces the second surface.
[0013] Optionally, an air duct connected to the heat dissipation module is formed in the box, the heat dissipation module has an air inlet connected to the outside of the box, and the air duct has an air outlet connected to the outside of the box.
[0014] Optionally, the air outlet and the inductor module are arranged in the box at an interval.
[0015] Optionally, the air inlet leads to a first side of the box body, and the air outlet leads to a second side of the box body, and the second side is adjacent to the first side.
[0016] Optionally, the air inlet and the air outlet are both covered with protective covers, and the protective covers are both provided with openings.
[0017] Optionally, the inverter includes a cover body covering the heat dissipation module, and the cover body and the box body together form the air duct.
[0018] Optionally, the cover body and the heat dissipation module are spaced apart to form a part of the air duct.
[0019] Optionally, a partition is provided in the box to divide the box into a first area and a second area, the first area is provided with a battery management system, and the inductor module and the heat dissipation module are provided in the second area.
[0020] Optionally, the partition is made of heat insulating material.
[0021] Optionally, the heat dissipation module includes a radiator and a fan that are adjacently arranged, and the fan is arranged at an edge of the box.
[0022] Optionally, the heat sink is configured as a stretched aluminum heat sink.
[0023] Optionally, the inverter includes a power component, and the power component is arranged in close contact with the heat dissipation module.
[0024] Optionally, the power component is attached to the heat dissipation module via a heat conducting plate.
[0025] Optionally, the power components include IGBTs and MOS tubes.
[0026] Optionally, the IGBT, the MOS tube and the inductor module are spaced apart from each other.
[0027] According to a second aspect of an embodiment of the present disclosure, there is provided an energy storage device, comprising the inverter provided by the present disclosure.
[0028] Through the above technical solution, the inductor module is fixed in the box by thermally conductive insulating glue, so that the heat of the inductor module can be transferred to the box through the thermally conductive insulating glue, so that the box itself acts as a heat sink for the inductor module, thereby reducing the temperature rise of the inductor module through radiation heat dissipation on the surface of the box, and improving the current load and electrical performance of the inductor module. When the box needs to be installed with other components and is set larger, the heat dissipation area can also be increased to improve the heat dissipation efficiency of the inductor module. In addition, the thermally conductive insulating glue combined with the insulating member set on the inductor module can achieve double insulation of the inductor module.
[0029] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:
[0031] Figure 1 is an exploded schematic diagram of an inverter provided by an exemplary embodiment of the present disclosure.
[0032] Figure 2 1 is a front perspective schematic diagram of an inverter provided by an exemplary embodiment of the present disclosure.
[0033] Figure 3 1 is a front plan view of an inverter provided by an exemplary embodiment of the present disclosure.
[0034] Figure 4 An exemplary embodiment of the present disclosure provides Figure 3 Cross-sectional view along AA in .
[0035] Figure 5 1 is a schematic back plan view of an inverter provided by an exemplary embodiment of the present disclosure with a cover omitted.
[0036] Figure 6 is a side schematic diagram of an inverter provided by an exemplary embodiment of the present disclosure.
[0037] Description of Reference Numerals
[0038] 100-box, 101-first cavity, 102-second cavity, 103-air duct, 104-air inlet, 105-air outlet, 106-opening, 110-first area, 120-second area, 10-inductor module, 20-heat dissipation module, 21-radiator, 22-fan, 30-protective cover, 40-cover, 50-partition, 60-power component, 61-power board, 62-MOS tube, 63-IGBT, 70-heat conduction plate. DETAILED DESCRIPTION
[0039] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.
[0040] In the present disclosure, unless otherwise stated, the directional words used, such as "inside" and "outside", are based on the contours of the corresponding parts. The terms "first" and "second" used in the present disclosure are to distinguish one element from another and do not have order or importance. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.
[0041] Reference Figure 1 and Figure 2 The embodiment of the present disclosure provides an inverter, which includes an inductor module 10 and a box 100 for accommodating the inductor module 10. The inductor module 10 may include multiple inductors, for example, four or eight. The box 100 includes a first cavity 101. The inductor module 10 is fixed in the first cavity 101 by a thermally conductive insulating adhesive. For example, the inductor module 10 may be fixed by potting the insulating adhesive. There may be many gaps between the inductor module 10 and the first cavity 101 to provide a potting space for the thermally conductive insulating adhesive. The first cavity 101 may be a partial area of the box 100. In addition to the inductor module 10, other electrical components may be installed in the box 100. Alternatively, the entire box 100 may be constructed as the first cavity 101, and only the inductor module 10 is installed in the box 100. In the embodiment of the present disclosure, the first cavity 101 is taken as a partial area of the box 100 for illustration, and the box 100 may also be installed with a heat dissipation module, a battery management system, and a power component as described below. The thermal conductive insulating adhesive may be an epoxy series thermal conductive insulating adhesive or a silicone series thermal conductive insulating adhesive.
[0042] Through the above technical solution, the inductor module 10 is fixed in the box 100 by the thermally conductive insulating adhesive, so that the heat of the inductor module can be transferred to the box 100 through the thermally conductive insulating adhesive, so that the box 100 itself acts as a heat sink for the inductor module 10, so that the temperature rise of the inductor module 10 can be reduced by radiating heat from the surface of the box 100, and the current load and electrical performance of the inductor module 10 can be improved. When the box 100 needs to be installed with other components and is set larger, the heat dissipation area can be increased to improve the heat dissipation efficiency of the inductor module 10. In addition, the thermally conductive insulating adhesive combined with the insulating member set on the inductor module 10 can achieve double insulation of the inductor module 10.
[0043] In one embodiment, referring to Figure 2As shown, the side wall of the box 100 can constitute part of the wall of the first cavity 101, so that the heat of the inductor module 10 can be directly transferred to the side wall of the box 100 through the thermally conductive insulating glue, thereby quickly cooling the inductor module 10 and improving the cooling effect. Figure 2 In the illustrated embodiment, taking the direction of the drawing as an example, a portion of the left side wall of the box 100 and a portion of the upper side wall of the box 100 enclose the two side walls of the first cavity 101, so as to directly transfer the heat to the outside as much as possible for heat dissipation. In addition, by configuring the side wall of the box 100 as a portion of the cavity wall of the first cavity 101, the first cavity 101 can also be located at the edge of the box 100, so that the inductor module 10 is installed at the edge of the box 100, so as to facilitate wiring of the inductor module 10.
[0044] In the disclosed embodiment, the inductor module 10 can be potted in the first cavity 101 by thermally conductive insulating glue, and the potting method can improve external resistance and ensure the installation stability of the inductor module 10. The inductor module 10 can be at least partially immersed in the thermally conductive insulating glue to ensure its fixing reliability.
[0045] In the disclosed embodiment, the thermally conductive insulating glue can be filled in the first cavity 101, and the inductor module 10 is sealed in the thermally conductive insulating glue, that is, the thermally conductive insulating glue can be seen on the solidified surface after the thermally conductive insulating glue is potted, but the inductor module 10 cannot be seen, and the lead wires of the inductor module 10 can be led out from the solidified surface of the thermally conductive insulating glue for easy connection. Through this completely filled potting method, on the one hand, the installation of the inductor module 10 can be made more stable, and on the other hand, the inductor module 10 can be fully surrounded, so that its heat conduction can be realized in all directions, so as to improve the heat dissipation effect and ensure the electrical performance of the inductor module 10.
[0046] The housing 100 in the embodiment of the present disclosure may be a die-cast housing. The die-cast housing can be configured to accommodate multiple components at the same time, eliminating the need for a housing for each inductor module 10, and having a larger area. When the inductor module 10 dissipates heat through the housing 100, the heat dissipation area can be increased, thereby improving the heat dissipation effect.
[0047] The wall thickness of the box body 100 may be 3-4 mm, for example, 3 mm, 3.5 mm or 4 mm. The wall thickness of the box body within this range can ensure the strength of the box body 100 while having a good heat dissipation effect.
[0048] like Figure 1As shown, the inverter may further include a heat dissipation module 20, which dissipates heat through the box 100 itself and also dissipates heat from the inductor module 10 through the heat dissipation module 20, thereby improving the heat dissipation efficiency. The box 100 may include a second cavity 102, and the heat dissipation module 20 may be embedded in the second cavity 102. Installing the heat dissipation module 20 in the second cavity 102 formed on the box 100 may improve the integration of the inverter.
[0049] Among them, the surface of the heat dissipation module 20 can be set in contact with the cavity wall of the second cavity 102, that is, the heat dissipation module 20 can maintain contact with the box body 100 to expand the heat dissipation area through the box body 100 and enhance the heat dissipation performance. While meeting the same heat dissipation requirements, this method in the embodiment of the present disclosure can reduce the volume of the heat dissipation module 20 and reduce the structural cost compared with the prior art.
[0050] Among them, combined Figures 1 to 5 , the housing 100 has an opposite first surface ( Figure 6 The left side of the second surface ( Figure 6 The opening of the first cavity 101 may face the first surface, and the opening of the second cavity 102 may face the second surface, that is, the first cavity 101 and the second cavity 102 may be formed on opposite sides of the case 100, so that the heat dissipation module 20 is separated from the inductor module 10, thereby preventing the heat from affecting the inductor module 10. For example, the first cavity 101 may be formed on the front side of the case 100 (that is, Figure 4 In order to facilitate the wiring of the inductor module 10, the second cavity 102 can be formed on the back side of the box body 100 (i.e. Figure 4 The first cavity 101 and the second cavity 102 may be arranged in a staggered manner, for example, Figure 4 In the direction of the drawing shown, the first cavity 101 and the second cavity 102 are staggered to the left and right to minimize the thickness of the inverter ( Figure 4 Dimensions in the upper and lower directions of the drawing).
[0051] In the present disclosure, Figure 1 and Figure 5 As shown, an air duct 103 connected to the heat dissipation module 20 may be formed in the box 100, the heat dissipation module 20 has an air inlet 104 connected to the outside of the box 100, and the air duct 103 has an air outlet 105 connected to the outside of the box 100. When the heat dissipation module 20 is working, the heat dissipation module 20 introduces external wind from the air inlet 104, cools the heat of the box 100 absorbed by the heat dissipation module 20 through the wind, and then passes through the air duct 103 and discharges the heat-absorbing wind from the air outlet 105. The air duct 103 is formed in the box 100, does not affect the external structure of the inverter, and makes the overall structure neat and beautiful.
[0052] The air outlet 105 and the inductor module 10 can be spaced apart in the housing 100 so that the air outlet 105 and the inductor module 10 can be far away from each other. For example, the air outlet 105 and the inductor module 10 can be arranged on different sides of the housing 100, such as on the opposite side or the adjacent side, so as to prevent the high-temperature airflow at the air outlet 105 from affecting the inductor module 10 and causing the performance of the inductor module 10 to deteriorate. Figure 3 and Figure 5 ,exist Figure 3 In the front view shown in FIG. 1 , the air outlet 105 and the inductor module 10 are arranged on opposite sides of the box body 100 , and the inductor module 10 is arranged on the left side. Figure 5 In the rear view shown, the air outlet 105 is arranged on the left side (i.e. corresponding to Figure 3 In other embodiments, the air outlet 105 and the inductor module 10 may be arranged on the same side, and the air outlet 105 may be arranged at an end of the box 100 away from the inductor module 10, or the air outlet 105 and the inductor module 10 may be arranged on adjacent sides, and the air outlet 105 may be arranged on an end of the box 100 away from the inductor module 10.
[0053] In order to ensure that the air inlet 104 and the air outlet 105 have a certain distance to increase the heat dissipation path, in the embodiment of the present disclosure, Figure 5 , the air inlet 104 can lead to the first side of the box 100, and the air outlet 105 can lead to the second side of the box 100, and the second side is adjacent to the first side. In this way, the air guide path can be constructed as a curved path, so that the heat dissipation path can be extended as much as possible, the heat dissipation time can be prolonged, and the heat dissipation effect can be ensured. Among them, the air inlet 104 can be set as close to the inductor module 10 as possible to ensure that the path length between the air inlet 104 and the air outlet 105 as far away from the inductor module 10 as possible is the longest.
[0054] In the present disclosure, refer to Figure 1 and Figure 5, the air inlet 104 can be covered with a protective cover 30 to prevent unnecessary impurities from entering the heat dissipation module 20 and affecting the heat dissipation effect or damaging the heat dissipation module 20. The air outlet 105 can also be covered with a protective cover 30 to prevent the air outlet 105 from leaking out. The protective covers 30 at the air inlet 104 and the air outlet 105 can be formed by the side walls of the box 100 itself, so that the air inlet 104 and the air outlet 105 can be integrated into the structure of the box 100 without protruding, making the overall structure neat and beautiful, and can play a role in protecting the air inlet 104 and the air outlet 105. Among them, the protective covers 30 can be provided with openings 106 so as not to affect the passage of airflow. The openings 106 can be set small and dense to block external impurities and provide sufficient airflow space.
[0055] Reference Figure 1 and Figure 4 The inverter may include a cover 40 covering the heat dissipation module 20 to protect the heat dissipation module 20, and the cover 40 and the box 100 may form an air duct 103. The arrangement of the cover 40 can simultaneously protect the heat dissipation module 20 and form the air duct 103, thereby realizing the diversification of the use of components, saving the number of components, and thus saving manufacturing costs.
[0056] The cover 40 may be spaced apart from the heat dissipation module 20 to form a portion of the air duct 103. Specifically, the heat dissipation surface of the heat dissipation module 20 may be spaced apart from the cover 40 so that airflow can pass through the surface of the heat dissipation module 20 to cool the temperature. Another portion of the air duct 103 may be formed by the space between the cover 40 and the housing 100 to guide airflow from the heat dissipation module 20 to the outside of the housing 100.
[0057] When a variety of components can be arranged in the box 100, the area of the box 100 can be divided to make its layout regular and distinguishable. Figure 2 , a partition 50 may be provided in the box 100 to divide the box 100 into a first area 110 and a second area 120, and different functional components may be provided in the first area 110 and the second area 120. In practical applications, multiple partitions may be provided to divide multiple areas according to needs, which are not listed here one by one. According to an embodiment of the present disclosure, a battery management system may be provided in the first area 110, and the above-mentioned inductor module 10 and heat dissipation module 20 are provided in the second area 120.
[0058] The partition 50 may be made of a heat-insulating material, thereby avoiding thermal interference between the first area 110 and the second area 120 , improving the overall cooling effect of the inverter, and further helping to improve the working efficiency of the inverter.
[0059] In the disclosed embodiment, the heat dissipation module 20 may include a radiator 21 and a fan 22 that are adjacent to each other. The fan 22 may be disposed at the edge of the housing 100 to facilitate the introduction of external airflow, and the heat of the radiator 21 and the housing 100 may be taken away by forced air convection of the fan 22.
[0060] Specifically, the heat sink 21 can be configured as a stretched aluminum heat sink, which has good heat dissipation performance and low weight. In other embodiments, the heat sink 21 can also be configured as a die-cast aluminum heat sink.
[0061] Reference Figure 1 The inverter may further include a power component 60, which may be fitted on the heat dissipation module 20 so that the heat generated by the power component 60 may be conducted to the heat dissipation module 20 for heat dissipation and cooling, so that the power component 60 maintains good working performance.
[0062] Furthermore, the power component 60 can be attached to the heat dissipation module 20 through a heat conducting plate 70. The heat conducting plate 70 can be a copper plate. The heat of the power component 60 can be more easily transferred to the heat dissipation module 20 or the box 100 through the heat conducting plate 70, thereby improving the heat dissipation efficiency of the power component 60.
[0063] In the disclosed embodiment, the power component 60 may include an IGBT 63 (Insulate Gate Bipolar Transistor) and / or a MOS (Metal-Oxide-Semiconductor) tube 62. The IGBT 63 and the MOS tube 62 may be mounted on a power board 61, and the above-mentioned heat conducting plate 70 may be disposed on the side of them facing away from the power board 61.
[0064] The IGBT 63 , the MOS tube 62 and the inductor module 10 may be spaced apart from each other, thereby preventing the heat generated by the three from being too concentrated and causing low heat dissipation efficiency.
[0065] According to a second aspect of an embodiment of the present disclosure, there is provided an energy storage device, which includes the above-mentioned inverter and has all the beneficial effects of the above-mentioned inverter, which will not be described in detail here.
[0066] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.
[0067] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.
[0068] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.
Claims
1. An inverter, characterized in that: It comprises an inductor module and a box for accommodating the inductor module, wherein the box comprises a first cavity, the inductor module is fixed in the first cavity by means of heat-conducting insulating adhesive, and the side wall of the box is used to constitute a part of the cavity wall of the first cavity.
2. The inverter according to claim 1, characterized in that: The inductor module is potted in the first cavity by means of a thermally conductive insulating adhesive, and at least a portion of the inductor module is immersed in the thermally conductive insulating adhesive.
3. The inverter according to claim 1, characterized in that: The thermally conductive insulating adhesive fills the first cavity, the inductor module is sealed in the thermally conductive insulating adhesive, and the lead wires of the inductor module are led out from the solidified surface of the thermally conductive insulating adhesive.
4. The inverter according to claim 1, characterized in that: The box body is a die-casting box body.
5. The inverter according to claim 1, characterized in that: The wall thickness of the box body is 3-4 mm.
6. The inverter according to claim 1, characterized in that: The inverter includes a heat dissipation module, the box includes a second cavity, and the heat dissipation module is embedded in the second cavity.
7. The inverter according to claim 6, characterized in that: The surface of the heat dissipation module is arranged in contact with the cavity wall of the second cavity.
8. The inverter according to claim 6, characterized in that: The box body has a first surface and a second surface opposite to each other. The opening of the first cavity faces the first surface, and the opening of the second cavity faces the second surface.
9. The inverter according to claim 6, characterized in that: An air duct connected to the heat dissipation module is formed in the box body, the heat dissipation module has an air inlet connected to the outside of the box body, and the air duct has an air outlet connected to the outside of the box body.
10. The inverter according to claim 9, characterized in that: The air outlet and the inductor module are arranged in the box body at intervals.
11. The inverter according to claim 9, characterized in that: The air inlet leads to a first side of the box body, and the air outlet leads to a second side of the box body, and the second side is adjacent to the first side.
12. The inverter according to claim 9, characterized in that: At least one of the air inlet and the air outlet is covered with a protective cover, and the protective cover is provided with openings.
13. The inverter according to claim 9, characterized in that: The inverter includes a cover body covering the heat dissipation module, and the cover body and the box body together form the air duct.
14. The inverter according to claim 13, characterized in that: The cover body is spaced apart from the heat dissipation module to form a part of the air duct.
15. The inverter according to any one of claims 6 to 14, characterized in that: A partition is arranged in the box body to divide the box body into a first area and a second area. The first area is provided with a battery management system, and the inductor module and the heat dissipation module are arranged in the second area.
16. The inverter according to claim 15, characterized in that: The partition is made of heat insulating material.
17. The inverter according to claim 6, characterized in that: The heat dissipation module includes a radiator and a fan which are arranged adjacent to each other, and the fan is arranged at the edge of the box.
18. The inverter according to claim 17, characterized in that: The heat sink is configured as a stretched aluminum heat sink.
19. The inverter according to claim 6, characterized in that: The inverter includes a power component, and the power component is arranged in close contact with the heat dissipation module.
20. The inverter according to claim 19, characterized in that: The power component is attached to the heat dissipation module via a heat conducting plate.
21. The inverter according to claim 19, characterized in that: The power components include IGBT and MOS tube.
22. The inverter according to claim 21, characterized in that: The IGBT, the MOS tube and the inductor module are arranged at intervals.
23. An energy storage device, characterized in that: Comprising the inverter according to any one of claims 1-22.