LED lamp bead, LED display module and LED display screen

Abstract

The utility model provides an LED lamp bead, an LED display module and an LED display screen, which are characterized in that m rows and n columns of pixel units are arranged on a first substrate, m and n are greater than or equal to 1, m * n is not equal to 1, and each pixel unit is provided with three LED chips with different light colors arranged along a first direction; the first substrate is further provided with a packaging adhesive layer, the packaging adhesive layer covers the LED chip, the packaging adhesive layer between two adjacent columns of pixel units extending in the first direction and / or between two adjacent rows of pixel units extending in the second direction is provided with paddle groups, the paddle groups can isolate the adjacent pixel units, and therefore the lateral light emitting effect of the pixel units is improved; moreover, each paddle-tumbler group comprises at least two paddle-tumblers extending along the corresponding direction, and the packaging adhesive layer between the adjacent paddle-tumblers can isolate the adjacent pixel units, so that the light-emitting interference between the adjacent pixel units is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED display screens, and in particular to an LED lamp bead, an LED display module and an LED display screen. Background Art

[0002] LED lamp beads are currently often packaged in an integrated form, that is, an all-in-one packaging method. The advantage of all-in-one packaging is that the lamp beads have a good anti-collision effect, because the number of pads on the bottom of the all-in-one LED lamp beads is more than that of a single lamp bead, which can provide greater thrust after reflow soldering with the PCB circuit board, reducing the phenomenon that the LED lamp beads are easily knocked off when assembling the LED display, reducing a lot of maintenance work and reducing the scrap rate of LED display modules, solving the troubles of LED display manufacturers. At the same time, if the all-in-one packaging structure adopts a chip-type structure with molded sealing glue, the surface flatness of the chip-type lamp beads is better and the display effect is also more outstanding.

[0003] However, the lateral light output effect of each pixel of the current all-in-one LED lamp beads is poor, and there is also light output interference between adjacent pixels. Utility Model Content

[0004] The utility model aims to provide an LED lamp bead, an LED display module and an LED display screen to solve the problems of poor lateral light emission effect of existing all-in-one LED lamp beads.

[0005] In order to achieve the above-mentioned object, the utility model provides an LED lamp bead, comprising a first substrate and m rows and n columns of pixel units located on the first substrate, m and n are greater than or equal to 1, and m*n is not equal to 1, wherein the direction of each column is a first direction, the direction of each row is a second direction, and the first direction is perpendicular to the second direction, and each of the pixel units has three LED chips of different light colors arranged along the first direction; and,

[0006] The first substrate has a packaging glue layer, which covers the LED chip. When m=1, the packaging glue layer between two adjacent pixel units in the second direction has a groove group. When n=1, the packaging glue layer between two adjacent pixel units in the first direction has a groove group. When m≠1 and n≠1, the packaging glue layer between two adjacent columns of pixel units extending along the first direction and between two adjacent rows of pixel units extending along the second direction has a groove group, and each groove group includes at least two grooves extending along the corresponding direction.

[0007] Optionally, the pixel unit comprises a first side and a second side extending along the first direction, and the distance between each LED chip of the pixel unit and the first side is equal to the distance between each LED chip and the second side.

[0008] Optionally, the groove extends from the top surface of the packaging glue layer to the inside of the packaging glue layer; or, the groove penetrates the packaging glue layer and exposes the first substrate.

[0009] Optionally, the width of the groove perpendicular to its extension direction is less than 0.3 mm.

[0010] Optionally, the packaging glue layer between adjacent grooves is a non-luminous area.

[0011] Optionally, the non-luminous area constitutes an isolation area to isolate adjacent pixel units.

[0012] Optionally, the three LED chips in the pixel unit are respectively a red LED chip, a blue LED chip and a green LED chip.

[0013] The utility model also provides an LED display module, comprising a second substrate and an LED lamp bead located on the second substrate, wherein the LED lamp bead comprises a first substrate and m rows and n columns of pixel units located on the first substrate, m and n are greater than or equal to 1, and m*n is not equal to 1, wherein the direction of each column is a first direction, the direction of each row is a second direction, and the first direction is perpendicular to the second direction, and each of the pixel units has three LED chips of different light colors arranged along the first direction; and,

[0014] The first substrate has a packaging glue layer, which covers the LED chip. When m=1, the packaging glue layer between two adjacent pixel units in the second direction has a groove group. When n=1, the packaging glue layer between two adjacent pixel units in the first direction has a groove group. When m≠1 and n≠1, the packaging glue layer between two adjacent columns of pixel units extending along the first direction and between two adjacent rows of pixel units extending along the second direction has a groove group, and each groove group includes at least two grooves extending along the corresponding direction.

[0015] Optionally, the pixel unit comprises a first side and a second side extending along the first direction, and the distance between each LED chip of the pixel unit and the first side is equal to the distance between each LED chip and the second side.

[0016] Optionally, the groove extends from the top surface of the packaging glue layer to the inside of the packaging glue layer; or, the groove penetrates the packaging glue layer and exposes the first substrate.

[0017] Optionally, the width of the groove perpendicular to its extension direction is less than 0.3 mm.

[0018] Optionally, the packaging glue layer between adjacent grooves is a non-luminous area.

[0019] Optionally, the non-luminous area constitutes an isolation area to isolate adjacent pixel units.

[0020] Optionally, the three LED chips in the pixel unit are respectively a red LED chip, a blue LED chip and a green LED chip.

[0021] The utility model also provides an LED display module, comprising a third substrate and m rows and n columns of pixel units located on the third substrate, m and n are greater than or equal to 1, and m*n is not equal to 1, wherein the direction of each column is a first direction, the direction of each row is a second direction, and the first direction is perpendicular to the second direction, and each of the pixel units has three LED chips of different light colors arranged along the first direction;

[0022] The third substrate has a packaging glue layer, which covers the LED chip. When m=1, the packaging glue layer between two adjacent pixel units in the second direction has a groove group. When n=1, the packaging glue layer between two adjacent pixel units in the first direction has a groove group. When m≠1 and n≠1, the packaging glue layer between two adjacent columns of pixel units extending along the first direction and between two adjacent rows of pixel units extending along the second direction has a groove group, and each groove group includes at least two grooves extending along the corresponding direction.

[0023] Optionally, the pixel unit comprises a first side and a second side extending along the first direction, and the distance between each LED chip of the pixel unit and the first side is equal to the distance between each LED chip and the second side.

[0024] Optionally, the groove extends from the top surface of the packaging glue layer to the inside of the packaging glue layer; or, the groove penetrates the packaging glue layer and exposes the third substrate.

[0025] Optionally, the width of the groove perpendicular to its extension direction is less than 0.3 mm.

[0026] Optionally, the packaging glue layer between adjacent grooves is a non-luminous area.

[0027] Optionally, the non-luminous area constitutes an isolation area to isolate adjacent pixel units.

[0028] Optionally, the three LED chips in the pixel unit are respectively a red LED chip, a blue LED chip and a green LED chip.

[0029] Optionally, all the LED chips are directly formed on the third substrate, and the packaging adhesive layer covers the third substrate and the LED chips.

[0030] The utility model also provides an LED display screen, comprising the LED display module.

[0031] In the LED lamp beads, LED display modules and LED display screens provided by the utility model, there are m rows and n columns of pixel units arranged on the first substrate, m and n are greater than or equal to 1, and m*n is not equal to 1, and each of the pixel units has three LED chips of different light colors arranged along the first direction; the first substrate also has a packaging glue layer, the packaging glue layer covers the LED chip, and the packaging glue layer between the two adjacent columns of pixel units extending along the first direction and / or between the two adjacent rows of pixel units extending along the second direction has a groove group, the groove group can isolate the adjacent pixel units, thereby improving the lateral light emission effect of the pixel units; and each of the groove groups includes at least two grooves extending along the corresponding direction, and the packaging glue layer between the adjacent grooves can isolate the adjacent pixel units, thereby reducing the light emission interference between the adjacent pixel units. In addition, while ensuring that the distance between the LED chip and the left and right light-emitting surfaces of the pixel unit is the same, the product appearance size of the utility model can be smaller, the selection is more, and the product is richer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the structure of the LED lamp bead provided in the first embodiment of the utility model;

[0033] Figure 2 This is a schematic diagram of the appearance of the LED lamp bead provided in the first embodiment of the utility model;

[0034] Figure 3 A schematic diagram of the structure of an LED display module provided in Embodiment 1 of the present utility model;

[0035] Figure 4 A schematic diagram of the structure of an LED lamp bead provided in the second embodiment of the utility model;

[0036] Figure 5 This is a schematic diagram of the structure of the LED lamp bead provided in the third embodiment of the utility model;

[0037] Figure 6 A schematic diagram of the structure of an LED display module provided in Embodiment 4 of the present utility model;

[0038] Wherein, the accompanying drawings are marked as follows:

[0039] 10 - first substrate; 11 - pixel unit; 20 - packaging adhesive layer; 31 - first groove; 32 - second groove; 40 - second substrate; 50 - third substrate; x - first direction; y - second direction. DETAILED DESCRIPTION

[0040] The following will describe the specific implementation of the utility model in more detail with reference to the schematic diagram. The advantages and features of the utility model will become clearer according to the following description. It should be noted that the drawings are all in a very simplified form and are not in exact proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model.

[0041] Embodiment 1

[0042] Figure 1 This is a schematic diagram of the structure of the LED lamp bead provided in this embodiment. Figure 2 This is a schematic diagram of the appearance of the LED lamp beads provided in this embodiment. Figure 1 and Figure 2 As shown, the LED lamp bead includes a first substrate 10 and m rows and n columns of pixel units 11 located on the first substrate 10, m and n are greater than or equal to 1, and m*n is not equal to 1, wherein the direction of each column is a first direction x, the direction of each row is a second direction y, and the first direction x is perpendicular to the second direction y. In this embodiment, m and n=2, and the LED lamp bead is a four-in-one LED lamp bead, which includes four pixel units 11 arranged in two rows and two columns.

[0043] It should be noted that m and n are not limited to being equal to 2, m and n may also be greater than 2, and m and n may be the same or different. That is, each of the LED lamp beads is not limited to having only 4 pixel units 11, but may also have 2, 6, 8, 9, 16, etc. pixel units 11. In this case, the LED lamp beads may be two-in-one, six-in-one, eight-in-one, nine-in-one, or sixteen-in-one LED lamp beads, and examples are not given one by one here.

[0044] Further, each of the pixel units 11 includes three LED chips of different light colors arranged along the first direction x. In this embodiment, the three light colors are one of red R, green G, and blue B. That is, each of the pixel units 11 includes a red LED chip, a green LED chip, and a blue LED chip. The LED chip can be a flip-chip structure, a face-up structure, or a vertical structure, which is not limited by the present invention.

[0045] In this embodiment, the arrangement order of the LED chips of each pixel unit 11 along the first direction x is the first light color, the second light color, and the third light color. In this embodiment, the first light color is blue B, the second light color is green G, and the third light color is red R, but it should not be limited to this. Of course, the three light color LED chips in the four pixel units 11 in the utility model are not limited to the arrangement order of the first light color, the second light color, and the third light color. Figure 1 For example, the arrangement order of the three light color LED chips of each pixel unit 11 along the first direction x may also be green G, blue B, red R; or the arrangement order of the three light color LED chips of each pixel unit 11 along the first direction x may also be green G, red R, blue B.

[0046] Please continue reading Figure 1 and Figure 2 The first substrate 10 has a packaging glue layer 20 on it, and the packaging glue layer 20 covers the first substrate 10 and the LED chip. In this embodiment, the surface of the packaging glue layer 20 is flat.

[0047] Furthermore, the encapsulation glue layer 20 between two adjacent columns of the pixel units 11 extending along the first direction x and / or between two adjacent rows of the pixel units 11 extending along the second direction y has a groove group, and the groove group can isolate the adjacent pixel units 11, thereby improving the lateral light emission effect of the pixel units 11, and each of the groove groups includes at least two grooves extending along the corresponding direction. The encapsulation glue layer 20 between adjacent grooves is a non-luminous area, and this non-luminous area can constitute an isolation area to further isolate the adjacent pixel units 11, thereby reducing the light emission interference between the adjacent pixel units 11.

[0048] Specifically, in this embodiment, the encapsulation glue layer 20 between two adjacent columns of the pixel units 11 extending along the first direction x has a first groove group, and the first groove group has two first grooves 31 extending along the first direction x. The encapsulation glue layer 20 between two adjacent rows of the pixel units 11 extending along the second direction y has a second groove group, and the second groove group has two second grooves 32 extending along the second direction y. Figure 1 and Figure 2As can be seen, the two first grooves 31 and the two second grooves 32 form a tic-tac-toe structure to separate the four pixel units 11 from each other, and the lateral light from the two sides (not on the two sides at the edge of the LED lamp bead) of each pixel unit 11 can be emitted through the first groove 31 and the second groove 32, without passing through a longer section of the packaging glue layer 20, thereby improving the lateral light emission effect of each pixel unit 11, and the packaging glue layer 20 between the two first grooves 31 and the packaging glue layer 20 between the two second grooves 32 can both form an isolation area to further isolate the adjacent pixel units 11, thereby reducing the light emission interference between the adjacent pixel units 11.

[0049] It should be noted that each of the groove groups is not limited to having only two grooves, but may also have more than three grooves; and the number of the first grooves 31 in the first groove group and the number of the second grooves 32 in the second groove group may be the same or different.

[0050] like Figure 1 As shown, in this embodiment, the first groove 31 and the second groove 32 are only located in the packaging glue layer 20, that is, the first groove 31 and the second groove 32 extend from the top surface of the packaging glue layer 20 to the inside of the packaging glue layer 20, so as to avoid damage to the first substrate 10 when forming the first groove 31 and the second groove 32, and the packaging glue layer 20 can still protect the entire surface of the first substrate 10. In some embodiments, the first groove 31 and the second groove 32 can also penetrate the packaging glue layer 20 and expose the surface of the first substrate 10. In this case, it is necessary to avoid setting wiring in the area of ​​the first substrate 10 corresponding to the first groove 31 and the second groove 32 as much as possible to avoid exposing or damaging the wiring on the first substrate 10.

[0051] In this embodiment, the width of the first groove 31 along the second direction y is less than 0.3 mm, and the width of the second groove 32 along the first direction x is less than 0.3 mm. In this way, the preparation process of the first groove 31 and the second groove 32 is relatively simple (a single groove does not need to be repeatedly cut multiple times), and the first groove 31 and the second groove 32 are not easy to reflect light. Of course, the width of the first groove 31 along the second direction y can be greater than 0.1 mm, and the width of the second groove 32 along the first direction x can also be greater than 0.1 mm, so as to avoid the problem that the groove is too thin and easy to get stuck with foreign particles.

[0052] Furthermore, the pixel unit 11 includes a first side and a second side extending along the first direction x, see Figure 1, taking the pixel unit 11 in the first row and the first column as an example, the first side is the left side of the pixel unit 11, the second side is the right side of the pixel unit 11 (also the left groove wall of the first first groove 31), and the distance x1 between each LED chip of the pixel unit 11 and the first side is equal to the distance x2 between each LED chip and the second side. In this way, the light emitting distance between each LED chip of the pixel unit 11 and the left and right light emitting surfaces is consistent, which can have a better light emitting effect.

[0053] In this embodiment, while ensuring that the distance between the LED chip and the left and right light-emitting surfaces of the pixel unit 11 is the same, the product appearance size can be smaller, the selection is more, and the product is richer. For example, in the second direction y, assuming that it is necessary to design an LED lamp bead with a dot pitch Py equal to 2.0mm, considering the difficulty of preparation and reflection, the width of a single groove is less than 0.3mm. If the first groove group only includes one first groove 31 and the second groove group only includes one second groove 32, the appearance size of the LED lamp bead is greatly restricted (for example, in the second direction y, Ly=Py+2x1, x1=x2=(Py-w) / 2, w<0.3mm) must be satisfied; if w=0.24, x1=x2=0.88, then Ly=3.76. If the first groove group includes at least two of the first grooves 31, and the second groove group includes at least two of the second grooves 32, the external dimensions of the LED lamp bead are less restricted (for example, in the second direction y, only Ly=Py+2x1, w<0.3mm is required); if x1=x2=0.5, then Ly=3.0, if x1=x2=0.6, then Ly=3.2. It can be seen that providing at least two grooves in each groove group can reduce the design difficulty of the LED lamp bead, and the external dimensions of the LED lamp bead can be smaller, with more choices and richer products.

[0054] Furthermore, the LED lamp beads may be chip-type lamp beads, which is not limited in the present invention.

[0055] When preparing the LED lamp beads, the LED chips can be first fixed on the front of the first substrate 10 in a predetermined order and direction, and then the LED chips are electrically connected to the first substrate 10, wherein the LED chips in the upright structure are electrically connected to the first substrate 10 through two bonding wires, the LED chips in the vertical structure are electrically connected to the first substrate 10 through one bonding wire and the bottom conductive glue, and the LED chips in the flip-chip structure are electrically connected to the first substrate 10 through the bottom conductive glue. A packaging glue layer 20 is formed on the first substrate 10, and the first score groove 31 and the second score groove 32 are cut in the packaging glue layer 20. Finally, cutting is performed according to actual needs to separate the individual LED lamp beads.

[0056] It should be understood that when m=1, there is only one row of the pixel units 11, and at this time, the groove group is located in the packaging glue layer 20 between two adjacent pixel units 11 in the second direction y. Similarly, when n=1, there is only one column of the pixel units 11, and at this time, the groove group is located in the packaging glue layer 20 between two adjacent pixel units 11 in the first direction x.

[0057] Based on this, this embodiment also provides an LED display module. Figure 3 The schematic diagram of the structure of the LED display module provided in this embodiment is as follows: Figure 3 As shown, the LED display module includes a second substrate 40 and a plurality of LED lamp beads located on the second substrate 40 .

[0058] In this embodiment, the LED display module includes 4 Figure 1 and Figure 2 The LED lamp beads shown in the figure have four LED lamp beads distributed in an array along the first direction x and the second direction y on the second substrate 40. The LED lamp beads are installed on the second substrate 40. At this time, the size of a single lamp in the LED display module is larger, the lamp bead has a better anti-collision effect, and the production efficiency is also higher.

[0059] Of course, it should be noted that the LED display module is not limited to comprising 4 LED lamp beads, but may also comprise 2, 3 or more than 5 LED lamp beads, which will not be illustrated one by one here.

[0060] Furthermore, this embodiment also provides an LED display screen, including the LED display module.

[0061] Embodiment 2

[0062] Figure 4 This is a schematic diagram of the structure of the LED lamp beads provided in this embodiment. Figure 4As shown, the difference from the first embodiment is that in this embodiment, the first groove group has three first grooves 31 extending along the first direction x, and the second groove group has three second grooves 32 extending along the second direction y. Figure 4 It can be seen that the three first grooves 31 and the three second grooves 32 separate the four pixel units 11 from each other, and the lateral light from the two sides (not on the two sides at the edge of the LED lamp bead) of each pixel unit 11 can go out through the first grooves 31 and the second grooves 32 without passing through a longer section of the packaging glue layer 20, thereby improving the lateral light emission effect of each pixel unit 11, and the packaging glue layer 20 between the three first grooves 31 and the packaging glue layer 20 between the three second grooves 32 can form a plurality of isolation areas to further isolate adjacent pixel units 11, thereby reducing the light emission interference between adjacent pixel units 11.

[0063] Embodiment 3

[0064] Figure 5 This is a schematic diagram of the structure of the LED lamp beads provided in this embodiment. Figure 5 As shown, the difference from the first embodiment is that in this embodiment, m, n=3, the LED lamp bead is a nine-in-one LED lamp bead, which includes nine pixel units 11 arranged in three rows and three columns.

[0065] Embodiment 4

[0066] Figure 6 This is a schematic diagram of the structure of the LED display module provided in this embodiment. Figure 6 As shown, the difference from the first embodiment is that the LED display module in this embodiment is a COB module.

[0067] Specifically, the LED display module includes a third substrate 50 and m rows and n columns of pixel units 11 located on the third substrate 50, m and n are greater than or equal to 1, and m*n is not equal to 1, wherein the direction of each column is a first direction x, the direction of each row is a second direction y, and the first direction x is perpendicular to the second direction y. In this embodiment, m and n=3, and the LED display module includes nine pixel units 11 arranged in three rows and three columns.

[0068] It should be noted that m and n are not limited to being equal to 3, and m and n can also be greater than 3 or less than 3, and m and n can be the same or different. Each of the LED display modules is not limited to having nine pixel units 11, and can also have 2, 6, 8, 12, 16, etc. pixel units 11, and examples are not given one by one here.

[0069] Furthermore, each of the pixel units 11 includes three LED chips of different light colors arranged along the first direction x, and all of the LED chips are directly formed on the third substrate 50, and the encapsulation glue layer 20 covers the third substrate 50 and the LED chips to form the LED display module. In this embodiment, the three light colors are one of red R, green G, and blue B. That is, each of the pixel units 11 includes a red LED chip, a green LED chip, and a blue LED chip. The LED chip can be a flip-chip structure, a face-up structure, or a vertical structure, which is not limited by the utility model.

[0070] In this embodiment, the arrangement order of the LED chips of each pixel unit 11 along the first direction x is the first light color, the second light color, and the third light color. In this embodiment, the first light color is blue B, the second light color is green G, and the third light color is red R, but it should not be limited to this. Of course, the three light color LED chips in the four pixel units 11 in the utility model are not limited to the arrangement order of the first light color, the second light color, and the third light color. Figure 6 For example, the arrangement order of the three light color LED chips of each pixel unit 11 along the first direction x may also be green G, blue B, red R; or the arrangement order of the three light color LED chips of each pixel unit 11 along the first direction x may also be green G, red R, blue B.

[0071] Please continue reading Figure 6 The third substrate 50 has a packaging glue layer 20 on it, and the packaging glue layer 20 covers the third substrate 50 and the LED chip. In this embodiment, the surface of the packaging glue layer 20 is flat.

[0072] Furthermore, the encapsulation glue layer 20 between two adjacent columns of the pixel units 11 extending along the first direction x and / or between two adjacent rows of the pixel units 11 extending along the second direction y has a groove group, and the groove group can isolate the adjacent pixel units 11, thereby improving the lateral light emission effect of the pixel units 11, and each of the groove groups includes at least two grooves extending along the corresponding direction. The encapsulation glue layer 20 between adjacent grooves is a non-luminous area, and this non-luminous area can constitute an isolation area to further isolate the adjacent pixel units 11, thereby reducing the light emission interference between the adjacent pixel units 11.

[0073] Specifically, in this embodiment, the encapsulation glue layer 20 between two adjacent columns of the pixel units 11 extending along the first direction x has a first groove group, and the first groove group has two first grooves 31 extending along the first direction x. Similarly, the encapsulation glue layer 20 between two adjacent rows of the pixel units 11 extending along the second direction y has a second groove group, and the second groove group has two second grooves 32 extending along the second direction y.

[0074] It should be noted that each of the groove groups is not limited to having only two grooves, but may also have more than three grooves; and the number of the first grooves 31 in the first groove group and the number of the second grooves 32 in the second groove group may be the same or different.

[0075] like Figure 6 As shown, in this embodiment, the first groove 31 and the second groove 32 are only located in the packaging glue layer 20, that is, the first groove 31 and the second groove 32 extend from the top surface of the packaging glue layer 20 to the inside of the packaging glue layer 20, so as to avoid damage to the first substrate 10 when forming the first groove 31 and the second groove 32, and the packaging glue layer 20 can still protect the entire surface of the first substrate 10. In some embodiments, the first groove 31 and the second groove 32 can also penetrate the packaging glue layer 20 and expose the surface of the first substrate 10. In this case, it is necessary to avoid setting wiring in the area of ​​the first substrate 10 corresponding to the first groove 31 and the second groove 32 as much as possible to avoid exposing or damaging the wiring on the first substrate 10.

[0076] In this embodiment, the width of the first groove 31 along the second direction y is less than 0.3 mm, and the width of the second groove 32 along the first direction x is less than 0.3 mm. In this way, the preparation process of the first groove 31 and the second groove 32 is relatively simple (a single groove does not need to be repeatedly cut to form multiple times), and the first groove 31 and the second groove 32 are not easy to reflect light. Of course, the width of the first groove 31 along the second direction y can be greater than 0.1 mm, and the width of the second groove 32 along the first direction x can also be greater than 0.1 mm, so as to avoid the problem that the groove is too thin and easy to get stuck with foreign particles.

[0077] Furthermore, the pixel unit 11 includes a first side and a second side extending along the first direction x, see Figure 6Taking the pixel unit 11 in the first row and the first column as an example, the first side is the left side of the pixel unit 11, the second side is the right side of the pixel unit 11 (also the left groove wall of the first first groove 31), and the distance x1 between each LED chip of the pixel unit 11 and the first side is equal to the distance x2 between the second side. In this way, the light emitting distance between each LED chip of the pixel unit 11 and the left and right light emitting surfaces is consistent, which can have a better light emitting effect.

[0078] When preparing the LED display module, the LED chip can be first fixed on the front of the third substrate 50 in a predetermined order and direction, and then the LED chip is electrically connected to the third substrate 50, wherein the LED chip of the upright structure is electrically connected to the third substrate 50 through two bonding wires, the LED chip of the vertical structure is electrically connected to the first substrate 10 through one bonding wire and the bottom conductive glue, and the LED chip of the flip-chip structure is electrically connected to the third substrate 50 through the bottom conductive glue. A packaging glue layer 20 is formed on the third substrate 50, and the first score groove 31 and the second score groove 32 are cut in the packaging glue layer 20.

[0079] It should be understood that when m=1, there is only one row of the pixel units 11, and at this time, the groove group is located in the packaging glue layer 20 between two adjacent pixel units 11 in the second direction y. Similarly, when n=1, there is only one column of the pixel units 11, and at this time, the groove group is located in the packaging glue layer 20 between two adjacent pixel units 11 in the first direction x.

[0080] Furthermore, this embodiment also provides an LED display screen, including the LED display module.

[0081] In summary, in the LED lamp beads, LED display modules and LED display screens provided in the embodiments of the present invention, there are m rows and n columns of pixel units arranged on the first substrate, m and n are greater than or equal to 1, and m*n is not equal to 1, and each of the pixel units has three LED chips of different light colors arranged along the first direction; the first substrate also has a packaging glue layer, the packaging glue layer covers the LED chip, and the packaging glue layer between the two adjacent columns of pixel units extending along the first direction and / or between the two adjacent rows of pixel units extending along the second direction has a groove group, the groove group can isolate the adjacent pixel units, thereby improving the lateral light emission effect of the pixel units; and each of the groove groups includes at least two grooves extending in the corresponding direction, and the packaging glue layer between the adjacent grooves can further isolate the adjacent pixel units, thereby reducing the light emission interference between the adjacent pixel units. In addition, while ensuring that the distance between the LED chip and the left and right light-emitting surfaces of the pixel unit is the same, the product appearance size of the present invention can be smaller, the selection is more, and the product is richer.

[0082] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0083] It should also be noted that, although the present invention has been disclosed as a preferred embodiment, the above embodiment is not intended to limit the present invention. For any technician familiar with the art, without departing from the scope of the technical solution of the present invention, the above disclosed technical content can be used to make many possible changes and modifications to the technical solution of the present invention, or modified into equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

[0084] It should also be understood that, unless otherwise specified or indicated, the terms "first", "second", "third", etc. in the specification are merely used to distinguish between the various components, elements, steps, etc. in the specification, and are not used to indicate the logical relationship or sequential relationship between the various components, elements, steps, etc.

[0085] It should also be recognized that the terms described herein are only used to describe specific embodiments and are not used to limit the scope of the utility model. It must be noted that the singular forms "one" and "a kind" used herein and in the appended claims include plural references unless the context clearly indicates the opposite meaning. For example, a reference to "a step" or "a device" means a reference to one or more steps or devices, and may include secondary steps and secondary devices. All conjunctions used should be understood in the broadest sense. And, the word "or" should be understood to have a logical "or" definition, rather than a logical "exclusive or" definition, unless the context clearly indicates the opposite meaning. In addition, the implementation of the method and / or device in the embodiment of the utility model may include performing the selected task manually, automatically, or in combination.

Claims

1. An LED lamp bead, characterized in that: A device comprising a first substrate and m rows and n columns of pixel units located on the first substrate, wherein m and n are greater than or equal to 1, and m*n is not equal to 1, wherein the direction of each column is a first direction, the direction of each row is a second direction, and the first direction is perpendicular to the second direction, and each of the pixel units has three LED chips of different light colors arranged along the first direction; and The first substrate has a packaging glue layer, which covers the LED chip. When m=1, the packaging glue layer between two adjacent pixel units in the second direction has a groove group. When n=1, the packaging glue layer between two adjacent pixel units in the first direction has a groove group. When m≠1 and n≠1, the packaging glue layer between two adjacent columns of pixel units extending along the first direction and between two adjacent rows of pixel units extending along the second direction has a groove group, and each groove group includes at least two grooves extending along the corresponding direction.

2. The LED lamp bead according to claim 1, characterized in that: The pixel unit comprises a first side and a second side extending along the first direction, and the distance between each LED chip of the pixel unit and the first side is equal to the distance between each LED chip and the second side.

3. The LED lamp bead according to claim 1 or 2, characterized in that: The scribe groove extends from the top surface of the packaging glue layer into the packaging glue layer; or, the scribe groove penetrates the packaging glue layer and exposes the first substrate.

4. The LED lamp bead according to claim 1 or 2, characterized in that: The width of the groove along a direction perpendicular to its extension direction is less than 0.3 mm.

5. The LED lamp bead according to claim 1 or 2, characterized in that: The packaging glue layer between adjacent grooves is a non-luminous area.

6. The LED lamp bead as claimed in claim 5, characterized in that: The non-luminous area constitutes an isolation area to isolate the adjacent pixel units.

7. The LED lamp bead according to claim 1 or 2, characterized in that: The three LED chips in the pixel unit are respectively a red LED chip, a blue LED chip and a green LED chip.

8. An LED display module, characterized in that: A second substrate and a plurality of LED lamp beads located on the second substrate, wherein the LED lamp beads include a first substrate and m rows and n columns of pixel units located on the first substrate, m and n are greater than or equal to 1, and m*n is not equal to 1, wherein the direction of each column is a first direction, the direction of each row is a second direction, and the first direction is perpendicular to the second direction, and each of the pixel units has three LED chips of different light colors arranged along the first direction; and, The first substrate has a packaging glue layer, which covers the LED chip. When m=1, the packaging glue layer between two adjacent pixel units in the second direction has a groove group. When n=1, the packaging glue layer between two adjacent pixel units in the first direction has a groove group. When m≠1 and n≠1, the packaging glue layer between two adjacent columns of pixel units extending along the first direction and between two adjacent rows of pixel units extending along the second direction has a groove group, and each groove group includes at least two grooves extending along the corresponding direction.

9. The LED display module according to claim 8, characterized in that: The pixel unit comprises a first side and a second side extending along the first direction, and the distance between each LED chip of the pixel unit and the first side is equal to the distance between each LED chip and the second side.

10. The LED display module according to claim 8 or 9, characterized in that: The scribe groove extends from the top surface of the packaging glue layer into the packaging glue layer; or, the scribe groove penetrates the packaging glue layer and exposes the first substrate.

11. The LED display module according to claim 8 or 9, characterized in that: The width of the groove along a direction perpendicular to its extension direction is less than 0.3 mm.

12. The LED display module according to claim 8 or 9, characterized in that: The packaging glue layer between adjacent grooves is a non-luminous area.

13. The LED display module according to claim 12, characterized in that: The non-luminous area constitutes an isolation area to isolate the adjacent pixel units.

14. The LED display module according to claim 8 or 9, characterized in that: The three LED chips in the pixel unit are respectively a red LED chip, a blue LED chip and a green LED chip.

15. An LED display module, characterized in that: It comprises a third substrate and m rows and n columns of pixel units located on the third substrate, m and n are greater than or equal to 1, and m*n is not equal to 1, wherein the direction of each column is a first direction, the direction of each row is a second direction, and the first direction is perpendicular to the second direction, and each of the pixel units has three LED chips of different light colors arranged along the first direction; The third substrate has a packaging glue layer, which covers the LED chip. When m=1, the packaging glue layer between two adjacent pixel units in the second direction has a groove group. When n=1, the packaging glue layer between two adjacent pixel units in the first direction has a groove group. When m≠1 and n≠1, the packaging glue layer between two adjacent columns of pixel units extending along the first direction and between two adjacent rows of pixel units extending along the second direction has a groove group, and each groove group includes at least two grooves extending along the corresponding direction.

16. The LED display module according to claim 15, characterized in that: The pixel unit comprises a first side and a second side extending along the first direction, and the distance between each LED chip of the pixel unit and the first side is equal to the distance between each LED chip and the second side.

17. The LED display module according to claim 15 or 16, characterized in that: The scribe groove extends from the top surface of the packaging glue layer into the packaging glue layer; or, the scribe groove penetrates the packaging glue layer and exposes the third substrate.

18. The LED display module according to claim 15 or 16, characterized in that: The width of the groove along a direction perpendicular to its extension direction is less than 0.3 mm.

19. The LED display module according to claim 15 or 16, characterized in that: The packaging glue layer between adjacent grooves is a non-luminous area.

20. The LED display module according to claim 19, characterized in that: The non-luminous area constitutes an isolation area to isolate the adjacent pixel units.

21. The LED display module according to claim 15 or 16, characterized in that: The three LED chips in the pixel unit are respectively a red LED chip, a blue LED chip and a green LED chip.

22. The LED display module according to claim 15, characterized in that: All the LED chips are directly formed on the third substrate, and the packaging glue layer covers the third substrate and the LED chips.

23. An LED display screen, characterized in that: It comprises the LED display module as described in any one of claims 8 to 22.

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