Electric field type integrated circuit collector

Abstract

A first insulating base material without a graphene coating is arranged at the bottom of the electric field type integrated circuit collector, overlapped electric field collecting sheets with graphene coatings are arranged in the middle of the electric field type integrated circuit collector, and a second insulating base material without a graphene coating is arranged on the uppermost surface of the electric field type integrated circuit collector. The channel is an ionization channel through which particles are charged, organic matters and water molecules are ionized into charges under the action of the high-voltage electric field, and the organic matters and the dust with opposite charges are adsorbed by the collector, so that the organic matters and the dust lose original characteristics and are stopped on the adsorption inner wall.

Description

Technical Field

[0001] The utility model relates to the field of high-voltage electrode disinfection and dust removal, in particular to an electric field type integrated circuit collector. Background Art

[0002] The existing high-voltage electrode dust removal method uses a metal electrode plate. After applying voltage between the positive and negative electrodes of the metal plate, the dust is decomposed into charged ions, and then the electrode plate adsorbs the charged ions. This method requires high voltage on the electrode plate, produces ozone, and consumes a lot of electricity. Summary of the invention

[0003] The purpose of this utility model is to overcome the above shortcomings and provide an electric field integrated circuit collector. Technical solution:

[0004] An electric field integrated circuit collector, comprising

[0005] On a 1 to 5 mm thick insulating substrate (1) of a periosteal structure, a graphene conductive paste is evenly printed in the window where the coating is to be printed using a paste coating machine to form a graphene coating (2);

[0006] Under ultraviolet light, the uniformity of the graphene coating (2) is checked to see if there are any missing coatings, bubbles, or broken coatings, and additional coating is performed on the defective areas;

[0007] Sent to a constant temperature box for curing at a temperature of 32 to 45 degrees Celsius;

[0008] A conductive buried electrode cutout (31) is made at the midline of the graphene coating (2) at one end, and an insulating buried electrode cutout (32) is made at a blank area without coating at the midline of the graphene coating (2) at the other end, so as to form an electric field collecting sheet (3) having multiple graphene coatings (2);

[0009] The power value is calculated according to the graphene resistance and current value in each electric field collection sheet (3), and the number of electric field collection sheets (3) required to produce an integrated circuit collector of a certain power is obtained, and the number of stacked layers is calculated; the number of stacked layers calculated is the number of electric field collection sheets (3) required; the electric field collection sheet (3) with a graphene coating is placed as the first layer at the bottom, and then another electric field collection sheet (3) with a graphene coating is rotated 180 degrees in the horizontal direction and placed on top of the first layer at the bottom as the second layer, and the third layer of electric field collection sheets (3) is in the same direction as the first layer, and the fourth layer of electric field collection sheets (3) is in the same direction as the second layer, and multiple layers are overlapped in this way, so that the conductive buried electrodes and the insulating buried electrodes overlap multiple layers in a cross manner; the number of overlapping layers is selected to be 20 to 40 layers.

[0010] Place 1 to 3 layers of a first insulating substrate (51) without a graphene coating on the bottom of the fixture workpiece, and then place 20 to 40 layers of overlapping electric field collecting sheets (3) with a graphene coating. Figure 3 20 to 40 layers of overlapping electric field collecting sheets 3 with graphene coating are placed on the first insulating substrate (51), and then 1 to 3 layers of second insulating substrate (52) without graphene coating are placed on the top, and its function is that the insulating substrate without graphene coating forms a protective insulating layer outside the electric field; buckle and fix the fixture workpiece and press it tightly;

[0011] Putting the completed multi-layer electric field collecting sheet and the insulating substrate below and above the multi-layer electric field collecting sheet onto a high-frequency fusion welding cutting device for cutting; Figure 4 The arrow in the middle is the cutting direction. Figure 4 The dashed line in the middle represents the cutting line. For ease of understanding, Figure 4 The insulating substrate is not shown, only a top view of an electric field collection sheet (3) is shown; after the cutting is completed, a multi-layer electric field collection sheet is cut into multiple pieces; each piece is called an electric field integrated circuit collector power component; the left end of the electric field integrated circuit collector power component is a conductive buried electrode cutout (31) and an insulating buried electrode cutout (32), and the right end is a conductive buried electrode cutout (31) and an insulating buried electrode cutout (32);

[0012] After the hot-melt welding cutting is completed, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are filled with graphene conductive glue on the side of one end of the electric field integrated circuit collector power component, and the high-voltage lead wire is pre-buried, so that all the electric field collectors of the same pole are connected to form equipotential electrodes; on the side of the other end, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are filled with graphene conductive glue, and the high-voltage lead wire is pre-buried, so that all the electric field collectors of the same pole (3) are also connected. The electrodes are connected to form a zero potential electrode, and then bonded and cured with insulating glue to form a fully functional electric field integrated circuit collector; that is, a tunnel of an electric field current channel surrounded by an energized electric field is made into a porous stacked crystal phase structure, and the ionized charged ions can be captured in the electric field channel and adsorbed on the inner wall of the electric field. The composition of the porous electric field tunnel is a collection of multiple electric fields, and is an electric field integrated circuit collector formed by overlapping wiring of graphene resistor elements, and cross-overlapping of buried electrode conductive plates and insulating electrode plates;

[0013] The electric field integrated circuit collector is characterized by:

[0014] The thickness of the insulating substrate (1) of the periosteal structure is 1.5 to 2 mm; a graphene conductive paste is evenly printed in the window where the coating is to be printed using a paste coating machine to form a graphene coating (2); the purpose is to make the area of ​​the printed graphene coating accurate;

[0015] The curing process is carried out in a constant temperature box, and the curing temperature is 34 to 36 degrees Celsius;

[0016] For example, the production of a 3W electric field integrated circuit collector requires 26 to 32 electric field collectors;

[0017] Placing three layers of insulating substrate without graphene coating on the bottom of the fixture workpiece, then pressing 26 to 32 overlapping electric field collection sheets (3) on the insulating substrate, and then placing three layers of insulating substrate without graphene coating on the 26 to 32 overlapping electric field collection sheets (3), and buckling and fixing them on the fixture workpiece;

[0018] The electric field integrated circuit collector adopts the process of printing integrated circuits, and the thickness of the insulating substrate (1) of the periosteal structure is 1.5 to 2 mm; a graphene conductive paste is evenly printed in the window where the coating is to be printed using a paste coating machine to form a graphene coating (2);

[0019] The electric field integrated circuit collector is characterized by:

[0020] The bottom is a first insulating substrate (51) with 1 to 3 layers without graphene coating, the middle is an electric field collecting sheet (3) with 20 to 40 layers of overlapping graphene coating, and the top is a second insulating substrate (52) with 1 to 3 layers without graphene coating, wherein:

[0021] The graphene coating (2) on each electric field collection sheet (3) is formed by printing a graphene conductive paste evenly in the window of the coating to be printed using a paste coating machine; a conductive buried electrode cutout (31) is made at the midline of the graphene coating (2) at one end, and an insulating buried electrode cutout (32) is made at a blank area without coating at the midline of the graphene coating (2) at the other end, thereby forming an electric field collection sheet (3) with multiple graphene coatings (2);

[0022] The overlapping placement of the electric field collecting sheets (3) with the graphene coating (2) is as follows: the electric field collecting sheets (3) with the graphene coating (2) are placed as the first layer at the bottom, and then another electric field collecting sheet (3) with the graphene coating is rotated 180 degrees in the horizontal direction and placed on top of the first layer at the bottom as the second layer, and the third layer of the electric field collecting sheets (3) is in the same direction as the first layer, and the fourth layer of the electric field collecting sheets (3) is in the same direction as the second layer, and multiple layers are overlapped in this way, so that the conductive buried electrodes and the insulating buried electrodes overlap multiple layers in a cross manner;

[0023] The multi-layer electric field collecting sheet (3) and the insulating substrate below and above the multi-layer electric field collecting sheet are placed on a high-frequency welding cutting device and cut into multiple pieces; each piece is called an electric field integrated circuit collector power component;

[0024] After the hot-melt cutting is completed, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are provided on the side of one end of the electric field integrated circuit collector power component, and are filled with graphene conductive glue, and high-voltage lead wires are pre-buried, so that all the electric field collectors of the same pole are connected to form an equipotential electrode; on the side of the other end, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are provided, and are filled with graphene conductive glue, and high-voltage lead wires are pre-buried, so that all the electric field collectors of the same pole (3) are also connected to form a zero-potential electrode, and then they are bonded and cured with insulating glue to form a complete functional electric field integrated circuit collector;

[0025] Working principle: The electric field integrated circuit collector of the utility model has a tunnel of electric field current channel surrounded by an energized electric field with a porous stacked crystal phase structure. The channel can capture the ionized charged ions in this electric field channel and adsorb them on the inner wall of the electric field. The composition of the porous electric field tunnel is a collection of multiple electric fields. It is an electric field integrated circuit collector formed by overlapping wiring of graphene resistor elements, and cross-overlapping of buried electrode conductive plates and insulating electrode plates; under the action of high voltage 7000V DC 0.2 microamperes, a micro-current and low-power high-voltage DC electric field is formed; each hole is a high-voltage DC channel surrounded by an electric field, and the inner wall of the channel is the collecting electrode for adsorbing charged ions, and the channel is an ionization channel through which the particles are charged. Organic matter and water molecules are ionized into electric charges under the action of this high-voltage electric field, and those with opposite charges are adsorbed by the collecting electrode, so that the organic matter and dust lose their original characteristics and remain on the adsorption inner wall; BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The utility model discloses an electric field type integrated circuit collector. Graphene slurry is printed on an insulating substrate to form a graphene coating.

[0027] Figure 2 The utility model discloses an electric field integrated circuit collector. A conductive buried electrode cutout (31) is made on an insulating substrate, and an insulating buried electrode cutout (32) is made on a blank area without coating in the middle line of a graphene coating (2) at the other end.

[0028] Figure 3 The utility model discloses an electric field integrated circuit collector with multiple layers of electric field collecting sheets placed in an overlapping manner.

[0029] Figure 4 The utility model is a schematic diagram of cutting a multi-layer stacked electric field collecting sheet for an electric field integrated circuit collector.

[0030] Figure 5The utility model is an electric field type integrated circuit collector, and a buried electrode is made on the left side of the power component integrated circuit collector. The buried electrode is made on the right side. Figure 5 same.

[0031] Figure 6 A partial cross-sectional view of an electric field integrated circuit collector of the utility model.

[0032] Figure 7 The utility model is a schematic diagram of the overlapping manner of multiple layers of electric field collecting sheets (3) in an electric field type integrated circuit collector.

[0033] Figures 1 to 7 The reference numerals are as follows: insulating substrate (1), graphene coating (2), conductive buried electrode cutout (31), insulating buried electrode cutout (32), electric field collection sheet (3), first insulating substrate without graphene coating (51), second insulating substrate without graphene coating (52), conductive buried electrode cutout (31), insulating buried electrode cutout (32), 20 to 40 layers of overlapping electric field collection sheet with graphene coating as a whole (53) DETAILED DESCRIPTION

[0034] An electric field integrated circuit collector includes

[0035] See Figure 1 , on a 1 to 5 mm thick insulating substrate (1) of a periosteal structure, at a window where a coating is to be printed, a graphene conductive paste is evenly printed in the window using a paste coating machine to form a graphene coating (2);

[0036] Under ultraviolet light, the uniformity of the graphene coating (2) is checked to see if there are any missing coatings, bubbles, or broken coatings, and additional coating is performed on the defective areas;

[0037] Sent to a constant temperature box for curing at a temperature of 32 to 45 degrees Celsius;

[0038] See Figure 2 , then making a conductive buried electrode cutout (31) at the midline of the graphene coating (2) at one end, and making an insulating buried electrode cutout (32) at a blank area without coating at the midline of the graphene coating (2) at the other end, to produce an electric field collecting sheet (3) with multiple graphene coatings (2);

[0039] See Figure 7The power value is calculated according to the graphene resistance and current value in each electric field collection sheet (3), and the number of electric field collection sheets (3) required to produce an integrated circuit collector of a certain power is obtained, and the number of stacked layers is calculated; the number of electric field collection sheets (3) required is calculated according to the number of stacked layers; the electric field collection sheet (3) with a graphene coating is placed on the bottom first layer, and then another electric field collection sheet (3) with a graphene coating is rotated 180 degrees in the horizontal direction and placed on top of the bottom first layer as the second layer, and the third layer of electric field collection sheets (3) is in the same direction as the first layer, and the fourth layer of electric field collection sheets (3) is in the same direction as the second layer, and multiple layers are overlapped in this way, so that the conductive buried electrodes and the insulating buried electrodes overlap multiple layers in a cross manner; the number of overlapping layers is selected to be 20 to 40 layers;

[0040] See Figure 3 , placing 1 to 3 layers of a first insulating substrate (51) without a graphene coating on the bottom of the fixture workpiece, then placing 20 to 40 layers of overlapping electric field collecting sheets (3) with a graphene coating on the first insulating substrate (51), and then placing 1 to 3 layers of a second insulating substrate (52) without a graphene coating on the top, the function of which is that the insulating substrate without a graphene coating forms a protective insulating layer outside the electric field; buckling and fixing the fixture workpiece and pressing it tightly;

[0041] See Figure 4 The above-mentioned multi-layer electric field collecting sheet and the insulating substrate below and above the multi-layer electric field collecting sheet are placed on a high-frequency fusion welding cutting device for cutting; Figure 4 The arrow in the middle is the cutting direction. Figure 4 The dashed line in the middle represents the cutting line. For ease of understanding, Figure 4 The insulating substrate is not shown, only a top view of an electric field collection sheet (3) is shown; after the cutting is completed, a multi-layer electric field collection sheet is cut into multiple pieces; each piece is called an electric field integrated circuit collector power component; the left end of the electric field integrated circuit collector power component is a conductive buried electrode cutout (31) and an insulating buried electrode cutout (32), and the right end is a conductive buried electrode cutout (31) and an insulating buried electrode cutout (32);

[0042] See Figure 5After the hot-melt welding cutting is completed, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are filled with graphene conductive glue on the side of one end of the electric field integrated circuit collector power component, and the high-voltage lead wire is pre-buried, so that all the electric field collectors of the same pole are connected to form equipotential electrodes; on the side of the other end, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are filled with graphene conductive glue, and the high-voltage lead wire is pre-buried, so that all the electric field collectors of the same pole (3) are also connected. The electrodes are turned on to form a zero potential electrode, which is then bonded and cured with insulating glue to form a fully functional electric field integrated circuit collector; that is, a tunnel of an electric field current channel surrounded by an energized electric field is made into a porous stacked crystal phase structure, in which the ionized charged ions can be captured in the electric field channel and adsorbed on the inner wall of the electric field. The composition of the porous electric field tunnel is a collection of multiple electric fields, and is an electric field integrated circuit collector formed by overlapping wiring of graphene resistor elements, and cross-overlapping of buried electrode conductive plates and insulating electrode plates.

[0043] The electric field integrated circuit collector is characterized by:

[0044] The thickness of the insulating base material (1) of the periosteal structure is 1.5 to 2 mm;

[0045] The curing process is carried out in a constant temperature box, and the curing temperature is 34 to 36 degrees Celsius;

[0046] For example, the production of a 3W electric field integrated circuit collector requires 26 to 32 electric field collectors;

[0047] The manufacturing process of the electric field integrated circuit collector is characterized by: using a printed integrated circuit process, at the window where the coating is to be printed, a graphene conductive paste is evenly printed in the window using a paste coating machine to form a graphene coating (2).

[0048] An electric field integrated circuit collector, characterized in that it comprises: a first insulating substrate (51) without a graphene coating having 1 to 3 layers at the bottom, an electric field collecting sheet (3) with a graphene coating (2) having 20 to 40 layers of overlapping layers in the middle, and a second insulating substrate (52) without a graphene coating having 1 to 3 layers at the top; wherein: the graphene coating (2) on each electric field collecting sheet (3) is at a window where the coating is to be printed, and a graphene conductive paste is evenly printed in the window by a paste coating machine to form a graphene coating (2); a conductive buried electrode cutout (31) is made at the midline of the graphene coating (2) at one end, and an insulating buried electrode cutout (32) is made at a blank area without coating at the midline of the graphene coating (2) at the other end, so as to form an electric field collecting sheet (3) with multiple graphene coatings (2);

[0049] The overlapping placement of the electric field collecting sheets (3) with the graphene coating (2) is as follows: the electric field collecting sheets (3) with the graphene coating (2) are placed as the first layer at the bottom, and then another electric field collecting sheet (3) with the graphene coating is rotated 180 degrees in the horizontal direction and placed on top of the first layer at the bottom as the second layer, and the third layer of the electric field collecting sheets (3) is in the same direction as the first layer, and the fourth layer of the electric field collecting sheets (3) is in the same direction as the second layer, and multiple layers are overlapped in this way, so that the conductive buried electrodes and the insulating buried electrodes overlap multiple layers in a cross manner;

[0050] The multi-layer electric field collecting sheet (3) and the insulating substrate below and above the multi-layer electric field collecting sheet are placed on a high-frequency welding cutting device and cut into multiple pieces; each piece is an electric field integrated circuit collector power component;

[0051] After the hot-melt welding cutting is completed, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are provided on the side surface of one end of the electric field type integrated circuit collector power component, which are filled with graphene conductive glue, and high-voltage lead wires are pre-buried, so that all the electric field collection pieces of the same pole are connected to form an equipotential electrode; on the side surface of the other end, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are provided, which are filled with graphene conductive glue, and high-voltage lead wires are pre-buried, so that all the electric field collection pieces of the same pole (3) are also connected to form a zero-potential electrode, and then the insulating glue is used for bonding and curing to form a complete functional electric field type integrated circuit collector.

Claims

1. An electric field integrated circuit collector, characterized by: The bottom is a first insulating substrate (51) with 1 to 3 layers without a graphene coating, the middle is an electric field collecting sheet (3) with 20 to 40 layers of overlapping graphene coatings (2), and the top is a second insulating substrate (52) with 1 to 3 layers without a graphene coating, wherein: The graphene coating (2) on each electric field collection sheet (3) is formed by printing a graphene conductive paste evenly in the window of the coating to be printed using a paste coating machine; a conductive buried electrode cutout (31) is made at the midline of the graphene coating (2) at one end, and an insulating buried electrode cutout (32) is made at a blank area without coating at the midline of the graphene coating (2) at the other end, thereby forming an electric field collection sheet (3) with multiple graphene coatings (2); The overlapping placement of the electric field collecting sheets (3) with the graphene coating (2) is as follows: the electric field collecting sheets (3) with the graphene coating (2) are placed as the first layer at the bottom, and then another electric field collecting sheet (3) with the graphene coating is rotated 180 degrees in the horizontal direction and placed on top of the first layer at the bottom as the second layer, and the third layer of the electric field collecting sheets (3) is in the same direction as the first layer, and the fourth layer of the electric field collecting sheets (3) is in the same direction as the second layer, and multiple layers are overlapped in this way, so that the conductive buried electrodes and the insulating buried electrodes overlap multiple layers in a cross manner; The multi-layer electric field collecting sheet (3) and the insulating substrate below and above the multi-layer electric field collecting sheet are placed on a high-frequency welding cutting device and cut into multiple pieces; each piece is an electric field integrated circuit collector power component; After the hot-melt welding cutting is completed, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are provided on the side surface of one end of the electric field integrated circuit collector power component, which are filled with graphene conductive glue, and high-voltage lead wires are pre-buried, so that all the electric field collectors of the same pole are connected to form an equipotential electrode; on the side surface of the other end, the conductive buried electrode cutout (31) and the insulating buried electrode cutout (32) are provided, which are filled with graphene conductive glue, and high-voltage lead wires are pre-buried, so that all the electric field collectors of the same pole (3) are also connected to form a zero-potential electrode, and then the insulating glue is used for bonding and curing to form a complete functional electric field integrated circuit collector.

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