Server

Abstract

The utility model belongs to the technical field of data processing center equipment, and particularly relates to a server which comprises a server module and a machine shell. A through hole for cooling liquid to enter and exit is formed in the bottom of the machine shell, and a through hole for air to enter and exit is formed in the top of the machine shell. The server module comprises a central processing unit, a first heat exchange part is arranged on the central processing unit, a liquid containing cavity is formed in the first heat exchange part, and the liquid containing cavity is communicated with a liquid inlet and a liquid outlet which are formed in the top of the machine shell through a heat exchange pipeline. The heat dissipation characteristic of the central processing unit is enhanced through the first heat exchange piece.

Description

Technical Field

[0001] The utility model belongs to the technical field of data processing center equipment, and specifically relates to a server. Background Art

[0002] Data processing centers are facilities used to centrally process, store, manage and protect data. These centers are responsible for collecting and integrating large amounts of data from different sources, processing and computing them efficiently to support the business needs of enterprises or organizations. They are also regarded as the "brains" of information technology, supporting the operation of various applications and helping enterprises and organizations achieve data-driven decision-making. Servers are the core components of data processing centers and are used to store and retrieve data. In the existing technology, multiple servers are usually connected to form a server cluster to provide high availability and scalability to meet the growing data needs.

[0003] Overheating of the server will cause the server to shut down or run slowly. In large data centers, in order to save space and improve efficiency, server equipment is often stacked closely, and server hardware generates a lot of heat during operation. In the prior art, multiple servers are usually installed in a standardized cabinet at the same time, and then the entire cabinet is provided with sufficient cooling, ventilation and humidity control to keep the server in the required working state.

[0004] Data center cooling technologies include air cooling, water cooling, natural cooling, and liquid cooling, among which liquid cooling technology uses liquid as a heat conduction medium to exchange heat through direct or indirect contact between the coolant and the server's heat-generating components, thereby achieving effective heat transfer and providing heat dissipation for the server. The prior art already has an immersion liquid cooling system, which refers to a technology that immerses the entire device in a non-conductive insulating liquid for cooling, including an immersion liquid cooling box and a server disposed in the liquid cooling box. Compared with traditional air cooling, immersion liquid cooling technology has the advantages of high heat dissipation efficiency, low noise, and convenience for dense layout, and has been widely used in high-density computing data centers.

[0005] The working medium of immersion liquid cooling is usually synthetic fluorinated liquid, mineral oil or other insulating liquids, which have good thermal conductivity and are also electrical insulators, and will not cause short circuits in IT equipment. However, due to the different actual heating conditions of various heating components inside the server, especially the central processing unit and graphics processor, which emit a lot of heat when running at high speed, and the limited heat transfer efficiency of general insulating coolants, immersion liquid cooling alone cannot meet the heat dissipation needs of components with severe heat generation. Utility Model Content

[0006] In order to solve the above technical problems, it is necessary to provide a server that can be applied to an immersion liquid cooling server system and has locally enhanced heat dissipation characteristics.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0008] A server, characterized in that it includes a server module and a casing; the bottom of the casing is provided with a through hole for coolant to enter and exit, and the top is provided with a through hole for air to enter and exit; the server module includes a central processing unit, and the central processing unit is provided with a first heat exchange component, and the first heat exchange component is provided with a liquid containing cavity, and the liquid containing cavity is connected to a liquid inlet and a liquid outlet arranged on the top of the casing through a heat exchange pipeline.

[0009] In the server provided by the utility model, a through hole for the coolant to enter and exit is arranged at the bottom of the casing, and a through hole for the air to enter and exit is arranged at the top, so that when the casing is immersed in and taken out of the liquid cooling box, both the air and the coolant can enter and exit the casing smoothly; a first heat exchanger is arranged to be close to the central processing unit so as to dissipate the heat generated by the central processing unit more quickly through solid heat conduction with the first heat exchanger; when in use, a heat transfer medium is introduced into the first heat exchanger; since the heat transfer medium flows in the first heat exchanger and the pipeline, it does not directly contact the electronic components, does not need to have insulation properties, and has a wider range of choices; when the server is immersed in the liquid cooling box, the heat transfer medium is introduced into the first heat exchanger and the pipeline, so as to not directly contact the electronic components, does not need to have insulation properties, and has a wider range of choices; when the server is immersed in the liquid cooling box, the heat transfer medium is introduced into the first heat exchanger and the pipeline is connected to the first heat exchanger. The heat transfer medium is introduced into the liquid inlet and discharged from the liquid outlet. Since the first heat exchanger and the pipeline separate the internal heat transfer medium from the medium in the liquid cooling box that immerses the server, the type and flow rate of the heat transfer medium introduced into the liquid inlet can be individually controlled to meet the heat dissipation performance requirements of the central processing unit; the liquid inlet and the liquid outlet are arranged on the top of the casing. When the arrangement of the server in the liquid cooling box needs to be changed, the top cover of the cabinet can be opened to conveniently immerse and take out the liquid cooling box without emptying the liquid cooling box. Moreover, since the pipeline interface is arranged at the top, there will be no waste of space due to the arrangement of the pipelines, and multiple groups of servers can be arranged close together. The heat dissipation characteristics of the central processing unit are enhanced by the first heat exchanger.

[0010] Preferably, a liquid inlet conduit connected to the liquid containing cavity is provided on one side of the first heat exchanger, and a liquid outlet conduit is provided on the other side of the first heat exchanger, and the directions of the liquid inlet conduit and the liquid outlet conduit are parallel. In this structure, the liquid inlet conduit and the liquid outlet conduit can be arranged close to the two sides of the main part of the first heat exchanger, occupying a small space, and can be arranged relatively long, which is convenient for quick connection with the pipeline.

[0011] Preferably, the server module further includes a motherboard, the central processing unit and the first heat exchanger are both connected to the motherboard, and the first heat exchanger is close to the central processing unit; the motherboard is also connected to a graphics processor and a second heat exchanger connected to the graphics processor, and the second heat exchanger has the same structure as the first heat exchanger. The heat generated by the graphics processor and the central processing unit needs to be dissipated, and the heat dissipation performance of the graphics processor is also enhanced by the second heat exchanger in this structure.

[0012] Preferably, the heat exchange pipeline includes a liquid inlet pipe that connects the liquid inlet conduit of the first heat exchange element and the liquid inlet conduit of the second heat exchange element and is connected to the liquid inlet port, and a liquid outlet pipe that connects the liquid outlet conduit of the first heat exchange element and the liquid outlet conduit of the second heat exchange element and is connected to the liquid outlet port. In this structure, the first heat exchange element and the second heat exchange element are connected in parallel through the three-way liquid inlet pipe and liquid outlet pipe, and the liquid inlet temperatures of the first heat exchange element and the second heat exchange element are the same. When the heat generation of the central processing unit and the graphics processing unit is similar, a relatively ideal cooling effect can be achieved.

[0013] Preferably, the liquid inlet and outlet conduits of the first heat exchanger and the liquid inlet and outlet conduits of the second heat exchanger are oriented in the same direction. This structure facilitates the parallel connection of the first heat exchanger and the second heat exchanger, and the pipelines are not easily entangled.

[0014] Preferably, the heat exchange pipeline includes a first quick-connect pipe connecting the liquid inlet conduit of the first heat exchange element and the liquid inlet, a second quick-connect pipe connecting the liquid outlet conduit of the first heat exchange element and the liquid inlet conduit of the second heat exchange element, and a third quick-connect pipe connecting the liquid outlet conduit of the second heat exchange element and the liquid outlet. In this structure, the first heat exchange element and the second heat exchange element are connected in series, and the coolant first passes through the first heat exchange element and then passes through the second heat exchange element. This connection method is more suitable when the heat generation of the central processing unit is more serious than that of the graphics processing unit, which can ensure that the cooling effect of the central processing unit is good and the graphics processing unit can also operate normally, with high overall cooling efficiency and fewer pipelines.

[0015] Preferably, the heat exchange pipeline includes a first quick-connect pipe connecting the liquid inlet conduit of the second heat exchange element and the liquid inlet, a second quick-connect pipe connecting the liquid outlet conduit of the second heat exchange element and the liquid inlet conduit of the first heat exchange element, and a third quick-connect pipe connecting the liquid outlet conduit of the first heat exchange element and the liquid outlet. In this structure, the first heat exchange element and the second heat exchange element are connected in series, and the coolant first passes through the second heat exchange element and then passes through the first heat exchange element. This connection method is more suitable when the heat generation of the graphics processor is more serious than that of the central processing unit, which can ensure that the cooling effect of the graphics processor is good, and the central processing unit can also operate normally, with high overall cooling efficiency and fewer pipelines.

[0016] Preferably, the total area of ​​the through holes at the bottom of the housing is greater than the total area of ​​the through holes at the top of the housing.

[0017] Preferably, the through holes at the bottom of the housing are a plurality of strip-shaped holes arranged at intervals. This structure makes it difficult for the coolant to bubble when it is immersed in the housing.

[0018] Preferably, the server further comprises a power module electrically connected to the mainboard, wherein the power module is electrically connected to the mainboard and is arranged inside the housing in parallel with the mainboard.

[0019] Preferably, a mounting opening is provided on the top of the housing corresponding to the power module, and one end of the power module provided with an interface protrudes from the housing, and a handle is provided on the end. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other purposes, features and advantages of the present invention will become more apparent through a more specific description of the preferred embodiments of the present invention shown in the accompanying drawings. The same reference numerals in all the accompanying drawings indicate the same parts, and the drawings are not intentionally scaled to the actual size, but the focus is on illustrating the subject matter of the present invention.

[0021] Figure 1 It is a schematic diagram of the internal structure of a preferred embodiment;

[0022] Figure 2 It is a schematic diagram of the overall structure of a preferred embodiment.

[0023] In the figure: a first heat exchange element 1, a second heat exchange element 2, a liquid inlet 3, a liquid outlet 4, a liquid inlet conduit 5, a liquid outlet conduit 6, a liquid inlet pipe 7, a liquid outlet pipe 8, a power module 9, and a handle 91. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0025] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element and combined with it as a whole, or there may be an intermediate element at the same time. The terms "installed", "one end", "the other end" and similar expressions used in this article are only for the purpose of illustrating the present utility model.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used in the specification herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] refer to Figure 1 and Figure 2 A server described in the utility model includes a server module and a casing; the bottom of the casing is provided with a through hole for the coolant to enter and exit, and the top is provided with a through hole for the air to enter and exit; the server module includes a central processing unit, and the central processing unit is provided with a first heat exchange component 1, and the first heat exchange component 1 is provided with a liquid containing cavity, and the liquid containing cavity is connected to a liquid inlet 3 and a liquid outlet 4 arranged on the top of the casing through a heat exchange pipeline.

[0028] refer to Figure 1 In a preferred embodiment, a liquid inlet conduit 5 communicating with the liquid containing cavity is provided on one side of the first heat exchanger 1, and a liquid outlet conduit 6 is provided on the other side of the first heat exchanger 1, and the liquid inlet conduit 5 and the liquid outlet conduit 6 are oriented in the same direction. Since the liquid inlet 3 and the liquid outlet 4 in the preferred embodiment are arranged at the top, the liquid inlet conduit 5 and the liquid outlet conduit 6 are both arranged facing upward, and in other embodiments, they may also be oriented to the side or downward according to different layouts.

[0029] refer to Figure 1 In a preferred embodiment, the server module further includes a graphics processor connected to the mainboard, and the mainboard is further connected to a second heat exchanger 2 abutting against the graphics processor, and the second heat exchanger 2 has the same structure as the first heat exchanger 1. The heat generated by the graphics processor and the central processing unit needs to be dissipated, and the heat dissipation performance of the graphics processor is also enhanced through the second heat exchanger 2 in this structure.

[0030] refer to Figure 1 In a preferred embodiment, the heat exchange pipeline includes a liquid inlet pipe 7 that connects the liquid inlet conduit 5 of the first heat exchange element 1 with the liquid inlet conduit 5 of the second heat exchange element 2 and is connected to the liquid inlet port 3, and a liquid outlet pipe 8 that connects the liquid outlet conduit 6 of the first heat exchange element 1 with the liquid outlet conduit of the second heat exchange element 2 and is connected to the liquid outlet port 4. In this structure, the first heat exchange element 1 and the second heat exchange element 2 are connected in parallel through the three-way liquid inlet pipe 7 and liquid outlet pipe 8, which is convenient for connection.

[0031] In another embodiment, the heat exchange pipeline includes a first quick-connect pipe connecting the liquid inlet conduit 5 of the first heat exchange element 1 and the liquid inlet port 3, a second quick-connect pipe connecting the liquid outlet conduit 6 of the first heat exchange element 1 and the liquid inlet conduit 5 of the second heat exchange element 2, and a third quick-connect pipe connecting the liquid outlet conduit 6 of the second heat exchange element 2 and the liquid outlet port 4. In this structure, the first heat exchange element and the second heat exchange element are connected in series, and the coolant first passes through the first heat exchange element and then passes through the second heat exchange element. This connection method is more suitable when the heat generation of the central processing unit is more serious than that of the graphics processing unit, which can ensure that the cooling effect of the central processing unit is good and the graphics processing unit can also operate normally, with high overall cooling efficiency and fewer pipelines.

[0032] In another embodiment, the heat exchange pipeline includes a first quick-connect pipe connecting the liquid inlet conduit 5 of the second heat exchange element 2 and the liquid inlet port 3, a second quick-connect pipe connecting the liquid outlet conduit 6 of the second heat exchange element 2 and the liquid inlet conduit 5 of the first heat exchange element 1, and a third quick-connect pipe connecting the liquid outlet conduit 6 of the first heat exchange element 1 and the liquid outlet port 4. In this structure, the first heat exchange element and the second heat exchange element are connected in series, and the coolant first passes through the second heat exchange element 2 and then passes through the first heat exchange element 1. This connection method is more suitable when the heat generation of the graphics processor is more serious than that of the central processor, which can ensure that the cooling effect of the graphics processor is good and the central processor can also operate normally, with high overall cooling efficiency and fewer pipelines.

[0033] refer to Figure 1 In a preferred embodiment, the liquid inlet conduit 5 and the liquid outlet conduit 6 of the first heat exchanger 1 and the liquid inlet conduit 5 and the liquid outlet conduit 6 of the second heat exchanger 2 are oriented in parallel. In this structure, the liquid inlet conduit 5 and the liquid outlet conduit 6 can be arranged close to both sides of the main body of the first heat exchanger 1, occupying a small space, and can be arranged relatively long, which is convenient for quick connection with the pipeline.

[0034] In a preferred embodiment, the through holes at the bottom of the housing are a plurality of strip-shaped holes arranged at intervals. This structure makes it difficult for the coolant to bubble when it is immersed in the housing.

[0035] refer to Figure 2 In a preferred embodiment, the through holes on the top of the housing are grid-shaped square holes.

[0036] In a preferred embodiment, the total area of ​​the strip-shaped holes at the bottom of the housing is greater than the total area of ​​the grid-shaped square holes at the top of the housing.

[0037] refer to Figure 1 and Figure 2 In a preferred embodiment, the server further comprises a power module 9 electrically connected to the mainboard, wherein the power module 9 is electrically connected to the mainboard and is arranged inside the housing in parallel with the mainboard.

[0038] refer to Figure 1 and Figure 2 A mounting opening is provided on the top of the housing corresponding to the power module 9. One end of the power module 9 provided with an interface extends out of the housing, and a handle 91 is provided on the end.

[0039] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] In the description of this specification, the description with reference to the terms "preferred embodiment", "further embodiment", "other embodiments" or "specific example" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0041] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A server, characterized in that: The invention comprises a server module and a casing; the bottom of the casing is provided with a through hole for the inlet and outlet of cooling liquid, and the top is provided with a through hole for the inlet and outlet of air; the server module comprises a central processing unit, the central processing unit is provided with a first heat exchange component (1), the first heat exchange component (1) is provided with a liquid containing cavity, and the liquid containing cavity is connected to a liquid inlet (3) and a liquid outlet (4) provided on the top of the casing through a heat exchange pipeline.

2. A server according to claim 1, characterized in that: A liquid inlet conduit (5) connected to the liquid containing cavity is provided on one side of the first heat exchange element (1), and a liquid outlet conduit (6) is provided on the other side of the first heat exchange element (1), wherein the liquid inlet conduit (5) and the liquid outlet conduit (6) are oriented in parallel.

3. A server according to claim 1 or 2, characterized in that: The server module also includes a mainboard, the central processing unit and the first heat exchanger (1) are both connected to the mainboard, and the first heat exchanger (1) is attached to the central processing unit; the mainboard is also connected to a graphics processing unit and a second heat exchanger (2) attached to the graphics processing unit, the second heat exchanger (2) having the same structure as the first heat exchanger (1).

4. A server according to claim 3, characterized in that: The heat exchange pipeline comprises a liquid inlet pipe (7) which connects the liquid inlet conduit (5) of the first heat exchange element (1) with the liquid inlet conduit (5) of the second heat exchange element (2) and is connected to the liquid inlet port (3), and a liquid outlet pipe (8) which connects the liquid outlet conduit (6) of the first heat exchange element (1) with the liquid outlet conduit of the second heat exchange element (2) and is connected to the liquid outlet port (4).

5. A server according to claim 4, characterized in that: The liquid inlet conduit (5) and the liquid outlet conduit (6) of the first heat exchange element (1) and the liquid inlet conduit (5) and the liquid outlet conduit (6) of the second heat exchange element (2) are oriented in the same direction.

6. A server according to claim 3, characterized in that: The heat exchange pipeline comprises a first quick-release pipe connecting the liquid inlet conduit (5) of the first heat exchange element (1) and the liquid inlet port (3), a second quick-release pipe connecting the liquid outlet conduit (6) of the first heat exchange element (1) and the liquid inlet conduit (5) of the second heat exchange element (2), and a third quick-release pipe connecting the liquid outlet conduit (6) of the second heat exchange element (2) and the liquid outlet port (4).

7. A server according to claim 3, characterized in that: The heat exchange pipeline comprises a first quick-release pipe connecting the liquid inlet conduit (5) of the second heat exchange element (2) and the liquid inlet port (3), a second quick-release pipe connecting the liquid outlet conduit (6) of the second heat exchange element (2) and the liquid inlet conduit (5) of the first heat exchange element (1), and a third quick-release pipe connecting the liquid outlet conduit (6) of the first heat exchange element (1) and the liquid outlet port (4).

8. A server according to any one of claims 1 or 2 or 4 or 5 or 6 or 7, characterized in that: The total area of ​​the through holes at the top of the housing is greater than the total area of ​​the through holes at the bottom of the housing.

9. A server according to claim 8, characterized in that: The through holes at the bottom of the housing are a plurality of rows of strip-shaped holes arranged at intervals.

10. A server according to any one of claims 1 or 2 or 4 or 5 or 6 or 7, characterized in that: The server further comprises a power module (9) electrically connected to the mainboard, wherein the power module (9) is electrically connected to the mainboard and is arranged inside the housing in parallel with the mainboard.

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