Signal source case, quantum computing measurement and control system and quantum computer

Abstract

The utility model discloses a signal source case, a quantum computing measurement and control system and a quantum computer, and the signal source case comprises a case, and a first side surface of the case is provided with a plurality of first heat dissipation holes; the signal sources are fixed in the case in parallel at intervals; the heat dissipation assemblies are provided with heat dissipation channels, are arranged on the signal sources in a one-to-one correspondence manner and are used for blowing away heat generated by the signal sources along the heat dissipation channels to the first heat dissipation holes opposite to the heat dissipation assemblies to be discharged; and the plurality of heat dissipation channels formed in the plurality of heat dissipation assemblies are arranged in parallel. According to the signal source case, through the arrangement of the first heat dissipation holes and the plurality of heat dissipation assemblies with the heat dissipation channels, heat generated by a plurality of signal sources in the case is blown away to the first heat dissipation holes along the heat dissipation channels to be discharged, and the purpose of heat dissipation is achieved; meanwhile, the plurality of signal sources are arranged in parallel at intervals, and the plurality of heat dissipation channels formed by the plurality of heat dissipation assemblies are arranged in parallel, so that the mutual interference of heat dissipation airflow among the plurality of signal sources is reduced, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a signal source chassis, a quantum computing measurement and control system and a quantum computer. Background Art

[0002] A quantum computer is a physical device that follows the laws of quantum mechanics to perform high-speed mathematical and logical operations, store and process quantum information. It is mainly composed of a quantum measurement and control system, a quantum chip system, a quantum computing environment support system and a quantum computer operating system. The quantum measurement and control system includes a signal source that provides a control signal for each quantum bit in the quantum chip.

[0003] As more and more quantum bits are integrated on quantum chips, the number of signal sources required is also increasing. Since each signal source needs to be connected to the quantum chip by lines, if these signal sources are directly placed in the quantum measurement and control system in a scattered manner, it will cause line confusion and inconvenience for line installation and maintenance. Therefore, multiple signal sources are integrated in the chassis. However, since the signal sources generate heat when working, the heat dissipation problem of the signal sources in the integrated chassis is another problem that needs to be solved urgently.

[0004] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] The utility model aims to provide a signal source chassis with good heat dissipation, a quantum computing measurement and control system and a quantum computer.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] The first aspect of the utility model provides a signal source chassis, comprising:

[0008] A chassis, wherein a first side surface of the chassis is provided with a plurality of first heat dissipation holes;

[0009] A plurality of signal sources fixed in parallel and at intervals in the chassis;

[0010] A plurality of heat dissipation components provided with heat dissipation channels are arranged one by one on the signal source, and are used to dissipate the heat generated by the signal source along the heat dissipation channels to the first heat dissipation holes opposite thereto for discharge; the heat dissipation channels formed by the plurality of heat dissipation components are arranged in parallel.

[0011] The signal source chassis as described above, further, the heat dissipation assembly includes a heat conducting member provided with a heat dissipation channel and a fan;

[0012] The heat conductive member is laid on the signal source and is used to conduct the heat emitted by the signal source to the surface of the heat conductive member;

[0013] The fan is located at one side of the heat-conducting member, and is used to blow the heat on the surface of the heat-conducting member along the heat dissipation channel to the first heat dissipation hole for discharge.

[0014] The signal source chassis as described above, further, the heat conducting member comprises a first substrate and a plurality of heat dissipating fins vertically disposed on the first substrate and arranged in parallel and spaced apart;

[0015] The first substrate is laid on the signal source, and the heat dissipation channel is formed between any two adjacent heat dissipation fins.

[0016] As the signal source chassis described above, further, the first substrate extends outwardly along one end of the heat dissipation fin to form a second substrate, and the fan is fixed on the second substrate so that the air outlet of the fan is arranged relative to the inlet gap of the heat dissipation channel.

[0017] As the signal source chassis described above, further, the heat dissipation assembly also includes a guide cover arranged on the heat conductive member and the fan, and the guide cover is provided with an inlet for the fan to take in air and an outlet for the heat dissipation channel to discharge air.

[0018] The signal source chassis as described above, further, has an air duct provided between the outlet of the air guide cover and the first heat dissipation hole opposite thereto.

[0019] The signal source chassis as described above further includes a voltage stabilizing circuit board arranged in the chassis, which is used to stabilize the received external voltage and output it to the multiple signal sources, and the voltage stabilizing circuit board is arranged close to the second heat dissipation hole; wherein the second heat dissipation hole is arranged on the second side of the chassis opposite to the first side.

[0020] The signal source chassis as described above, further, the heat dissipation fin is in the shape of a long sheet, an S shape, a wave shape, or a broken line shape;

[0021] And / or, the heat dissipation fin is provided with a plurality of protrusions or depressions;

[0022] And / or, a thermally conductive silicone pad is provided between the first substrate and the signal source;

[0023] And / or, the heat conducting member is made of aluminum alloy or copper or copper alloy;

[0024] And / or, the fan comprises a centrifugal fan.

[0025] The second aspect of the utility model provides a quantum computing measurement and control system, comprising the above-mentioned signal source chassis and a signal generation module, wherein the signal generation module outputs a measurement and control signal based on the signal provided by the signal source chassis.

[0026] The third aspect of the utility model provides a quantum computer, comprising the above-mentioned quantum computing measurement and control system and a quantum chip, wherein the quantum chip performs quantum computing tasks according to the measurement and control signals provided by the quantum computing measurement and control system.

[0027] The beneficial effects of the utility model are:

[0028] The signal source chassis of the present application realizes that the heat generated by multiple signal sources in the chassis is blown away along the heat dissipation channel to the first heat dissipation hole for discharge by providing a first heat dissipation hole and multiple heat dissipation components with heat dissipation channels, thereby achieving the purpose of heat dissipation; at the same time, since multiple signal sources are arranged in parallel and spaced apart, and multiple heat dissipation channels formed by multiple heat dissipation components are arranged in parallel, the mutual interference of the heat dissipation airflows between the multiple signal sources is reduced, thereby improving the heat dissipation effect.

[0029] The quantum computing measurement and control system and quantum computer provided by the utility model include the above-mentioned signal source chassis, and therefore have the same beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of a first signal source chassis provided by an embodiment of the utility model;

[0031] Figure 2 A schematic diagram of the three-dimensional structure of a second signal source chassis provided by an embodiment of the utility model;

[0032] Figure 3 A schematic diagram of an exploded structure of the cooperation between a signal source and a heat dissipation component in a second signal source chassis provided by an embodiment of the utility model.

[0033] In the accompanying drawings: 10, chassis; 11, first heat dissipation hole; 12, second heat dissipation hole; 20, signal source; 30, heat dissipation component; 31, heat conductor; 32, fan; 33, air duct; 40, voltage stabilizing circuit board; 50 power adapter; 60, column; 70, thermal conductive silicone pad. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limitations on the present application.

[0035] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0037] Figure 1 A schematic diagram of the three-dimensional structure of a first signal source chassis provided by an embodiment of the utility model (the cover plate is not shown in the figure), such as Figure 1 As shown: The embodiment of the present application discloses a signal source chassis, including: a chassis 10, a first side of the chassis 10 is provided with a plurality of first heat dissipation holes 11; a plurality of signal sources 20 fixed in parallel and at intervals in the chassis 10; a plurality of heat dissipation components 30 with heat dissipation channels, arranged one by one on the signal source 20, for dissipating the heat generated by the signal source 20 along the heat dissipation channels to the first heat dissipation holes 11 opposite thereto for discharge; the heat dissipation channels formed by the plurality of heat dissipation components 30 are arranged in parallel.

[0038] The signal source chassis of the present application realizes that the heat generated by multiple signal sources 20 in the chassis 10 is blown away along the heat dissipation channels to the first heat dissipation holes 11 for discharge, thereby achieving the purpose of heat dissipation; at the same time, since the multiple signal sources 20 are arranged in parallel and spaced apart, the multiple heat dissipation channels formed by the multiple heat dissipation components 30 are arranged in parallel, which reduces the mutual interference of the heat dissipation airflows between the multiple signal sources 20 and improves the heat dissipation effect.

[0039] In this embodiment, the structure of the chassis 10 is not specifically limited. Exemplarily, the chassis 10 is a rectangular structure, which is composed of a box body with an opening at one end and a cover plate arranged at the opening. The box body and the cover plate are detachably connected by screws.

[0040] In this embodiment, the specific arrangement of the multiple signal sources 20 in the box is not limited, and it is only necessary to ensure that they are fixed in parallel and spaced in the box 10. In some implementations of this embodiment, the multiple signal sources 20 can be arranged in an array in the box 10 in sequence along the length or width direction of the box; for example, Figure 1 As shown, four signal sources 20 are arranged in the chassis 10, and the four signal sources 20 are fixed on the bottom plate of the chassis 10 in parallel and spaced apart along the length direction of the chassis 10. In other implementations of this embodiment, when the number of signal sources 20 is large enough, it is also possible to consider arranging multiple layers along the height direction, and the multiple signal sources 20 in each layer are arranged along the length or width direction.

[0041] In this embodiment, the heat dissipation component 30 is not specifically limited. In some implementation methods of this embodiment, the heat dissipation component 30 includes a heat conductor 31 and a fan 32 provided with a heat dissipation channel; the heat conductor 31 is laid on the signal source 20, and is used to conduct the heat emitted by the signal source 20 to the surface of the heat conductor 31; the fan 32 is located on one side of the heat conductor 31, and is used to blow the heat on the surface of the heat conductor 31 along the heat dissipation channel to the first heat dissipation hole 11 for discharge; by setting the heat dissipation component 30 as a combination of the above-mentioned heat conductor 31 and the fan 32, the heat dissipation effect is improved. Specifically, the heat conductor 31 is laid on the signal source 20, so that the heat emitted by the signal source 20 is efficiently conducted to the surface of the heat conductor 31. Since the fan 32 is located on one side of the heat conductor 31, the heat on the surface of the heat conductor 31 is blown away along the heat dissipation channel to the first heat dissipation hole 11 for discharge through the fan 32, thereby realizing the directional discharge of heat along the heat dissipation channel, reducing the mutual interference of the heat dissipation airflows between multiple signal sources 20, and improving the heat dissipation effect.

[0042] In this embodiment, the material of the heat conducting member 31 is not specifically limited. In order to improve the heat conducting effect, the material of the heat conducting member 31 is aluminum alloy or copper or copper alloy.

[0043] In this embodiment, the type of the fan 32 is not specifically limited. In order to improve the heat dissipation effect, the fan 32 is a centrifugal fan.

[0044] In this embodiment, the number and shape of the first heat dissipation holes 11 are not specifically limited, and the first heat dissipation holes 11 can be various shapes such as round, square, waist-shaped, etc. In order to further ensure the heat dissipation effect, multiple groups of first heat dissipation holes 11 are arranged at intervals on the first side surface, and the multiple groups of first heat dissipation holes 11 are arranged one-to-one correspondingly to the multiple signal sources 20, and multiple first heat dissipation holes 11 are arranged in an array in each group, so that the heat of each signal source 20 is ensured to be dissipated from different first heat dissipation holes 11, thereby improving the heat dissipation effect.

[0045] In this embodiment, the structure of the heat conductor 31 is not specifically limited. In some implementations of this embodiment, the heat conductor 31 includes a first substrate and a plurality of parallel and spaced heat dissipation fins vertically arranged on the first substrate; the first substrate is laid on the signal source 20, and the heat dissipation channel is formed between any two adjacent heat dissipation fins; by laying the first substrate on the signal source 20, the heat is fully conducted to the first substrate, and by arranging a plurality of parallel and spaced heat dissipation fins on the first substrate, a plurality of parallel heat dissipation channels are formed on the heat conductor 31, thereby increasing the heat dissipation area and improving the heat dissipation effect.

[0046] In this embodiment, the shape of the heat dissipation flap is not specifically limited, and can be a long piece. In order to increase the heat dissipation area, the heat dissipation flap can be S-shaped, wavy, or folded. In order to further increase the heat dissipation area and improve the heat dissipation effect, the heat dissipation flap is provided with a plurality of protrusions or depressions.

[0047] In the present embodiment, the specific arrangement of the fan 32 on one side of the heat conductor 31 is not limited. In some implementations of the present embodiment, the first substrate extends outward along one end of the heat dissipation fin to form a second substrate, and the fan 32 is fixed on the second substrate so that the air outlet of the fan 32 is arranged relative to the entrance gap of the heat dissipation channel. By arranging the fan 32 on the second substrate formed by extending outward along one end of the heat dissipation fin from the first substrate, not only the integration of the entire heat dissipation assembly 30 is improved, but also the distance between the air outlet of the fan 32 and the entrance of the heat dissipation channel is shortened, thereby ensuring that the wind blown by the fan 32 dissipates the heat in the heat dissipation channel more efficiently, thereby improving the heat dissipation effect.

[0048] In order to further improve the heat dissipation effect, in some implementations of this embodiment, Figure 2 A schematic diagram of the three-dimensional structure of a second signal source chassis provided by an embodiment of the utility model; Figure 3 The schematic diagram of the exploded structure of the signal source 20 and the heat dissipation component 30 in the second signal source chassis provided by the utility model embodiment; Figure 2 and Figure 3 Shown: In Figure 1On the basis of, the heat dissipation assembly 30 also includes a guide cover 33 covered on the heat conductive member 31 and the fan 32, and the guide cover 33 is provided with an inlet for the fan 32 to take in air and an outlet for the heat dissipation channel to discharge air; by providing the heat conductive cover, heat is prevented from being blown away to the space outside the heat conductive cover, so that the heat is more efficiently blown away to the first heat dissipation hole 11, thereby improving the heat dissipation effect.

[0049] In this embodiment, the specific method of laying the first substrate on the signal source 20 is not limited. The first substrate can be directly fixed to the signal source 20 by screws. In order to improve the heat conduction effect, a thermal conductive silicone pad 70 is arranged between the first substrate and the signal source 20.

[0050] In order to further improve the heat dissipation effect, in some implementations of the present embodiment, an air duct is provided between the outlet of the air deflector 33 and the first heat dissipation hole 11 opposite thereto; by providing the air duct, the heat blown out from the heat dissipation channel reaches the first heat dissipation hole 11 along the air duct, preventing the heat from expanding to the space outside the air duct, so that the heat can be further and more efficiently dissipated to the first heat dissipation hole 11, further improving the heat dissipation effect.

[0051] In some implementations of this embodiment, the signal source chassis also includes a voltage stabilizing circuit board 40 disposed in the chassis 10, which is used to stabilize the received external voltage and then output it to the multiple signal sources 20; the voltage stabilizing circuit board 40 is arranged close to the second heat dissipation hole 12; wherein the second heat dissipation hole 12 is arranged on the second side of the chassis 10 opposite to the first side; by arranging the voltage stabilizing circuit board 40 close to the second heat dissipation hole 12, the voltage stabilizing circuit board 40 forms a heat dissipation path opposite to the signal source 20, avoiding the mutual influence between the heat generated by the signal source 20 and the heat generated by the voltage stabilizing circuit board 40, and improving the heat dissipation effect. In order to further improve the heat dissipation effect of the voltage stabilizing circuit board 40, in some implementations of this embodiment, a heat sink is arranged on the voltage stabilizing circuit board 40. By providing a heat sink, the heat dissipation efficiency can be improved to ensure the normal operation of the voltage stabilizing circuit board 40. Specifically, the heat sink includes a bottom plate and a heat sink arranged vertically on the bottom plate, and the bottom plate is fixed on the voltage stabilizing circuit board 40. In order to further improve the heat dissipation effect, the voltage stabilizing circuit board 40 is fixed to the bottom plate of the chassis 10 through the columns 60. Specifically, a plurality of columns 60 are fixed to the bottom plate of the chassis 10. The columns 60 are provided with threaded holes. The voltage stabilizing circuit board 40 is located on the columns 60 and is installed on the columns 60 through screws. By providing the columns 60 and the screws, not only is a detachable connection between the voltage stabilizing circuit board 40 and the bottom plate of the chassis 10 realized, but also the columns 60 also play a role in supporting the voltage stabilizing circuit board 40, so that there is a certain distance between the voltage stabilizing circuit board 40 and the bottom plate of the chassis 10, which is convenient for heat dissipation.

[0052] In this embodiment, the number and shape of the second heat dissipation holes 12 are not specifically limited, and the second heat dissipation holes 12 can be various shapes such as round, square, waist, etc. In order to further ensure the heat dissipation effect, a plurality of the second heat dissipation holes 12 are arranged.

[0053] Furthermore, a power adapter 50 is provided between the voltage stabilizing circuit board 40 and the external voltage; the power adapter 50 is used to process the external voltage. In order to avoid the influence of heat dissipation between the power adapter 50 and the signal source 20, the power adapter 50 is arranged close to the second heat dissipation hole 12, so that the power adapter 50 and the signal source 20 have different heat dissipation paths, thereby improving the overall heat dissipation effect; in order to avoid the influence of heat dissipation between the power adapter 50 and the voltage stabilizing circuit board 40, a plurality of second heat dissipation holes 12 are provided along the length direction of the second side surface, and the power adapter 50 and the voltage stabilizing circuit board 40 are arranged at intervals along the length direction of the second side surface provided with the second heat dissipation holes 12, so that the power adapter 50 and the voltage stabilizing circuit board 40 are close to different second heat dissipation holes 12, so that the power adapter 50 and the voltage stabilizing circuit board 40 have different heat dissipation paths, thereby further improving the overall heat dissipation effect.

[0054] Based on the same application concept, the embodiment of the present application also proposes a quantum computing measurement and control system, including the above-mentioned signal source chassis, and a signal generation module, wherein the signal generation module outputs a measurement and control signal based on the signal provided by the signal source chassis. The quantum measurement and control system of the present application includes the above-mentioned signal source chassis, and therefore has the same beneficial effects as the above-mentioned signal source chassis, which will not be repeated here.

[0055] Based on the same application concept, the embodiment of the present application also proposes a quantum computer, including the above-mentioned quantum computing measurement and control system and a quantum chip, wherein the quantum chip runs a quantum computing task according to the measurement and control signal provided by the quantum computing measurement and control system. The quantum computer of the present application includes the above-mentioned signal source chassis, and therefore has the same beneficial effects as the above-mentioned signal source chassis, which will not be repeated here.

[0056] In the description of this specification, the description with reference to the terms "some embodiments" or "examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0057] The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any technician in the relevant technical field, without departing from the scope of the technical solution of the present invention, may make any equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which shall be deemed as the content of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. A signal source chassis, characterized in that: include: A chassis, wherein a first side surface of the chassis is provided with a plurality of first heat dissipation holes; A plurality of signal sources fixed in parallel and at intervals in the chassis; A plurality of heat dissipation components provided with heat dissipation channels are arranged on the signal source in a one-to-one correspondence, and are used to dissipate the heat generated by the signal source along the heat dissipation channels to the first heat dissipation holes opposite thereto for discharge; The heat dissipation channels formed by the multiple heat dissipation components are arranged in parallel.

2. The signal source chassis according to claim 1, characterized in that: The heat dissipation assembly includes a heat conducting member provided with a heat dissipation channel and a fan; The heat conductive member is laid on the signal source and is used to conduct the heat emitted by the signal source to the surface of the heat conductive member; The fan is located at one side of the heat-conducting member, and is used to blow the heat on the surface of the heat-conducting member along the heat dissipation channel to the first heat dissipation hole for discharge.

3. The signal source chassis according to claim 2, characterized in that: The heat conducting member comprises a first substrate and a plurality of heat dissipating fins vertically disposed on the first substrate and arranged in parallel and spaced apart from each other; The first substrate is laid on the signal source, and the heat dissipation channel is formed between any two adjacent heat dissipation fins.

4. The signal source chassis according to claim 3, characterized in that: The first substrate extends outwardly along one end of the heat dissipation fin to form a second substrate, and the fan is fixed on the second substrate so that the air outlet of the fan is arranged relative to the inlet gap of the heat dissipation channel.

5. The signal source chassis according to claim 4, characterized in that: The heat dissipation assembly further comprises a guide cover which is arranged on the heat conducting member and the fan, and the guide cover is provided with an inlet for air intake of the fan and an outlet for air discharge of the heat dissipation channel.

6. The signal source chassis according to claim 5, characterized in that: An air guide duct is provided between the outlet of the air guide cover and the first heat dissipation hole opposite thereto.

7. The signal source chassis according to any one of claims 1 to 6, characterized in that: It also includes a voltage-stabilizing circuit board arranged in the chassis, which is used to stabilize the received external voltage and output it to the multiple signal sources, and the voltage-stabilizing circuit board is arranged close to the second heat dissipation hole; wherein the second heat dissipation hole is arranged on the second side of the chassis opposite to the first side.

8. The signal source chassis according to any one of claims 3 to 6, characterized in that: The heat dissipation fin is in the shape of a long sheet, an S shape, a wave shape, or a broken line shape; And / or, the heat dissipation fin is provided with a plurality of protrusions or depressions; And / or, a thermally conductive silicone pad is provided between the first substrate and the signal source; And / or, the heat conducting member is made of aluminum alloy or copper or copper alloy; And / or, the fan comprises a centrifugal fan.

9. A quantum computing measurement and control system, characterized in that: It comprises a signal source chassis as described in any one of claims 1 to 8, and a signal generating module, wherein the signal generating module outputs a measurement and control signal based on a signal provided by the signal source chassis.

10. A quantum computer, characterized in that: It includes the quantum computing measurement and control system and quantum chip as described in claim 9, and the quantum chip performs quantum computing tasks according to the measurement and control signals provided by the quantum computing measurement and control system.

Images