Storage chip with installation offset prevention effect

Abstract

The utility model discloses a memory chip with an installation offset prevention effect, which relates to the technical field of memory chips and comprises a PCB (printed circuit board) connecting plate. A connecting joint is arranged on the surface of the front end of the PCB connecting plate, a guide groove is formed in the front surface of the upper end of the PCB connecting plate and is parallel to the PCB connecting plate, guide grooves are formed in the surfaces of the two sides of the PCB connecting plate, limiting telescopic rods are arranged on the inner walls of the guide grooves, and compression springs are arranged on the surfaces of the limiting telescopic rods; according to the storage chip with the installation offset prevention effect, compared with an existing common storage chip, through the arrangement of the guide groove and the guide block, after the storage chip is installed, the storage chip can be conveniently and rapidly installed, the storage chip can be conveniently and rapidly installed, and the installation offset of the storage chip can be effectively prevented. By observing whether the positions of the guide blocks and the guide grooves on the two sides of the PCB penetrate through the installation of the storage chip to be inclined or not, the position of the storage chip can be conveniently and timely adjusted, and normal use of the storage chip is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of storage chips, in particular to a storage chip capable of preventing installation deviation. Background Art

[0002] Storage chips are the specific application of the concept of embedded system chips in the storage industry. Therefore, whether it is a system chip or a storage chip, it is achieved by embedding software in a single chip to achieve multi-function and high performance, as well as support for multiple protocols, multiple hardware and different applications.

[0003] With existing memory chips, if insufficient force is used when installing the memory chip in a specified position, although the connector is inserted, the battery cell is not in complete contact and may shift and tilt, which may damage the memory chip after long-term use.

[0004] Therefore, in view of this, the existing structural deficiencies are studied and improved, and a memory chip with an anti-installation offset effect is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a memory chip capable of preventing installation deviation effect, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a memory chip that prevents installation deviation effect, comprising a PCB connecting plate, a connecting joint is provided on the front end surface of the PCB connecting plate, a guide groove is provided on the upper front surface of the PCB connecting plate, and the guide groove is parallel to the PCB connecting plate, guide grooves are provided on both side surfaces of the PCB connecting plate, and a limiting telescopic rod is provided on the inner wall of the guide groove, and a compression spring is provided on the surface of the limiting telescopic rod, a guide block is provided on the front end of the compression spring, and the guide block is slidably connected to the PCB connecting plate through a sliding groove.

[0007] Preferably, storage particles are mounted on the upper surface of the PCB connecting plate, and the storage particles are evenly arranged.

[0008] Preferably, a rotating device is installed on the rear surface of the upper end of the PCB connecting plate, and the rotating device consists of a supporting plate and a rotating rod.

[0009] Preferably, a heat sink is provided on the surface of the rotating device, and a lifting plate is provided at the front end of the heat sink.

[0010] Preferably, a positive magnetic block is provided at the lower end of the lifting plate, and a negative magnetic block is provided on the upper end surface of the PCB connecting plate, and the negative magnetic block is magnetically connected to the positive magnetic block.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. The utility model provides a PCB connection plate, a connection joint, a guide groove, a sliding groove, a limit telescopic rod, a compression spring and a guide block. Through the provision of the guide groove and the guide block, after the memory chip is installed using the connection joint, the position of the guide blocks provided on both sides of the PCB in the guide groove can be compared to observe whether the memory chip is tilted, thereby ensuring the correct installation of the memory chip;

[0013] 2. The utility model arranges storage particles, a rotating device, a heat sink, a lifting plate, a positive magnetic block and a negative magnetic block. Through the arrangement of the heat sink, the storage particles during operation can be cooled to ensure the service life of the storage particles. Through the arrangement of the lifting plate, the heat sink can be flipped through the rotating device to facilitate observation of the storage particles, and the removal of the PCB connecting plate can also be facilitated. Through the arrangement of the positive magnetic block and the negative magnetic block, the heat sink can be fixed on the surface of the storage particles. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0015] Figure 2 For this utility model Figure 1 The enlarged structural diagram at A in the middle;

[0016] Figure 3 It is a schematic diagram of the three-dimensional structure of the storage chip of the utility model.

[0017] In the figure: 1. PCB connecting plate; 101. connecting joint; 2. guide groove; 201. sliding groove; 202. limiting telescopic rod; 203. compression spring; 204. guide block; 3. storage particles; 301. rotating device; 302. heat sink; 303. lifting plate; 304. positive magnetic block; 305. negative magnetic block. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] like Figure 1-Figure 2As shown, a memory chip that prevents installation deviation effect includes a connection joint 101 arranged on the front end surface of a PCB connection board 1, and a guide groove 2 is opened on the upper front surface of the PCB connection board 1, and the guide groove 2 is parallel to the PCB connection board 1. The advantage of this arrangement is that through the arrangement of the guide groove 2, it can be observed whether the memory chip is tilted.

[0020] Furthermore, guide grooves 2 are provided on the two side surfaces of the PCB connecting plate 1, and the inner wall of the guide groove 2 is provided with a limiting telescopic rod 202, and the surface of the limiting telescopic rod 202 is provided with a compression spring 203. The advantage of this arrangement is that the position of the guide block 204 can be adjusted by setting the compression spring 203.

[0021] Furthermore, a guide block 204 is provided at the front end of the compression spring 203, and the guide block 204 is slidably connected to the PCB connecting plate 1 through a sliding groove 201. The advantage of this arrangement is that, through the arrangement of the guide groove 2 and the guide block 204, after the memory chip is installed using the connecting connector 101, the positions of the guide blocks 204 provided at both ends of the PCB in the guide groove 2 can be compared to observe whether the memory chip is tilted, thereby ensuring the correct installation of the memory chip.

[0022] like Figure 3 As shown, storage particles 3 are installed on the upper surface of the PCB connecting plate 1, and the storage particles 3 are evenly arranged. The advantage of this arrangement is that the heat dissipation of the storage particles 3 is facilitated by the evenly arranged storage particles 3.

[0023] Furthermore, a rotating device 301 is installed on the rear surface of the upper end of the PCB connecting plate 1, and the rotating device 301 is composed of a supporting plate and a rotating rod. A heat sink 302 is arranged on the surface of the rotating device 301, and a lifting plate 303 is arranged at the front end of the heat sink 302. The advantage of this arrangement is that, through the arrangement of the heat sink 302, the storage particles 3 can be cooled during operation to ensure the service life of the storage particles 3. Through the arrangement of the lifting plate 303, the heat sink 302 can be flipped through the rotating device 301 to facilitate the observation of the storage particles 3, and it can also facilitate the removal of the PCB connecting plate 1.

[0024] Furthermore, a positive magnetic block 304 is provided at the lower end of the lifting plate 303, and a negative magnetic block 305 is provided on the upper end surface of the PCB connecting plate 1, and the negative magnetic block 305 and the positive magnetic block 304 are magnetically connected. The advantage of this arrangement is that the heat sink 302 can be fixed on the surface of the storage particles 3 through the arrangement of the positive magnetic block 304 and the negative magnetic block 305.

[0025] Working principle: When using the memory chip with the anti-installation offset effect, first, insert the PCB connection board 1 with the connection joint 101 into the position of the connection port, and at the same time, the guide block 204 contacts both sides of the connection port, and press down the compression spring 203 to move along the sliding groove 201. After the installation is completed, observe and compare the positions of the guide blocks 204 set on both sides of the PCB in the guide groove 2, and observe whether the memory chip is tilted to ensure the correct insertion of the memory chip. When the memory chip needs to be taken out, pull the lifting plate 303 upward to separate the positive magnetic block 304 from the negative magnetic block 305, drive the heat sink 302 to open along the rotating device 301, increase the length of the memory chip, and facilitate the removal of the memory chip. This is the working principle of the memory chip with the anti-installation offset effect.

Claims

1. A memory chip for preventing installation deviation, comprising a PCB connecting plate (1), characterized in that: The front end surface of the PCB connecting plate (1) is provided with a connecting joint (101), and the upper front surface of the PCB connecting plate (1) is provided with a guide groove (2), and the guide groove (2) is parallel to the PCB connecting plate (1), and the two side surfaces of the PCB connecting plate (1) are provided with guide grooves (2), and the inner wall of the guide groove (2) is provided with a limit telescopic rod (202), and the surface of the limit telescopic rod (202) is provided with a compression spring (203), and the front end of the compression spring (203) is provided with a guide block (204), and the guide block (204) is slidably connected to the PCB connecting plate (1) via a sliding groove (201).

2. The memory chip for preventing installation deviation effect according to claim 1, characterized in that: Storage particles (3) are mounted on the upper surface of the PCB connecting plate (1), and the storage particles (3) are evenly arranged.

3. The memory chip for preventing installation deviation effect according to claim 1, characterized in that: A rotating device (301) is installed on the rear surface of the upper end of the PCB connecting plate (1), and the rotating device (301) consists of a supporting plate and a rotating rod.

4. The memory chip for preventing installation deviation effect according to claim 3, characterized in that: A heat dissipation plate (302) is provided on the surface of the rotating device (301), and a lifting plate (303) is provided at the front end of the heat dissipation plate (302).

5. The memory chip for preventing installation deviation effect according to claim 4, characterized in that: A positive magnetic block (304) is provided at the lower end of the lifting plate (303), and a negative magnetic block (305) is provided on the upper end surface of the PCB connecting plate (1), and the negative magnetic block (305) and the positive magnetic block (304) are magnetically connected.

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