Assembly structure of camera module

By first fixing the lens to the base during the assembly of the camera module, and cleaning debris before being mounted to the PCB board, the problem of dirt and dirt in the prior art is solved, and the imaging effect and quality are improved.

CN222638594UActive Publication Date: 2025-03-18TRULY OPTO ELECTRONICS
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Patent Information

Application Number
CN202421119530.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-21
Publication Date
2025-03-18
Estimated Expiration
2034-05-21

AI Technical Summary

Technical Problem

In the existing camera module assembly solution, the dust spots generated when the base is mounted on the substrate are difficult to remove, resulting in the formation of stains and affecting the imaging effect and quality.

Method used

By first making the lens fixedly connect with the base, then load the base onto the PCB board. When connecting the lens to the base, use self-solid glue to absorb debris, and clean the debris in the base after debugging the focal length to prevent stains from falling on the surface of the chip.

Benefits of technology

It effectively prevents dust spots from falling onto the chip surface, improving the imaging effect and quality of the camera module.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222638594U_ABST
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Abstract

The utility model discloses an assembly structure of a camera module, which comprises a camera module body, the camera module body comprises a PCB and a chip arranged on the PCB, a base and a lens are sequentially arranged above the chip, the lens is fixed with the base and then carried on the PCB, and the camera module body is arranged on the PCB. The lens is in threaded connection with the base, and a locking structure for threaded connection is arranged between the lens and the base. The assembling structure has the effects that the lens and the base are fixed through the locking structure, chips generated during fixing are removed, and then the lens and the base are carried on the PCB, so that the chips are prevented from falling onto the surface of the chip to influence the imaging quality.
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Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to an assembly structure of a camera module. Background Art

[0002] The camera module is composed of capacitors, chips, components, connectors, flexible circuit boards, lens + holder integrated materials and other main components. Conventional camera module assembly solutions are mostly assembled from bottom to top according to the module structure, that is, first from the substrate, electronic components SMT to the substrate, the base is mounted on the substrate, the lens is locked on the base for focusing, and then glue is dispensed and cured.

[0003] Since the base is first mounted on the substrate, the dust and dirt generated when the lens is locked to the base cannot be removed, and thus fall onto the surface of the chip, forming stains, which affect the imaging effect and quality of the camera module. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide an assembly structure of a camera module.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] An assembly structure of a camera module includes: a camera module body, the camera module body includes a PCB board and a chip arranged on the PCB board, a base and a lens are arranged above the chip in sequence, the lens is first fixed to the base and then mounted on the PCB board, the lens is threadedly connected to the base, and a locking structure for threaded connection is arranged between the lens and the base.

[0007] In one embodiment, the lens includes a shell and a lens disposed on the shell, the lens is installed at a top middle position of the shell, and the shell is threadedly connected to the base.

[0008] In one embodiment, the locking structure includes a circle of internal threads arranged on the inner side of the bottom of the shell and a circle of external threads arranged on the outer side of the top of the base, the top of the base extends into the bottom of the shell, and the external threads are threadedly connected to the internal threads.

[0009] In one embodiment, a circle of self-solidifying glue is coated on the internal thread on the inner side of the shell, and the self-solidifying glue is used to adhere to debris when the shell is threadedly connected to the base.

[0010] In one embodiment, the base is mounted on the PCB board, and a positioning component for positioning is provided between the base and the PCB board.

[0011] In one embodiment, the positioning assembly includes a positioning column disposed at the bottom of the base and a positioning hole opened on the PCB board, and the positioning column is correspondingly inserted into the positioning hole.

[0012] In one embodiment, the chip is located at the head position of the PCB board, the base and the lens are both located directly above the chip, and the base and the lens are both located at the head position of the PCB board.

[0013] In one embodiment, a receiving cavity is provided in the shell, the base is hollow, the receiving cavity is communicated with the base, and the chip is located in the base.

[0014] In one embodiment, a filter is disposed on the upper surface of the chip, and the filter is adhered to the upper surface of the chip by optical glue.

[0015] In one embodiment, the locking structure includes a first flange sleeved outside the shell, a second flange sleeved outside the base, and bolts passing between the first flange and the second flange.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The utility model provides an assembly structure of a camera module by first connecting the lens to the base, and then mounting the base on the PCB board. When the lens is connected to the base, debris is adsorbed by self-solidifying glue, and after adjusting the focal length, the debris in the base is cleaned and then mounted on the PCB board to prevent the debris from falling onto the chip surface and affecting the imaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 A schematic diagram of the assembly structure of a camera module provided by the utility model;

[0020] Figure 2 A schematic cross-sectional view of the assembly structure of a camera module provided by the utility model;

[0021] Figure 3 This is a schematic cross-sectional structure diagram of Example 2 in the assembly structure of a camera module provided by the utility model.

[0022] Description of the drawings: 10. Camera module body; 20. PCB board; 21. Positioning hole; 30. Chip; 40. Base; 41. External thread; 42. Positioning column; 50. Lens; 51. Shell; 511. Internal thread; 52. Lens; 53. Accommodating cavity; 60. Self-solidifying glue; 70. Filter; 80. First flange; 90. Second flange; 100. Bolt. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0024] Embodiment 1: An assembly structure of a camera module, referring to Figure 1 and Figure 2 , including a camera module body 10, the camera module body 10 includes a PCB board 20 and a chip 30 arranged on the PCB board 20, and the chip 30 is a photosensitive chip 30. The chip 30 is located at the head position of the PCB board 20, and the chip 30 is electrically connected to the PCB board 20. A base 40 is arranged above the chip 30, and a lens 50 is connected above the base 40. The base 40 is mounted on the PCB board 20, and the base 40 and the lens 50 are both located directly above the chip 30, and the base 40 and the lens 50 are both located at the head position of the PCB board 20. After the lens 50 is fixedly connected to the base 40, the base 40 is then mounted on the PCB board 20.

[0025] Reference Figure 2 The lens 50 is threadedly connected to the base 40. The lens 50 includes a housing 51 and a lens 52 disposed on the housing 51. The lens 52 is installed at the top middle position of the housing 51. The housing 51 is used to support the lens 52 directly above the chip 30. A receiving cavity 53 is provided in the housing 51, and the base 40 is hollow. The receiving cavity 53 is communicated with the base 40.

[0026] Reference Figure 2 A locking structure for threaded connection is provided between the bottom of the housing 51 and the top of the base 40. The locking structure includes a circle of internal threads 511 provided on the inner side of the bottom of the housing 51 and a circle of external threads 41 provided on the outer side of the top of the base 40. The top of the base 40 extends into the bottom of the housing 51. The external threads 41 and the internal threads 511 are threadedly connected to achieve the connection and fixation between the housing 51 and the base 40. The lens 50 is first connected to the base 40, and then the base 40 is mounted on the PCB board 20. After the lens 50 is connected to the base 40 and the focal length is adjusted, the generated debris is cleaned and then mounted on the PCB board 20 to prevent the debris from falling onto the surface of the chip 30 and affecting the imaging quality.

[0027] Further, refer to Figure 2A circle of self-solidifying glue 60 is coated on the inner thread 511 of the housing 51. The self-solidifying glue 60 is used to adhere to the debris generated by friction when the housing 51 and the base 40 are threadedly connected, so that dust and dirt fall onto the chip 30, affecting the imaging effect. After the housing 51 and the base 40 are locked, the inside of the base 40 is blown clean with a high-pressure air gun to remove the debris that the self-solidifying glue 60 did not stick to.

[0028] Reference Figure 2 After the lens 50 is locked with the base 40, it is mounted on the upper surface of the PCB board 20, and the chip 30 is located in the base 40, so that the lens 50 and the base 40 are located directly above the chip 30. A positioning assembly for positioning is provided between the base 40 and the PCB board 20. The positioning assembly includes a positioning column 42 provided at the bottom of the base 40 and a positioning hole 21 provided on the PCB board 20. The positioning column 42 is correspondingly provided in the positioning hole 21 to position the position of the base 40, thereby determining the position of the base 40 and the lens 50, which is convenient for further fixing.

[0029] Further, refer to Figure 2 A filter 70 is disposed on the upper surface of the chip 30 , and the filter 70 is adhered to the upper surface of the chip 30 by optical glue.

[0030] Embodiment 2:

[0031] The difference between this embodiment and embodiment 1 is that the locking structure is different.

[0032] Reference Figure 3 The locking structure includes a first flange 80 sleeved on the outside of the shell 51, a second flange 90 sleeved on the outside of the base 40, and bolts 100 passing between the first flange 80 and the second flange 90. The first flange 80 and the second flange 90 are locked and abutted against each other by the bolts 100, so that the shell 51 and the base 40 are fixed.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An assembly structure of a camera module, characterized in that: include: A camera module body (10), the camera module body (10) comprising a PCB board (20) and a chip (30) arranged on the PCB board (20), a base (40) and a lens (50) being arranged in sequence above the chip (30), the lens (50) being first fixed to the base (40) and then mounted on the PCB board (20), the lens (50) being threadedly connected to the base (40), and a locking structure for threaded connection being arranged between the lens (50) and the base (40).

2. The assembly structure of a camera module according to claim 1, characterized in that: The lens (50) comprises a shell (51) and a lens (52) arranged on the shell (51); the lens (52) is installed at the middle position of the top of the shell (51); and the shell (51) is threadedly connected to the base (40).

3. The assembly structure of a camera module according to claim 2, characterized in that: The locking structure comprises a circle of internal threads (511) arranged on the inner side of the bottom of the shell (51) and a circle of external threads (41) arranged on the outer side of the top of the base (40), the top of the base (40) extends into the bottom of the shell (51), and the external threads (41) are threadedly connected to the internal threads (511).

4. The assembly structure of a camera module according to claim 3, characterized in that: A circle of self-solidifying glue (60) is coated on the internal thread (511) on the inner side of the shell (51), and the self-solidifying glue (60) is used to adhere to debris when the shell (51) and the base (40) are threadedly connected.

5. The assembly structure of a camera module according to claim 4, characterized in that: The base (40) is mounted on the PCB board (20), and a positioning component for positioning is provided between the base (40) and the PCB board (20).

6. The assembly structure of a camera module according to claim 5, characterized in that: The positioning assembly comprises a positioning column (42) arranged at the bottom of the base (40) and a positioning hole (21) opened on the PCB board (20), and the positioning column (42) is correspondingly inserted into the positioning hole (21).

7. The assembly structure of a camera module according to claim 6, characterized in that: The chip (30) is located at the head position of the PCB board (20), the base (40) and the lens (50) are both located directly above the chip (30), and the base (40) and the lens (50) are both located at the head position of the PCB board (20).

8. The assembly structure of a camera module according to claim 7, characterized in that: The housing (51) is provided with a receiving cavity (53); the base (40) is hollow; the receiving cavity (53) is communicated with the base (40); and the chip (30) is located in the base (40).

9. The assembly structure of a camera module according to claim 8, characterized in that: The upper surface of the chip (30) is provided with a filter (70), and the filter (70) is adhered to the upper surface of the chip (30) by optical glue.

10. The assembly structure of a camera module according to claim 2, characterized in that: The locking structure comprises a first flange (80) sleeved on the outside of the housing (51), a second flange (90) sleeved on the outside of the base (40), and a bolt (100) passing between the first flange (80) and the second flange (90).