Camera module with curved surface photosensitive chip

By designing a curved photosensitive chip in the camera module to match its curved surface with the lens imaging surface, the problem of mismatch between the planar photosensitive chip and the curved lens is solved, the imaging effect is improved and manufacturing difficulty is reduced.

CN222638597UActive Publication Date: 2025-03-18TRULY OPTO ELECTRONICS
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Patent Information

Application Number
CN202421180816.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-27
Publication Date
2025-03-18
Estimated Expiration
2034-05-27

AI Technical Summary

Technical Problem

In the existing camera modules, the plane photosensitive chip does not match the imaging surface of the curved lens, resulting in high requirements for optical design and manufacturing accuracy, affecting the quality and yield of the camera module.

Method used

A camera module with a curved photosensitive chip is designed. The curved surface part of the photosensitive chip coincides with the curved imaging surface of the lens, and the radius of curvature is equal, which can receive more light and improve the imaging effect.

Benefits of technology

Through the design of curved photosensitive chips, the imaging effect of the camera module is improved, the requirements for optical design and manufacturing accuracy are reduced, and the production process is simplified.

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Abstract

The utility model discloses a camera module with a curved surface photosensitive chip, which comprises a substrate, a base and a lens, the base and the lens are carried on the substrate, the photosensitive chip is bound on the substrate, the lens is positioned right above the photosensitive chip, and the top of the photosensitive chip is curved and is used for receiving more light rays coming from the lens. The camera module has the advantages that the curved photosensitive chip is arranged to coincide with the curved imaging surface of the lens, and the optical design difficulty of the camera module is reduced.
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