Camera module with curved surface photosensitive chip
By designing a curved photosensitive chip in the camera module to match its curved surface with the lens imaging surface, the problem of mismatch between the planar photosensitive chip and the curved lens is solved, the imaging effect is improved and manufacturing difficulty is reduced.
Patent Information
- Application Number
- CN202421180816.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-05-27
AI Technical Summary
In the existing camera modules, the plane photosensitive chip does not match the imaging surface of the curved lens, resulting in high requirements for optical design and manufacturing accuracy, affecting the quality and yield of the camera module.
A camera module with a curved photosensitive chip is designed. The curved surface part of the photosensitive chip coincides with the curved imaging surface of the lens, and the radius of curvature is equal, which can receive more light and improve the imaging effect.
Through the design of curved photosensitive chips, the imaging effect of the camera module is improved, the requirements for optical design and manufacturing accuracy are reduced, and the production process is simplified.