Heat dissipation structure of camera module
By covering the thermal glue on the PCB board of the camera module and setting the heat dissipation structure of the iron frame, the problem of heating of the camera module is solved, extending the service cycle and improving optical performance.
Patent Information
- Application Number
- CN202421119523.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-21
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-05-21
AI Technical Summary
The camera module is prone to heat up during work, especially high-pixel modules. Long-term high temperatures will cause the module material to age, shorten the service life and affect optical performance.
A heat dissipation structure of an imaging module is designed, and the heat conduction glue is covered on the PCB board to cover the periphery of multiple electronic components, and an iron frame is arranged on one side of the PCB board, and the iron frame is in contact with the thermal conduction glue to derive the heat of the electronic components.
It effectively reduces the temperature of the camera module, extends the service cycle of the module, improves optical performance, and reduces variations in noise and clarity.
Smart Images
Figure CN222638611U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of camera modules, in particular to a heat dissipation structure of a camera module. Background Art
[0002] The camera module is composed of capacitors, chips, components, connectors, flexible circuit boards, lens + holder integrated materials and other main components. Conventional camera module assembly solutions are mostly assembled from bottom to top according to the module structure, that is, first from the substrate, electronic components SMT to the substrate, the base is mounted on the substrate, the lens is locked on the base for focusing, and then glue is dispensed and cured. The camera module is prone to heat when working, especially the high-pixel module, which can reach a high temperature of 70°C after being lit for a few minutes. If the camera module works under high temperature for a long time, it will easily accelerate the aging of the module material, shorten the service life of the module, and affect the overall optical performance of the camera module, such as display noise, clarity MTF variation, and displacement of the clear distance.
[0003] The main source of heat in the camera module comes from electronic components such as photosensitive chips, boost ICs, and voltage regulator ICs. The heat emitted by electronic components can easily affect the performance of the camera module. Utility Model Content
[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a heat dissipation structure of a camera module.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A heat dissipation structure of a camera module is applied to a camera module body, wherein the camera module body comprises a PCB board and a lens arranged on the PCB board, wherein a plurality of electronic components are arranged on the PCB board, wherein the plurality of electronic components are bound to the PCB board, wherein the PCB board is covered with a thermal conductive adhesive for heat conduction, wherein an iron frame is arranged on one side of the PCB board, wherein the iron frame is located on the side of the PCB board where the plurality of electronic components are arranged, and wherein the thermal conductive adhesive is in contact with the iron frame.
[0007] In one embodiment, the thermal conductive adhesive is coated on the periphery of the plurality of electronic components in a fully surrounding manner.
[0008] In one embodiment, the thickness of the thermal conductive adhesive is 0.3 mm-0.5 mm.
[0009] In one embodiment, the iron frame is folded inward at one end toward the PCB board to surround the periphery of the multiple electronic components, the end surface of the iron frame facing the PCB board is in contact with the PCB board, and the side of the iron frame facing the multiple electronic components is in contact with the thermal conductive adhesive around the periphery of the multiple electronic components.
[0010] In one embodiment, the thickness of the iron frame is 0.1 mm-0.2 mm.
[0011] In one embodiment, a fixing component for connecting and fixing is provided between the iron frame and the PCB board, and the fixing component is located at a contact position between the iron frame and the PCB board.
[0012] In one embodiment, the fixing component includes a protrusion arranged on the iron frame and a groove opened on the PCB board, the protrusion is located on an end surface of the iron frame facing the PCB board, the position of the groove corresponds to the position of the protrusion, and the protrusion can be embedded in the groove.
[0013] In one embodiment, the groove is a copper leakage area of the PCB board.
[0014] In one embodiment, there are multiple protrusions on the iron frame, and the multiple protrusions are arranged on the contact surface between the iron frame and the PCB board along the circumferential direction of the iron frame. The PCB board is correspondingly provided with multiple grooves, and the multiple protrusions are embedded in the multiple grooves.
[0015] In one embodiment, the plurality of bumps and the plurality of grooves are reinforced by soldering.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] 1. The heat dissipation structure of a camera module of the utility model is provided with a heat conductive adhesive covering the periphery of multiple electronic components to conduct the heat of the electronic components. An iron frame is provided on one side of the PCB board, and the iron frame is in contact with the heat conductive adhesive on the periphery of multiple electronic components, so that the heat generated by the multiple electronic components can be conducted to the iron frame through the heat conductive adhesive for release;
[0018] 2. The heat dissipation structure of a camera module of the utility model fixes the PCB board and the iron frame by setting a fixing component, and the iron frame contacts the copper leakage area on the PCB board, so that the static electricity on the PCB board can be guided out to achieve the EMI effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0020] Figure 1 A schematic diagram of the heat dissipation structure of a camera module provided by the utility model;
[0021] Figure 2 A schematic diagram of a top view of a PCB board in a heat dissipation structure of a camera module provided by the utility model;
[0022] Figure 3 for Figure 1 Enlarged schematic diagram of part A.
[0023] Description of the drawings: 10. Camera module body; 20. PCB board; 21. Groove; 30. Lens; 40. Electronic components; 50. Thermal conductive adhesive; 60. Iron frame; 61. Bump. DETAILED DESCRIPTION
[0024] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0025] A heat dissipation structure of a camera module, referring to Figure 1 , applied to a camera module body 10, the camera module body 10 includes a PCB board 20 and a lens 30 arranged on the PCB board 20, a photosensitive chip is arranged on the PCB board 20, and the photosensitive chip is located at the head position of the PCB board 20. The lens 30 is mounted above the photosensitive chip, and the lens 30 is located at the head position of the PCB board 20.
[0026] Reference Figure 1 and Figure 2 , a plurality of electronic components 40 are arranged on the PCB board 20, and the plurality of electronic components 40 are bound to the PCB board 20, and the plurality of electronic components 40 include a boost IC and a voltage regulator IC, etc. When the camera module body 10 is working, the plurality of electronic components 40 will emit a large amount of heat, thereby affecting the performance of the camera module body 10. Therefore, a thermal conductive adhesive 50 for heat dissipation is arranged on the PCB board 20, and the thermal conductive adhesive 50 covers the surface of the PCB board 20, and the thermal conductive adhesive 50 is coated on the periphery of the electronic components 40, and the thermal conductive adhesive 50 is fully coated on the periphery of the plurality of electronic components 40, so that the areas of the plurality of electronic components 40 exposed to the outside are covered by the thermal conductive adhesive 50. The thermal conductive adhesive 50 can export the heat of the plurality of electronic components 40 and dissipate it in time.
[0027] Further, refer to Figure 1 The thickness of the thermal conductive adhesive 50 is 0.3 mm to 0.5 mm. The thermal conductive adhesive 50 with a certain thickness surrounds the plurality of electronic components 40 to conduct away the heat generated by the electronic components 40.
[0028] Reference Figure 1, an iron frame 60 is provided on one side of the PCB board 20, and the iron frame 60 is located on one side of the PCB board 20 where multiple electronic components 40 are provided, and the iron frame 60 is in contact with the PCB board 20 and the multiple electronic components 40. The iron frame 60 is folded inward at one end facing the PCB board 20 to surround the periphery of the multiple electronic components 40, and the end surface of the iron frame 60 facing the PCB board 20 is in contact with the PCB board 20. The iron frame 60 surrounds the periphery of the multiple electronic components 40, and the side of the iron frame 60 facing the multiple electronic components 40 is in contact with the thermal conductive glue 50 on the periphery of the multiple electronic components 40, and the iron frame 60 is in contact with the thermal conductive glue 50 flatly, so that the heat generated by the multiple electronic components 40 can be conducted to the iron frame 60 through the thermal conductive glue 50 for release.
[0029] Reference Figure 1 The iron frame 60 is made of metal material with good heat dissipation effect. In this embodiment, the iron frame 60 can also be replaced with an aluminum alloy material with better heat dissipation effect.
[0030] Reference Figure 1 and Figure 3 A fixing assembly for connecting and fixing is provided between the iron frame 60 and the PCB board 20. The iron frame 60 and the PCB board 20 are connected by the fixing assembly so that the iron frame 60 can export the heat of multiple electronic components 40 on the PCB board 20, thereby ensuring the performance of the camera module body 10.
[0031] Reference Figure 1 and Figure 3 The fixing assembly includes a protrusion 61 disposed on the iron frame 60 and a groove 21 opened on the PCB board 20, and the fixing assembly is located at the contact position between the iron frame 60 and the PCB board 20. The protrusion 61 is located on one end face of the iron frame 60 facing the PCB board 20, and the protrusion 61 is in a straight line protruding from the end face of the iron frame 60. The groove 21 is a copper leakage area of the PCB board 20, and the groove 21 on the PCB board 20 is opened in a straight line. The position of the groove 21 corresponds to the position of the protrusion 61, and the protrusion 61 can be embedded in the groove 21, so that the iron frame 60 and the PCB board 20 are connected and fixed.
[0032] Reference Figure 1 and Figure 3The iron frame 60 is surrounded on all sides and arranged outside the plurality of electronic components 40. The end face of the iron frame 60 contacts the PCB board 20. The thickness of the iron frame 60 is 0.1mm-0.2mm. There are a plurality of protrusions 61 on the iron frame 60. The plurality of protrusions 61 are arranged on the contact surface between the iron frame 60 and the PCB board 20 along the circumferential direction of the iron frame 60. A plurality of grooves 21 are correspondingly provided on the PCB board 20. The plurality of grooves 21 are correspondingly arranged with the plurality of protrusions 61, and the plurality of protrusions 61 are embedded with the plurality of grooves 21. The number of protrusions 61 and the grooves 21 is determined according to the size of the iron frame 60 and the PCB board 20. The reference number is 6-10. The plurality of grooves 21 are respectively located near the plurality of outer edges of the PCB board 20. The plurality of protrusions 61 are correspondingly arranged on the end face where the iron frame 60 contacts the PCB board 20.
[0033] Further, refer to Figure 1 and Figure 3 The plurality of bumps 61 and the plurality of grooves 21 are reinforced by soldering, so that the bumps 61 are fixed in the grooves 21, so as to further improve the connectivity between the iron frame 60 and the PCB board 20.
[0034] Reference Figure 1 The side of the iron frame 60 facing the multiple electronic components 40 contacts the thermal conductive adhesive 50 on the periphery of the multiple electronic components 40, so that the heat generated by the multiple electronic components 40 can be conducted to the iron frame 60 through the thermal conductive adhesive 50 for release. The iron frame 60 also contacts the copper leakage area on the PCB board 20, so that the static electricity on the PCB board 20 can be guided out, achieving the EMI effect.
[0035] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A heat dissipation structure of a camera module, characterized in that: The invention is applied to a camera module body (10), wherein the camera module body (10) comprises a PCB board (20) and a lens (30) arranged on the PCB board (20), wherein a plurality of electronic components (40) are arranged on the PCB board (20), wherein the plurality of electronic components (40) are bound to the PCB board (20), wherein the PCB board (20) is covered with a heat-conducting adhesive (50) for heat conduction, wherein an iron frame (60) is arranged on one side of the PCB board (20), wherein the iron frame (60) is located on the side of the PCB board (20) where the plurality of electronic components (40) are arranged, and wherein the heat-conducting adhesive (50) is in contact with the iron frame (60).
2. The heat dissipation structure of a camera module according to claim 1, characterized in that: The thermal conductive adhesive (50) is coated on the periphery of the plurality of electronic components (40) in a fully surrounding manner.
3. The heat dissipation structure of a camera module according to claim 2, characterized in that: The thickness of the thermal conductive adhesive (50) is 0.3 mm-0.5 mm.
4. The heat dissipation structure of a camera module according to claim 3, characterized in that: One end of the iron frame (60) is folded inward toward the PCB board (20) to surround the periphery of the plurality of electronic components (40); one end surface of the iron frame (60) facing the PCB board (20) is in contact with the PCB board (20); and one side of the iron frame (60) facing the plurality of electronic components (40) is in contact with the thermal conductive adhesive (50) at the periphery of the plurality of electronic components (40).
5. The heat dissipation structure of a camera module according to claim 4, characterized in that: The thickness of the iron frame (60) is 0.1 mm-0.2 mm.
6. The heat dissipation structure of a camera module according to claim 5, characterized in that: A fixing component for connecting and fixing is provided between the iron frame (60) and the PCB board (20), and the fixing component is located at a contact position between the iron frame (60) and the PCB board (20).
7. The heat dissipation structure of a camera module according to claim 6, characterized in that: The fixing assembly comprises a protrusion (61) arranged on the iron frame (60) and a groove (21) opened on the PCB board (20); the protrusion (61) is located on an end surface of the iron frame (60) facing the PCB board (20); the position of the groove (21) corresponds to the position of the protrusion (61); and the protrusion (61) can be embedded in the groove (21).
8. The heat dissipation structure of a camera module according to claim 7, characterized in that: The groove (21) is a copper leakage area of the PCB board (20).
9. The heat dissipation structure of a camera module according to claim 8, characterized in that: There are a plurality of protrusions (61) on the iron frame (60), and the plurality of protrusions (61) are arranged on the contact surface between the iron frame (60) and the PCB board (20) along the circumferential direction of the iron frame (60). There are a plurality of corresponding grooves (21) on the PCB board (20), and the plurality of protrusions (61) are embedded in the plurality of grooves (21).
10. The heat dissipation structure of a camera module according to claim 9, characterized in that: The plurality of protrusions (61) and the plurality of grooves (21) are reinforced by soldering.