Novel semiconductor radio frequency power supply water cooling plate

Abstract

The utility model discloses a novel semiconductor radio frequency power supply water cooling plate, the novel semiconductor radio frequency power supply water cooling plate comprises a substrate and a water channel cover plate, the substrate is provided with a recessed water channel, the shape of the water channel cover plate is the same as the shape of the water channel, the water channel cover plate covers the water channel to form a water cooling water channel, and the substrate is welded with the abutted seam of the water channel cover plate through friction welding. The water tank is processed on the substrate, and the water channel cover plate is welded and covered on the top of the water tank through friction welding, so that structural integration of the water cooling plate is realized, cooling liquid in the water cooling plate can be in direct contact with the substrate and the water channel cover plate, and the heat conduction performance is relatively good. And the water cooling plate welded by friction welding can have a larger flow channel, so that the thermal resistance is further reduced. And particularly, the water cooling device is more flexible to cope with complex flow channels and certain flow channels with height difference, and is particularly suitable for water cooling plates with smaller or particularly large sizes, or the water cooling plates with more complex and fine water channel design can be better realized by adopting a friction welding process.

Description

Technical Field

[0001] The utility model relates to the technical field of water cooling plates, in particular to a novel semiconductor radio frequency power supply water cooling plate. Background Art

[0002] For devices with multiple heat generating elements (high heat generation) working at the same time, there are currently a series of mature cooling methods available. These cooling methods mainly include the following methods: 1) natural cooling, which relies on the heat convection and radiation effects of environmental conditions; 2) forced convection cooling technology, including air cooling and liquid cooling, which accelerates the transfer and dissipation of heat by enhancing the flow of air or liquid; 3) micro refrigeration system, which uses the evaporation and condensation process of the refrigerant to achieve efficient heat transfer.

[0003] In addition, some emerging cooling technologies are gradually emerging. For example, solid cooling technology uses high thermal conductivity solid materials as heat conduction media to achieve rapid heat diffusion; phase change cooling technology uses the characteristics of materials absorbing or releasing a large amount of latent heat during phase change to achieve efficient cooling; and spray cooling technology can quickly remove heat over a large area through the evaporation of fine mist liquid.

[0004] Among the above cooling methods, water-cooled plate technology has become an ideal choice for rapid cooling and temperature reduction of heating elements due to its high efficiency and stable performance. The water-cooled plate can effectively absorb and take away the heat generated by the heating element through the circulation of water or other liquids in the plate, thereby ensuring the stable operation of the device and extending its service life.

[0005] The buried pipe process is the most commonly used water-cooled plate manufacturing process. Generally, copper pipes are buried in aluminum substrates. When processing and manufacturing this type of water-cooled plate, the aluminum substrate is first milled with CNC, and then a punching machine is used to press the bent copper pipe onto the aluminum substrate. The gap between the copper pipe and the aluminum substrate is filled with thermal conductive epoxy resin, and then brazing is performed, and then polished and processed into a water-cooled plate.

[0006] Due to the buried tube process, thermal conductive epoxy resin needs to be filled between the copper tube and the aluminum substrate. The heat dissipated by the water in the copper tube must be dissipated through the copper tube to the thermal conductive epoxy resin and then transferred to the aluminum substrate for heat dissipation. Because there is thermal conductive glue between the aluminum plate and the copper tube, the thermal conductivity of the thermal conductive glue is relatively low, so the heat dissipation effect is poor.

[0007] The above problems need to be solved urgently. Utility Model Content

[0008] In order to overcome the disadvantage of poor heat dissipation effect of water-cooling plates produced by the existing buried pipe process, the utility model provides a novel semiconductor radio frequency power supply water-cooling plate.

[0009] The technical solution of the utility model is as follows:

[0010] A novel semiconductor radio frequency power water cooling plate comprises a base plate and a water channel cover plate. The base plate is provided with a concave water trough. The water channel cover plate has the same shape as the water trough and covers the water trough to form a water cooling water channel. The base plate is welded to the water channel cover plate at the joint by friction welding.

[0011] Furthermore, in one embodiment, the substrate is flush with an upper surface of the waterway cover plate.

[0012] Furthermore, in one embodiment, at least two water-cooling connection holes are provided on the side of the substrate, and the water-cooling connection holes are communicated with the end points of the water channel for connecting a water pipe.

[0013] Furthermore, in one embodiment, on the base plate, a cover groove is provided at the top of the water tank, the width of the cover groove is greater than the width of the water tank, and the waterway cover plate is embedded in the cover groove.

[0014] Furthermore, in one embodiment, the water tank is a square tank, and the cover placement tank is also a square tank.

[0015] Furthermore, in one embodiment, there are two water-cooling connection holes, and they are located on the same side of the base plate.

[0016] Furthermore, in one embodiment, the water channel is a curved water channel.

[0017] Furthermore, in one embodiment, the bend of the curved waterway is an arc-shaped bend.

[0018] Furthermore, in one embodiment, the substrate and the water channel cover plate are made of the same material, which is a heat-conducting metal material.

[0019] The utility model according to the above scheme has the beneficial effect that the water tank is processed on the substrate, and the water channel cover plate is covered by friction welding on the top of the water tank to realize the integration of the water cooling plate structure, so that the coolant in the water cooling plate can directly contact the substrate and the water channel cover plate, and the thermal conductivity is better. And the friction welded water cooling plate can have a larger flow channel, further reducing the thermal resistance. It is more flexible in dealing with complex flow channels and some flow channels with height differences, especially suitable for small or large water cooling plates, or for water cooling plates with complex and delicate water channel designs, which can be better achieved by using friction welding technology.

[0020] Furthermore, the substrate and water channel cover in the present application can be made of unified materials, thereby reducing thermal resistance and further improving heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of the utility model;

[0022] Figure 2 It is an exploded view of the utility model;

[0023] Figure 3 It is a cross-sectional view of the cross section of the substrate.

[0024] In the figure, 100, base plate; 110, water tank; 120, cover slot; 130, water cooling connection hole; 200, water channel cover plate. DETAILED DESCRIPTION

[0025] The utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element or there can be one or more centered elements therebetween. When an element is described as "connected" to another element, it can be directly connected to another element or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are for illustrative purposes only. In the description of the utility model, the meaning of "multiple" is two or more. The term "includes" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may exist or be added.

[0026] In addition, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. All technical and scientific terms used in this specification have the same meaning as those generally understood by technicians in the technical field of the present utility model. The terms used in the specification of the present utility model are only for the purpose of describing specific embodiments and are not used to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0027] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0028] like Figure 1-Figure 2As shown, the present application provides a novel semiconductor RF power water cooling plate embodiment, the novel semiconductor RF power water cooling plate includes a substrate 100 and a water channel cover plate 200, the substrate 100 is provided with a concave water tank 110, the water channel cover plate 200 has the same shape as the water tank 110 and covers the water tank 110 to form a water cooling water channel, and the substrate 100 is welded to the water channel cover plate 200 at the joint by friction welding. In this embodiment, the water tank 110 is processed on the substrate 100, and the water channel cover plate 200 is covered by friction welding on the top of the water tank 110, so that the coolant in the water cooling plate can directly contact the substrate 100 and the water channel cover plate 200. Compared with the water cooling plate produced by the traditional buried pipe process, the present application does not need to fill with thermal conductive epoxy resin, and the water flow heated by the electronic components is directly in direct contact with the substrate 100 for heat dissipation, the thermal conductivity is consistent, the heat dissipation is faster, and the heat dissipation effect is better. It has a simple structure and is easy to weld by friction welding. It is suitable for processing occasions with complex pipelines. It is more flexible in dealing with complex flow channels and some flow channels with height differences. It is particularly suitable for small or large water-cooled plates, or water-cooled plates with complex and delicate water channel designs. It is perfectly suitable for the semiconductor RF power supply industry.

[0029] In one embodiment, the upper surfaces of the substrate 100 and the water channel cover plate 200 are flush. The higher the flatness of the upper surfaces of the substrate 100 and the water channel cover plate 200, the better the heat dissipation fit with the electronic components close to the board surface, and the better the heat dissipation effect. In order to ensure that the upper surfaces of the substrate 100 and the water channel cover plate 200 are flush, CNC is generally used to perform surface processing on the welding surface of the new semiconductor RF power supply water cooling plate.

[0030] like Figure 2 As shown, in one embodiment, at least two water-cooling connection holes 130 are provided on the side of the base plate 100, and the water-cooling connection holes 130 are connected to the end points of the water channel for connecting the water pipe. The water-cooling connection holes 130 connect the water channel in the water-cooled plate with the external water pipe. Generally, an interface connector is connected to the water-cooled connection hole 130 to connect the water-cooled plate with other cooling system components (such as a water pump, a radiator, etc.). It usually includes various pipe joints, quick connectors or flanges, which have different specifications and connection methods (such as threaded connection, clamp connection, welding, etc.) to adapt to different installation environments and requirements. In order to ensure that the coolant does not leak from the interface, a seal such as an O-ring, a gasket or a sealant is required.

[0031] like Figure 2 As shown, in this embodiment, there are two water cooling connection holes 130, and they are located on the same side of the substrate 100. In other embodiments, the number and position of the water cooling connection holes 130 can be adaptively adjusted to any side of the substrate 100 according to the shape of the water channel.

[0032] The water channel cover plate 200 is relatively independent from the substrate 100, and multiple non-connected water grooves 110 can also be processed on one substrate 100. Corresponding to different water grooves 110, each water channel cover plate 200 is connected to the corresponding water groove 110 to form multiple cooling circulation water channels, and the water cooling connection holes 130 are also set accordingly.

[0033] like Figure 3 As shown, in one embodiment, on the base plate 100, a cover groove 120 is provided at the top of the water tank 110, the width of the cover groove 120 is greater than the width of the water tank 110, and the waterway cover plate 200 is embedded in the cover groove 120. The waterway cover plate 200 is embedded in the cover groove 120, and the waterway cover plate 200 is not easy to shift after being placed in the base plate 100, which is convenient for subsequent friction welding connection. In addition, the base plate 100 provides an upward support force for the waterway cover plate 200, which simplifies the structure of the water cooling plate and prevents the collapse of the waterway.

[0034] In one embodiment, the water tank 110 is a square tank, and the cover slot 120 is also a square tank. This makes it easier to CNC process the water tank 110 on the substrate 100, and improves the processing efficiency. The cover slot 120 is a square tank, which facilitates the close fit of the waterway cover plate 200 and the substrate 100, facilitates the subsequent smooth welding of the waterway cover plate 200 and the substrate 100, and also helps to ensure the airtightness of the waterway.

[0035] like Figure 2 As shown, in one embodiment, the water channel is a curved water channel, and the bend of the curved water channel is an arc bend. The curved water channel increases the length of the water channel on the substrate 100. Without increasing the volume of the substrate 100, increasing the length of the water channel helps to increase the amount of coolant in the water cooling plate and enhance the cooling and heat dissipation effect of the water cooling plate.

[0036] The arc-shaped bend allows the coolant to flow more smoothly in the water channel, minimizes the backflow caused by the coolant hitting the inner wall of the water tank 110 at the bend, reduces the disturbance of the normal flow direction by the backflowing coolant, and ensures the smooth circulation of the coolant in the water channel.

[0037] In one embodiment, the substrate 100 and the waterway cover plate 200 are made of the same material, which is a metal material. Aluminum is generally selected as the material for making the substrate 100 and the waterway cover plate 200. The aluminum substrate 100 and the aluminum waterway cover plate 200 have good thermal conductivity, and the aluminum material has a low density, so that the weight of the water-cooled plate is small, which is convenient for the installation and use of the water-cooled plate made thereof. In addition, the price of aluminum is low, which helps to reduce the production cost of the product and improve the practicality of the utility model. Under other conditions, the substrate 100 and the waterway cover plate 200 can also be made of alloys such as copper, aluminum alloy, stainless steel, or other heat-conducting metal materials.

[0038] In one embodiment, in order to facilitate the connection and fixation of the water-cooling plate with the PCB or other heating elements, a threaded hole is further provided on the base plate. The threaded hole is used for locking the PCB and various heating electronic components with the new semiconductor RF power water-cooling plate, which not only facilitates the fixation of the water-cooling plate, but also ensures the close contact between the heating element and the water-cooling plate, facilitating the conduction of heat.

[0039] The production process of the product described in this utility model, such as a new type of aluminum semiconductor radio frequency power water cooling plate, is roughly as follows:

[0040] Step 1: First, the aluminum substrate 100 is placed on the CNC machine tool for processing, and the water channel 110 required for heat dissipation and water flow is processed on the substrate 100 according to the size requirements of the drawing.

[0041] Step 2: Then put the aluminum plate on the CNC machine tool and process it into a water channel cover plate 200 covering the water tank 110 according to the drawing requirements.

[0042] Step 3: Finally, place the processed substrate 100 on the friction welding equipment, press the water channel cover plate 200 into the processed water tank 110 on the substrate 100 for welding and positioning, then perform friction welding along the weld and complete the welding of the entire weld.

[0043] Step 4: After welding, check the welding strength and air tightness of the water cooling plate welding point. If there is no problem, use CNC to perform surface finishing on the welding surface again to obtain a higher flatness. The higher the flatness of the water cooling plate, the better the heat dissipation effect of the electronic components close to the board surface.

[0044] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0045] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A new type of semiconductor radio frequency power water cooling plate, characterized in that: It comprises a base plate and a water channel cover plate, wherein the base plate is provided with a concave water trough, the water channel cover plate has the same shape as the water trough and covers the water trough to form a water channel for water cooling, and the base plate is welded to the seam of the water channel cover plate by friction welding; The base plate is flush with the upper surface of the waterway cover plate; A cover placement groove is provided at the top of the water tank, the width of the cover placement groove is greater than the width of the water tank, and the waterway cover plate is embedded in the cover placement groove.

2. The novel semiconductor radio frequency power supply water cooling plate according to claim 1 is characterized in that: At least two water cooling connection holes are provided on the side of the base plate, and the water cooling connection holes are communicated with the end points of the water channel for connecting water pipes.

3. The novel semiconductor radio frequency power supply water cooling plate according to claim 1 is characterized in that: The water tank is a square tank, and the cover placement tank is also a square tank.

4. The novel semiconductor radio frequency power supply water cooling plate according to claim 2 is characterized in that: There are two water cooling connection holes, which are located on the same side of the base plate.

5. The novel semiconductor radio frequency power supply water cooling plate according to claim 4 is characterized in that: The water channel is a curved water channel.

6. The novel semiconductor radio frequency power supply water cooling plate according to claim 5 is characterized in that: The bending part of the curved water channel is an arc-shaped bending.

7. The novel semiconductor radio frequency power supply water cooling plate according to claim 1 is characterized in that: The substrate and the water channel cover plate are made of the same material, which is a heat-conducting metal material.

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