Wafer punching machine

Abstract

The utility model relates to the technical field of punching machines, in particular to a wafer punching machine which comprises supporting legs, a working table, a fixing frame, a containing box, an air cylinder, a push plate and a discharging groove, the containing box is fixedly connected with the working table and located above the working table, the air cylinder is detachably connected with the working table and located above the working table, the push plate is fixedly connected with the output end of the air cylinder, and the discharging groove is formed in the working table. The discharging groove is formed in one side of the containing box, penetrates through the containing box and is matched with the pushing plate, the raw materials are stacked in the containing box, the air cylinder is started, the pushing plate is inserted into the bottom of the containing box through the discharging groove, the raw materials at the bottom are pushed to the fixing table through the discharging groove to be punched, and the steps are repeated after punching is completed. And the next raw material can eject the punched waste out of the fixing table, discharging is completed through the discharging shell, and the problem that the punching efficiency is too low during working due to the fact that rapid feeding and discharging cannot be achieved in the punching process of the wafer punching machine is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of punching machines, in particular to a wafer punching machine. Background Art

[0002] The punching machine is mainly used to punch out discs from sheets. When using the existing punching machine, manual loading is required. Manual loading is prone to danger, and the manual loading position is difficult to accurately control, which easily leads to material waste.

[0003] To solve the above problems, the prior art patent (CN217528872U) discloses a round sheet punching machine with automatic loading function. By starting the telescopic cylinder, the loading plate can be driven to move, so that the sheet to be punched is moved to the position below the punching head, and then the punching head can be moved to punch the sheet by pressing the toggle mechanism. After the punching is completed, the punching head is reset under the action of the reset mechanism, and then the telescopic cylinder continues to push the sheet, so that automatic loading and punching can be achieved.

[0004] However, in the above-mentioned prior art, the wafer punching machine cannot quickly load and unload materials, resulting in low punching efficiency during operation. Utility Model Content

[0005] The utility model aims to provide a wafer punching machine, which solves the technical problem in the prior art that the wafer punching machine cannot quickly load and unload materials, resulting in low punching efficiency during operation.

[0006] To achieve the above-mentioned purpose, the utility model adopts a wafer punching machine, including supporting legs, a workbench, a fixed frame and a loading and unloading assembly, the loading and unloading assembly including a placement box, a cylinder, a push plate, a discharge trough and a punching component, the supporting legs are fixedly connected to the workbench and are located below the workbench, the fixed frame is fixedly connected to the workbench and is located above the workbench, the placement box is fixedly connected to the workbench and is located above the workbench, the cylinder is detachably connected to the workbench and is located above the workbench, the push plate is fixedly connected to the output end of the cylinder and is located on one side of the placement box, the discharge trough is arranged on one side of the placement box and passes through the placement box, and the discharge trough is adapted to the push plate.

[0007] Wherein, the loading and unloading assembly also includes a fixed platform and a unloading shell, the fixed platform is fixedly connected to the working platform and is located above the working platform, and the unloading shell is fixedly connected to the working platform and is located on one side of the fixed platform.

[0008] Wherein, the punching component includes a hydraulic cylinder, a movable plate, a punching head, a discharge port, a connecting rod and a collecting box; the hydraulic cylinder is detachably connected to the fixed frame and is located above the fixed frame, and the output end of the hydraulic cylinder passes through the fixed frame; the movable plate is fixedly connected to the output end of the hydraulic cylinder and is located below the hydraulic cylinder; the punching head is fixedly connected to the movable plate and is located below the movable plate; the discharge port is arranged on the workbench and passes through the discharge port; the connecting rod is fixedly connected to the workbench and is located below the workbench; the collecting box is fixedly connected to the connecting rod and is located below the connecting rod.

[0009] Among them, the punching component also includes a telescopic rod, a spring and a limit plate, one end of the telescopic rod is detachably connected to the movable plate and is located below the movable plate, the spring is detachably connected to the telescopic rod and wraps the telescopic rod, and the limit plate is detachably connected to the other end of the telescopic rod and is located below the telescopic rod.

[0010] Among them, the wafer punching machine also includes a fixing ring 1, a fixing ring 2 and a cleaning brush, the fixing ring 1 is fixedly connected to the fixing frame and is located on one side of the fixing frame, the fixing ring 1 is fixedly connected to the fixing frame and is located on one side of the fixing frame, the cleaning brush is detachably connected to the fixing ring 1 and is located between the fixing ring 1 and the fixing frame, and the cleaning brush is detachably connected to the fixing ring 2.

[0011] The utility model provides a wafer punching machine, wherein the supporting leg is fixedly connected to the workbench and is located below the workbench, the fixing frame is fixedly connected to the workbench and is located above the workbench, the placement box is fixedly connected to the workbench and is located above the workbench, the cylinder is detachably connected to the workbench and is located above the workbench, the push plate is fixedly connected to the output end of the cylinder and is located at one side of the placement box, the discharge trough is arranged at one side of the placement box and passes through the placement box, and the discharge trough is adapted to the push plate to stack the raw materials in the placement box , start the cylinder to insert the push plate into the bottom of the placement box through the discharge slot, push the raw material at the bottom to the fixed platform through the discharge slot, start the hydraulic cylinder to press down the movable plate, the limit plate first contacts with the raw material for fixation, and the movable plate continues to press down to compress the spring and the telescopic rod, so that the punching head punches the raw material, and repeats the above steps after punching. The next piece of raw material will push the punched waste out of the fixed platform, and the unloading is completed through the unloading shell. This method can effectively solve the problem that the wafer punching machine cannot load and unload quickly, resulting in low punching efficiency during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0013] Figure 1 It is a structural schematic diagram of the first embodiment of the utility model.

[0014] Figure 2 It is a front view of the first embodiment of the utility model.

[0015] Figure 3 It is a side view of the first embodiment of the utility model.

[0016] Figure 4 It is a structural schematic diagram of the second embodiment of the utility model.

[0017] 101-supporting leg, 102-working table, 103-fixed frame, 104-placing box, 105-cylinder, 106-push plate, 107-discharging chute, 108-fixed table, 109-discharging shell, 110-hydraulic cylinder, 111-moving plate, 112-punching head, 113-discharging port, 114-connecting rod, 115-collecting box, 116-telescopic rod, 117-spring, 118-limiting plate, 201-fixing ring 1, 202-fixing ring 2, 203-cleaning brush. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0019] The first embodiment of the present application is:

[0020] See also Figure 1 to Figure 3 ,in Figure 1 It is a structural schematic diagram of the first embodiment of the utility model. Figure 2 2 is a front view of the first embodiment of the utility model. Figure 3 It is a side view of the first embodiment of the utility model.

[0021] The utility model provides a wafer punching machine, including a supporting leg 101, a workbench 102, a fixing frame 103, a placing box 104, a cylinder 105, a pushing plate 106, a discharging chute 107, a fixing table 108, a material discharge shell 109, a hydraulic cylinder 110, a movable plate 111, a punching head 112, a material discharge port 113, a connecting rod 114, a collecting box 115, a telescopic rod 116, a spring 117 and a limiting plate 118. The above scheme solves the problem that the wafer punching machine in the prior art cannot load and unload materials quickly, resulting in too low efficiency of punching during operation.

[0022] According to the present specific embodiment, the support leg 101 is fixedly connected to the workbench 102 and is located below the workbench 102; the fixing frame 103 is fixedly connected to the workbench 102 and is located above the workbench 102; the placement box 104 is fixedly connected to the workbench 102 and is located above the workbench 102; the cylinder 105 is detachably connected to the workbench 102 and is located above the workbench 102; the push plate 106 is detachably connected to the workbench 102 and is located above the workbench 102; The output end of the cylinder 105 is fixedly connected and located on one side of the placement box 104. The discharge trough 107 is arranged on one side of the placement box 104 and penetrates the placement box 104. The discharge trough 107 is adapted to the push plate 106. The raw materials are stacked in the placement box 104. The cylinder 105 is started to insert the push plate 106 into the bottom of the placement box 104 through the discharge trough 107, and the raw materials at the bottom are pushed onto the fixed platform 108 through the discharge trough 107.

[0023] Among them, the fixed table 108 is fixedly connected to the workbench 102 and is located above the workbench 102. The unloading shell 109 is fixedly connected to the workbench 102 and is located on one side of the fixed table 108. After the punching is completed, the push plate 106 pushes the next piece of raw material onto the fixed table 108, ejects the waste material on the fixed table 108 after punching, and completes the unloading through the unloading shell 109.

[0024] Secondly, the hydraulic cylinder 110 is detachably connected to the fixed frame 103 and is located above the fixed frame 103, and the output end of the hydraulic cylinder 110 passes through the fixed frame 103, the movable plate 111 is fixedly connected to the output end of the hydraulic cylinder 110 and is located below the hydraulic cylinder 110, the punching head 112 is fixedly connected to the movable plate 111 and is located below the movable plate 111, and the discharge port 113 is arranged on the workbench 102 and passes through the discharge port 113, the connecting rod 114 is fixedly connected to the workbench 102 and is located below the workbench 102, the collecting box 115 is fixedly connected to the connecting rod 114 and is located below the connecting rod 114, the hydraulic cylinder 110 is started to press down the movable plate 111, and the movable plate 111 drives the punching head 112 to press down, and the raw materials on the fixed table 108 are punched and cut, and the finished products after punching fall into the collecting box 115 through the discharge port 113 for easy collection.

[0025] At the same time, one end of the telescopic rod 116 is detachably connected to the movable plate 111 and is located below the movable plate 111, the spring 117 is detachably connected to the telescopic rod 116 and wraps the telescopic rod 116, the limit plate 118 is detachably connected to the other end of the telescopic rod 116 and is located below the telescopic rod 116, when the movable plate 111 is pressed downward, the limit plate 118 is driven downward to fix the raw material on the fixed table 108, and the punching head 112 can punch the raw material while the spring 117 and the telescopic rod 116 are compressed.

[0026] A wafer punching machine using the present embodiment includes a support leg 101, a workbench 102, a fixing frame 103, a placing box 104, a cylinder 105, a push plate 106, a discharge chute 107, a fixing table 108, a material discharge shell 109, a hydraulic cylinder 110, a movable plate 111, a punching head 112, a discharge port 113, a connecting rod 114, a collecting box 115, a telescopic rod 116, a spring 117 and a limiting plate 118. The support leg 101 is fixedly connected to the workbench 102 and is located on the workbench 102. 02, the fixing frame 103 is fixedly connected to the workbench 102 and is located above the workbench 102, the placement box 104 is fixedly connected to the workbench 102 and is located above the workbench 102, the cylinder 105 is detachably connected to the workbench 102 and is located above the workbench 102, the push plate 106 is fixedly connected to the output end of the cylinder 105 and is located on one side of the placement box 104, and the discharge trough 107 is arranged on the placement box The material discharging trough 107 is adapted to the push plate 106. The cylinder 105 is started to insert the push plate 106 into the bottom of the placing box 104 through the discharging trough 107, and the raw materials at the bottom are pushed onto the fixed platform 108 through the discharging trough 107. The hydraulic cylinder 110 is started to press down the movable plate 111. When the movable plate 111 is pressed down, it will drive the limit plate 118 to press down to fix the raw materials on the fixed platform 108. When the spring 117 and the telescopic rod 116 are compressed, the punching head 112 can punch the raw material, and the finished product after punching falls into the collection box 115 through the discharge port 113 for easy collection. After the punching is completed, the push plate 106 pushes the next piece of raw material onto the fixed table 108, and pushes out the waste material on the fixed table 108 after punching, and completes the unloading through the unloading shell 109, thereby solving the problem that the wafer punching machine cannot load and unload materials quickly, resulting in low punching efficiency during operation.

[0027] The second embodiment of the present application is:

[0028] Based on the first embodiment, please refer to Figure 4 , Figure 4 It is a structural schematic diagram of the second embodiment of the utility model.

[0029] The utility model provides a wafer punching machine, which also includes a fixing ring 1 201, a fixing ring 202 and a cleaning brush 203. The above solution solves the problem that the surface of the wafer punching machine in the prior art is inconvenient to clean.

[0030] Among them, the fixing ring 201 is fixedly connected to the fixing frame 103 and is located on one side of the fixing frame 103, the fixing ring 201 is fixedly connected to the fixing frame 103 and is located on one side of the fixing frame 103, the cleaning brush 203 is detachably connected to the fixing ring 201 and is located between the fixing ring 201 and the fixing frame 103, and the cleaning brush 203 is detachably connected to the fixing ring 202, the fixing ring 1 201 and the fixing ring 2 202 fix the cleaning brush 203, and the debris or dust generated on the workbench 102 can be cleaned by removing the cleaning brush 203.

[0031] A wafer punching machine using the present embodiment is provided with a fixing ring 1 201, a fixing ring 202 and a cleaning brush 203. By removing the cleaning brush 203, the debris or dust generated on the workbench 102 can be cleaned. The fixing ring 1 201 and the fixing ring 202 fix the cleaning brush 203, thereby solving the problem that the surface of the wafer punching machine is difficult to clean.

[0032] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope covered by the utility model.

Claims

1. A wafer punching machine, comprising a support leg, a workbench and a fixed frame, wherein the support leg is fixedly connected to the workbench and is located below the workbench, and the fixed frame is fixedly connected to the workbench and is located above the workbench, characterized in that: It also includes a loading and unloading assembly, which includes a placement box, a cylinder, a push plate, a discharge trough and a punching component. The placement box is fixedly connected to the workbench and is located above the workbench. The cylinder is detachably connected to the workbench and is located above the workbench. The push plate is fixedly connected to the output end of the cylinder and is located on one side of the placement box. The discharge trough is arranged on one side of the placement box and passes through the placement box, and the discharge trough is adapted to the push plate.

2. The wafer punching machine according to claim 1, characterized in that: The loading and unloading assembly also includes a fixed platform and a material unloading shell. The fixed platform is fixedly connected to the working platform and is located above the working platform. The material unloading shell is fixedly connected to the working platform and is located on one side of the fixed platform.

3. The wafer punching machine according to claim 1, characterized in that: The punching component includes a hydraulic cylinder, a movable plate, a punching head, a discharge port, a connecting rod and a collecting box. The hydraulic cylinder is detachably connected to the fixed frame and is located above the fixed frame, and the output end of the hydraulic cylinder passes through the fixed frame. The movable plate is fixedly connected to the output end of the hydraulic cylinder and is located below the hydraulic cylinder. The punching head is fixedly connected to the movable plate and is located below the movable plate. The discharge port is arranged on the workbench and passes through the discharge port. The connecting rod is fixedly connected to the workbench and is located below the workbench. The collecting box is fixedly connected to the connecting rod and is located below the connecting rod.

4. The wafer punching machine according to claim 3, characterized in that: The punching component also includes a telescopic rod, a spring and a limit plate, one end of the telescopic rod is detachably connected to the movable plate and is located below the movable plate, the spring is detachably connected to the telescopic rod and wraps the telescopic rod, and the limit plate is detachably connected to the other end of the telescopic rod and is located below the telescopic rod.

5. The wafer punching machine according to claim 1, characterized in that: The wafer punching machine also includes a fixing ring 1, a fixing ring 2 and a cleaning brush. The fixing ring 1 is fixedly connected to the fixing frame and is located on one side of the fixing frame. The fixing ring 1 is fixedly connected to the fixing frame and is located on one side of the fixing frame. The cleaning brush is detachably connected to the fixing ring 1 and is located between the fixing ring 1 and the fixing frame, and the cleaning brush is detachably connected to the fixing ring 2.

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