Ion sputtering vacuum coating device

Abstract

The utility model discloses an ion sputtering vacuum coating device in the technical field of scanning electron microscope sample preparation and vacuum coating, which comprises a shell, a vacuum module, a coating generation chamber, an ion sputtering module, a circuit module and a control module, the shell comprises an upper shell and a lower shell, the upper shell is fixedly connected to the top of the lower shell, and the vacuum module is fixedly connected to the top of the lower shell. The vacuum module comprises a vacuum chamber, a vacuum conduit, an air inlet interface and an electromagnetic valve, the ion sputtering module comprises an upper cover, an insulating part, a magnet and a target fixing piece, and the circuit module comprises a cooling fan, a first socket, a second socket, a safety device, a low-voltage circuit board, a high-voltage circuit board and a wire. The control module comprises a power switch, a gas regulating valve, a control panel and a vacuum gauge tube, the ion sputtering vacuum coating device is reasonable in structural design, and the problem that the quality of an acquired image is poor when a non-conductive sample is analyzed by a scanning electron microscope is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of scanning electron microscope sample preparation and vacuum coating, in particular to an ion sputtering vacuum coating device. Background Art

[0002] For non-conductive samples, such as biological materials, paper, rubber, plastic, and ceramics, coating treatment is required before image observation and composition analysis in traditional electron microscopes. Otherwise, discharge is likely to occur, causing image drift, thermal damage, and other phenomena, making it difficult to locate and focus during analysis. When the energy of the incident electron beam is large, those heat-sensitive or low-melting-point samples may produce blistering, burns, or even melting at the irradiation site of the electron beam. For this reason, we have proposed an ion sputtering vacuum coating device. Utility Model Content

[0003] The purpose of the utility model is to provide an ion sputtering vacuum coating device to solve the problem raised in the above background technology that heat-sensitive or low-melting-point samples may cause blistering, burning or even melting at the irradiation site of the electron beam.

[0004] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an ion sputtering vacuum coating device, comprising a shell, a vacuum module, a coating generating chamber, an ion sputtering module, a circuit module and a control module, the shell comprising an upper shell and a lower shell, the upper shell being fixedly connected to the top of the lower shell, the vacuum module comprising a vacuum chamber, a vacuum duct, an air inlet interface and a solenoid valve, the ion sputtering module comprising an upper cover, an insulating component, a magnet and a target material fixing part, the circuit module comprising a cooling fan, a first socket, a second socket, a safety device, a low-voltage circuit board, a high-voltage circuit board and a wire, the control module comprising a power switch, a gas regulating valve, a control panel and a vacuum gauge.

[0005] As a further description of the above technical solution:

[0006] The upper shell is composed of a front panel, a rear panel and an upper panel in one piece, and the lower shell is composed of a left side panel, a right side panel and a base in one piece.

[0007] As a further description of the above technical solution:

[0008] The vacuum chamber is connected to the solenoid valve and the control module through an air pipe, and the vacuum conduit is connected to the vacuum chamber and an external vacuum pump.

[0009] As a further description of the above technical solution:

[0010] The film coating chamber includes a rotating sample stage, an internal sample stage and a glass cover. The film coating chamber is communicated with the vacuum chamber. The film coating chamber and the ion sputtering module are in the same vertical direction.

[0011] As a further description of the above technical solution:

[0012] The ion sputtering module is located above the film coating chamber.

[0013] As a further description of the above technical solution:

[0014] The second socket is electrically connected to the safety device and the first socket, the low-voltage circuit board and the high-voltage circuit board through the wire. The low-voltage circuit board is electrically connected to the rotating sample stage, the solenoid valve and the cooling fan through the wire. The high-voltage circuit board is electrically connected to the ion sputtering module and the control module through the wire.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the ion sputtering vacuum coating device, the ion sputtering module generates glow discharge, ionizes the gas in the vacuum module, and accelerates the impact on the surface of the metal target material, so that the atoms on the surface of the metal target material fly out and accumulate on the surface of the non-conductive sample to form a coating; thereby solving the problem of poor image quality when collecting non-conductive samples during scanning electron microscope analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural schematic diagram of an ion sputtering vacuum coating device proposed by the utility model.

[0017] In the figure: 1. Outer shell; 11. Upper shell; 12. Lower shell; 2. Vacuum module; 21. Vacuum chamber; 22. Vacuum duct; 23. Air inlet interface; 24. Solenoid valve; 3. Coating chamber; 31. Rotating sample stage; 32. Internal sample stage; 33. Glass cover; 4. Ion sputtering module; 41. Upper cover; 42. Insulating component; 43. Magnet; 44. Target material fixing part; 5. Circuit module; 51. Cooling fan; 52. First socket; 53. Second socket; 54. Safety device; 55. Low-voltage circuit board; 56. High-voltage circuit board; 57. Wire; 6. Control module; 61. Power switch; 62. Gas regulating valve; 63. Control panel; 64. Vacuum gauge. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0020] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0021] The utility model provides an ion sputtering vacuum coating device, which solves the problem of poor image quality when analyzing non-conductive samples under scanning electron microscope. Figure 1 , including a housing 1, a vacuum module 2, a coating generation chamber 3, an ion sputtering module 4, a circuit module 5 and a control module 6;

[0022] Please refer again Figure 1 The housing 1 includes an upper housing 11 and a lower housing 12. The upper housing 11 is fixedly connected to the top of the lower housing 12. The upper housing 11 is composed of a front panel, a rear panel and an upper panel. The lower housing 12 is composed of a left panel, a right panel and a base.

[0023] Please refer again Figure 1 The vacuum module 2 includes a vacuum chamber 21, a vacuum conduit 22, an air inlet interface 23 and a solenoid valve 24. The vacuum chamber 21 is connected to the solenoid valve 24 and the control module 6 through an air pipe, and the vacuum conduit 22 is connected to the vacuum chamber 21 and an external vacuum pump;

[0024] Please refer again Figure 1The coating chamber 3 includes a rotating sample stage 31, an internal sample stage 32 and a glass cover 33. The coating chamber 3 is connected to the vacuum chamber 21. The coating chamber 3 and the ion sputtering module 4 are in the same vertical direction. The rotation speed, tilt angle and height of the internal sample stage 32 are adjustable.

[0025] Please refer again Figure 1 The ion sputtering module 4 includes an upper cover 41, an insulating component 42, a magnet 43 and a target material fixing member 44. The target material fixing member 44 is used to fix the metal target material. The ion sputtering module 4 is located above the coating generation chamber 3. The ion sputtering module 4 generates a glow discharge to ionize the gas in the vacuum module 2 and accelerate it to impact the surface of the metal target material, so that the atoms on the surface of the metal target material fly out and accumulate on the surface of the material to form a coating film;

[0026] Please refer again Figure 1 The circuit module 5 includes a cooling fan 51, a first socket 52, a second socket 53, a safety device 54, a low-voltage circuit board 55, a high-voltage circuit board 56 and a wire 57. The second socket 53 is electrically connected to the safety device 54 and the first socket 52, the low-voltage circuit board 55 and the high-voltage circuit board 56 through the wire 57. The low-voltage circuit board 55 is electrically connected to the rotating sample stage 31, the solenoid valve 24 and the cooling fan 51 through the wire 57. The high-voltage circuit board 56 is electrically connected to the ion sputtering module 4 and the control module 6 through the wire 57.

[0027] Please refer again Figure 1 The control module 6 includes a power switch 61, a gas regulating valve 62, a control panel 63 and a vacuum gauge 64. The gas regulating valve 62 is connected to the vacuum chamber 21 and the air inlet interface 23 through an air pipe for adjusting the target vacuum degree; the control panel 63 is used to set and display the coating parameters; the vacuum gauge 64 is connected to the vacuum chamber 21 for vacuum measurement.

[0028] In summary, the problem of poor image quality when analyzing non-conductive samples using a scanning electron microscope is solved.

[0029] During specific use, when performing vacuum coating on a non-conductive sample, a person skilled in the art will connect the coating equipment to an external power supply, press the power switch 61 to turn on the coating equipment, open the upper cover 41 through the ion sputtering module 4, install the non-conductive sample on the target material fixing part 44, and insulate and protect it through the insulating component 42. The ion sputtering module 4 drives the upper cover 41 to reset and close, the vacuum chamber 21 is connected to the solenoid valve 24 and the control module 6 through the air pipe, and the vacuum conduit 22 is connected to the vacuum chamber 21 and the external vacuum pump for gas supply. The ion sputtering module 4 generates a glow discharge to ionize the gas in the vacuum module 2 and accelerate it to impact the surface of the metal target material, so that the atoms on the surface of the metal target material fly out and accumulate on the surface of the non-conductive sample to form a coating. During the operation of the coating equipment, the ion sputtering module 4 and the control module 6 are connected to the high-voltage circuit board 56, and the low-voltage circuit board 55 is electrically connected to the rotating sample stage 31, the solenoid valve 24 and the cooling fan 51 through the wire 57. The high and low voltage electricity are distinguished to ensure the safety of the equipment operation.

[0030] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the illustrative use of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0031] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An ion sputtering vacuum coating device, characterized in that: The invention comprises a housing (1), a vacuum module (2), a film-forming chamber (3), an ion sputtering module (4), a circuit module (5) and a control module (6), wherein the housing (1) comprises an upper housing (11) and a lower housing (12), wherein the upper housing (11) is fixedly connected to the top of the lower housing (12), the vacuum module (2) comprises a vacuum chamber (21), a vacuum conduit (22), an air inlet interface (23) and a solenoid valve (24), the ion sputtering module (4) comprises an upper cover (41), an insulating component (42), a magnet (43) and a target material fixing member (44), the circuit module (5) comprises a cooling fan (51), a first socket (52), a second socket (53), a safety device (54), a low-voltage circuit board (55), a high-voltage circuit board (56) and a wire (57), and the control module (6) comprises a power switch (61), a gas regulating valve (62), a control panel (63) and a vacuum gauge (64).

2. The ion sputtering vacuum coating device according to claim 1, characterized in that: The upper shell (11) is composed of a front panel, a rear panel and an upper panel, and the lower shell (12) is composed of a left side panel, a right side panel and a base.

3. The ion sputtering vacuum coating device according to claim 1, characterized in that: The vacuum chamber (21) is connected to the solenoid valve (24) and the control module (6) via an air pipe, and the vacuum conduit (22) is connected to the vacuum chamber (21) and an external vacuum pump.

4. The ion sputtering vacuum coating device according to claim 1, characterized in that: The coating chamber (3) comprises a rotating sample stage (31), an internal sample stage (32) and a glass cover (33); the coating chamber (3) is connected to the vacuum chamber (21); and the coating chamber (3) and the ion sputtering module (4) are in the same vertical direction.

5. The ion sputtering vacuum coating device according to claim 1, characterized in that: The ion sputtering module (4) is located above the film coating chamber (3).

6. The ion sputtering vacuum coating device according to claim 1, characterized in that: The second socket (53) is electrically connected to the safety device (54) and the first socket (52), the low-voltage circuit board (55) and the high-voltage circuit board (56) through the wire (57); the low-voltage circuit board (55) is electrically connected to the rotating sample stage (31), the solenoid valve (24) and the cooling fan (51) through the wire (57); and the high-voltage circuit board (56) is electrically connected to the ion sputtering module (4) and the control module (6) through the wire (57).

Images