Temperature detection device for semiconductor chip in low-temperature environment

Abstract

The utility model relates to a temperature detection device, in particular to a temperature detection device for a semiconductor chip in a low-temperature environment, which belongs to the technical field of chip temperature detection equipment and comprises an omnibearing detection box, clamping assemblies are arranged on the inner walls of the two ends of the omnibearing detection box, and a semiconductor chip body is arranged between the clamping assemblies. The inner wall of one end of the omnibearing detection box is provided with a rotation driving assembly used for rotation of the clamping assembly at one end, the omnibearing detection box is internally provided with a detection ring frame, and the detection ring frame is internally provided with a detection assembly capable of performing circular motion along the inner wall of the detection ring frame. According to the device, through mutual cooperation of the rotation driving assembly, the detection assembly and the transverse driving assembly, the temperature sensor can carry out omnibearing detection on a semiconductor chip body, and the device is wide in detection range, high in detection quality and high in detection efficiency. The practicability is high.

Description

Technical Field

[0001] The utility model relates to a temperature detection device for a semiconductor chip in a low-temperature environment, belonging to the technical field of chip temperature detection equipment. Background Art

[0002] Semiconductor chip: A semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. It is not just silicon chips. Common ones also include semiconductor materials such as gallium arsenide and germanium. Semiconductors are also trendy like cars. In the 1970s, American companies such as Intel had the upper hand in the dynamic random access memory market. When semiconductor chips work at high and low temperatures, their stability is particularly critical.

[0003] There is a chip surface defect and temperature detection device (CN215342507U), including: a chip carrier, a shell, a lens, a CCD camera, a computer, a spectroscope and a thermal imager, wherein the lens is provided at one end of the shell, and the CCD camera is provided at the other end, the CCD camera is connected to the computer, the spectroscope is provided in the shell, the spectroscope of the shell is connected to the thermal imager through a light guide, and the chip carrier is arranged below the lens. The chip surface defect and temperature detection device provided by the utility model uses a spectroscope to take pictures of the chip for defect analysis, and at the same time uses a thermal imager to measure the chip temperature in real time, so that the surface defects of the semiconductor chip can be processed quickly and with high precision during the processing, and combined with the temperature measurement data, it is of great significance to improve the processing technology, enhance the performance of semiconductor materials and their devices, reduce their size, and improve the yield and stability of semiconductor devices.

[0004] The above existing devices can measure the chip temperature in real time with a thermal imager. However, when the above devices detect semiconductor chips, the above existing devices cannot detect every position of the semiconductor chip body well through simple temperature detection, and cannot achieve comprehensive detection of the semiconductor chip.

[0005] In view of this, the present utility model is proposed. Utility Model Content

[0006] The purpose of the utility model is to provide a temperature detection device for semiconductor chips in a low temperature environment in order to solve the above problems, which has the purpose of performing comprehensive temperature detection on the semiconductor chip body.

[0007] The utility model achieves the above-mentioned purpose through the following technical solutions: a temperature detection device for semiconductor chips in a low-temperature environment, comprising an omnidirectional detection box, both ends of the inner walls of the omnidirectional detection box are provided with clamping components, a semiconductor chip body is arranged between the clamping components, one end of the inner wall of the omnidirectional detection box is provided with a rotating drive component for rotating the clamping component at one end, a detection ring frame is arranged inside the omnidirectional detection box, a detection component that can perform circular motion along the inner wall of the detection ring frame is arranged inside the detection ring frame, the detection component includes a temperature sensor, and a lateral drive component for horizontal movement of the detection ring frame is arranged inside the omnidirectional detection box.

[0008] Furthermore, in order to enable the spring telescopic rod to rotate stably, the clamping assembly includes a spring telescopic rod, and the spring telescopic rod is symmetrically rotatably mounted on the inner walls of both ends of the omnidirectional detection box respectively rotatably mounted through ball bearings.

[0009] Furthermore, in order to provide spring force for the clamping plate through the clamping spring, an L-shaped frame is fixedly installed at one end of the spring telescopic rod, a clamping spring is evenly fixedly installed on the inner bottom wall of the L-shaped frame, a clamping plate is fixedly installed on the upper end of the clamping spring, and sliding grooves are symmetrically opened on the outer wall of one side of the L-shaped frame. The middle position of one side of the clamping plate is located in the sliding groove, and the other side of the clamping plate is arranged on the outside of the L-shaped frame, and the lower surface of one side of the clamping plate is in contact with the upper surface of the semiconductor chip body.

[0010] Furthermore, in order to provide driving force for the rotating gear through the rotating motor, the rotating drive assembly includes a rotating gear, which is arranged on the inner wall position of one end of the omnidirectional detection box, and the rotating gear is sleeved on the outer surface of one end of the spring telescopic rod. A driving gear is rotatably installed on the inner wall of one end of the omnidirectional detection box, and the driving gear and the rotating gear are meshed and transmitted with each other. A rotating motor is inlaid on the outer wall of one end of the omnidirectional detection box, and the output end of the rotating motor and the driving gear are fixedly connected to each other.

[0011] Furthermore, in order to provide driving force for the detection gear through the wheel hub motor, the circumferential inner wall of the detection ring frame is evenly provided with fixed teeth, and the inner walls on both sides of the detection ring frame are provided with limiting ring grooves. The detection component includes a detection gear, which is meshed with the evenly arranged fixed teeth. The detection gear is embedded with a wheel hub motor, and both ends of the wheel hub motor are fixedly installed with Z-shaped arc plates, and one end of the Z-shaped arc plate is slidably engaged in the limiting ring groove.

[0012] Furthermore, in order to fix the temperature sensor, a detection plate is fixedly mounted on the outer surfaces of the lower ends of the Z-shaped arc plates at both ends of the hub motor, and the temperature sensor is fixedly mounted on one side surface of the detection plate.

[0013] Furthermore, in order to drive the driving screw to rotate by the driving motor, the lateral driving assembly includes a driving motor, and the driving motor is embedded in the outer wall of one end of the all-round detection box. The inner walls on both sides of the all-round detection box are provided with screw grooves, and driving screws are rotatably installed in the screw grooves. One end of the driving screw in the screw groove on one side is fixedly connected to the output end of the driving motor, and the circumferential outer walls of the detection ring frame are fixedly installed with connecting plates, and the driving screw passes through the connecting plates and rotatably engages with the connecting plates.

[0014] Furthermore, in order to drive the driving screw through the synchronous chain and the synchronous sprocket, one end of the driving screw is sleeved with a synchronous sprocket, and the outer surfaces of the synchronous sprockets at one end of the driving screw arranged on both sides are jointly engaged with the synchronous chain.

[0015] The technical effects and advantages of the utility model are as follows: when the temperature of the semiconductor chip body is detected, the device can, through the mutual cooperation among the rotating drive component, the detection component and the lateral drive component, enable the temperature sensor to perform all-round detection of the semiconductor chip body. The device has a wide detection area, high detection quality and strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the detection component of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the clamping assembly of the utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the transverse drive assembly of the utility model;

[0020] Figure 5 This is a schematic diagram of the structure of the rotary drive assembly of the utility model;

[0021] In the figure: 1. All-round detection box; 2. Clamping assembly; 201. Spring telescopic rod; 202. Ball bearing; 203. L-shaped frame; 204. Clamping spring; 205. Clamping plate; 3. Semiconductor chip body; 4. Rotary drive assembly; 401. Rotary gear; 402. Drive gear; 403. Rotary motor; 5. Detection ring frame; 6. Detection assembly; 601. Temperature sensor; 602. Detection gear; 603. Hub motor; 604. Z-shaped arc plate; 605. Detection plate; 7. Horizontal drive assembly; 701. Drive motor; 702. Drive screw; 703. Synchronous sprocket; 704. Synchronous chain; 8. Fixed teeth; 9. Connecting plate. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 5 As shown, a temperature detection device for semiconductor chips in a low-temperature environment includes an omnidirectional detection box 1, both ends of the inner wall of the omnidirectional detection box 1 are provided with clamping components 2, a semiconductor chip body 3 is arranged between the clamping components 2, one end of the inner wall of the omnidirectional detection box 1 is provided with a rotating drive component 4 for rotating the clamping component 2 at one end, a detection ring frame 5 is arranged inside the omnidirectional detection box 1, a detection component 6 that can perform circular motion along the inner wall of the detection ring frame 5 is arranged inside the detection ring frame 5, the detection component 6 includes a temperature sensor 601, and a lateral drive component 7 for horizontal movement of the detection ring frame 5 is arranged inside the omnidirectional detection box 1.

[0024] like Figure 3 and Figure 5As shown, the clamping assembly 2 includes a spring telescopic rod 201, which is symmetrically rotatably mounted on the inner walls of both ends of the omnidirectional detection box 1 through ball bearings 202, an L-shaped frame 203 is fixedly mounted on one end of the spring telescopic rod 201, a clamping spring 204 is evenly fixedly mounted on the inner bottom wall of the L-shaped frame 203, a clamping plate 205 is fixedly mounted on the upper end of the clamping spring 204, a sliding groove is symmetrically opened on the outer wall of one side of the L-shaped frame 203, the middle position of one side of the clamping plate 205 is located in the sliding groove, and the other side of the clamping plate 205 is arranged on the outside of the L-shaped frame 203, the lower surface of one side of the clamping plate 205 and the upper surface of the semiconductor chip body 3 are mutually fitted, so as to facilitate the semiconductor chip body 3, the rotation driving assembly 4 includes a rotating gear 401, the rotating gear 401 is arranged at the inner wall position of one end of the omnidirectional detection box 1, the rotating gear 401 is sleeved on the outer surface of one end of the spring telescopic rod 201, and the inner wall of one end of the omnidirectional detection box 1 is rotatably mounted with a driving gear 402 The driving gear 402 and the rotating gear 401 are meshed with each other for transmission. A rotating motor 403 is embedded in the outer wall of one end of the omnidirectional detection box 1. The output end of the rotating motor 403 and the driving gear 402 are fixedly connected to each other, so that when the staff places the semiconductor chip body 3 between the symmetrically arranged spring telescopic rods 201, the L-shaped frame 203, the clamping plate 205 and the clamping spring 204 cooperate with each other to clamp and fix the semiconductor chip body 3. Then the staff uses the refrigeration equipment to make the inside of the device in a low temperature state, and then the staff turns on the power of the rotating motor 403, so that the rotating motor 403 drives the driving gear 402 to rotate, and then drives the rotating gear 401 to rotate through the driving gear 402. Then, through the spring telescopic rod 201 fixedly connected to the rotating gear 401, the spring telescopic rod 201 drives the semiconductor chip body 3 to rotate, so as to better detect the semiconductor chip body 3.

[0025] like Figure 2As shown, the circumferential inner wall of the detection ring frame 5 is evenly provided with fixed teeth 8, and the inner walls on both sides of the detection ring frame 5 are provided with limited ring grooves. The detection component 6 includes a detection gear 602, and the detection gear 602 is meshed with the evenly arranged fixed teeth 8. A hub motor 603 is embedded in the detection gear 602, and both ends of the hub motor 603 are fixedly installed with a Z-shaped arc plate 604, one end of the Z-shaped arc plate 604 is slidably engaged in the limited ring groove, and the Z-shaped arc plates 604 at both ends of the hub motor 603 are A detection plate 605 is fixedly installed on the outer surface of the lower end, and a temperature sensor 601 is fixedly installed on one side surface of the detection plate 605, so that when the staff turns on the power of the hub motor 603, the hub motor 603 can be limited by the Z-shaped arc plate 604 to enable the detection gear 602 to engage with the evenly arranged fixed teeth 8. At this time, the detection gear 602 starts to drive the detection plate 605 to rotate, and the rotation of the detection plate 605 can form a circular motion for the semiconductor chip body 3.

[0026] like Figure 4 As shown, the lateral drive assembly 7 includes a drive motor 701, which is embedded in the outer wall of one end of the omnidirectional detection box 1. The inner walls on both sides of the omnidirectional detection box 1 are provided with screw grooves, and drive screws 702 are rotatably installed in the screw grooves. One end of the drive screw 702 in the screw groove on one side is fixedly connected to the output end of the drive motor 701. The circumferential outer wall of the detection ring frame 5 is fixedly installed with a connecting plate 9. The drive screw 702 passes through the connecting plate 9 and is rotatably engaged with the connecting plate 9. One end of the drive screw 702 is sleeved with a synchronous sprocket 703. The synchronous sprockets at one end of the drive screw 702 arranged on both sides are The outer surfaces of 703 are all engaged with a synchronous chain 704, so that when the staff turns on the power of the driving motor 701, the driving motor 701 drives the driving screw 702 to rotate, and then the synchronous sprocket 703 and the synchronous chain 704 cooperate to enable the connecting plate 9 that is engaged with the driving screw 702 to drive the detection ring frame 5 to move, so that the temperature sensor 601 in the detection ring frame 5 can perform a comprehensive detection of the semiconductor chip body 3. At the same time, the temperature sensor 601 can be connected to an external display screen, so that the staff can perform fine detection of the temperature of each position of the semiconductor chip.

[0027] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0028] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A temperature detection device for semiconductor chips in a low temperature environment, comprising an omnidirectional detection box (1), characterized in that: The inner walls at both ends of the omnidirectional detection box (1) are provided with clamping assemblies (2), a semiconductor chip body (3) is provided between the clamping assemblies (2), a rotation drive assembly (4) for rotating the clamping assembly (2) at one end is provided on the inner wall of one end of the omnidirectional detection box (1), a detection ring frame (5) is provided inside the omnidirectional detection box (1), a detection assembly (6) capable of performing circular motion along the inner wall of the detection ring frame (5) is provided inside the detection ring frame (5), the detection assembly (6) comprises a temperature sensor (601), and a lateral drive assembly (7) for horizontally moving the detection ring frame (5) is provided inside the omnidirectional detection box (1).

2. The temperature detection device for semiconductor chips in a low temperature environment according to claim 1, characterized in that: The clamping assembly (2) comprises a spring telescopic rod (201), and the spring telescopic rod (201) is symmetrically rotatably mounted on the inner walls at both ends of the omnidirectional detection box (1) via ball bearings (202).

3. The temperature detection device for semiconductor chips in a low temperature environment according to claim 2, characterized in that: An L-shaped frame (203) is fixedly mounted on one end of the spring telescopic rod (201), a clamping spring (204) is evenly fixedly mounted on the inner bottom wall of the L-shaped frame (203), a clamping plate (205) is fixedly mounted on the upper end of the clamping spring (204), a sliding groove is symmetrically provided on the outer wall of one side of the L-shaped frame (203), a middle position of one side of the clamping plate (205) is located in the sliding groove, and the other side of the clamping plate (205) is arranged outside the L-shaped frame (203), and a lower surface of one side of the clamping plate (205) is in contact with an upper surface of the semiconductor chip body (3).

4. The temperature detection device for semiconductor chips in a low temperature environment according to claim 3, characterized in that: The rotary drive assembly (4) comprises a rotary gear (401), the rotary gear (401) being arranged at an inner wall position at one end of the omnidirectional detection box (1), the rotary gear (401) being sleeved on an outer surface of one end of the spring telescopic rod (201), a driving gear (402) being rotatably mounted on the inner wall at one end of the omnidirectional detection box (1), the driving gear (402) and the rotary gear (401) being meshed and transmitted with each other, a rotary motor (403) being inlaid and mounted on the outer wall at one end of the omnidirectional detection box (1), and an output end of the rotary motor (403) and the driving gear (402) being fixedly connected with each other.

5. The temperature detection device for semiconductor chips in a low temperature environment according to claim 1, characterized in that: The circumferential inner wall of the detection ring frame (5) is evenly provided with fixed teeth (8), and the inner walls on both sides of the detection ring frame (5) are provided with limit ring grooves. The detection component (6) comprises a detection gear (602), and the detection gear (602) and the evenly provided fixed teeth (8) are meshed with each other. A hub motor (603) is embedded in the detection gear (602), and both ends of the hub motor (603) are fixedly installed with Z-shaped arc plates (604), and one end of the Z-shaped arc plate (604) is slidably engaged in the limit ring groove.

6. The temperature detection device for semiconductor chips in a low temperature environment according to claim 5, characterized in that: A detection plate (605) is fixedly mounted on the outer surfaces of the lower ends of the Z-shaped arc plates (604) at both ends of the hub motor (603), and the temperature sensor (601) is fixedly mounted on a side surface of the detection plate (605).

7. The temperature detection device for semiconductor chips in a low temperature environment according to claim 1, characterized in that: The lateral drive assembly (7) comprises a drive motor (701), the drive motor (701) is embedded in an outer wall at one end of the omnidirectional detection box (1), the inner walls on both sides of the omnidirectional detection box (1) are provided with screw grooves, a drive screw (702) is rotatably installed in the screw grooves, one end of the drive screw (702) in the screw groove on one side is fixedly connected to the output end of the drive motor (701), and a connecting plate (9) is fixedly installed on the circumferential outer wall of the detection ring frame (5), and the drive screw (702) passes through the connecting plate (9) and is rotatably engaged with the connecting plate (9).

8. The temperature detection device for semiconductor chips in a low temperature environment according to claim 7, characterized in that: One end of the driving screw (702) is sleeved with a synchronous sprocket (703), and the outer surfaces of the synchronous sprockets (703) at one end of the driving screw (702) arranged on both sides are jointly meshed with a synchronous chain (704).

Images