Novel wind gathering radiator

By designing a new air-concentrating radiator, using the combination of siphon heat conduction pipes and heat dissipation fin sets, the problem of difficulty in gathering air volume and dissipating heat in a specific space is solved, and efficient heat dissipation effect and space utilization are achieved.

CN222655597UActive Publication Date: 2025-03-21DONGGUAN YIZHAO ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202420869247.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-25
Publication Date
2025-03-21
Estimated Expiration
2034-04-25

AI Technical Summary

Technical Problem

The prior art is difficult to gather the air volume provided by the system in a specific space and achieve efficient heat dissipation.

Method used

A new type of air-concentrating radiator is designed, including siphon heat conduction pipes, substrates, heat dissipation fin sets and PADs. The heat is brought to the heat dissipation fin sets through the siphon heat conduction pipes for heat dissipation, and the heat is dissipated into the air through the air provided by the system.

Benefits of technology

It realizes efficient air volume and heat dissipation in a limited space, improving the heat dissipation effect and space utilization.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of radiators, in particular to a novel wind-gathering radiator which comprises a siphon heat conduction pipe, a substrate, a radiating fin group and a PAD, one side of the substrate is suitable for being attached to a heat source, the other side of the substrate is fixedly provided with the siphon heat conduction pipe, part of the siphon heat conduction pipe protrudes out of the substrate and is fixedly provided with the radiating fin group, one end of the radiating fin group faces a system air inlet, and the other end of the radiating fin group faces a system air outlet. A sintered capillary structure is arranged in the siphon heat conduction pipe, the sintered capillary structure is filled with a condensing medium, and the attached position of the substrate and the heat source is filled with the PAD. According to the utility model, after the heating source generates heat, the heat passes through the substrate along the PAD, then the heat is transferred to the siphon heat conduction pipe by the substrate, and the siphon heat conduction pipe brings the heat to the heat dissipation fin group, so that air takes away the heat dissipated from the surface of the heat dissipation fin group. And the heat is dissipated into the air through the air quantity provided by the system, so that the problem that the air quantity provided by the system is difficult to gather and dissipate in a specific space in the prior art is solved.
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Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a novel air-gathering radiator. Background Art

[0002] With the development of electronic products, the multifunctionality requirements of electronic products are getting higher and higher. However, as the size of products becomes smaller and smaller, their compact structure also makes heat dissipation more difficult.

[0003] In the existing diverse industrial electronic products, various electronic components, structural parts and chips occupy a certain space, and the space provided for the radiator is very limited. In order to ensure the normal operation of a certain performance system, the radiators designed by thermal design engineers are also diverse. However, it is difficult to gather and dissipate the air volume provided by the system in a specific space with existing technology.

[0004] Therefore, engineers have been working hard to design a radiator in a specific space environment and to gather the air volume provided by the system into the entire cooling duct to achieve efficient heat dissipation performance. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies of the prior art, the utility model provides a novel air-collecting radiator, which can utilize the limited environmental space to gather and dissipate the air volume provided by the system, so as to solve the problem in the prior art that it is difficult to gather and dissipate the air volume provided by the system in a specific space.

[0007] (II) Technical solution

[0008] In order to achieve the above-mentioned purpose, the utility model provides a novel air-collecting radiator, comprising: a siphon heat pipe, a substrate, a heat dissipation fin group and a PAD. One side of the substrate is suitable for fitting with a heat source, and the other side thereof is fixed with the siphon heat pipe. Part of the siphon heat pipe protrudes from the substrate and is fixed with a heat dissipation fin group. One end of the heat dissipation fin group faces the air inlet of the system. A sintered capillary structure is provided in the siphon heat pipe, and the sintered capillary structure is filled with a condensing medium. The PAD is filled at the fitting place between the substrate and the heat source.

[0009] Optionally, the heat dissipation fin group includes a plurality of fins, the plurality of fins are distributed at intervals, the plurality of fins form a fan shape at one end facing the air inlet of the system, and an air duct is formed between adjacent fins.

[0010] Optionally, each fin is provided with an embedding groove, and the siphon heat conducting pipe is embedded in the embedding groove and fixed to the fin.

[0011] Optionally, a mounting groove is provided on a side of the substrate facing away from the heat source, and the siphon heat conducting pipe is embedded in the mounting groove and fixed to the substrate.

[0012] Optionally, the material of the substrate is CU1100.

[0013] Optionally, the siphon heat pipe, the base plate and the heat sink fin assembly are all fixed by tin welding.

[0014] Optionally, a plurality of locking holes are provided on the base plate.

[0015] Optionally, the siphon heat pipe, the substrate and the heat sink fin assembly are all sprayed with a nano-carbon layer.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the utility model provides a new type of air-gathering radiator, which has the following beneficial effects:

[0018] 1. The utility model provides a siphon heat pipe, a substrate, a heat dissipation fin group and a PAD, so that heat can pass through the substrate along the PAD, and the heat is brought to the heat dissipation fin group through the siphon heat pipe for heat dissipation. This structure makes full use of the limited environmental space for heat transfer, and dissipates the heat into the air through the air volume provided by the system;

[0019] 2. The utility model provides a heat dissipation fin group with multiple fins, distributes the multiple fins at intervals, and arranges the multiple fins in a fan shape at one end facing the air inlet of the system, so that an air duct is formed between adjacent fins. The fan-shaped end composed of multiple fins can conveniently converge the wind, increase the flow speed of the wind, and blow it into the heat dissipation fin group along the wind duct, thereby improving the wind convergence and heat dissipation effect;

[0020] 3. The utility model provides an embedding groove on each fin and an installation groove on the side of the base plate away from the heat source, so that the siphon heat pipe is embedded in the embedding groove and the installation groove, thereby further reducing the volume of the new wind-collecting radiator and increasing the utilization rate of limited space. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the three-dimensional structure of the utility model;

[0022] Figure 2 Shows Figure 1 A rear view structural diagram of ;

[0023] Figure 3 A schematic diagram of the structure of a heat dissipation fin group is shown;

[0024] Figure 4 A schematic structural diagram of a substrate is shown;

[0025] Figure 5 A schematic diagram of the internal structure of a siphon heat pipe is shown.

[0026] In the figure: 1. siphon heat pipe; 2. base plate; 3. heat sink fin group; 31. fin; 32. air duct; 4. PAD; 5. sintered capillary structure; 6. condensation medium; 7. fitting groove; 8. mounting groove; 9. locking hole; 10. nano-carbon layer. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Example: See Figures 1 to 5 According to an embodiment of the utility model, a technical solution is provided: a new type of wind-collecting radiator, comprising: a siphon heat-conducting pipe 1, a sintered capillary structure 5 is arranged inside the siphon heat-conducting pipe 1, and a condensing medium 6 is filled in the sintered capillary structure 5 to achieve heat conduction through the condensing medium 6; a substrate 2, one side of which is suitable for fitting to a heat source, and the other side of which is fixed with the siphon heat-conducting pipe 1, a portion of the siphon heat-conducting pipe 1 protrudes from the substrate 2 and fixes a heat dissipation fin group 3, and a PAD4 is filled at the fitting position between the substrate 2 and the heat source, and it should be noted that the PAD4 is a heat-conducting silicone sheet; a heat dissipation fin group 3, one end of which faces the system air inlet, and is blown by the system air volume, so as to quickly blow away the heat emitted from the surface of the heat dissipation fin group 3.

[0029] The new type of air-gathering radiator with the above structure, after the heat source generates heat, the heat passes through the substrate 2 along the PAD4, and the substrate 2 transfers the heat to the siphon heat pipe 1, and the heat is brought to the heat dissipation fin group 3 through the siphon heat pipe 1, and then the wind is blown into the heat dissipation fins through the system air inlet, so that the wind can quickly take away the heat dissipated from the surface of the fins in the heat dissipation fin group 3. This structure makes full use of the limited environmental space for heat transfer, and dissipates the heat into the air through the air volume provided by the system, which solves the problem in traditional technology that it is difficult to gather and dissipate the air volume provided by the system in a specific space.

[0030] In the present embodiment, when the wind entering along the system air inlet is blown into the heat dissipation fin group 3, some of the wind is still unable to converge into the heat dissipation fin group 3. In order to increase the convergence of the wind, the heat dissipation fin group 3 is provided with a plurality of fins 31, and the plurality of fins 31 are distributed at intervals, and the plurality of fins 31 are arranged in a fan shape at one end facing the system air inlet, so that an air duct 32 is formed between adjacent fins 31. The fan-shaped end formed by the plurality of fins 31 can conveniently converge the wind, increase the air volume and flow speed, and blow into the heat dissipation fin group 3 along the air duct 32, thereby improving the wind convergence and heat dissipation effects.

[0031] In this embodiment, in order to further reduce the volume of the new wind-collecting radiator and increase the utilization rate of limited space, an embedding groove 7 is opened on each fin 31, and an installation groove 8 is opened on the side of the substrate 2 facing away from the heat source, so that the siphon heat pipe 1 can be embedded in the embedding groove 7 and the installation groove 8, and the siphon heat pipe 1 is fixed to the heat dissipation fin group 3 and the substrate 2, thereby achieving the effect of reducing the volume.

[0032] In this embodiment, in order to increase the thermal conductivity of the substrate 2 and reduce the heat accumulated between the substrate 2 and the heat source, the material of the substrate 2 is set to CU1100. The copper substrate 2 has a higher thermal conductivity and can effectively dissipate heat from the heat source, thereby improving the heat dissipation and thermal conductivity of the substrate 2.

[0033] In this embodiment, the siphon heat pipe 1, the base plate 2 and the heat dissipation fin group 3 are fixed together by soldering, so that heat conduction and heat dissipation can be effectively performed.

[0034] In this embodiment, in order to quickly fix the substrate 2 on the heat source and facilitate subsequent disassembly, a plurality of locking holes 9 are provided on the substrate 2, and the locking holes 9 can facilitate the insertion of threaded nails. During the installation process, the threaded nails can be inserted into the locking holes 9 and the screws can be driven into the heat source, thereby quickly fixing the substrate 2. During disassembly, the threaded nails can be rotated to take them out to facilitate subsequent disassembly.

[0035] In this embodiment, in order to increase the surface heat radiation, a nano-carbon layer 10 is sprayed on the siphon heat pipe 1 , the substrate 2 and the heat dissipation fin group 3 .

[0036] Working principle: After the heat source generates heat, the heat passes through the substrate 2 along the PAD4, and then the substrate 2 transfers the heat to the siphon heat pipe 1, and the heat is brought to the heat dissipation fin group 3 through the siphon heat pipe 1. The fan-shaped end composed of multiple fins 31 in the heat dissipation fin group 3 can converge the wind, increase the air volume and flow speed, and introduce the wind into the air duct 32, so that the wind can quickly take away the heat emitted from the surface of the fin 31. During installation, the threaded nail can be inserted into the locking hole 9, and the screw can be driven into the heat source, so as to quickly fix the substrate 2. During disassembly, the threaded nail can be turned to remove it to facilitate subsequent disassembly. This structure can maximize the system wind gathering within the limited space of the system, achieve high-efficiency heat dissipation, and ensure the normal operation of the product system.

[0037] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A new type of air-gathering radiator, characterized in that: include: A siphon heat conducting pipe (1), a substrate (2), a heat dissipation fin group (3) and a PAD (4), wherein one side of the substrate (2) is suitable for being attached to a heat source, and the other side thereof is fixed with the siphon heat conducting pipe (1), a portion of the siphon heat conducting pipe (1) protrudes from the substrate (2) and is fixed with the heat dissipation fin group (3), one end of the heat dissipation fin group (3) faces the air inlet of the system, a sintered capillary structure (5) is provided in the siphon heat conducting pipe (1), and a condensation medium (6) is filled in the sintered capillary structure (5), and the PAD (4) is filled at the place where the substrate (2) and the heat source are attached.

2. A novel air-collecting radiator according to claim 1, characterized in that: The heat dissipation fin group (3) comprises a plurality of fins (31), the plurality of fins (31) are distributed at intervals, the plurality of fins (31) form a fan shape at one end facing the system air inlet, and an air duct (32) is formed between adjacent fins (31).

3. A novel air-collecting radiator according to claim 2, characterized in that: Each of the fins (31) is provided with an embedding groove (7), and the siphon heat conducting pipe (1) is embedded in the embedding groove (7) and fixed to the fin (31).

4. The novel air-collecting radiator according to claim 1 is characterized in that: A mounting groove (8) is provided on the side of the base plate (2) facing away from the heat source, and the siphon heat conducting pipe (1) is embedded in the mounting groove (8) and fixed to the base plate (2).

5. The novel air-collecting radiator according to claim 1 is characterized in that: The material of the substrate (2) is CU1100.

6. A novel air-collecting radiator according to any one of claims 1 to 5, characterized in that: The siphon heat conducting pipe (1), the base plate (2) and the heat dissipation fin group (3) are all fixed by tin welding.

7. The novel air-collecting radiator according to claim 1 is characterized in that: The base plate (2) is provided with a plurality of locking holes (9).

8. The novel air-collecting radiator according to claim 1 is characterized in that: The siphon heat conducting pipe (1), the substrate (2) and the heat dissipation fin group (3) are all sprayed with a nano-carbon layer (10).